CN108347839A - A kind of production method of multilayer circuit board - Google Patents
A kind of production method of multilayer circuit board Download PDFInfo
- Publication number
- CN108347839A CN108347839A CN201810243454.XA CN201810243454A CN108347839A CN 108347839 A CN108347839 A CN 108347839A CN 201810243454 A CN201810243454 A CN 201810243454A CN 108347839 A CN108347839 A CN 108347839A
- Authority
- CN
- China
- Prior art keywords
- circuit middle
- layer
- circuit
- middle layer
- location hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Abstract
The invention discloses a kind of production methods of multilayer circuit board, include the following steps：Prepare multiple circuit middle layers, location hole setting is carried out to it；The harmomegathus value for obtaining multiple circuit middle layers makes the positioning hole pattern of each circuit middle layer according to the harmomegathus value got；Position of positioning hole is determined according to the positioning hole pattern of circuit middle layer；Multiple circuit middle layers are subjected to riveted lamination according to the location hole, and prepreg is provided between the circuit middle layer two-by-two；It is superimposed copper foil layer respectively below multiple circuit middle layers surface layer and bottom after the riveted lamination；Each circuit middle layer is stacked successively, and the location hole of each circuit middle layer is corresponded to unanimously；Each circuit middle layer is fixed together across each location hole with locating piece；Pressing each circuit middle layer becomes multilayer circuit board.The present invention solves the technical issues of pcb board thickness made in the prior art cannot be satisfied lightening design.
Description
Technical field
The present invention relates to PCB technical fields more particularly to a kind of manufacturing method of multi-layer circuit board
Background technology
PCB Chineses are printed circuit board, are important electronic unit, are the supporters of electronic component, are electronics
The carrier of component electrical connection since it is made of electron printing, therefore is referred to as printed circuit board, with science
The development of technology, electronic product, such as mobile phone etc. are increasingly to lightening design, therefore, the lightening design of electronic product mainboard
Increasingly receive those skilled in the art's favor.
Electronic product mainboard is typically to be formed by stacking by copper-clad plate, prepreg and multiple pure copper foil line layers at present, so
And when electronic product mainboard needs up to 4 layers or more, such as cell phone mainboard is routinely 10 layers of pcb board, then makes
Nowadays the thickness of pcb board just cannot be satisfied the technical issues of to lightening design.
Invention content
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of production methods of multilayer circuit board, solve
The technical issues of pcb board thickness made in the prior art cannot be satisfied lightening design.
The technical solution adopted by the present invention to solve the technical problems is：
Prepare multiple circuit middle layers, location hole setting is carried out to it；The harmomegathus value for obtaining multiple circuit middle layers, according to
The harmomegathus value got makes the positioning hole pattern of each circuit middle layer；It is fixed to be determined according to the positioning hole pattern of circuit middle layer
Position hole site；According to the location hole by multiple circuit middle layers carry out riveted lamination, and the circuit middle layer two-by-two it
Between be provided with prepreg；It is superimposed copper foil respectively below multiple circuit middle layers surface layer and bottom after the riveted lamination
Layer；Each circuit middle layer is stacked successively, and the location hole of each circuit middle layer is corresponded to unanimously；It is passed through with locating piece each
Each circuit middle layer is fixed together by location hole；Pressing each circuit middle layer becomes multilayer circuit board.
As an improvement of the above technical solution, location hole is carried out to the layer side of multiple circuit middle layers by hole knockout to set
It sets.
As an improvement of the above technical solution, the location hole of each circuit middle layer is in the circuit middle layer
Position all same, and the location hole of interlayer corresponds among any two circuit.
As an improvement of the above technical solution, further include after multiple circuit middle layers being carried out location hole setting：To described
Circuit middle layer carries out pattern transfer so that the circuit middle layer is the insulation layer structure that upper and lower surface is provided with line layer；
Roughening treatment is carried out to the line layer and insulating layer.
As an improvement of the above technical solution, below multiple circuit middle layers surface layer after the riveted lamination and bottom
It is superimposed with prepreg respectively；It is added in the prepreg outer stack and states copper foil layer.
As an improvement of the above technical solution, the locating piece is all made of rivet positioning.
Beneficial effects of the present invention have：
Prepreg is set between any two by multiple circuit middle layers in the present invention, then by circuit middle layer surface layer and bottom
Layer lower section is superimposed copper foil layer respectively, is finally pressed, after realizing prepreg pressing, between multiple circuit middle layers most
The pressing of small spacing solves the technical issues of pcb board thickness made in the prior art cannot be satisfied lightening design.
Specific implementation mode
A kind of production method of multilayer circuit board, includes the following steps：
Prepare multiple circuit middle layers, location hole setting is carried out to it；The harmomegathus value for obtaining multiple circuit middle layers, according to
The harmomegathus value got makes the positioning hole pattern of each circuit middle layer；It is fixed to be determined according to the positioning hole pattern of circuit middle layer
Position hole site；According to the location hole by multiple circuit middle layers carry out riveted lamination, and the circuit middle layer two-by-two it
Between be provided with prepreg；It is superimposed copper foil respectively below multiple circuit middle layers surface layer and bottom after the riveted lamination
Layer；Each circuit middle layer is stacked successively, and the location hole of each circuit middle layer is corresponded to unanimously；It is passed through with locating piece each
Each circuit middle layer is fixed together by location hole；Pressing each circuit middle layer becomes multilayer circuit board.
