CN211321625U - Stainless steel base copper-clad plate - Google Patents
Stainless steel base copper-clad plate Download PDFInfo
- Publication number
- CN211321625U CN211321625U CN201922344889.6U CN201922344889U CN211321625U CN 211321625 U CN211321625 U CN 211321625U CN 201922344889 U CN201922344889 U CN 201922344889U CN 211321625 U CN211321625 U CN 211321625U
- Authority
- CN
- China
- Prior art keywords
- layer
- stainless steel
- circuit
- clad plate
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a stainless steel base copper-clad plate, include from last to first solder mask, first circuit layer, first insulation layer, stainless steel layer, second insulating layer, second circuit layer and the second solder mask that sets gradually down, be equipped with first through-hole on first circuit layer, stainless steel layer and the second circuit layer, the copper foil has been coated on the first through-hole, first circuit layer and second circuit layer pass through copper foil electric connection on the first through-hole, first insulation layer and second insulating layer are the resin composition layer, the surface on stainless steel layer is equipped with cross line. The stainless steel layer is adopted as the substrate, so that the corrosion resistance and the heat conductivity are good, the service life is long, and the combined and superposed mode of the first circuit layer and the second circuit layer is adopted, so that the circuit distribution area is reduced by 1 time compared with a single-sided circuit, and the original characteristics are not lost, thereby reducing the product volume and saving the assembly cost.
Description
Technical Field
The utility model relates to a copper-clad plate field, in particular to stainless steel base copper-clad plate.
Background
The development time of the high-thermal-conductivity metal-based copper-clad plate is short, and the manufacturing technology level in the industry is not mature enough. At present, the metal copper clad plates in the market mainly adopt aluminum or copper as a substrate, and the traditional aluminum-based and copper-based high-heat-conductivity copper clad plates are easy to generate a micro-battery effect in a humid acid-base environment for a long time, so that components are easy to corrode, and the service lives of the components are greatly shortened.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a stainless steel base copper-clad plate has good corrosion resistance and heat conductivity, long service life.
According to the utility model discloses stainless steel base copper-clad plate, include from last to the first solder mask, first circuit layer, first insulation layer, stainless steel layer, second insulating layer, second circuit layer and the second solder mask that sets gradually down, be equipped with first through-hole on first circuit layer, stainless steel layer and the second circuit layer, the copper foil has been coated on the first through-hole, first circuit layer and second circuit layer pass through copper foil electric connection on the first through-hole, first insulation layer and second insulating layer are the resin composition layer, the surface on stainless steel layer is equipped with cross line.
According to the utility model discloses stainless steel base copper-clad plate has following beneficial effect at least: the stainless steel layer is adopted as the substrate, the corrosion resistance and the heat conductivity are good, the service life is long, the mode that the first circuit layer and the second circuit layer are combined and overlapped is adopted, the circuit distribution area is reduced by 1 time compared with a single-sided circuit, the original characteristic is not lost, the product size is reduced, the assembly cost is saved, the first insulating layer and the second insulating layer are made of the resin composition layer, the resin composition layer can be perfectly combined with the stainless steel, the heat conductivity of the resin is good, and the heat conductivity is favorably improved.
According to the utility model discloses stainless steel base copper-clad plate, the surface on stainless steel layer is equipped with the cross line.
According to the utility model discloses stainless steel base copper-clad plate, the thickness of first group's layer and/or second group's layer is 5-15 um.
According to the utility model discloses stainless steel base copper-clad plate of embodiment, the thickness on first circuit layer and/or second circuit layer is 25-50 um.
According to the utility model discloses stainless steel base copper-clad plate of embodiment, the thickness on stainless steel layer is 0.1-2.0 mm.
According to the utility model discloses stainless steel base copper-clad plate of embodiment, the thickness of first insulating layer and/or second insulating layer is 50-100 um.
According to the utility model discloses stainless steel base copper-clad plate, the both ends on stainless steel layer all are equipped with the heating panel, the heating panel is the T type, and the heating panel outside is equipped with the arch.
