CN106295518A - Fingerprint module and mobile terminal - Google Patents
Fingerprint module and mobile terminal Download PDFInfo
- Publication number
- CN106295518A CN106295518A CN201610607149.5A CN201610607149A CN106295518A CN 106295518 A CN106295518 A CN 106295518A CN 201610607149 A CN201610607149 A CN 201610607149A CN 106295518 A CN106295518 A CN 106295518A
- Authority
- CN
- China
- Prior art keywords
- pad
- copper foil
- foil layer
- fingerprint module
- fingerprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
- 239000011889 copper foil Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 45
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims 2
- 239000010974 bronze Substances 0.000 claims 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The open a kind of fingerprint module of the present invention, the printed circuit board (PCB) arranged including stacking and fingerprint recognition chip, described printed circuit board (PCB) includes substrate and is respectively formed at the first copper foil layer and second copper foil layer of described substrate both sides, described first copper foil layer includes multiple first pads being spaced, and described fingerprint recognition chip is positioned at the side away from described substrate of described second copper foil layer and just to the plurality of first pad.The shock resistance of fingerprint module of the present invention is stronger.Invention additionally discloses a kind of mobile terminal.
Description
Technical field
The present invention relates to fingerprint technical field of touch control, particularly relate to a kind of fingerprint module and the described fingerprint mould of a kind of application
The mobile terminal of group.
Background technology
Fingerprint refers to the lines of the finger tips positive surface skin recessed injustice of epirelief, although fingerprint is a little portion of human body skin
Point, but, it contains substantial amounts of information, and these lines are different on pattern, breakpoint and intersection point, in information processing
They being referred to as " feature ", it is different for medically having turned out these features for each finger, and these features tool
Having uniqueness and permanent, therefore we just can be mapped a people with his fingerprint, special by comparing his fingerprint
Seek peace the fingerprint characteristic pre-saved, it is possible to verify his true identity.Therefore, Fingerprint Lock is arisen at the historic moment, and Fingerprint Lock is intelligence
Energy lockset, it is the perfect crystallization of computer information technology, electronic technology, mechanical technique and modern five gold process.The spy of fingerprint
Property become and identify the most important evidence of identity and be widely used in police criminal detection and judicial domain.Lock particularly with mobile fingerprint,
Being the product that receives much concern of current mobile terminal, mobile fingerprint lock is a kind of induced signal to be converted into digital signal, it is achieved hands
The device of machine security set.
In daily life, mobile phone is that user carries with and use mobile terminal the most frequently, inevitably
The situation occurring some to inadvertently fall off or to be clashed into.Now, owing to mobile fingerprint lock is generally arranged at the surface of mobile phone, and
The shock resistance of conventional mobile phone Fingerprint Lock is more weak, and therefore mobile fingerprint lock is the most destroyed when being impacted.
Summary of the invention
The technical problem to be solved is the fingerprint module providing a kind of shock resistance stronger.
Additionally, also provide for a kind of mobile terminal applying described fingerprint module.
To achieve these goals, embodiment of the present invention adopts the following technical scheme that
On the one hand, it is provided that a kind of fingerprint module, the printed circuit board (PCB) arranged including stacking and fingerprint recognition chip, described print
Printed circuit board includes substrate and is respectively formed at the first copper foil layer and second copper foil layer of described substrate both sides, described first Copper Foil
Layer include multiple first pads of being spaced, described fingerprint recognition chip be positioned at described second copper foil layer away from described substrate
Side and just to the plurality of first pad.
Wherein, described second copper foil layer includes multiple second pad, the plurality of second pad and the plurality of first weldering
Dish one_to_one corresponding is arranged；
Described substrate includes that multiple linkage section, the plurality of linkage section are connected to the plurality of first pad correspondingly
And between described second pad.
Wherein, described first copper foil layer also includes continuous print the first copper face, and described first copper face is around the plurality of first
Pad is also spaced with the plurality of first pad.
Wherein, described second copper foil layer also includes continuous print the second copper face, and described second copper face is around the plurality of second
Pad is also spaced with the plurality of second pad.
Wherein, the plurality of first pad is matrix arrangement.
