CN211457505U

CN211457505U - Multilayer printed circuit board structure

Info

Publication number: CN211457505U
Application number: CN201922327733.7U
Authority: CN
Inventors: 王�锋
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-09-08
Anticipated expiration: 2029-12-23

Abstract

The utility model provides a pair of multilayer printed wiring board structure, which comprises a circuit board, the circuit board includes from the top down and folds the upper plate, first prepreg, double sided board, second prepreg, the plywood down of establishing in proper order, the terminal surface is equipped with first inlayer circuit under the upper plate, both ends face is equipped with second inlayer circuit, third inlayer circuit respectively about the double sided board, lower plywood up end is equipped with fourth inlayer circuit, the open slot has still been seted up at first prepreg edge, the open slot inboard is connected with the inserting groove, both ends are equipped with first conductive terminal, second conductive terminal respectively about the inserting groove inboard, first conductive terminal with first inlayer circuit electric connection, second conductive terminal with second inlayer circuit electric connection. The utility model discloses a multilayer printed wiring board structure, the slot setting that will be used for grafting DRAM is inboard at the circuit board, has rationally utilized the space, can reduce the whole thickness behind the grafting DRAM.

Description

Multilayer printed circuit board structure

Technical Field

The utility model relates to a printed wiring board technical field, concretely relates to multilayer printed wiring board structure.

Background

Printed wiring boards are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the printed circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board is developed from a single layer to a double-sided board and a multilayer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, high-speed transmission, light weight and thin type. In the prior art, a printed circuit board, such as a printed circuit board for a computer, usually needs to be plugged with a memory strip, and the size of the inner strip is large, so that the traditional plugging structure is not favorable for the development of lightness and thinness of the computer.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a multilayer printed wiring board structure, the slot setting that will be used for grafting DRAM is inboard at the circuit board, has rationally utilized the space, can reduce the whole thickness after the grafting DRAM.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a multilayer printed wiring board structure, includes the circuit board, the circuit board includes from the top down superposes upper plate, first prepreg, double sided board, second prepreg, the lower plate of establishing in proper order, the terminal surface is equipped with first inlayer circuit under the upper plate, both ends face is equipped with second inlayer circuit, third inlayer circuit respectively about the double sided board, lower plate up end is equipped with fourth inlayer circuit, open slot has still been seted up at first prepreg edge, the open slot inboard is connected with the inserting groove, both ends are equipped with first conductive terminal, second conductive terminal respectively about the inserting groove inboard, first conductive terminal with first inlayer circuit electric connection, second conductive terminal with second inlayer circuit electric connection.

Specifically, a first platinum hole is further formed in the first semi-cured film, and the first inner layer circuit and the second inner layer circuit are electrically connected through the first platinum hole.

Specifically, a second gold plating hole is further formed in the second prepreg, and the third inner layer circuit and the fourth inner layer circuit are electrically connected through the second gold plating hole.

Specifically, an upper circuit is arranged on the upper end face of the upper plate, and a plurality of electronic elements are welded on the upper end of the upper circuit.

Specifically, the lower end of the edge of the upper plate and the upper end of the edge of the double-sided plate are respectively provided with a first limiting groove, and the upper end and the lower end of the edge of the first semi-cured sheet are respectively provided with a first limiting block matched with the first limiting grooves.

Specifically, the lower end of the edge of the double-sided board and the upper end of the edge of the lower-layer board are both provided with second limiting grooves, and the upper end and the lower end of the edge of the second prepreg are both provided with second limiting blocks matched with the second limiting grooves.

The utility model has the advantages that:

firstly, the multi-layer printed circuit board structure of the utility model arranges the slot for plugging the memory bank at the inner side of the circuit board, thereby reasonably utilizing the space and reducing the overall thickness after the memory bank is plugged;

and second, limiting grooves are additionally arranged at the lower end of the edge of the upper layer board, the upper end of the edge of the lower layer board and the upper end and the lower end of the edge of the double-sided board, and can prevent deviation of each layer after being pressed with a prepreg, so that the structural stability of the circuit board is improved.

Drawings

Fig. 1 is a schematic structural view of the multi-layer printed circuit board structure of the present invention.

