CN215582514U - Wave-absorbing composite structure with low-dielectric heat conduction layer - Google Patents
Wave-absorbing composite structure with low-dielectric heat conduction layer Download PDFInfo
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- CN215582514U CN215582514U CN202121211181.4U CN202121211181U CN215582514U CN 215582514 U CN215582514 U CN 215582514U CN 202121211181 U CN202121211181 U CN 202121211181U CN 215582514 U CN215582514 U CN 215582514U
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Abstract
The utility model relates to a wave-absorbing composite structure with a low-dielectric-conductivity layer, which comprises a wave-absorbing material layer and a low-dielectric-conductivity material layer, wherein the wave-absorbing material layer is fixedly adhered to one side of the low-dielectric-conductivity material layer through a double-sided adhesive layer, a release film layer is arranged on the other side of the low-dielectric-conductivity material layer and is used for protection before the wave-absorbing composite structure is used, a chip placing hole is formed in the middle of the wave-absorbing composite structure, and the wave-absorbing composite structure is conveniently adhered to a PCB (printed circuit board) around a chip after being torn away from the release film so that the chip passes through the chip placing hole. The wave-absorbing composite structure compounds the low-dielectric heat conduction material and the high-performance wave-absorbing material together, can simultaneously improve the heat dissipation capacity of a chip, reduce the influence of the wave-absorbing material on the transmission of high-speed signals of a PCB, and avoid the influence of the wave-absorbing material on the integrity of the transmission of the high-speed signals and data on the PCB due to high dielectric loss.
Description
Technical Field
The utility model relates to the technical field of heat conduction and wave absorption, in particular to a wave absorption composite structure with a low-dielectric heat conduction layer.
Background
In recent years, with the rapid development of electronic technology, the performance of electronic products has been increasingly improved, and the degree of miniaturization, integration and densification has been increasing, with the accompanying rapid increase of power consumption and heat productivity, and the problems of electromagnetic radiation and interference have been increasingly raised. High temperature can make electronic equipment's stability reduce, and the reliability descends and life shortens, for guaranteeing the high-efficient even running of equipment, how become the problem that awaits a urgent solution with the quick effectual discharge of heat. In electronic products, particularly, harmful electromagnetic waves generated at the chip and the antenna interfere with other surrounding electronic devices, so that the electronic devices cannot work normally. Therefore, the development of a heat-conducting and wave-absorbing composite functional material with a low dielectric loss layer has become a hot topic in the material field. The wave-absorbing material is a material capable of effectively absorbing incident electromagnetic waves and attenuating the incident electromagnetic waves, and the incident electromagnetic waves are converted into heat energy or other energy forms through different loss mechanisms so as to achieve the purpose of absorbing waves. Among the wave-absorbing materials, the patch type wave-absorbing material has the advantages of thin thickness, convenient use, good effect on reducing electromagnetic radiation and preventing electromagnetic interference, and is more suitable for being applied to electronic products. However, in the prior art, the patch type wave-absorbing material still has the problems of simple structure, low absorption efficiency and low heat-conducting property, and cannot meet the requirements of electromagnetic interference resistance and heat dissipation in a high-frequency high-speed transmission circuit.
SUMMERY OF THE UTILITY MODEL
In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a microwave absorbing composite structure with low dielectric thermal conductive layer, includes absorbing material layer and low dielectric thermal conductive layer, one side on low dielectric thermal conductive layer is fixed with absorbing material layer through two-sided adhesive layer paste, the opposite side on low dielectric thermal conductive layer is equipped with from the type rete, absorbing composite structure's middle part is equipped with the chip and places the hole, absorbing material layer's thickness is greater than the thickness on low dielectric thermal conductive layer.
Preferably, the wave-absorbing material layer is prepared from a magnetic wave-absorbing material.
Preferably, the wave-absorbing material layer is filled with magnetic particles with high magnetic permeability and high magnetic loss.
Preferably, the low-dielectric heat conduction material layer is a silica gel gasket layer filled with low-dielectric heat conduction powder.
The thickness of the low-dielectric heat conduction material layer is preferably 0.1-3 mm.
Preferably, the release film layer is a PET release film or laminating paper.
The utility model relates to a wave-absorbing composite structure with a low-dielectric-conductivity layer, which comprises a wave-absorbing material layer and a low-dielectric-conductivity material layer, wherein the wave-absorbing material layer is fixedly adhered to one side of the low-dielectric-conductivity material layer through a double-sided adhesive layer, a release film layer is arranged on the other side of the low-dielectric-conductivity material layer and is used for protecting the wave-absorbing composite structure before use, a chip placing hole is formed in the middle of the wave-absorbing composite structure, the wave-absorbing composite structure is torn away from the release film and is conveniently adhered to a PCB (printed circuit board) around a chip, so that the chip passes through the chip placing hole, the low-dielectric-conductivity material layer is a silica gel gasket layer filled with low-dielectric heat-conduction powder, and has the characteristics of good heat conductivity, high resistance and low dielectric loss. The utility model relates to a wave-absorbing composite structure with a low-dielectric heat-conducting layer, which compounds a low-dielectric heat-conducting material and a high-performance wave-absorbing material together, and can improve the heat-radiating capacity of a chip and reduce the influence of the wave-absorbing material on the high-speed signal transmission of a PCB (printed circuit board) through punching. Through setting up the low dielectric loss's of different thickness heat conduction gasket and PCB contact, can keep apart absorbing material and PCB at the colleague that absorbs the chip heat to avoid absorbing material because of the integrality of high-speed signal and data transmission on the high dielectric loss nature influence PCB. The utility model is in a rectangular or square annular structure, the size of the chip placing hole is punched according to the size of the chip, the chip placing hole is conveniently and quickly arranged around the chip, electromagnetic interference signals generated by the chip are isolated, and the influence on peripheral circuits and components is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a wave-absorbing composite structure with a low dielectric thermal conductive layer according to the present invention;
fig. 2 is a sectional view taken along a-a in fig. 1.