According to the utility model discloses stainless steel base copper-clad plate of embodiment, the stainless steel layer is equipped with a plurality of second through-holes.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural view of a stainless steel-based copper-clad plate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a stainless steel-based copper-clad plate according to another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, a stainless steel-based copper-clad plate comprises a first solder mask layer 1, a first circuit layer 2, a first insulation layer 3, a stainless steel layer 4, a second insulation layer 5, a second circuit layer 6 and a second solder mask layer 7 which are sequentially arranged from top to bottom, wherein first through holes 8 are formed in the first circuit layer 2, the stainless steel layer 4 and the second circuit layer 6, copper foils are coated on the first through holes 8, the first circuit layer 2 and the second circuit layer 6 are electrically connected through the copper foils on the first through holes 8, the first insulation layer 3 and the second insulation layer 5 are resin composition layers, and cross-shaped grains are arranged on the surface of the stainless steel layer 4. The stainless steel layer 4 is used as a substrate, the rigidity is higher than that of an aluminum-based copper-clad plate, the appearance is not easy to scratch and scratch, the thermal expansion and cold contraction are small, the deformation and warping are not easy, the long-term stable operation of the product in a high-humidity environment can be met, the insulation resistance is more than 5000M ohm, the voltage resistance DC is 500V, the maximum bearing current is 1A, the maximum bearing temperature is 85 ℃, the predicted temperature is 40-50 ℃ during working, and the service life of the product is effectively prolonged; the mode of combining and superposing the first circuit layer 2 and the second circuit layer 6 is adopted, the distribution area of the circuits is reduced by 1 time compared with a single-sided circuit, and the original characteristics are not lost, so that the product volume is reduced, and the assembly cost is saved; the first insulating layer 3 and the second insulating layer 5 are resin composition layers, can be perfectly combined with stainless steel, and resin has good thermal conductivity, so that the heat conducting performance is favorably improved.
In some embodiments of the present invention, the surface of the stainless steel layer 4 is provided with cross grains, 3. the stainless steel layer is polished into vertical and horizontal cross grains by a plate polishing machine, so as to increase the roughness and improve the binding force.
In some embodiments of the present invention, the thickness of the first set of solder layers and the second set of solder layers is 5-15um, which prevents physical disconnection of the conductor circuit; in the welding process, short circuit caused by bridging is prevented; the copper foil is covered by solder resist ink, and has excellent acid and alkali resistance, solvent resistance, high temperature resistance and other performances.
In some embodiments of the present invention, the thickness of the first circuit layer 2 and/or the second circuit layer 6 is 25-50 um. The two layers of circuits are connected and conducted through a first through hole 8 to form a double-sided circuit. The first circuit layer 2 and the second circuit layer 6 are copper foil layers and are mainly used for placing components or wiring to conduct current.
In some embodiments of the present invention, the thickness of the stainless steel layer 4 is 0.1-2.0mm, which plays a role of heat dissipation; the high temperature and humidity resistance and corrosion prevention are realized, and the normal operation of the double-sided circuit is ensured; compared with an aluminum-based copper-clad plate, the copper-clad plate has stronger rigidity, is difficult to scratch and scrape flowers in appearance, and is small in expansion with heat and contraction with cold and difficult to deform and warp.
In some embodiments of the present invention, the thickness of the first insulating layer 3 and/or the second insulating layer 5 is 50-100 um. The circuit and the stainless steel are bonded, but short circuit is not conducted, and the heat conduction effect is achieved. The material used was a resin composition, the material of patent No. CN201110390797.7, and had good thermal conductivity. The thermal stress (dip soldering) can meet the requirements of no delamination and no bubbling for 288 ℃/10s/12 times (no delamination and no bubbling for 288 ℃/10s/3 times in the industry standard), and the thermal conductivity can reach 3W/m.k.
Referring to fig. 2, in some embodiments of the present invention, heat dissipation plates 9 are disposed at both ends of the stainless steel layer 4, the heat dissipation plates 9 are T-shaped, protrusions 91 are disposed on the outer sides of the heat dissipation plates 9, and the stainless steel layer 4 is disposed with a plurality of second through holes 10. The heat dissipation plate 9 is made of an aluminum plate, heat dissipation capacity is further improved by arranging the heat dissipation plate 9, and the heat dissipation area is further increased by arranging the arc-shaped protrusions 91. Set up second through-hole 10 and can alleviate the 4 qualities of stainless steel layer, and keep apart through second through-hole 10, prevent that stainless steel layer 4 is whole too big because expend with heat and contract with cold deformation.
The utility model discloses the manufacturing method of stainless steel base copper-clad plate of embodiment does:
1. the contour lines and the burned holes appointed by a customer are cut by laser, but the connection positions with the width of 0.5mm are arranged among the units, so that the single unit is ensured to be connected and not to fall off.
2. Stainless steel crosses and fills up the board cleaning machine of passing on aluminum plate, and conveying speed 3 meters per minute, electric current 3A to get rid of surface greasy dirt and impurity, the while alligatoring surface increases the cohesion between stainless steel and the insulating layer.
3. And filling epoxy resin in the hole positions, polishing and flattening the protruded resin by a belt sander, and baking at 150 ℃ for 30 minutes for curing.
4. Coating a complete precious heat conduction insulating layer heat conduction adhesive on the stainless steel, sealing the positioning hole, and overlapping the positioning hole and the copper foil in the past.
5. Stainless steel, heat conduction insulating layer, copper foil are pressed together through press high temperature high pressure, 288 degrees thermal stress does not have layering bubble unusual problem.