Wherein, described fingerprint recognition chip includes cog region and is positioned at the first connection terminal of described cog region periphery, institute
Stating cog region just to the plurality of first pad, described first connects terminal electrically connects described second copper foil layer.
Wherein, described second copper foil layer also includes that the second connection terminal, the plurality of second pad are electrically connected to described
Two connect terminal, and described second connects terminal electrical connection described first connects terminal.
Wherein, described printed circuit board (PCB) also includes that the first protective layer and the second protective layer, described first protective layer are positioned at institute
Stating the side away from described substrate of the first copper foil layer and expose the plurality of first pad, described second protective layer is positioned at institute
State the side away from described substrate of the second copper foil layer and expose described second connection terminal.
Wherein, described fingerprint module also includes flexible PCB, and one end electrical connection of described flexible PCB is the plurality of
First pad.
On the other hand, a kind of mobile terminal is also provided for, including the fingerprint module described in as above any one.
Compared to prior art, the method have the advantages that
Owing to described first copper foil layer includes the plurality of first pad, described fingerprint recognition chip is just to the plurality of
One pad is arranged, and described first pad uses copper material, and toughness is relatively strong, therefore improves the shock resistance of described fingerprint module
Ability, the impact resistance of the most described fingerprint recognition chip region so that described fingerprint module has more reliable
Properties of product and longer service life.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, the accompanying drawing used required in embodiment will be made below
Introduce simply, it should be apparent that, the accompanying drawing in describing below is only some embodiments of the present invention, general for this area
From the point of view of logical technical staff, on the premise of not paying creative work, it is also possible to as these accompanying drawings obtain other accompanying drawing.
Fig. 1 is the schematic diagram of a kind of fingerprint module that embodiment of the present invention provides.
Fig. 2 is the schematic diagram of the first copper foil layer of a kind of fingerprint module that embodiment of the present invention provides.
Fig. 3 is the schematic diagram of the second copper foil layer of a kind of fingerprint module that embodiment of the present invention provides.
Fig. 4 is the schematic diagram of the fingerprint recognition chip of a kind of fingerprint module that embodiment of the present invention provides.
Fig. 5 is the schematic diagram of another kind first copper foil layer of a kind of fingerprint module that embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clearly
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole realities
Execute mode.Based on the embodiment in the present invention, those of ordinary skill in the art are institute under not making creative work premise
The every other embodiment obtained, broadly falls into the scope of protection of the invention.
Additionally, the explanation of following embodiment is with reference to additional diagram, may be used to enforcement in order to illustrate the present invention
Particular implementation.The direction term being previously mentioned in the present invention, such as, " on ", D score, "front", "rear", "left", "right",
" interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings, therefore, the direction term of use be in order to more preferably, more clear
Chu ground illustrates and understands that the present invention rather than instruction or the device inferring indication or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, be therefore not considered as limiting the invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection ", " be arranged on ... on " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be removably to connect
Connect, or be integrally connected；Can be to be mechanically connected；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can
To be the connection of two element internals.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Additionally, in describing the invention, except as otherwise noted, " multiple " are meant that two or more.If this
Occurring the term of " operation " in description, it refers not only to independent operation, when cannot clearly distinguish with other operation, as long as
The effect desired by this operation that can realize then is also included within this term.It addition, in this specification with "～" the numerical value model that represents
Enclose refer to using "～" before and after the scope that is included as minima and maximum of numerical value recorded.In the accompanying drawings, structure
Similar or identical unit is indicated by the same numeral.
Seeing also Fig. 1 and Fig. 2, embodiment of the present invention provides a kind of fingerprint module 100, the print arranged including stacking
Printed circuit board 1 and fingerprint recognition chip 2.Described printed circuit board (PCB) 1 includes substrate 11 and is respectively formed at described substrate 11 both sides
The first copper foil layer 12 and the second copper foil layer 13, described first copper foil layer 12 includes multiple first pads 121 being spaced, institute
State fingerprint recognition chip 2 and be positioned at the side away from described substrate 11 of described second copper foil layer 13 and just to the plurality of first weldering
Dish 121.
