CN215529423U - Circuit board assembly and electronic device - Google Patents

Abstract

The application provides a circuit board assembly and electronic equipment, wherein, circuit board assembly includes: a first circuit board; the connecting circuit board comprises a first side surface and a second side surface, the first side surface is connected with the first circuit board, and the first circuit board and the connecting circuit board are electrically connected; and the second side surface of the second circuit board is connected with the second circuit board so that the second circuit board and the connecting circuit board form electrical connection, wherein the connecting circuit board is vertically arranged between the first circuit board and the second circuit board. The application provides a first side and the first circuit board of circuit board assembly connecting circuit board are connected, and the second side is connected with the second circuit board for connecting circuit board stands between first circuit board and second circuit board, thereby need not copperize again outside connecting circuit board and come the shielding, and the copper on connecting circuit board's signal layer can realize shielding environmental interference, and the thickness of connecting circuit board simultaneously also can reduce. Thus, the performance of the circuit board assembly is improved, and meanwhile, the cost is reduced.

Description

Circuit board assembly and electronic device

Technical Field

The application belongs to the technical field of circuit boards, and particularly relates to a circuit board assembly and electronic equipment.

Background

In the related art, as more and more components are mounted on a Printed Circuit Board (PCB), a frame structure 100' formed by stacking two PCBs is generally used to meet the requirement.

Specifically, as shown in fig. 1 and 2, the shelf structure 100 ' generally includes a main board 110 ', a shelf 120 ', and a connecting plate 130 ', and electronic components 140 ' may be mounted on the main board 110 ' and the shelf 120 ', so as to perform corresponding functions.

As shown in fig. 3, the front and back surfaces of the connection board 130 ' face the main board 110 ' and the chassis 120 ', respectively, and the via hole 150 ' is formed in the connection board 130 ', and both ends of the via hole 150 ' are connected to the main board 110 ' and the chassis 120 ', respectively, so as to electrically connect the main board 110 ' and the chassis 120 ', and a copper-plated shielding layer 160 ' is required to be separately formed on the connection board, which leads to an increase in cost.

As shown in fig. 4, the connecting plate 130' has a ring shape in plan view, and is provided with a hole disk. Therefore, as shown in fig. 5, the connection plate 130 'is manufactured by a plate assembly, and a large amount of space is wasted due to the annular structure of the connection plate 130', so that the connection plate 130 'manufactured at the same time is limited, and the production efficiency is low, and the thickness of the connection plate 130' is also high due to the sufficient space required between the main plate 110 'and the frame plate 120', which also results in high cost.

SUMMERY OF THE UTILITY MODEL

The present application aims to provide a circuit board assembly and an electronic device, which can solve one of the problems of the too high cost of the shelf board structure.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the present application provides a circuit board assembly comprising: a first circuit board; the connecting circuit board comprises a first side surface and a second side surface, the first side surface is connected with the first circuit board, and the first circuit board and the connecting circuit board are electrically connected; and the second side surface of the second circuit board is connected with the second circuit board so that the second circuit board and the connecting circuit board form electrical connection, wherein the connecting circuit board is vertically arranged between the first circuit board and the second circuit board.

In a second aspect, the present application provides an electronic device comprising: the circuit board assembly as provided in the embodiments of the first aspect.

In the embodiment of the application, the circuit board assembly comprises a first circuit board, a second circuit board and a connecting circuit board, the three are electrically connected, thereby realizing the transmission of signals, and realizing the signal processing function of the circuit board assembly, furthermore, the connecting circuit board comprises a first side surface and a second side surface, the first side surface is connected with the first circuit board, the second side surface is connected with the second circuit board, so that the connecting circuit board stands between the first circuit board and the second circuit board, therefore, the thickness of the connecting circuit board is not restricted by electronic elements, only the corresponding width is set according to actual needs, and the connecting strength is ensured, thereby reducing the production cost of the connecting circuit board and reducing the production cost of the circuit board assembly.

And the shielding can be increased by increasing the number of layers of the connecting circuit board without singly plating copper for shielding, thereby reducing the production cost of the connecting circuit board and reducing the production cost of the circuit board assembly.

Furthermore, the connecting circuit board is connected with the first circuit board and the second circuit board in the peripheral side mode, and the connecting circuit board does not need to be arranged into a frame shape, so that more connecting circuit boards can be arranged simultaneously when the connecting circuit board is produced by splicing boards, more connecting circuit boards can be produced at one time, the production flow is optimized, the production cost of the connecting circuit board is reduced, and the production cost of a circuit board assembly is reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view showing one direction of a shelf structure in the related art;

FIG. 2 is a schematic view of another orientation of a deck structure in the related art;

FIG. 3 is a schematic view of a deck structure in the related art;

FIG. 4 is a schematic structural view of a connecting plate in a shelf plate structure in the related art;

FIG. 5 is a schematic view of a panel in the construction of a panel according to the prior art;

FIG. 6 is a schematic view of a shelf board structure in a related art when tested;