Location hole setting is carried out to the layer side of multiple circuit middle layers by hole knockout, each circuit middle layer
Position all same of the location hole in the circuit middle layer, and uniform a pair of location hole of any two circuit centre interlayer
It answers, further includes after multiple circuit middle layers are carried out location hole setting：Pattern transfer is carried out to the circuit middle layer so that institute
It is the insulation layer structure that upper and lower surface is provided with line layer to state circuit middle layer；The line layer and insulating layer are carried out at roughening
It manages, prepreg is superimposed with respectively below the multiple circuit middle layers surface layer and bottom after the riveted lamination；Described half
Cured sheets outer stack adds and states copper foil layer.The locating piece is all made of rivet positioning.
Prepreg is set between any two by multiple circuit middle layers in the present invention, then by circuit middle layer surface layer and bottom
Layer lower section is superimposed copper foil layer respectively, is finally pressed, after realizing prepreg pressing, between multiple circuit middle layers most
The pressing of small spacing solves the technical issues of pcb board thickness made in the prior art cannot be satisfied lightening design.
The above, only better embodiment of the invention, but the present invention is not limited to above-described embodiments, as long as
It reaches the technique effect of the present invention with any same or similar means, should all belong to the scope of protection of the present invention.
Claims (6)
1. a kind of production method of multilayer circuit board, which is characterized in that include the following steps：
Prepare multiple circuit middle layers, location hole setting is carried out to it；The harmomegathus value for obtaining multiple circuit middle layers, according to acquisition
To harmomegathus value make the positioning hole pattern of each circuit middle layer；Location hole is determined according to the positioning hole pattern of circuit middle layer
Position；Multiple circuit middle layers are subjected to riveted lamination according to the location hole, and are set between the circuit middle layer two-by-two
It is equipped with prepreg；It is superimposed copper foil layer respectively below multiple circuit middle layers surface layer and bottom after the riveted lamination；According to
It is secondary to stack each circuit middle layer, and the location hole of each circuit middle layer is corresponded to unanimously；Each positioning is passed through with locating piece
Each circuit middle layer is fixed together by hole；Pressing each circuit middle layer becomes multilayer circuit board.
2. a kind of production method of multilayer circuit board according to claim 1, which is characterized in that by hole knockout to more
The layer side of a circuit middle layer carries out location hole setting.
3. a kind of production method of multilayer circuit board according to claim 2, which is characterized in that among each circuit
Position all same of the location hole of layer in the circuit middle layer, and the location hole of any two circuit centre interlayer is one by one
It is corresponding.
4. a kind of production method of multilayer circuit board according to claim 1, which is characterized in that by multiple circuit middle layers
Further include after carrying out location hole setting：Pattern transfer is carried out to the circuit middle layer so that the circuit middle layer is upper and lower
Two sides is provided with the insulation layer structure of line layer；Roughening treatment is carried out to the line layer and insulating layer.
5. a kind of production method of multilayer circuit board according to claim 1, which is characterized in that after the riveted lamination
Multiple circuit middle layers surface layer and bottom below be superimposed with prepreg respectively；It is added in the prepreg outer stack and states copper
Layers of foil.
6. a kind of production method of multilayer circuit board according to any one of claims 1 to 5, which is characterized in that described fixed
Position part is all made of rivet positioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810243454.XA CN108347839A (en) | 2018-03-23 | 2018-03-23 | A kind of production method of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810243454.XA CN108347839A (en) | 2018-03-23 | 2018-03-23 | A kind of production method of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108347839A true CN108347839A (en) | 2018-07-31 |
Family
ID=62957719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810243454.XA Pending CN108347839A (en) | 2018-03-23 | 2018-03-23 | A kind of production method of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108347839A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3346689A (en) * | 1965-01-29 | 1967-10-10 | Philco Ford Corp | Multilayer circuit board suing epoxy cards and silver epoxy connectors |
| CN104244567A (en) * | 2014-09-30 | 2014-12-24 | 信利电子有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN204157152U (en) * | 2014-09-30 | 2015-02-11 | 信利电子有限公司 | A kind of multilayer circuit board |
-
2018
- 2018-03-23 CN CN201810243454.XA patent/CN108347839A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3346689A (en) * | 1965-01-29 | 1967-10-10 | Philco Ford Corp | Multilayer circuit board suing epoxy cards and silver epoxy connectors |
| CN104244567A (en) * | 2014-09-30 | 2014-12-24 | 信利电子有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN204157152U (en) * | 2014-09-30 | 2015-02-11 | 信利电子有限公司 | A kind of multilayer circuit board |
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