CN210030552U - Wave-absorbing adhesive tape - Google Patents

Wave-absorbing adhesive tape Download PDF

Info

Publication number
CN210030552U
CN210030552U CN201920812806.9U CN201920812806U CN210030552U CN 210030552 U CN210030552 U CN 210030552U CN 201920812806 U CN201920812806 U CN 201920812806U CN 210030552 U CN210030552 U CN 210030552U
Authority
CN
China
Prior art keywords
wave
absorbing
layer
adhesive tape
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920812806.9U
Other languages
Chinese (zh)
Inventor
王建义
徐宏飞
王博文
周雄安
覃环
汪刘兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN GUCHUAN ADHESIVE TAPE Co Ltd
Original Assignee
DONGGUAN GUCHUAN ADHESIVE TAPE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN GUCHUAN ADHESIVE TAPE Co Ltd filed Critical DONGGUAN GUCHUAN ADHESIVE TAPE Co Ltd
Priority to CN201920812806.9U priority Critical patent/CN210030552U/en
Application granted granted Critical
Publication of CN210030552U publication Critical patent/CN210030552U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model provides a wave-absorbing adhesive tape. The wave-absorbing adhesive tape comprises a wave-absorbing layer, a first adhesive layer, a base film and a second adhesive layer which are sequentially stacked. The utility model discloses set up first adhesive layer between absorbed wave layer and base film, help preventing that absorbed wave layer from taking place the fracture. The wave-absorbing adhesive tape provided by the utility model has simple structure and smaller overall thickness, can be used for pasting internal elements of mobile terminals and other equipment, can effectively absorb electromagnetic waves and reduce electromagnetic pollution; or the ultra-thin radar wave-absorbing adhesive tape is pasted outside the equipment to play a role in radar stealth.