In the present embodiment, owing to described first copper foil layer 12 includes the plurality of first pad 121, described fingerprint is known
The plurality of first pad 121 is just arranged by other chip 2, and described first pad 121 uses copper material, and toughness is relatively strong, because of
This improves the impact resistance of described fingerprint module 100, the shock resistance energy of the most described fingerprint recognition chip 2 region
Power so that described fingerprint module 100 has more reliable properties of product and longer service life.
The impact resistance of described fingerprint module 100 may be embodied in falling sphere strength test, relative to prior art middle finger
The stricture of vagina module intensity of 20g/3cm in the case of pad foam, fingerprint module 100 described in present embodiment can strengthen to 20g/17cm
And 25g/15cm, and described fingerprint module 100 is not in the case of padding foam, intensity also can reach 20g/13cm and 25g/
10cm。
Further, seeing also Fig. 1 to Fig. 3, as a kind of optional embodiment, described second copper foil layer 13 includes
Multiple second pads 131, the plurality of second pad 131 and the plurality of first pad 121 one_to_one corresponding.Described substrate 11 wraps
Including multiple linkage section, the plurality of linkage section is connected to the plurality of first pad 121 and described second pad correspondingly
Between 131.
In the present embodiment, due to the plurality of second pad 131 and the plurality of first pad 121 one_to_one corresponding,
The most described fingerprint recognition chip 2 is the most just to the plurality of second pad 131, thus can further improve described fingerprint module
The impact resistance of 100.
Optionally, described substrate 11 offers multiple through hole, by filling conducting objects in the plurality of through hole to be formed
The plurality of linkage section, the plurality of linkage section can realize the plurality of second pad 131 and the plurality of first pad 121 it
Between electrical connection.
Further, seeing also Fig. 1 to Fig. 3, as a kind of optional embodiment, described first copper foil layer 12 also wraps
Including continuous print the first copper face 122, described first copper face 122 welds around the plurality of first pad 121 and with the plurality of first
Dish 121 is spaced.
In the present embodiment, described first copper foil layer 12 can use a complete copper-clad surface, then by removing material
The mode of material processes described first copper face 122 and the plurality of first pad 121 being spaced, described first copper face 122
For the most complete, continuous print copper-clad surface.Described first copper face 122 can make described fingerprint module 100 have higher anti-impact
Hit ability, also can improve the bending strength of described fingerprint module 100 simultaneously.
Preferably, described first copper foil layer 12 also includes the first copper mesh 123, and described first copper mesh 123 is around described first
Copper face 122 is arranged.Described first copper mesh 123 is in latticed.
Certainly, in other embodiments, described first copper foil layer 12 includes multiple first pad 121 and the first copper mesh
123, described first copper mesh 123 is around the plurality of first pad 121 and and the plurality of first pad 121 interval setting.Institute
State the first copper mesh 123 in latticed.
Further, seeing also Fig. 1 to Fig. 3, as a kind of optional embodiment, described second copper foil layer 13 also wraps
Including continuous print the second copper face 132, described second copper face 132 welds around the plurality of second pad 131 and with the plurality of second
Dish 131 is spaced.
In the present embodiment, described second copper foil layer 13 can use a complete copper-clad surface, then by removing material
The mode of material processes described second copper face 132 and the plurality of second pad 131 being spaced, described second copper face 132
For the most complete, continuous print copper-clad surface.Described second copper face 132 can make described fingerprint module 100 have higher anti-impact
Hit ability, also can improve the bending strength of described fingerprint module 100 simultaneously.
Preferably, described second copper foil layer 13 also includes the second copper mesh 133, and described second copper mesh 133 is around described second
Copper face 132 is arranged.Described second copper mesh 133 is in latticed.
Certainly, in other embodiments, described second copper foil layer 13 includes multiple second pad 131 and the second copper mesh
133, described second copper mesh 133 is around the plurality of second pad 131 and and the plurality of second pad 131 interval setting.Institute
State the secondth copper mesh 133 in latticed.
Further, see also Fig. 1 to Fig. 3, as a kind of optional embodiment, single described first pad 121
Area more than the area of single described second pad 131, it is achieved foolproof function, prevent described fingerprint module 100 from occurring connecting
Mistake.