FIG. 7 is a schematic diagram of a circuit board assembly provided by one embodiment of the present application;

FIG. 8 is a schematic diagram of a connection circuit board in a circuit board assembly provided by one embodiment of the present application;

FIG. 9 is a schematic view of a panel assembly for use in the production of a circuit board assembly according to one embodiment of the present application;

FIG. 10 is a schematic diagram of a circuit board assembly provided by one embodiment of the present application;

FIG. 11 is a schematic diagram of a circuit board assembly provided by an embodiment of the present application at test time;

FIG. 12 is a schematic diagram of a circuit board assembly provided by one embodiment of the present application;

FIG. 13 is a schematic diagram of a second circuit board in a circuit board assembly provided by one embodiment of the present application;

fig. 14 is a schematic diagram of a circuit board assembly provided in an embodiment of the present application at test time.

Fig. 1 to 6 reference numerals:

100 'shelf board structure, 110' main board, 120 'shelf board, 130' connecting board, 140 'electronic element, 150' via hole, 160 'shielding layer and 170' debugging board;

fig. 7 to 14 reference numerals:

100 circuit board assembly, 110 first circuit board, 112 first via hole, 114 first groove structure, 120 connection circuit board, 122 first signal layer, 124 second signal layer, 126 first shielding layer, 128 second shielding layer, 130 connection via hole, 132 first plug part, 134 second plug part, 140 second circuit board, 142 second via hole, 144 second groove structure, 150 solder.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," "bottom," "inner," "outer," "horizontal," "vertical," and the like, as used herein, refer to an orientation or positional relationship as shown in the accompanying drawings, which are used for convenience in describing and simplifying the present application, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The circuit board assembly 100 and the electronic device according to the embodiment of the present application are described below with reference to fig. 7 to 14.

As shown in fig. 7, 10 and 12, a circuit board assembly 100 according to one embodiment of the present application includes: a first circuit board 110; a connection circuit board 120 including a first side and a second side, the first side being connected to the first circuit board 110 and electrically connecting the first circuit board 110 and the connection circuit board 120; and a second circuit board 140, the second side surface and the second circuit board being connected such that the second circuit board 140 and the connection circuit board 120 form an electrical connection, wherein the connection circuit board 120 is vertically disposed between the first circuit board 110 and the second circuit board 140.

The circuit board assembly 100 of an embodiment of the present application includes a first circuit board 110, a second circuit board 140 and a connection circuit board 120, which are electrically connected to each other, so as to implement signal transmission and implement a signal processing function of the circuit board assembly 100.

Specifically, the connection circuit board 120 includes a front surface, a back surface, a first side surface and a second side surface, wherein the front surface and the back surface are opposite to each other, and the first side surface and the second side surface are disposed on the periphery sides of the front surface and the back surface.

Also, the first side of the connection circuit board 120 is connected to the first circuit board 110, and the second side is connected to the second circuit board 140, specifically, the first side and the second side may be two adjacent sides of the connection circuit board 120, or two sides of the connection circuit board 120 spaced apart from each other. The arrangement is such that the front and back sides of the connecting circuit board 120 are vertically sealed in the gap formed between the first circuit board 110 and the second circuit board 140.

Specifically, the first circuit board 110 is perpendicular to the connection circuit board 120, and the second circuit board 140 is perpendicular to the connection circuit board 120.

Wherein the distance between the first circuit board 110 and the second circuit board 140 is related to the size of the front side and the back side of the connecting circuit board 120, and particularly, the first side and the second side are two opposite sides of the connecting circuit board 120, the distance between the first circuit board 110 and the second circuit board 140 is related to the distance between the first side and the second side, and the distance between the first side and the second side is determined by the sizes of the front and rear surfaces of the connection circuit board 120, that is, the distance between the first circuit board 110 and the second circuit board 140 is not related to the thickness of the connection circuit board 120, therefore, the thickness of the connection circuit board 120 is not limited by the electronic components, and only needs to set a corresponding width according to actual needs to ensure the connection strength, thereby reducing the production cost of the connection circuit board 120 and reducing the production cost of the circuit board assembly 100.

Furthermore, the shielding of the connection circuit board 120 can be increased by increasing the number of layers without plating copper separately for shielding, thereby reducing the production cost of the connection circuit board 120 and the production cost of the circuit board assembly 100.

Further, as shown in fig. 9, since the connection circuit board 120 is connected to the first circuit board 110 and the second circuit board 140 at the peripheral side, and the connection circuit board 120 does not need to be configured into a frame shape, when the connection circuit board 120 is produced by a jointed board, more connection circuit boards 120 can be arranged at the same time, so that more connection circuit boards 120 can be produced at one time, the production flow is optimized, the production cost of the connection circuit board 120 is reduced, and the production cost of the circuit board assembly 100 is reduced.

That is, the connection circuit board 120 in the present application is not soldered flatly, but is connected vertically between the first circuit board 110 and the second circuit board 140, and a plurality of layers of the connection circuit board 120 may be disposed, so that there is no need to plate copper outside the connection circuit board 120 again for shielding, the copper of the signal layer of the connection circuit board 120 in the present application may achieve shielding of environmental interference, and may also shield crosstalk between signals, and meanwhile, the thickness of the connection circuit board 120 may also be reduced. This improves performance of the circuit board assembly 100 while reducing costs.

Specifically, the present application replaces the annular connection board with the planar connection circuit board 120 in the related art, that is, four sides of the annular connection board can be separated into four planar connection circuit boards 120, and the specific structure of the connection circuit board is shown in fig. 7.

Specifically, the first side of the connection circuit board 120 is soldered to the front and back sides of the first circuit board 110 by the solder 150, and the second side of the connection circuit board 120 is connected to the front and back sides of the second circuit board 140 by the solder 150, thereby forming a double-layered circuit board assembly 100, saving space, and allowing more electronic components to be mounted on one circuit board assembly 100. Specifically, the flux 150 may be solder.

The connecting circuit board 120 may be a triangle structure, a quadrilateral structure, a pentagon structure, etc., the first circuit board 110 and the second circuit board 140 may be connected to adjacent sides of the connecting circuit board 120, respectively, or the first circuit board 110 and the second circuit board 140 may be connected to spaced sides of the connecting circuit board 120, respectively, that is, the shape of the connecting circuit board 120 and the connection manner of the connecting circuit board 120, the first circuit board 110 and the second circuit board 140 may be set according to the internal space form of the electronic device.

As one possible embodiment, as shown in fig. 7, 8, 10 and 12, the connection circuit board 120 includes: a plurality of stacked connection substrates; the first circuit board 110 includes: the multilayer first substrate is stacked, and at least part of layers in the multilayer connecting substrate are connected with at least part of layers in the multilayer first substrate; the second circuit board 140 includes: and the laminated multilayer second substrate, at least part of the layers in the multilayer connecting substrate and at least part of the layers in the multilayer second substrate are also connected.

Specifically, the connection circuit board 120 includes a plurality of layers of connection substrates stacked together, the plurality of layers of connection substrates are sequentially stacked in a front-to-back direction, the peripheral sides of the plurality of layers of connection substrates form a first side surface and a second side surface, the plurality of layers of connection substrates can increase the thickness of the connection circuit board 120 appropriately, so that the support strength of the first circuit board 110 and the second circuit board 140 can be enhanced when the first circuit board 110 and the second circuit board 140 are stacked, and the amount of the flux 150 between the first circuit board 110 and the connection circuit board 120 can be increased, the connection strength between the first circuit board 110 and the connection circuit board 120 can be enhanced, the amount of the flux 150 between the second circuit board 140 and the connection circuit board 120 can be increased, and the connection strength between the second circuit board 140 and the second connection board can be enhanced. Among them, the connection circuit board 120 may include a 1-layer connection substrate, a 2-layer connection substrate, a 4-layer connection substrate, a 6-layer connection substrate, an 8-layer connection substrate, or a 10-layer connection substrate, etc.

The first circuit board 110 includes a plurality of stacked first substrates, and specifically, different circuit board distributions can be manufactured by using the plurality of first substrates, so as to improve the integration performance of the circuit board assembly 100 and reduce the volume of the circuit board assembly 100. Among them, the first circuit board 110 may include a 1-layer first substrate, a 2-layer first substrate, a 4-layer first substrate, a 6-layer first substrate, an 8-layer first substrate, or a 10-layer first substrate, etc.

The second circuit board 140 includes a plurality of stacked second substrates, and specifically, different circuit board distributions can be manufactured by using the plurality of second substrates, so as to improve the integration performance of the circuit board assembly 100 and reduce the volume of the circuit board assembly 100. Among them, the second circuit board 140 may include a 1-layer second substrate, a 2-layer second substrate, a 4-layer second substrate, a 6-layer second substrate, an 8-layer second substrate, or a 10-layer second substrate, etc.

Wherein a portion of the layers of the multilayer connection substrate may be connected to a portion of the layers of the multilayer first substrate, and a portion of the layers of the multilayer connection substrate may be connected to a portion of the multilayer second substrate.

Specifically, the multilayer connection substrate may be divided into a plurality of groups, and each group is connected to a different multilayer first substrate and a different multilayer second substrate, so as to realize connection between different layers in the first circuit board 110 and different layers in the second circuit board 140, thereby improving the complexity of the circuit board assembly 100 and obtaining a circuit board with more various functions.

As a possible implementation, as shown in fig. 7 and 10, the first circuit board 110 further includes: a first via hole 112 penetrating a portion of the plurality of layers of the first substrate and connected to at least one layer of the plurality of layers of the first substrate, and a connection circuit board 120 connected to the first via hole 112; the second circuit board 140 further includes: the second via holes 142 penetrate through portions of the plurality of second substrates and are connected to at least one layer of the plurality of second substrates, and the connection circuit board 120 is connected to the second via holes 142, wherein the number of the first via holes 112 is one or more, the plurality of first via holes 112 are connected to at least one layer of the plurality of first substrates, which is the same as or different from the layer of the plurality of first substrates, the number of the second via holes 142 is one or more, and the plurality of second via holes 142 are connected to at least one layer of the plurality of second substrates, which is the same as or different from the layer of the plurality of second substrates.

Specifically, the first circuit board 110 is provided with a first via hole 112, the first via hole 112 is disposed through a portion of the multilayer first substrate and connected to one or more layers of the multilayer first substrate, and the connection circuit board 120 is connected to the first via hole 112 by a solder 150, wherein the first via hole 112 can connect one or more layers of the multilayer first substrate to the connection circuit board 120, and the layers not required to be connected can be cut outside the first via hole 112, so that one or more layers of the multilayer first substrate are connected to one or more layers of the multilayer connection substrate.

Similarly, the second circuit board 140 is provided with a second via hole 142, the second via hole 142 penetrates through a portion of the multilayer second substrate and is connected to one or more layers of the multilayer second substrate, and the connection circuit board 120 and the second via hole 142 are connected by a solder 150, wherein the second via hole 142 can connect one or more layers of the multilayer second substrate with the connection circuit board 120, and the layers that are not required to be connected can be cut outside the second via hole 142, so that the connection of one or more layers of the specified multilayer second substrate with one or more layers of the multilayer connection substrate is achieved.

Furthermore, by adopting the manner that the first via hole 112 and the second via hole 142 are connected with the connection circuit board 120, the connection between the designated layer of the first circuit board 110 and the designated layer of the second circuit board 140 can be achieved, and the connection form of the circuit board assembly 100 can be enriched.

Also, as shown in fig. 10, the number of the first via 112 and the second via 142 may be set as needed, for example: the first circuit board 110 has 8 layers, the second circuit board 140 has 8 layers, and each layer is independently connected between the two, so that 8 first via holes 112 are required to be respectively connected to different layers in the first circuit board 110, and 8 second via holes 142 are required to be respectively connected to different layers in the second circuit board 140, thereby realizing independent connection of different layers of the first circuit board 110 and the second circuit board 140.

The connection layer of the first via 112 and the second via 142 may be arbitrarily set, for example: layer 1-3 first or second vias 112 or 142, layer 1-5 first or second vias 112 or 142, layer 1-6 first or second vias 112 or 142, and so on.

Of course, a first via 112 may be connected to two layers of the first circuit board 110, a second via 142 may be connected to two layers of the second circuit board 140, and the two layers are electrically connected to each other through the connecting circuit board 120.

As one possible embodiment, as shown in fig. 7, 8 and 10, the connection circuit board 120 includes: and the at least one group of signal layers comprises at least one layer in the multilayer connection substrate, the at least one group of signal layers is connected with at least one layer in the multilayer first substrate and at least one layer in the multilayer second substrate, and the multilayer connection substrate in the same group in the at least one group of signal layers is connected.

Specifically, at least one layer of the multilayer connection substrate constitutes a set of signal layers, and one connection circuit board 120 may include at least one set of signal layers, so that the same set of signal layers realizes signal transmission between one or more layers of the first circuit board 110 and the second circuit board 140, where the multiple layers form an electrical connection therebetween, or realize an electrical connection through the signal layers.

Specifically, the same group of signal layers in the multilayer connection substrate may be subjected to via-hole formation at the edge and cut off, so that a pad is formed by a portion of the via-hole, and soldering between the connection circuit board 120 and the first and second circuit boards 110 and 140 is achieved. The signal layer may include 1 group, 2 groups, 3 groups, 4 groups, 5 groups, or the like.

As a possible embodiment, as shown in fig. 7, 8 and 10, the connection circuit board 120 further includes: at least one group of shielding layers are arranged with the at least one group of signal layers.

Specifically, a set of shielding layers may be disposed on one side of a set of signal layers of the connection circuit board 120, so as to implement a screen signal, ensure that interference of the signal is reduced, and improve accuracy of signal transmission.

Wherein, a group of shielding layers can comprise one or more layers of the multilayer connection substrate.

In particular, a set of shielding layers may be disposed between two sets of signal layers. Wherein, the number of the shielding layers and the number of the signal layers can be the same or different.

As shown in fig. 7, 8 and 10, the at least one set of shielding layers may include a first shielding layer 126 and a second shielding layer 128, the first shielding layer 126 being disposed on a side of the first signal layer 122 facing away from the second signal layer 124, and the second shielding layer 128 being disposed between the first signal layer 122 and the second signal layer 124.

As a possible implementation, as shown in fig. 10 and 11, in the case that at least one set of signal layers is a plurality of sets, edges of the plurality of sets of at least one set of signal layers are staggered, a first step structure is formed on one side of the at least one set of signal layers, and a second step structure is formed on the other side of the at least one set of signal layers; the edges of the multilayer first substrates are staggered, a first groove structure 114 is formed on one side of the multilayer first substrates, and the first step structure is butted with the first groove structure 114; the edges of the multi-layer second substrate are staggered, a second groove structure 144 is formed on one side of the multi-layer second substrate, and the second step structure is butted with the second groove structure 144.

Specifically, the edge of the connecting circuit board 120 may form a first step structure and a second step structure, so that the first step structure may be abutted with the first groove structure 114 in the first circuit board 110, the second step structure may be abutted with the second groove structure 144 in the second circuit board 140, and the step structure may make the connection between the first circuit board 110 and the second circuit board 140 more stable, so that the connection between the first circuit board 110 and the second circuit board 140 may be achieved by only using one connecting circuit board 120, and further, the cost of the connecting circuit board 120 may be reduced, and the spatial arrangement of the circuit board assembly 100 in more polar environments may be adapted.

Specifically, the connection circuit board 120 includes a first signal layer and a second signal layer 124, the first signal layer may protrude from the second signal layer 124 on two opposite sides, so as to form a first step structure and a second step structure on two sides of the connection circuit board 120, specifically, a protruding length a of the first step structure protruding from the first signal layer is equal to a thickness B of the second signal layer 124, so that a first groove structure 114 having a depth identical to that of a and B may be formed on the first circuit board 110, wherein, since the connection circuit board 120 and the first circuit board 110 are both of a multilayer structure, a certain number of layers in a multilayer first substrate is actually cut off by the first groove structure 114, and a and B are identical, which may facilitate splicing and implementation of the first step structure and the first groove structure 114.

One side of at least one group of signal layers is connected with one side of the multilayer first substrate, and the other side of at least one group of signal layers is connected with one side of the multilayer second substrate.

Specifically, the first circuit board 110 may have a front surface or a back surface connected to a side surface of the connection circuit board 120, and the second circuit board 140 may have a front surface or a back surface connected to a side surface of the connection circuit board 120. Furthermore, the first circuit board 110 and the second circuit board 140 may form a double-layer structure, thereby reducing the overall volume of the circuit board assembly 100.

Wherein the first groove structure 114 is disposed at the edge of the first circuit board 110, the second groove structure 144 is disposed at the edge of the second circuit board 140, when mounting, the first groove structure 114 and the second groove structure 144 are opposite in front, the side of the first signal layer protruding first step structure is connected to the edge portion of the first circuit board 110 at the first groove structure 114, the side of the first signal layer protruding second step structure is connected to the edge portion of the second circuit board 140 at the second groove structure 144, the side of the second signal layer facing the first land structure, and a portion of the edge of the first mesa structure is connected to the first substrate at the bottom of the first recess structure 114, the side of the second signal layer 124 facing the second mesa structure, and portions of the second land feature edges are connected to the second base plate at the groove bottoms of the second groove features 144.

The signal on each step has two pads at two ends and the left side, respectively, and the front side of the first step structure facing the first circuit board 110 is also provided with a pad, the front side of the second step structure facing the second circuit board 140 is also provided with a pad, and the second signal layer 124 deviates from the first signal layer, and the portion at the edge of the second signal layer 124 is also provided with a pad.

As shown in fig. 11, the connection circuit board 120 may be removed to connect the first circuit board 110 and the second circuit board 140 to the front and the back, respectively, when performing a test.

Specifically, the first circuit board 110 may be connected to the front or back of the connection circuit board 120 at the time of testing, and the second circuit board 140 may be connected to the front or back of the connection circuit board 120 at the time of testing. Furthermore, the first circuit board 110 and the second circuit board 140 may be formed in an unfolded state so as to expose all electronic components, and when the circuit board assembly 100 is debugged, it is necessary to ensure that the electronic components on the circuit board assembly 100 are exposed, so that the configuration is convenient for debugging the circuit board assembly 100.

When the first groove structure 114 is arranged at the edge of the first circuit board 110, the second groove structure 144 is arranged at the edge of the second circuit board 140, when the first groove structure 114 and the second groove structure 144 are installed, the side faces of the first groove structure 114 are opposite, the front face of the first step structure protruding from the first signal layer is connected with the edge part of the first groove structure 114 on the first circuit board 110, the front face of the second step structure protruding from the first signal layer is connected with the edge part of the second groove structure 144 on the second circuit board 140, the second signal layer 124 is deviated from the first signal layer, the part of the first boss structure edge is connected with the first substrate at the groove bottom of the first groove structure 114, and the second signal layer 124 is deviated from the first signal layer, and the part of the second boss structure edge is connected with the second substrate at the groove bottom of the second groove structure 144.

In the related art, as shown in fig. 6, when testing the rack structure, the main board 110 ' and the rack 120 ' need to be disassembled, all the electronic components 140 ' are exposed, and then the two are mounted on a debugging board 170 ', so as to test the rack structure 100 '.

As shown in fig. 11, in the present application, the first circuit board 110 and the second circuit board 140 can expose all electrical components only by changing the connection form with the connection circuit board 120, so that a debugging board does not need to be added, and the cost for testing the circuit board assembly 100 is reduced.

Further, during debugging, the circuit board assembly 100 may be disassembled and mounted in the form of the embodiment shown in fig. 10, thereby exposing the electrical components for facilitating debugging of the circuit board assembly 100.

As one possible embodiment, as shown in fig. 12, 13 and 14, the connection circuit board 120 includes: at least one first insertion part 132 formed at one side of the connection circuit board 120; at least one second insertion part 134 formed at the other side of the connection circuit board 120; the first circuit board 110 includes: at least one first connection part, which is adapted to the first plugging part 132, and the first circuit board 110 and the connection circuit board 120 are spliced together by the first plugging part 132 and the first connection part; the second circuit board 140 includes: and at least one second connection part matched with the second plugging part 134, wherein the second circuit board 140 and the connection circuit board 120 are spliced through the second plugging part 134 and the second connection part.

Specifically, one side of the connection circuit board 120 is formed with a first insertion part 132, and the other side is formed with a second insertion part 134, and one side of the first circuit board 110 is formed with a first connection part which is engaged with the first insertion part 132 to increase the connection strength between the first circuit board 110 and the connection circuit board 120, and one side of the second circuit board 140 is formed with a second connection part which is engaged with the second insertion part 134 to increase the connection strength between the second circuit board 140 and the connection circuit board 120. The first mating portion 132 is an integral protrusion of all the multilayer connection substrates, and the second mating portion 134 is an integral protrusion of all the multilayer connection substrates.

In the related art, as shown in fig. 6, when testing the rack structure, the main board 110 ' and the rack 120 ' need to be disassembled, all the electronic components 140 ' are exposed, and then the two are mounted on a debugging board 170 ', so as to test the rack structure 100 '.

As shown in fig. 14, during testing, the first circuit board 110 or the second circuit board 140 may be folded back, so that all electronic components between the first circuit board 110 and the second circuit board 140 are exposed, and a debugging board is not required to be added, thereby facilitating debugging of the circuit board assembly 100.

Specifically, the first mating part 132 and the second mating part 134 may be protrusions, and the first connection part and the second connection part may be grooves, so that the first circuit board 110, the second circuit board 140 and the connection circuit board 120 are spliced by using the protrusions and the grooves.

In a first embodiment, the circuit board assembly 100 includes: the printed circuit board assembly includes a first circuit board 110, a second circuit board 140, and a connection circuit board 120, wherein the second circuit board 140 is a 10-layer circuit board, the first circuit board 110 is a 6-layer circuit board, the connection circuit board 120 and the first circuit board 110 are connected by a solder 150, the connection circuit board 120 and the second circuit board 140 are connected by the solder 150, the connection circuit board 120 is connected with a first via 112 on the first circuit board 110, the connection circuit board 120 is connected with a second via 142 on the second circuit board 140, and the connection circuit board 120 is vertically soldered between the first circuit board 110 and the second circuit board 140. The connection circuit board 120 is an 8-layer circuit board, two layers of the connection circuit board are shielding layers, the remaining 6 layers are divided into two groups, namely a first signal layer and a second signal layer 124, each signal layer has three layers of connection substrates, the same group of signal layers are connected through a connection via 130, and half of the connection via 130 is cut off to be used as a pad to ensure a welding area.

Specifically, when the connecting circuit board 120 is manufactured, a board splicing mode as shown in fig. 9 may be adopted, a plurality of connecting circuit boards 120 may be arranged between two outer boards, and the outer boards are connected to the connecting circuit boards 120 through connecting ribs. Compared with an annular connecting plate, the connecting circuit board 120 reduces the waste area and saves the cost when the jointed boards are manufactured. In which both sides of the connection circuit board 120 are soldered, that is, the connection via 130 is cut in half at both ends of the connection circuit board 120 in fig. 8.

As shown in fig. 8, both ends of the first and second signal layers 124 have connection vias 130, which also function as pads. The dotted line in fig. 8 is the ink layer, which mainly serves as insulation.

Specifically, the specific number of layers of the first circuit board 110, the second circuit board 140 and the connecting circuit board 120 may be set according to actual needs.

As shown in fig. 7, the layer-1-3 second via 142, the layer-1-5 second via 142 on the second circuit board 140, the layer-4-6 first via 112 on the first circuit board 110, and the layer-1-6 first via 112 are examples, and the via level may be changed as desired.

The connecting circuit board 120 is only vertically welded, the number of layers is not necessarily 8, the number of layers occupied by each group of signal lines may be arbitrary, the thickness of each layer and the arrangement of the connecting vias 130 serving as the bonding pads may also be arbitrary (two rows in the embodiment shown in fig. 7), the connecting vias 130 and the connecting vias 130 may be arranged in a staggered manner, no isolated ground wire may be provided, and only the cut-off portions of the connecting vias 130 may serve as the bonding pads. The connection circuit board 120 connecting the first circuit board 110 and the second circuit board 140 is not necessarily enclosed on four sides, and may be divided into any sections.