The reference signs are: the structure comprises an upper layer board 1, an upper layer circuit 11, an electronic element 12, a first semi-cured sheet 2, an open slot 21, a plug-in slot 22, a first gold-plated hole 23, a double-sided board 3, a second semi-cured sheet 4, a second gold-plated hole 41, a lower layer board 5, a first conductive terminal 61, a second conductive terminal 62, a first limit slot 71, a second limit slot 72 and a memory bank 8.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

As shown in fig. 1:

a multilayer printed circuit board structure comprises a circuit board, wherein the circuit board comprises an upper layer board 1, a first semi-cured sheet 2, a double-sided board 3, a second semi-cured sheet 4 and a lower layer board 5 which are sequentially stacked from top to bottom, a first inner layer circuit is arranged on the lower end face of the upper layer board 1, a second inner layer circuit and a third inner layer circuit are respectively arranged on the upper end face and the lower end face of the double-sided board 3, a fourth inner layer circuit is arranged on the upper end face of the lower layer board 5, an open slot 21 is also formed in the edge of the first semi-cured sheet 2, an insertion slot 22 is connected to the inner side of the open slot 21, a first conductive terminal 61 and a second conductive terminal 62 are respectively arranged at the upper end and the lower end of the inner side of the insertion slot 22, a memory bank 8 is inserted into the insertion slot 22 along the open slot 21, conductive terminals at the two sides of the memory bank 8 are respectively contacted with the first conductive terminal 61 and the second conductive terminal 62, so as to realize, the second conductive terminal 62 and the second inner layer circuit can be electrically connected by welding conductive sheets such as copper sheets.

Preferably, a first gold hole 23 is further formed in the first semi-cured sheet 2, copper is plated on the inner wall of the first gold hole 23, and the first inner layer circuit and the second inner layer circuit are electrically connected through the first gold hole 23.

Preferably, a second gold hole 41 is further formed in the second prepreg 4, copper is plated on an inner wall of the second gold hole 41, and the third inner layer circuit and the fourth inner layer circuit are electrically connected through the second gold hole 41.

Preferably, the upper end surface of the upper plate 1 is provided with an upper layer circuit 11, and a plurality of electronic components 12 are welded on the upper end of the upper layer circuit 11.

Preferably, in order to prevent that the layering phenomenon takes place after the 5 pressfitting of top plate 1, first prepreg 2, the double sided board 3, second prepreg 4, the plywood, improve the structural stability of circuit board, 1 marginal lower extreme of top plate all is equipped with first spacing groove 71 with 3 marginal upper ends of double sided board, 2 marginal upper and lower both ends of first prepreg all are equipped with first spacing groove 71 assorted first stopper, 3 marginal lower extremes of double sided board and 5 marginal upper ends of lower floor's board all are equipped with second spacing groove 72, both ends all are equipped with the second stopper with second spacing groove 72 assorted about the second prepreg 4 marginal.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A multilayer printed circuit board structure comprises a circuit board and is characterized in that the circuit board comprises an upper layer board (1), a first semi-cured sheet (2), a double-sided board (3), a second semi-cured sheet (4) and a lower layer board (5) which are sequentially stacked from top to bottom, a first inner layer circuit is arranged on the lower end face of the upper layer board (1), a second inner layer circuit and a third inner layer circuit are respectively arranged on the upper end face and the lower end face of the double-sided board (3), a fourth inner layer circuit is arranged on the upper end face of the lower layer board (5), an open slot (21) is further formed in the edge of the first semi-cured sheet (2), an insertion groove (22) is connected to the inner side of the open slot (21), a first conductive terminal (61) and a second conductive terminal (62) are respectively arranged at the upper end and the lower end of the inner side of the insertion groove (22), and the first conductive terminal (61), the second conductive terminal (62) is electrically connected with the second inner layer circuit.

2. A multi-layer printed wiring board structure as claimed in claim 1, wherein a first vias (23) are further formed in the first semi-cured sheet (2), and the first inner layer circuit and the second inner layer circuit are electrically connected through the first vias (23).

3. The multilayer printed circuit board structure according to claim 1, wherein a second gold via (41) is further disposed in the second prepreg (4), and the third inner layer circuit and the fourth inner layer circuit are electrically connected through the second gold via (41).

4. A multilayer printed wiring board structure as claimed in claim 1, wherein said upper board (1) is provided with an upper layer wiring (11) on the upper end surface thereof, and a plurality of electronic components (12) are soldered on the upper end of said upper layer wiring (11).

5. The structure of the multi-layer printed circuit board as claimed in claim 1, wherein the lower edge of the upper plate (1) and the upper edge of the double-sided board (3) are provided with first limiting grooves (71), and the upper and lower ends of the edge of the first semi-cured sheet (2) are provided with first limiting blocks matched with the first limiting grooves (71).

6. The structure of the multi-layer printed circuit board according to claim 1, wherein the lower edge of the double-sided board (3) and the upper edge of the lower board (5) are both provided with a second limiting groove (72), and the upper and lower ends of the edge of the second prepreg (4) are both provided with a second limiting block matched with the second limiting groove (72).