Description

Wave-absorbing adhesive tape
Technical Field
The utility model belongs to the technical field of the electromagnetic absorption material, concretely relates to inhale ripples sticky tape.
Background
Mobile devices such as mobile phones and computers bring great convenience to people, and become an indispensable part of work and life of people. However, these devices also radiate electromagnetic waves to the outside during normal operation, which causes a great deal of electromagnetic pollution, interference to other surrounding electronic devices, and harm to human health to some extent. With the rapid development of electronic and communication technologies, more and more electronic and electrical devices are put into use, and the electromagnetic pollution caused by the electronic and electrical devices is more and more serious, which gradually draws attention of people.
At present, the main method for reducing electromagnetic pollution is to shield and absorb electromagnetic waves by using electromagnetic shielding materials or electromagnetic absorption materials. Among them, the electromagnetic shielding material is common, and mainly is a metal sheet or a mesh. But the electromagnetic shielding material can only isolate the electromagnetic wave and cannot eliminate the electromagnetic pollution. In some situations, such as base stations, signal data lines, etc., electromagnetic shielding is feasible; but are not applicable in certain situations, such as radio frequency identification. Moreover, at present, miniaturization and high integration are the mainstream trends of electronic product development, the inner space of the products is relatively narrow, the metal electromagnetic shielding material is hard and difficult to arrange in the narrow space, and the short circuit of the internal circuit of the equipment can be caused.
Compared with electromagnetic shielding materials, the electromagnetic absorbing material is more suitable for being applied to miniaturized electronic products. The electromagnetic absorption material can be combined with a high polymer material to form the wave-absorbing adhesive tape for packaging and pasting internal elements of electronic products, which not only can play a role in insulating and protecting the electronic elements, but also can play a role in absorbing electromagnetic waves.
However, common electromagnetic shielding materials (such as sendust, ferrite, etc.) are inorganic materials, and have poor compatibility with high polymer materials, and the adhesive tape formed by mixing the two materials is easy to crack in the preparation and use processes. CN107556933A discloses a wave-absorbing adhesive tape, which comprises a base material, an adhesive and a release film; the base material contains a mixture of carbonyl iron powder and ferrite powder with the weight percentage of 60-70%, and the wave-absorbing adhesive tape has a simple structure and is easy to crack. The wave-absorbing adhesive tape with a complex structure can reduce the influence of cracking to a certain extent, but the thickness of the wave-absorbing adhesive tape is usually larger, and the wave-absorbing adhesive tape occupies more space when being used in electronic products. Therefore, the wave-absorbing adhesive tape which is simple in structure and not easy to crack is to be developed in the field.
SUMMERY OF THE UTILITY MODEL
To the not enough of prior art existence, the utility model aims to provide a inhale ripples sticky tape. The wave-absorbing adhesive tape can effectively absorb electromagnetic waves and reduce electromagnetic pollution, and has the advantages of simple structure, small overall thickness and difficulty in cracking.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a wave-absorbing adhesive tape, including wave-absorbing layer, first adhesive layer, base film and the second adhesive layer that stacks gradually.
The wave-absorbing layer is generally formed by dissolving and dispersing powder of wave-absorbing material (such as sendust, ferrite, etc.) and polymer matrix in organic solvent to form dispersion, coating the dispersion on a base material or other functional layers, and then drying. Because the wave-absorbing layer contains wave-absorbing material powder and has poor compatibility with a polymer matrix, the adhesive tape is easy to crack in the preparation and use processes of the adhesive tape, and the adhesive tape is deteriorated.
The utility model discloses set up first adhesive layer between absorbed wave layer and base film, help preventing that absorbed wave layer from taking place the fracture. The wave-absorbing adhesive tape provided by the utility model has simple structure and smaller overall thickness, can be used for pasting internal elements of mobile terminals and other equipment, can effectively absorb electromagnetic waves and reduce electromagnetic pollution; or the ultra-thin radar wave-absorbing adhesive tape is pasted outside the equipment to play a role in radar stealth.
As the preferred technical scheme of the utility model, inhale ripples sticky tape still including setting up it is in to inhale the first single face on the wave layer from the type membrane.
The utility model discloses in, the wave-absorbing layer is the shaping on first single face is from the type membrane, nevertheless is inhaling the preparation of ripples sticky tape and accomplish the back, also can detach this first single face from the type membrane.
As the preferred technical scheme of the utility model, inhale ripples sticky tape still including setting up second single face on the second adhesive layer is from the type membrane.
The utility model discloses in, the second adhesive layer is the adhesive layer that is used for pasting to cover, and the second single face is used for protecting the second adhesive layer from the type membrane, prevents its surface contamination and loses the adhesion function.
As the preferred technical scheme of the utility model, inhale ripples sticky tape and leave the type membrane including the first single face that stacks gradually from type membrane, inhale ripples layer, first adhesive layer, base film, second adhesive layer and second single face.
As the preferred technical scheme of the utility model, inhale the ripples layer and be inhaling ripples polyurethane layer, inhale ripples acrylic resin layer or inhale ripples epoxy layer.
It is required to explain, the utility model discloses in inhale ripples polyurethane layer, inhale ripples acrylic resin layer, inhale ripples epoxy layer and indicate that polymer matrix material is polyurethane, acrylic resin, epoxy's absorbing layer respectively, the utility model discloses well absorbing layer more preferably is inhaling ripples polyurethane layer.
As the preferable technical proposal of the utility model, the thickness of the wave-absorbing layer is 30-80 μm; for example, it may be 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm, 48 μm, 50 μm, 52 μm, 55 μm, 58 μm, 60 μm, 62 μm, 65 μm, 68 μm, 70 μm, 72 μm, 75 μm, 78 μm or 80 μm.
The thickness of the wave-absorbing layer can be adjusted according to the required wave-absorbing performance, the thickness is increased, the contained wave-absorbing materials are increased, and the wave-absorbing performance of the adhesive tape is correspondingly improved. However, if the thickness of the wave-absorbing layer is too thick, the whole thickness of the adhesive tape is too thick, which is not beneficial to practical application, and the risk of cracking of the wave-absorbing layer is increased, therefore, the thickness of the wave-absorbing layer in the utility model is preferably 30-80 μm.
As the preferable technical proposal of the utility model, the thickness of the first adhesive layer is 3-15 μm; for example, it may be 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.
The utility model discloses in, the effect of first adhesive layer prevents on the one hand that microwave absorbing layer from taking place the fracture, and on the other hand makes microwave absorbing layer and base film bond as an organic wholely, and it is not used for sticky tape and other adhesions of being pasted the thing, consequently compares in the second adhesive layer, and first adhesive layer can select littleer thickness.
The utility model discloses do not have special restriction to the kind of first adhesive layer and second adhesive layer, exemplarily, first adhesive layer and second adhesive layer all can select for the acrylic acid adhesive layer.
As a preferred technical solution of the present invention, the base film is a PET (polyethylene terephthalate) film or a PI (polyimide) film.
PET films and PI films are commonly used as substrates for tapes, wherein the PET films are better in transparency and flexibility, and the PI films are higher in strength and heat resistance. The utility model discloses in, because the wave-absorbing layer has the problem of easy fracture, in order to increase the adaptability between wave-absorbing layer and the base film, therefore the base film is the better PET film of flexibility more preferably.
As the preferable technical proposal of the utility model, the thickness of the basal membrane is 1.9-25 μm; for example, it may be 1.9. mu.m, 2. mu.m, 3. mu.m, 4. mu.m, 5. mu.m, 6. mu.m, 7. mu.m, 8. mu.m, 9. mu.m, 10. mu.m, 11. mu.m, 12. mu.m, 13. mu.m, 14. mu.m, 15. mu.m, 16. mu.m, 17. mu.m, 18. mu.m, 19. mu.m, 20. mu.m, 21. mu.m, 22. mu.m, 23. mu.m, 24. mu.m, 25. mu.m.
The basal membrane is taken as the basic material of the wave-absorbing adhesive tape, and the adhesive tape is ensured to have proper stiffness and strength, so that the thickness of the basal membrane is preferably 1.9-25 mu m. If the base film is a PET film, the thickness thereof may be 1.9 to 25 μm; if the base film is a PI film, the thickness is usually difficult to process to 4.5 μm or less, and is selected to be 4.5 to 25 μm.
As the preferable technical proposal of the utility model, the thickness of the second adhesive layer is 10-50 μm; for example, it may be 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm, 48 μm or 50 μm.
In the utility model, the second adhesive layer is used for bonding with the object to be pasted, in order to ensure that the adhesive tape has enough bonding strength and not excessively increase the overall thickness of the adhesive tape, the thickness of the second adhesive layer is preferably 10-50 μm.
The utility model discloses in, there is not special restriction, exemplary to the preparation method of inhaling the wave sticky tape, can adopt following method:
(1) dissolving and dispersing wave-absorbing material powder and a polymer matrix material in an organic solvent, stirring and mixing uniformly by using a double-planet stirrer, filtering by using a 200-mesh and 500-mesh screen, coating the obtained dispersion on a single-sided release film, and drying to form a wave-absorbing layer;
(2) coating one side of the base film with a layer of adhesive, performing hot-pressing on the base film and the wave-absorbing layer obtained in the step (1), and drying to form a first adhesive layer;
(3) coating a layer of adhesive on the other side of the base film to form a second adhesive layer, compounding or not compounding a layer of single-sided release film on the second adhesive layer, and removing or not removing the single-sided release film on the wave absorbing layer to obtain the wave absorbing adhesive tape;
wherein the wave-absorbing material powder in the step (1) is ferrum-silicon-aluminum or ferrite, and the mesh number is 200-500 meshes;
the polymer matrix material in the step (1) is polyurethane, acrylic resin or epoxy resin;
the organic solvent in the step (1) is a mixture of toluene, ethyl acetate and DMF (dimethylformamide) according to the mass ratio of 1:1: 1;
the content of the wave-absorbing material in the wave-absorbing layer in the step (1) is 50-85 wt%;
the thickness of the first adhesive layer is 3-15 μm, the thickness of the second adhesive layer is 10-50 μm, and the adhesives adopted by the first adhesive layer and the second adhesive layer are acrylic adhesives.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses set up first adhesive layer between absorbed wave layer and base film, help preventing that absorbed wave layer from taking place the fracture. The wave-absorbing adhesive tape provided by the utility model has simple structure and smaller overall thickness, can be used for pasting internal elements of mobile terminals and other equipment, can effectively absorb electromagnetic waves and reduce electromagnetic pollution; or the ultra-thin radar wave-absorbing adhesive tape is pasted outside the equipment to play a role in radar stealth.
Drawings
Fig. 1 is a schematic cross-sectional structure view of the wave-absorbing adhesive tape provided in example 1;
FIG. 2 is a schematic cross-sectional view of the wave-absorbing adhesive tape provided in example 2;
FIG. 3 is a schematic cross-sectional view of the wave-absorbing adhesive tape provided in example 3;
FIG. 4 is a schematic cross-sectional view of the wave-absorbing adhesive tape provided in example 4;
wherein, 1 is the wave absorbing layer, 2 is the first adhesive layer, 3 is the base film, 4 is the second adhesive layer, 5 is the first single face from the type membrane, 6 is the second single face from the type membrane.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings. It should be understood by those skilled in the art that the specific embodiments described are merely to aid in understanding the present invention and should not be considered as specific limitations of the present invention.
Example 1
The embodiment provides a wave-absorbing adhesive tape, as shown in fig. 1, which includes a wave-absorbing layer 1, a first adhesive layer 2, a base film 3, and a second adhesive layer 4 stacked in sequence.
The wave-absorbing adhesive tape is prepared by the following method in the embodiment:
(1) dissolving and dispersing 200-mesh 500-mesh ferrosilicon aluminum powder and polyurethane powder (the mass ratio of the ferrosilicon aluminum powder to the polyurethane powder is 7:3) in a mixed solvent of toluene, ethyl acetate and DMF (the mass ratio is 1:1:1), uniformly stirring and mixing the mixture by using a double-planet stirrer, filtering the mixture by using a 200-mesh 500-mesh screen, coating the obtained dispersion on a single-sided release film, and drying the release film to form a wave-absorbing polyurethane layer (wave-absorbing layer 1) with the thickness of 50 mu m;
(2) coating one side of a PET film (base film 3) with the thickness of 8 mu m with a layer of acrylic acid adhesive, carrying out hot-pressing on the acrylic acid adhesive and the wave-absorbing polyurethane layer obtained in the step (1), and drying to form a first adhesive layer 2 with the thickness of 8 mu m;
(3) and coating a layer of acrylic acid adhesive on the other side of the PET film to form a second adhesive layer 4 with the thickness of 50 mu m, and removing the single-sided release film on the wave-absorbing polyurethane layer to obtain the wave-absorbing adhesive tape.
The wave-absorbing layer of the wave-absorbing adhesive tape provided by the embodiment has no cracking phenomenon, and is simple in structure and small in overall thickness. The wave-absorbing performance of the wave-absorbing adhesive tape provided by the embodiment is tested according to the method of GJB2038A-2011, the reflectivity of the wave-absorbing adhesive tape to electromagnetic waves with the frequency of 1-10GHz is less than or equal to-7 dB, and the electromagnetic waves can be effectively absorbed.
Example 2
The embodiment provides a wave-absorbing adhesive tape, as shown in fig. 2, which includes a first single-sided release film 5, a wave-absorbing layer 1, a first adhesive layer 2, a base film 3, and a second adhesive layer 4, which are stacked in sequence.
The wave-absorbing adhesive tape is prepared by the following method in the embodiment:
(1) dissolving and dispersing 200-mesh 500-mesh ferrosilicon aluminum powder and polyurethane powder (the mass ratio of the two is 5:5) in a mixed solvent of toluene, ethyl acetate and DMF (the mass ratio is 1:1:1), stirring and mixing uniformly by using a double-planet stirrer, filtering by using a 200-mesh 500-mesh screen, coating the obtained dispersion on a single-sided release film (a first single-sided release film 5), and drying to form a wave-absorbing polyurethane layer (a wave-absorbing layer 1) with the thickness of 80 mu m;
(2) coating one side of a PET film (base film 3) with the thickness of 15 mu m with a layer of acrylic acid adhesive, carrying out hot-pressing on the acrylic acid adhesive and the wave-absorbing polyurethane layer obtained in the step (1), and drying to form a first adhesive layer 2 with the thickness of 15 mu m;
(3) and coating a layer of acrylic acid adhesive on the other side of the PET film to form a second adhesive layer 4 with the thickness of 30 mu m to obtain the wave-absorbing adhesive tape.
The wave-absorbing layer of the wave-absorbing adhesive tape provided by the embodiment has no cracking phenomenon, and is simple in structure and small in overall thickness. The wave-absorbing performance of the wave-absorbing adhesive tape provided by the embodiment is tested according to the method of GJB2038A-2011, the reflectivity of the wave-absorbing adhesive tape to electromagnetic waves with the frequency of 1-10GHz is less than or equal to-8 dB, and the electromagnetic waves can be effectively absorbed.
Example 3
The embodiment provides a wave-absorbing adhesive tape, as shown in fig. 3, which includes a wave-absorbing layer 1, a first adhesive layer 2, a base film 3, a second adhesive layer 4, and a second single-sided release film 6 stacked in sequence.
The wave-absorbing adhesive tape is prepared by the following method in the embodiment:
(1) dissolving and dispersing 200-mesh 500-mesh ferrosilicon aluminum powder and polyurethane powder (the mass ratio of the two is 8.5:1.5) in a mixed solvent of toluene, ethyl acetate and DMF (the mass ratio is 1:1:1), stirring and mixing uniformly by using a double-planet stirrer, filtering by using a 200-mesh 500-mesh screen, coating the obtained dispersion on a single-sided release film, and drying to form a wave-absorbing polyurethane layer (wave-absorbing layer 1) with the thickness of 30 mu m;
(2) coating one side of a PET film (base film 3) with the thickness of 2 mu m with a layer of acrylic acid adhesive, carrying out hot-pressing on the acrylic acid adhesive and the wave-absorbing polyurethane layer obtained in the step (1), and drying to form a first adhesive layer 2 with the thickness of 5 mu m;
(3) and coating a layer of acrylic acid adhesive on the other side of the PET film to form a second adhesive layer 4 with the thickness of 20 mu m, compounding a layer of single-sided release film (a second single-sided release film 6) on the second adhesive layer 4, and removing the single-sided release film on the wave-absorbing polyurethane layer to obtain the wave-absorbing adhesive tape.
The wave-absorbing layer of the wave-absorbing adhesive tape provided by the embodiment has no cracking phenomenon, and is simple in structure and small in overall thickness. The wave-absorbing performance of the wave-absorbing adhesive tape provided by the embodiment is tested according to the method of GJB2038A-2011, the reflectivity of the wave-absorbing adhesive tape to electromagnetic waves with the frequency of 1-10GHz is less than or equal to-6 dB, and the electromagnetic waves can be effectively absorbed.
Example 4
The embodiment provides a wave-absorbing adhesive tape, as shown in fig. 4, which includes a first single-sided release film 5, a wave-absorbing layer 1, a first adhesive layer 2, a base film 3, a second adhesive layer 4, and a second single-sided release film 6 stacked in sequence.
The wave-absorbing adhesive tape is prepared by the following method in the embodiment:
(1) dissolving and dispersing 200-mesh 500-mesh ferrosilicon aluminum powder and polyurethane powder (the mass ratio of the two is 6:4) in a mixed solvent of toluene, ethyl acetate and DMF (the mass ratio is 1:1:1), uniformly stirring and mixing the mixture by using a double-planet stirrer, filtering the mixture by using a 200-mesh 500-mesh screen, coating the obtained dispersion on a single-sided release film (a first single-sided release film 5), and drying the coating to form a wave-absorbing polyurethane layer (a wave-absorbing layer 1) with the thickness of 60 mu m;
(2) coating one side of a PET film (base film 3) with the thickness of 20 mu m with a layer of acrylic acid adhesive, carrying out hot-pressing on the acrylic acid adhesive and the wave-absorbing polyurethane layer obtained in the step (1), and drying to form a first adhesive layer 2 with the thickness of 10 mu m;
(3) and coating a layer of acrylic acid adhesive on the other side of the PET film to form a second adhesive layer 4 with the thickness of 40 mu m, and compounding a layer of single-sided release film (a second single-sided release film 6) on the second adhesive layer 4 to obtain the wave-absorbing adhesive tape.
The wave-absorbing layer of the wave-absorbing adhesive tape provided by the embodiment has no cracking phenomenon, and is simple in structure and small in overall thickness. The wave-absorbing performance of the wave-absorbing adhesive tape provided by the embodiment is tested according to the method of GJB2038A-2011, the reflectivity of the wave-absorbing adhesive tape to electromagnetic waves with the frequency of 1-10GHz is less than or equal to-7 dB, and the electromagnetic waves can be effectively absorbed.
The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.

Claims (10)

1. The wave-absorbing adhesive tape is characterized by comprising a wave-absorbing layer, a first adhesive layer, a base film and a second adhesive layer which are sequentially stacked.
2. The wave-absorbing adhesive tape according to claim 1, further comprising a first single-sided release film disposed on the wave-absorbing layer.
3. The wave-absorbing adhesive tape according to claim 1, further comprising a second single-sided release film disposed on the second adhesive layer.
4. The wave-absorbing adhesive tape according to any one of claims 1 to 3, which comprises a first single-sided release film, a wave-absorbing layer, a first adhesive layer, a base film, a second adhesive layer and a second single-sided release film, which are sequentially stacked.
5. The wave-absorbing adhesive tape according to claim 1, wherein the wave-absorbing layer is a wave-absorbing polyurethane layer, a wave-absorbing acrylic resin layer or a wave-absorbing epoxy resin layer.
6. The wave-absorbing adhesive tape according to claim 1, wherein the thickness of the wave-absorbing layer is 30-80 μm.
7. The wave-absorbing adhesive tape according to claim 1, wherein the thickness of the first adhesive layer is 3-15 μm.
8. The wave-absorbing adhesive tape according to claim 1, wherein the base film is a PET film or a PI film.
9. The wave-absorbing adhesive tape according to claim 1, wherein the thickness of the base film is 1.9-25 μm.
10. The wave-absorbing adhesive tape according to claim 1, wherein the thickness of the second adhesive layer is 10-50 μm.
CN201920812806.9U 2019-05-31 2019-05-31 Wave-absorbing adhesive tape Active CN210030552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920812806.9U CN210030552U (en) 2019-05-31 2019-05-31 Wave-absorbing adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920812806.9U CN210030552U (en) 2019-05-31 2019-05-31 Wave-absorbing adhesive tape

Publications (1)

Publication Number Publication Date
CN210030552U true CN210030552U (en) 2020-02-07

Family

ID=69345847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920812806.9U Active CN210030552U (en) 2019-05-31 2019-05-31 Wave-absorbing adhesive tape

Country Status (1)

Country Link
CN (1) CN210030552U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112768953A (en) * 2020-12-30 2021-05-07 深圳市信丰伟业科技有限公司 Flexible super-surface film for reducing SAR value

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112768953A (en) * 2020-12-30 2021-05-07 深圳市信丰伟业科技有限公司 Flexible super-surface film for reducing SAR value

Similar Documents

Publication Publication Date Title
EP2624676A1 (en) Electromagnetic wave shielding sheet for use in wireless power transmission
CN103609207B (en) electromagnetic wave interference suppressor
CN104134513A (en) Soft-magnetic composite film and manufacturing method and application of soft-magnetic composite film in electronic equipment
CN103619154A (en) Electromagnetic protection film with efficient shielding and electromagnetism absorption function
CN105542673A (en) Shading conductive adhesive and adhesive tape with strong shielding performance, and preparation methods thereof
CN103929933B (en) Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same
US20110149538A1 (en) Electronic Devices with Embedded Electromagnetic Materials and Process of Making the Same
KR20170076361A (en) Complex sheets with shielding and absorbing of electromagnetic waves and thermal dissipation, and methods of manufacturing the same
KR101679336B1 (en) Conductive tape for EMI shielding and manufacturing the same
CN210030552U (en) Wave-absorbing adhesive tape
CN105744816B (en) Electromagnetic wave shielding composite film
CN204265677U (en) The moistureproof electromagnetic shielding adhesive tape of a kind of shading
JP2019009396A (en) Electromagnetic wave shielding film and electronic component mounting substrate
CN206164976U (en) Printed circuit board who contains conductive film and electromagnetic shielding film
KR20160103397A (en) Coated tape with preventing electromagnetic interference and method for manufacturing of the same
CN104875441A (en) Screen protecting film for electronic product
CN110446397B (en) Heat dissipation shielding film and application thereof
CN203157257U (en) Compound type copper foil base plate with electromagnetic shielding effect
JP2000348916A (en) Manufacture of magnetic sheet
JP2003023287A (en) Radio wave absorbing sheet
JP2016207738A (en) Conductive adhesive sheet for FPC and FPC using the same
CN114179449A (en) Wave-absorbing material for folding screen and preparation method and application thereof
CN111410920A (en) Wave-absorbing shielding adhesive film and preparation method thereof
CN206164977U (en) Printed circuit board who contains electromagnetic shielding film
JP2001244684A (en) Magnetic body sheet

Legal Events

Date Code Title Description
GR01 Patent grant