6. And (4) positioning by a shooting machine, drilling plug-in holes required by a customer at the original position for burning the hole plug resin, and finishing the post-process circuit pattern and the solder mask processing.
Claims (8)
1. A stainless steel base copper-clad plate is characterized in that: include from last first solder mask (1), first circuit layer (2), first insulation layer (3), stainless steel layer (4), second insulation layer (5), second circuit layer (6) and the second solder mask (7) that sets gradually extremely down, be equipped with first through-hole (8) on first circuit layer (2), stainless steel layer (4) and second circuit layer (6), first through-hole (8) have been coated with the copper foil, first circuit layer (2) and second circuit layer (6) pass through copper foil electric connection on first through-hole (8), first insulation layer (3) and second insulation layer (5) are the resin composition layer.
2. The stainless steel-based copper-clad plate according to claim 1, wherein: the surface of the stainless steel layer (4) is provided with cross grains.
3. The stainless steel-based copper-clad plate according to claim 1, wherein: the thickness of first solder mask and/or second solder mask is 5-15 um.
4. The stainless steel-based copper-clad plate according to claim 1, wherein: the thickness of the first circuit layer (2) and/or the second circuit layer (6) is 25-50 um.
5. The stainless steel-based copper-clad plate according to claim 1, wherein: the thickness of the stainless steel layer (4) is 0.1-2.0 mm.
6. The stainless steel-based copper-clad plate according to claim 1, wherein: the thickness of the first insulating layer (3) and/or the second insulating layer (5) is 50-100 um.
7. The stainless steel-based copper-clad plate according to claim 1, wherein: both ends of stainless steel layer (4) all are equipped with heating panel (9), heating panel (9) are the T type, and heating panel (9) outside is equipped with arch (91).
8. The stainless steel-based copper-clad plate according to claim 1, wherein: the stainless steel layer (4) is provided with a plurality of second through holes (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922344889.6U CN211321625U (en) | 2019-12-23 | 2019-12-23 | Stainless steel base copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922344889.6U CN211321625U (en) | 2019-12-23 | 2019-12-23 | Stainless steel base copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211321625U true CN211321625U (en) | 2020-08-21 |
Family
ID=72057742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922344889.6U Active CN211321625U (en) | 2019-12-23 | 2019-12-23 | Stainless steel base copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211321625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113301715A (en) * | 2021-04-01 | 2021-08-24 | 珠海精路电子有限公司 | Circuit board and manufacturing process thereof |
-
2019
- 2019-12-23 CN CN201922344889.6U patent/CN211321625U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113301715A (en) * | 2021-04-01 | 2021-08-24 | 珠海精路电子有限公司 | Circuit board and manufacturing process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202697035U (en) | LED circuit board with conducting adhesive lines, and LED lamp band | |
| CN211321625U (en) | Stainless steel base copper-clad plate | |
| CN104302097A (en) | Multilayer printed circuit board | |
| CN202262031U (en) | Heat dissipation type led flexible circuit board | |
| TW201509257A (en) | Flexible printed circuit board and method for manufacturing same | |
| CN203072249U (en) | Aluminum substrate used for mounting LED lamps | |
| CN103167724B (en) | With the LED double-sided wiring board of four wire producings | |
| CN201093439Y (en) | LED heat sinking base plate | |
| CN209926075U (en) | Flexible lamp strip substrate and flexible lamp strip | |
| CN210807782U (en) | Substrate heat dissipation substrate structure | |
| CN202535630U (en) | A LED double-sided circuit board produced by four wires | |
| CN207604001U (en) | FPC plates and the electronic equipment with the FPC plates | |
| CN102612254A (en) | Heat radiation type LED (Light-Emitting Diode) flexible circuit board | |
| CN204966543U (en) | Novel composite metal material base plate | |
| CN208016227U (en) | A kind of assembly substrate of circuit board | |
| CN211240300U (en) | Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil | |
| CN103442512A (en) | Multi-layer insulating metal substrate circuit board | |
| US20070261882A1 (en) | Printed Circuit Board and Heat Dissipating Metal Surface Layout thereof | |
| CN205755050U (en) | A kind of novel high-density interconnection printed circuit board (PCB) | |
| CN202178913U (en) | Half hollow type metal-base copper coated board | |
| CN202455644U (en) | Serial-connection light emitting diode (LED) single-sided circuit board made by single conducting wire | |
| CN210986574U (en) | Multilayer printed circuit board convenient to location | |
| CN2922382Y (en) | Surface installation printed-circuit board circuit module | |
| CN100471363C (en) | Mounting structure for electronic parts and mounting method | |
| CN206024242U (en) | A kind of printed circuit-board assembly of quick heat radiating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |