CN212184008U - Insulation wave-absorbing structure for electronic product - Google Patents
Insulation wave-absorbing structure for electronic product Download PDFInfo
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- CN212184008U CN212184008U CN202021137991.5U CN202021137991U CN212184008U CN 212184008 U CN212184008 U CN 212184008U CN 202021137991 U CN202021137991 U CN 202021137991U CN 212184008 U CN212184008 U CN 212184008U
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Abstract
The utility model relates to an absorbing material technical field especially relates to an insulating absorbing structure for electronic product, including the silica gel protection film, the silica gel protection film has connected gradually shock attenuation bubble cotton, conductive cloth, absorbing material layer, insulating glue film and has left the type membrane, absorbing material layer includes from type paper and with from the heat-resisting double-sided adhesive layer that type paper is connected, the upper surface of heat-resisting double-sided adhesive layer is provided with the metal level that is used for realizing the electromagnetic shield, the upper portion of metal level is provided with first absorbing layer and the second absorbing layer that is used for absorbing electromagnetic wave energy, be provided with the heat dissipation layer between first absorbing layer and the second absorbing layer, the surface of second absorbing layer is provided with the protection film. The utility model discloses structural stability is strong, makes the circuit board of electronic product have good electrically conductive absorbing performance and heat dispersion, further strengthens shielding interfering signal.
Description
Technical Field
The utility model relates to an absorbing material technical field especially relates to an insulating absorbing structure for electronic product.
Background
The wave-absorbing material is a material capable of absorbing or greatly reducing electromagnetic wave energy projected to the surface of the wave-absorbing material so as to reduce electromagnetic wave interference, and is widely applied to the electronic product industry, such as mobile phones, computers, panels, communication base stations, communication die cutting and other products containing electronic signal receiving and sending, but the existing wave-absorbing material is a common single-layer electromagnetic shielding layer, has poor structural stability and single function, but along with the development of modern communication technology, the working frequency of the product is higher and higher, so that the basic working performance of the existing wave-absorbing material cannot meet the current use requirement, and further the normal and efficient transmission of signals is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art not enough, provide an insulating absorbing structure for electronic product, structural stability is strong, makes electronic product's circuit board have good electrically conductive absorbing performance and heat dispersion, further strengthens shielding interfering signal.
In order to realize the above-mentioned purpose, the utility model discloses an insulating absorbing structure for electronic product, including the silica gel protection film, the silica gel protection film has connected gradually shock attenuation bubble cotton, conductive cloth, absorbing material layer, insulating glue film and has left the type membrane, absorbing material layer include from type paper and with from the heat-resisting double-sided adhesive layer that type paper is connected, heat-resisting double-sided adhesive layer's upper surface is provided with the metal level that is used for realizing the electromagnetic shield, the upper portion of metal level is provided with first absorbing layer and the second absorbing layer that is used for absorbing electromagnetic wave energy, be provided with the heat dissipation layer between first absorbing layer and the second absorbing layer, the surface of second absorbing layer is provided with the protection film.
Preferably, a plurality of heat dissipation through holes are arranged in the heat dissipation layer at intervals.
Preferably, the metal layer is a copper foil or an aluminum foil.
Preferably, the insulating glue layer is made of resin or silica gel.
The utility model has the advantages that: the utility model provides an insulating wave-absorbing structure for electronic product, includes the silica gel protection film, the silica gel protection film has connected gradually shock attenuation bubble cotton, conductive cloth, absorbing material layer, insulating glue film and has left the type membrane, absorbing material layer include from type paper and with from the heat-resisting double-sided adhesive layer that type paper is connected, heat-resisting double-sided adhesive layer's upper surface is provided with the metal level that is used for realizing the electromagnetic shield, the upper portion of metal level is provided with first absorbing layer and the second absorbing layer that is used for absorbing electromagnetic wave energy, be provided with the heat dissipation layer between first absorbing layer and the second absorbing layer, the surface of second absorbing layer is provided with the protection film.
The upper surface of the silica gel protective film is sequentially connected with the shock absorption foam, the conductive cloth, the wave absorbing material layer, the insulating adhesive layer and the release film, the processing precision and the structural stability of the electronic product circuit board are effectively improved, the forming efficiency is high, the working procedures are further saved to reduce the production cost, the wave absorbing material layer is sequentially connected with the release paper, the heat-resistant double-sided adhesive layer, the metal layer, the first wave absorbing layer, the heat dissipation layer, the second wave absorbing layer and the protective film in a stacking mode from bottom to top, the heat-resistant double-sided adhesive layer has better adhesiveness and high temperature resistance, the metal layer is used for electromagnetic shielding, the first wave absorbing layer and the second wave absorbing layer can fully absorb electromagnetic waves, the heat dissipation layer can timely discharge heat in the working process, the heat dissipation efficiency is improved, the normal transmission of electronic circuit signals is not influenced, and the product can also enable the circuit boards of electronic products such as a, meanwhile, mobile phone signals are strengthened and interference signals are shielded. The utility model discloses structural stability is strong, makes the circuit board of electronic product have good electrically conductive absorbing performance and heat dispersion, further strengthens shielding interfering signal.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the exploded structure of the present invention.
Fig. 3 is a schematic side view of the present invention.
Fig. 4 is a partially enlarged structural diagram of a in fig. 3.
Fig. 5 is a schematic structural view of the wave-absorbing material layer of the present invention.
The reference numerals include:
1-silica gel protective film 2-damping foam 3-conductive cloth
4-wave absorbing material layer 41-release paper 42-heat-resistant double-sided adhesive layer
43-metal layer 44-first wave-absorbing layer 45-second wave-absorbing layer
46-heat dissipation layer 47-protection film 48-heat dissipation through hole
5-an insulating glue layer 6-a release film.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, the utility model discloses an insulating wave-absorbing structure for electronic product, including silica gel protection film 1, silica gel protection film 1 has connected gradually shock attenuation bubble cotton 2, conductive cloth 3, absorbing material layer 4, insulating glue film 5 and has left type membrane 6, absorbing material layer 4 includes from type paper 41 and with from the heat-resisting double-sided adhesive layer 42 that type paper 41 is connected, the upper surface of heat-resisting double-sided adhesive layer 42 is provided with the metal level 43 that is used for realizing electromagnetic shield, the upper portion of metal level 43 is provided with first absorbing layer 44 and the second absorbing layer 45 that is used for absorbing electromagnetic wave energy, be provided with heat dissipation layer 46 between first absorbing layer 44 and the second absorbing layer 45, the surface of second absorbing layer 45 is provided with protection film 47.
The upper surface of the silica gel protective film 1 is sequentially connected with damping foam 2, conductive cloth 3, a wave-absorbing material layer 4, an insulating glue layer 5 and a release film 6, the processing precision and the structural stability of an electronic product circuit board are effectively improved, the forming efficiency is high, the working procedures are further saved to reduce the production cost, the wave-absorbing material layer 4 is sequentially connected with release paper 41, a heat-resistant double-sided glue layer 42, a metal layer 43, a first wave-absorbing layer 44, a heat dissipation layer 46, a second wave-absorbing layer 45 and a protective film 47 in a stacked mode from bottom to top, the heat-resistant double-sided glue layer 42 has better adhesiveness and high temperature resistance, the metal layer 43 is used for an electromagnetic shielding effect, the first wave-absorbing layer 44 and the second wave-absorbing layer 45 can fully absorb electromagnetic waves, the heat dissipation layer 46 can timely discharge heat in the working process, the heat dissipation efficiency is improved, the normal transmission of, The circuit board of electronic products such as tablet computers, notebook computers and the like has better insulation and conductivity, and simultaneously strengthens mobile phone signals and shields interference signals. The utility model discloses structural stability is strong, makes the circuit board of electronic product have good electrically conductive absorbing performance and heat dispersion, further strengthens shielding interfering signal.
As shown in fig. 2 and 5, the heat dissipation layer 46 of the present embodiment is provided with a plurality of heat dissipation through holes 48 at intervals. Specifically, a heat dissipation layer 46 is arranged between the first wave absorbing layer 44 and the second wave absorbing layer 45, and the first wave absorbing layer 44 and the second wave absorbing layer 45 are communicated through a heat dissipation through hole 48, so that not only is the heat dissipation efficiency improved, but also the wave absorbing effect is improved.
As shown in fig. 5, the metal layer 43 of the present embodiment is a copper foil or an aluminum foil. Specifically, the metal layer 43 is made of copper foil or aluminum foil, so that an electromagnetic shielding effect is achieved, and the shielding performance is remarkable.
As shown in fig. 1, 2 and 4, the insulating adhesive layer 5 of the present embodiment is made of resin or silicone material. Specifically, the insulating adhesive layer 5 can be made of resin or silica gel, the resin is polyvinyl chloride resin, and the insulating adhesive layer and the silica gel have the advantages of good electrical insulation, good structural strength, stable physical and chemical properties and strong adhesion.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (4)
1. An insulating microwave absorbing structure for electronic products is characterized in that: including the silica gel protection film, the silica gel protection film has connected gradually the shock attenuation bubble cotton, has electrically conductive cloth, absorbing material layer, insulating glue film and has left the type membrane, absorbing material layer include from type paper and with the heat-resisting double-sided adhesive layer of being connected from type paper, heat-resisting double-sided adhesive layer's upper surface is provided with the metal level that is used for realizing the electromagnetic shield, the upper portion of metal level is provided with first absorbing layer and the second absorbing layer that is used for absorbing electromagnetic wave energy, be provided with the heat dissipation layer between first absorbing layer and the second absorbing layer, the surface of second absorbing layer is provided with the protection film.
2. The insulating and wave-absorbing structure for electronic products according to claim 1, wherein: a plurality of heat dissipation through holes are formed in the heat dissipation layer at intervals.
3. The insulating and wave-absorbing structure for electronic products according to claim 1, wherein: the metal layer is copper foil or aluminum foil.
4. The insulating and wave-absorbing structure for electronic products according to claim 1, wherein: the insulating glue layer is made of resin or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021137991.5U CN212184008U (en) | 2020-06-18 | 2020-06-18 | Insulation wave-absorbing structure for electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021137991.5U CN212184008U (en) | 2020-06-18 | 2020-06-18 | Insulation wave-absorbing structure for electronic product |
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| Publication Number | Publication Date |
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| CN212184008U true CN212184008U (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021137991.5U Active CN212184008U (en) | 2020-06-18 | 2020-06-18 | Insulation wave-absorbing structure for electronic product |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115449311A (en) * | 2022-06-20 | 2022-12-09 | 苏州伟铂瑞信电子科技有限公司 | Mobile phone screen die-cutting diaphragm capable of reducing electromagnetic interference |
| CN115449310A (en) * | 2022-06-10 | 2022-12-09 | 苏州伟铂瑞信电子科技有限公司 | Flat panel screen die cutting diaphragm capable of reducing electromagnetic interference |
-
2020
- 2020-06-18 CN CN202021137991.5U patent/CN212184008U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115449310A (en) * | 2022-06-10 | 2022-12-09 | 苏州伟铂瑞信电子科技有限公司 | Flat panel screen die cutting diaphragm capable of reducing electromagnetic interference |
| CN115449310B (en) * | 2022-06-10 | 2023-12-05 | 苏州伟铂瑞信电子科技有限公司 | Flat screen die-cutting diaphragm capable of reducing electromagnetic interference |
| CN115449311A (en) * | 2022-06-20 | 2022-12-09 | 苏州伟铂瑞信电子科技有限公司 | Mobile phone screen die-cutting diaphragm capable of reducing electromagnetic interference |
| CN115449311B (en) * | 2022-06-20 | 2023-12-05 | 苏州伟铂瑞信电子科技有限公司 | Mobile phone screen die-cutting diaphragm capable of reducing electromagnetic interference |
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