In the present application, as shown in fig. 7, the thickness of the connection circuit board 120 is not constrained by the height of the electronic component, but is related to the pad arrangement. The width of the pads is generally smaller than the thickness of the electronic component and the design is more arbitrary. In addition, the connecting circuit board 120 can conveniently shield crosstalk between signals by increasing the number of layers, and the increase of the thickness is small. Not only is the shielding performance of signals on the connecting circuit board 120 increased, the wiring density of the connecting circuit board 120 is increased, but also the area waste of the jointed boards is reduced, and the cost is saved.

In the second embodiment, as shown in fig. 10, the connection positions of the first circuit board 110 and the second circuit board 140 are both at the edge, and the connection circuit board 120 has only one block, the connection pads can be made into a step type, and the connection circuit board 120 has two-sided pads, as shown in fig. 11, the overall structure of the circuit board assembly 100 can be changed by changing the welding manner, so as to facilitate the debugging of the circuit board assembly 100.

Specifically, the second circuit board 140 may be a 10-layer circuit board or an 8-layer circuit board, the first circuit board 110 is an 8-layer circuit board, the connection circuit board 120 and the first circuit board 110 and the second circuit board 140 are connected by solder 150, and the connection circuit board 120 is an 8-layer circuit board. The pads soldered to the first circuit board 110, the second circuit board 140 and the connection circuit board 120 are all at the edge, and each row of pads is in step separation, that is, a first step structure and a second step structure are formed on the connection circuit board 120, a first groove structure 114 is formed on the first circuit board 110, a second groove structure 144 is formed on the second circuit board 140, and the height B in the horizontal direction and the height a in the vertical direction of the first step structure on the connection circuit board 120 are equal. The signal on each step has two pads, respectively at both ends and left position, and the front of first stair structure towards first circuit board 110 also is provided with the pad, and the front of second stair structure towards second circuit board 140 also is provided with the pad, and second signal layer 124 deviates from first signal layer one side, is located the part at second signal layer 124 edge, also is provided with the pad.

In the debugging process, the pads on the front or back of the first signal layer and the second signal layer 124 are used to be disposed in the circuit board assembly 100 as shown in fig. 11, so that the components sandwiched between the first circuit board 110 and the second circuit board 140 are exposed to the outside, thereby facilitating the debugging.

The first circuit board 110 and the second circuit board 140 may have the same lamination structure (i.e., the same layer thickness as the corresponding layer thickness), or may be different. The layer thickness and the number of layers of the connecting circuit board 120 may be the same as those of the first circuit board 110 or the second circuit board 140, or may be designed as required as long as the heights of the first step structure and the second step structure are consistent with those of the first circuit board 110 and the second circuit board 140. The arrangement of the bonding pads can be two rows or can be increased or decreased, and the bonding pads can also be provided with connecting through holes 130 which are directly connected with other signal layers. There may be other support structures between the first circuit board 110 and the second circuit board 140 besides the connection circuit board 120.

In addition, the chassis structure normally mounted at the time of debugging is soldered as shown in fig. 10, and at the time of debugging, the circuit board assembly 100 can be detached and soldered as shown in fig. 11 for the structure of the circuit board assembly 100. The pad on the connecting circuit board 120 is changed into the step shape, so that a debugging board can be omitted, the cost is saved, the lengths of all signal wires on the debugging board and a normal assembling board are almost the same, and the performance of the debugging board is closer to the normal use condition of the circuit board assembly 100.

The third concrete embodiment: the first circuit board 110 and/or the second circuit board 140 are provided with pads on both front and back sides and connected by vias, so that the pads can exist on the same plane. Thereby facilitating Surface Mounted Technology (SMT) soldering.

Specifically, a first insertion portion 132 and a second insertion portion 134 are respectively disposed on two sides of the connection circuit board 120, a first connection portion is disposed on one side of the first circuit board 110, a second connection portion is disposed on one side of the second circuit board 140, the first insertion portion 132 and the first connection portion are inserted together, and the second insertion portion 134 and the second connection portion are inserted together.

The first circuit board 110 is provided with a first connecting portion, the second circuit board 140 is provided with a second connecting portion, the first connecting portion and the second connecting portion form a groove, the first inserting portion 132 and the second inserting portion 134 form a protrusion, the first inserting portion 132 is inserted into the first connecting portion to form a splicing connection, and the second inserting portion 134 is inserted into the second connecting portion to form a splicing connection. Further, the stability and the structural strength between the first circuit board 110 and the connection circuit board 120 are increased by the engagement of the first mating portion 132 and the first connection portion, the stability and the structural strength between the second circuit board 140 and the connection circuit board 120 are increased by the engagement of the second mating portion 134 and the second connection portion, and the pads on the front and the back of the first circuit board 110 correspond to each other.

As shown in fig. 12, which is a configuration of the normal assembly of the circuit board assembly 100, when debugging, the first circuit board 110 may be connected in a reverse direction and connected to the connecting circuit board 120 by using the pads on the other side, as shown in fig. 14, wherein there may be a support between the first circuit board 110 and the second circuit board 140 at other positions.

As shown in fig. 12, 13 and 14, the pads on the first circuit board 110 and the second circuit board 140 are in one row, and through holes can be used, and if multiple rows are required to be designed symmetrically, a blind-buried hole combination can be changed.

Moreover, the engagement between the first connection portion and the first insertion portion 132, and the engagement between the second connection portion and the second insertion portion 134 are for enhancing the structural strength, and a pad may be added between the first connection portion and the second connection portion, and between the first insertion portion 132 and the second insertion portion 134, to further increase the structural strength, and if the first connection portion and the first insertion portion 132 are not provided, the engagement structure between the second connection portion and the second insertion portion 134 may also satisfy the stress, and the first connection portion, the second connection portion, the first insertion portion 132, and the second insertion portion 134 may be removed.

The front and back sides of the pad of the first circuit board 110 are symmetrical and can be welded in a front-back mode, so that a debugging board can be omitted during debugging, step-shaped pads are omitted, and the welding difficulty is reduced. The occlusion structure is added, and the structural strength is increased.

An electronic device according to an embodiment of the present application includes: the circuit board assembly 100 provided by the embodiment of the first aspect.

Therefore, the electronic device provided by the present application has all the advantages of the circuit board assembly 100 provided in the embodiment of the first aspect, and is not stated again.

Specifically, the electronic device further includes a screen module electrically connected to the circuit board assembly 100, and a housing in which the circuit board assembly 100 is disposed.

Specifically, the electronic device includes: terminals such as mobile phones, tablet computers, notebook computers, wearable devices and the like.

In the description herein, reference to the term "one embodiment," or "a specific embodiment," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A circuit board assembly, comprising:

a first circuit board;

the connecting circuit board comprises a first side surface and a second side surface, the first side surface is connected with the first circuit board, and the first circuit board and the connecting circuit board are electrically connected;

and the second side surface is connected with the second circuit board so that the second circuit board is electrically connected with the connecting circuit board, wherein the connecting circuit board is vertically arranged between the first circuit board and the second circuit board.

2. The circuit board assembly of claim 1,

the connection circuit board includes: a plurality of stacked connection substrates;

the first circuit board includes: the multilayer first substrate is stacked, and at least part of layers in the multilayer connection substrate are connected with at least part of layers in the multilayer first substrate;

the second circuit board includes: and at least part of the layers of the multilayer connection substrate are also connected with at least part of the layers of the multilayer second substrate.

3. The circuit board assembly of claim 2,

the first circuit board further includes:

the first via hole penetrates through the part of the multilayer first substrate and is connected with at least one layer of the multilayer first substrate, and the connecting circuit board is connected with the first via hole; the second circuit board further includes:

a second via hole penetrating a portion of the plurality of second substrates and connected to at least one of the plurality of second substrates, the connection circuit board being connected to the second via hole,

the number of the first through holes is one or more, the first through holes are connected with at least one layer which is the same or different in the multiple layers of the first substrates, the number of the second through holes is one or more, and the second through holes are connected with at least one layer which is the same or different in the multiple layers of the second substrates.

4. A circuit board assembly according to claim 2 or 3, wherein the connection circuit board comprises:

at least one set of signal layers including at least one of the multilayer connection substrates, the at least one set of signal layers being connected with at least one of the multilayer first substrate and at least one of the multilayer second substrate,

wherein the multilayer connection substrate included in the same one of the at least one group of signal layers is connected.

5. The circuit board assembly of claim 4, wherein the connection circuit board further comprises:

and the at least one group of shielding layers are laminated with the at least one group of signal layers.

6. The circuit board assembly of claim 4,

when the at least one group of signal layers are in a plurality of groups, the edges of the plurality of groups of signal layers are staggered, a first step structure is formed on one side of the at least one group of signal layers, and a second step structure is formed on the other side of the at least one group of signal layers;

the edges of the multilayer first substrates are staggered, a first groove structure is formed on one side of the multilayer first substrates, and the first step structure is butted with the first groove structure;

the edges of the multiple layers of second substrates are staggered, a second groove structure is formed on one side of the multiple layers of second substrates, and the second step structure is butted with the second groove structure.

7. Circuit board assembly according to one of the claims 1 to 3,

the connection circuit board includes:

at least one first insertion part formed at one side of the connection circuit board;

at least one second insertion part formed at the other side of the connection circuit board;

the first circuit board includes:

the first circuit board and the connecting circuit board are spliced through the first plugging part and the first connecting part;

the second circuit board includes:

and the second circuit board and the connecting circuit board are spliced through the second plugging part and the second connecting part.

8. Circuit board assembly according to one of the claims 1 to 3,

the first side surface and the second side surface are two opposite side surfaces of the connecting circuit board.

9. Circuit board assembly according to one of the claims 1 to 3,

the first side face and the first circuit board are connected through welding flux;

the second side and the second circuit board are connected by solder.

10. An electronic device, comprising:

a circuit board assembly according to any one of claims 1 to 9.

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