Preferably, the plurality of first pad 121 can use rectangle (including square), the plurality of second pad
131 can use circle.The area of single described first pad 121 is more than the area of single described second pad 131 of twice.
Further, seeing also Fig. 1 to Fig. 4, as a kind of optional embodiment, described fingerprint recognition chip 2 wraps
Including cog region 21 and be positioned at the first connection terminal 22 of described cog region 21 periphery, described cog region 21 is just to the plurality of first
Pad 121, described first connects terminal 22 electrically connects described second copper foil layer 13.
In the present embodiment, it is most susceptible to impact due to the described cog region 21 of described fingerprint recognition chip 2
Region, therefore makes described cog region 21 just to the plurality of first pad 121, can improve the anti-impact of described fingerprint module 100
Hitting ability, described fingerprint module 100 has more reliable properties of product and longer service life.
Preferably, when described fingerprint module 100 is applied to mobile terminal, described cog region 21 is positioned at described mobile terminal
Visible area or tangible district, described first connects terminal 22 is positioned at the non-visual and non-tactile district of described mobile terminal.
Further, seeing also Fig. 1 to Fig. 5, as a kind of alternative embodiment, the plurality of first pad 121 can
To arrange (as shown in Figure 5) in matrix.Or, the plurality of first pad 121 can substantially be arranged (such as Fig. 2 institute in matrix
Show), the most the plurality of first pad 121 is distributed in most of region of matrix, and subregion is not arranged.
It should be appreciated that multiple first pads 121 described in embodiment of the present invention mode be present by center big to surrounding
Causing the queueing discipline of uniformly dispersing, the center of the plurality of first pad 121 region has most reliable anti-impact
Hit ability.
Further, seeing also Fig. 1 to Fig. 4, as a kind of optional embodiment, described second copper foil layer 13 includes
Second connects terminal 134, and described second connects terminal 134 is formed at the neighboring area of described second copper foil layer 13, the plurality of
Second pad 131 is electrically connected to described second and connects terminal 134, and described second connects terminal 134 electrically connects described first connection
Terminal 22.
The plurality of second pad 131 can be connected to described second by copper foil circuit 135 and connect terminal 134, and described the
Two connect terminal 134 can connect described first connection terminal 22 by connecting line 3 (such as gold thread).
Preferably, described fingerprint module 100 also includes the described fingerprint recognition chip 2 of parcel and the envelope of described connecting line 3
Dress portion 4, in order to prevent extraneous steam to described fingerprint recognition chip 2 and the corrosion of described connecting line 3, protects described fingerprint recognition
Chip 2 and described connecting line 3.
Further, seeing also Fig. 1 to Fig. 4, as a kind of optional embodiment, described printed circuit board (PCB) 1 also wraps
Include the first protective layer 14 and the second protective layer 15.Described first protective layer 14 be positioned at described first copper foil layer 12 away from described base
The side of plate 11 also exposes the plurality of first pad 121, so that the plurality of second pad 131 can realize even with outside
Connect.Described second protective layer 15 is positioned at the side away from described substrate 11 of described second copper foil layer 13 and exposes described second
Connect terminal 134, so that described second connection terminal 134 can be connected terminal 22 and realize connecting with described first.
Preferably, the plurality of first pad 121 exposed and the surface of described second connection terminal 134 are coated with
Corrosion protective layer, such as nickel, gold coat.
Preferably, described fingerprint recognition chip 2 can be fixed on described second protective layer 15 by adhesive glue.
Further, seeing also Fig. 1 and Fig. 2, as a kind of optional embodiment, described fingerprint module 100 also wraps
Including flexible PCB 5, one end of described flexible PCB 5 electrically connects the plurality of first pad 121.Described flexible PCB 5
The other end in order to electrically connect process chip, described process chip in order to process the signal that described fingerprint recognition chip 2 is sent,
To realize the fingerprint touch controllable function of described fingerprint module 100.
Seeing also Fig. 1 to Fig. 5, embodiment of the present invention also provides for a kind of mobile terminal, including arbitrary enforcement
Fingerprint module 100 described in mode.Described mobile terminal includes but not limited to mobile phone, notebook, panel computer, POS, vehicle-mounted
Computer, camera etc..