In the figure: 1. a wave-absorbing material layer; 2. a double-sided adhesive layer; 3. a layer of low dielectric thermal conductivity material; 4. a release film layer; 5. and a chip placing hole.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
As shown in fig. 1-2, a wave-absorbing composite structure with a low dielectric thermal conductive layer comprises a wave-absorbing material layer 1 and a low dielectric thermal conductive material layer 3, a wave absorbing material layer 1 is fixedly adhered on one side of the low-dielectric heat conducting material layer 3 through a double-sided adhesive layer 2, the other side of the low-dielectric heat conducting material layer 3 is provided with a release film layer 4, the middle part of the wave-absorbing composite structure is provided with a chip placing hole 5, the thickness of the wave-absorbing material layer 1 is larger than that of the low-dielectric heat conduction material layer 3, the wave-absorbing material layer 1 is prepared from a magnetic wave-absorbing material, the wave absorbing material layer 1 is filled with magnetic particles with high magnetic permeability and high magnetic loss, the low dielectric heat conduction material layer 3 is a silica gel gasket layer filled with low dielectric heat conduction powder, the thickness of the low-dielectric heat conduction material layer 3 is 0.1-3 mm, and the release film layer 4 is a PET release film or laminating paper.
The utility model relates to a wave-absorbing composite structure with a low-dielectric-conductivity layer, which comprises a wave-absorbing material layer 1 and a low-dielectric-conductivity material layer 3, wherein the wave-absorbing material layer 1 is fixedly adhered to one side of the low-dielectric-conductivity material layer 3 through a double-sided adhesive layer 2, a release film layer 4 is arranged on the other side of the low-dielectric-conductivity material layer 3, the release film layer 4 is used for protecting the wave-absorbing composite structure before use, a chip placing hole 5 is arranged in the middle of the wave-absorbing composite structure, the wave-absorbing composite structure is torn away from the release film and then is conveniently adhered to a PCB (printed circuit board) around a chip, so that the chip passes through the chip placing hole 5, the low-dielectric-conductivity material layer 3 is a silica gel gasket layer filled with low-dielectric heat-conduction powder, and the low-dielectric-conductivity material layer 3 has the characteristics of good heat conductivity, high resistance and low dielectric loss. The utility model relates to a wave-absorbing composite structure with a low-dielectric heat-conducting layer, which compounds a low-dielectric heat-conducting material and a high-performance wave-absorbing material together, and can improve the heat-radiating capacity of a chip and reduce the influence of the wave-absorbing material on the high-speed signal transmission of a PCB (printed circuit board) through punching. Through setting up the low dielectric loss's of different thickness heat conduction gasket and PCB contact, can keep apart absorbing material and PCB at the colleague that absorbs the chip heat to avoid absorbing material because of the integrality of high-speed signal and data transmission on the high dielectric loss nature influence PCB. The utility model is in a rectangular or square annular structure, the size of the chip placing hole 5 is punched according to the size of the chip, and the chip placing hole is conveniently and quickly arranged around the chip, so that electromagnetic interference signals generated by the chip are isolated, and the influence on peripheral circuits and components is reduced.
It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A wave-absorbing composite structure with a low-dielectric heat conduction layer comprises a wave-absorbing material layer (1) and a low-dielectric heat conduction material layer (3), and is characterized in that: one side of low dielectric thermal conductive material layer (3) is pasted through two-sided adhesive layer (2) and is fixed with absorbing material layer (1), the opposite side of low dielectric thermal conductive material layer (3) is equipped with from type rete (4), absorbing composite structure's middle part is equipped with the chip and places hole (5), the thickness of absorbing material layer (1) is greater than the thickness of low dielectric thermal conductive material layer (3).
2. A wave-absorbing composite structure with a low dielectric thermal conductive layer according to claim 1, characterized in that: the wave-absorbing material layer (1) is prepared from a magnetic wave-absorbing material.
3. A wave-absorbing composite structure with a low dielectric thermal conductive layer according to claim 1 or 2, characterized in that: and magnetic particles with high magnetic permeability and high magnetic loss are filled in the wave-absorbing material layer (1).
4. A wave-absorbing composite structure with a low dielectric thermal conductive layer according to claim 1, characterized in that: the low-dielectric heat conduction material layer (3) is a silica gel gasket layer filled with low-dielectric heat conduction powder.
5. A wave-absorbing composite structure with a low dielectric thermal conductive layer according to claim 1 or 4, characterized in that: the thickness of the low-dielectric heat conduction material layer (3) is 0.1-3 mm.
6. A wave-absorbing composite structure with a low dielectric thermal conductive layer according to claim 1, characterized in that: the release film layer (4) is a PET release film or laminating paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211181.4U CN215582514U (en) | 2021-06-01 | 2021-06-01 | Wave-absorbing composite structure with low-dielectric heat conduction layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211181.4U CN215582514U (en) | 2021-06-01 | 2021-06-01 | Wave-absorbing composite structure with low-dielectric heat conduction layer |
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| Publication Number | Publication Date |
|---|---|
| CN215582514U true CN215582514U (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121211181.4U Active CN215582514U (en) | 2021-06-01 | 2021-06-01 | Wave-absorbing composite structure with low-dielectric heat conduction layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215582514U (en) |
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2021
- 2021-06-01 CN CN202121211181.4U patent/CN215582514U/en active Active
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