Above embodiment of the present invention is described in detail, the specific case principle to the present invention used herein
And embodiment is set forth, the explanation of embodiment of above is only intended to help to understand that the method for the present invention and core thereof are thought
Think；Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, in specific embodiments and applications
All will change, in sum, this specification content should not be construed as limitation of the present invention.
Claims (10)
1. a fingerprint module, it is characterised in that include printed circuit board (PCB) and fingerprint recognition chip, described printing that stacking arranges
Circuit board includes substrate and is respectively formed at the first copper foil layer and second copper foil layer of described substrate both sides, described first copper foil layer
Including multiple first pads being spaced, described fingerprint recognition chip be positioned at described second copper foil layer away from described substrate
Side just to the plurality of first pad.
2. fingerprint module as claimed in claim 1, it is characterised in that described second copper foil layer includes multiple second pad, institute
State multiple second pad to arrange with the plurality of first pad one_to_one corresponding；
Described substrate includes that multiple linkage section, the plurality of linkage section are connected to the plurality of first pad and institute correspondingly
State between the second pad.
3. fingerprint module as claimed in claim 2, it is characterised in that described first copper foil layer also includes continuous print the first bronze medal
Face, described first copper face is spaced around the plurality of first pad and with the plurality of first pad.
4. fingerprint module as claimed in claim 3, it is characterised in that described second copper foil layer also includes continuous print the second bronze medal
Face, described second copper face is spaced around the plurality of second pad and with the plurality of second pad.
5. the fingerprint module as described in any one of Claims 1 to 4, it is characterised in that the plurality of first pad is matrix row
Cloth.
6. fingerprint module as claimed in claim 2, it is characterised in that described fingerprint recognition chip includes cog region and is positioned at institute
Stating the first connection terminal of cog region periphery, described cog region is just to the plurality of first pad, and described first connects terminal electricity
Connect described second copper foil layer.
7. fingerprint module as claimed in claim 6, it is characterised in that described second copper foil layer also includes the second connection terminal,
The plurality of second pad is electrically connected to described second and connects terminal, and described second connects terminal electrical connection described first connects end
Son.
8. fingerprint module as claimed in claim 7, it is characterised in that described printed circuit board (PCB) also includes the first protective layer and the
Two protective layers, described first protective layer is positioned at the side away from described substrate of described first copper foil layer and exposes the plurality of
First pad, described second protective layer is positioned at the side away from described substrate of described second copper foil layer and exposes described second
Connect terminal.
9. fingerprint module as claimed in claim 1, it is characterised in that described fingerprint module also includes flexible PCB, described
One end of flexible PCB electrically connects the plurality of first pad.
10. a mobile terminal, it is characterised in that include the fingerprint module as described in any one of claim 1～9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607149.5A CN106295518A (en) | 2016-07-28 | 2016-07-28 | Fingerprint module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607149.5A CN106295518A (en) | 2016-07-28 | 2016-07-28 | Fingerprint module and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106295518A true CN106295518A (en) | 2017-01-04 |
Family
ID=57662934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610607149.5A Pending CN106295518A (en) | 2016-07-28 | 2016-07-28 | Fingerprint module and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106295518A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08242045A (en) * | 1995-03-02 | 1996-09-17 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| CN104332452A (en) * | 2014-08-20 | 2015-02-04 | 深圳市汇顶科技股份有限公司 | Chip packaging module |
| CN105578749A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Circuit board connecting assembly and mobile terminal |
| CN206224511U (en) * | 2016-07-28 | 2017-06-06 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and mobile terminal |
-
2016
- 2016-07-28 CN CN201610607149.5A patent/CN106295518A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08242045A (en) * | 1995-03-02 | 1996-09-17 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| CN104332452A (en) * | 2014-08-20 | 2015-02-04 | 深圳市汇顶科技股份有限公司 | Chip packaging module |
| CN105578749A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Circuit board connecting assembly and mobile terminal |
| CN206224511U (en) * | 2016-07-28 | 2017-06-06 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and mobile terminal |
Non-Patent Citations (1)
| Title |
|---|
| 向守兵: "《电工电子实训教程》", 电子科技大学出版社, pages: 166 - 168 * |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |