JPH08242045A - Printed wiring board - Google Patents

Abstract

PURPOSE: To provide a printed wiring board which can improve the accuracy in inspection of continuity and function of a board, keeping the accuracy in positioning of parts during mounting of parts. CONSTITUTION: It becomes possible to mount an integrated circuit chip 2 in proper position and perform the continuity inspection of the pin and the function inspection of an integrated circuit chip 2 by connecting a land 17 for positioning during mounting of the integrated circuit chip 2 in the region of high mounting density and wiring density of the printed board body 1 to the wiring pattern 11 where a checker land for inspection of a board is not connected, by means of copper foil pattern 32, and using it as the land for inspection of a board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board provided with a circuit component having a narrow pitch, a positioning land attached to the circuit component, and a checker land.

[0002]

2. Description of the Related Art In recent years, mobile devices such as mobile phones have been downsized,
With the progress of weight reduction, the printed wiring boards inside mobile devices are also required to be downsized and have a smaller area. In addition, integrated circuit chips mounted on the printed wiring board in order to realize a small area of the printed wiring board have a narrow pitch (0.5 mm pitch, 0.3 mm pitch). Similarly, the wiring pattern width and the wiring pattern interval on the printed wiring board have come to be 0.1 mm.

A conventional printed wiring board will be described below with reference to the drawings. FIG. 4 is a partial plan view of a conventional printed wiring board. 1 is a printed circuit board body, 2 is an integrated circuit chip, 3 is connectors, 4, 5, 6 are through-hole lands, 7 to 13 are wiring patterns, 14, 15, 16
Is a checker land, 17 and 18 are positioning lands,
19 to 27 are copper foil lands for pin connection of the integrated circuit chip 2, and 28 to 31 are copper foil lands for pin connection of the connector 3. Further, in FIG. 4, all the shaded portions are covered with the partial resist of the copper foil pattern, and the hatched portions are all copper foil lands and are not covered with the resist, and the copper foil is exposed.

The printed wiring board is basically composed of a printed circuit board body 1 and circuit components (integrated circuit chip 2, connector 3, etc.) mounted on the printed circuit board body 1. The circuit components (integrated circuit chip 2, connector 3, etc.) are solder-mounted on the copper foil lands 19-27, 28-31, etc. on the printed circuit board body 1, and each copper foil land is connected to the wiring pattern 7-.
Connected by 11 and 13, circuit parts (integrated circuit chip 2,
The pins of the connector 3) are electrically connected. In addition, the through hole land 4 is the wiring pattern 12 and is the copper foil land 2.
Connected to 5.

In the printed wiring board of FIG. 4, the minimum wiring pattern width is 0.15 mm and the minimum wiring pattern interval is 0.15 m due to the restrictions on the pattern design of the printed circuit board body 1.
m, and the wiring patterns 7 to 13 have a pattern width of 0.15.
mm, the narrowest pattern interval of the wiring patterns 7, 8 and 9 has a pattern interval of 0.15 mm. The checker lands 14, 15, 16 are round lands having a diameter of 0.17 mm, the through hole lands 4, 5 are round lands having a diameter of 0.6 mm, the through hole lands 6 are round lands having a diameter of 0.8 mm, and the positioning land 17 is used. , 18 are 1 mm square corner lands. In addition, checker land 14, 15, 1
6, through-hole land 4, 5, 6, copper foil land 19 ~
The land interval distance of 31 is the distance between lands of the same component (for example, the distance between lands of copper foil lands 19 and 20: 0.2 m).
0.4 mm or more, except for m), checkerland 1
4, 15, 16, through-hole lands 4, 5, 6, copper foil lands 19-31 and unconnected wiring patterns 7-13, and the distance between lands is required to be 0.2 mm or more. The checker lands 14, 15, 16, through hole lands 4, 5, 6, copper foil lands 19-31, and wiring patterns 7-13 are arranged so as to satisfy this constraint. Here, with respect to the wiring pattern 11, checker lands cannot be arranged due to the above restrictions.

The structure and mounting inspection of the conventional printed wiring board having the above structure will be described below. There are roughly two items in the manufacturing process of a printed wiring board. One is the mounting of the circuit component on the printed circuit board body 1, and the second is the inspection process after the circuit component mounting.

In mounting the first circuit component, automatic mounting using a component mounter (chip mounter) is performed.
The component mounter first sucks the circuit components to be mounted (integrated circuit chip 2, connector 3, etc.) individually by suction nozzles, and the sucked circuit components are copper foil lands 19 to 27, 2.
8 to 31 are arranged on the printed circuit board body 1 on which cream solder is applied, and an operation of separating the suction nozzle is performed. When mounting this circuit component, it is necessary to accurately align the copper foil lands 19 to 27, 28 to 31 and the like on the printed circuit board body 1 to arrange the circuit component. In particular, in a circuit component having a narrow pitch (0.5 mm pitch) such as the integrated circuit chip 2, unless the alignment is accurately performed, many solder bridges are generated in the copper foil lands 19 to 27 and the like. Therefore, the positioning lands 17 and 18 for accurately mounting the integrated circuit chip 2 are used. Usually, the positioning lands 17 and 18 are 1 mm square copper foil lands and are not covered with resist. The component mounter uses positioning lands 17, 18 when arranging the integrated circuit chip 2.
The converged light is irradiated in the vicinity, and the position having the highest reflectance of the irradiated light is detected and used as the reference point for mounting the component, and the integrated circuit chip 2
To place. For a circuit component having a large number of pins on four sides like the integrated circuit chip 2, it is necessary to perform accurate alignment in the X-axis direction and the Y-axis direction of the component. Therefore, as shown in FIG. 4, two positioning lands 17 and 18 are arranged at diagonal positions with respect to the integrated circuit chip 2.

In the inspection process after mounting the second circuit component,
An inspection machine (checker) for inspecting the continuity of wiring and the operation of a circuit is used. As an inspection method, a method is used in which the inspection probe pins of the inspection machine are brought into contact with the checker lands 14, 15, 16 and the like on the printed wiring board to inspect the continuity between the pins of each component and the operation of the circuit component. In the inspection, the inspection probe pin and the checker land 14, 1
Positive contact with 5, 16 is required. Therefore, a round land having a diameter of 0.7 mm or more is used as the checker land. The checker lands 14, 15, 16 are connected to the wiring patterns 8, 10, 13 which electrically connect the pins of the integrated circuit chip 2 and the pins of the connector 3 of FIG. Here, since the checker land is not connected to the wiring pattern 11, it is impossible to inspect the continuity of the wiring and the operation of the circuit by using an inspection machine.

[0009]

However, in the above-mentioned conventional printed wiring board, there are wiring patterns in which checker lands cannot be arranged due to an increase in mounting component density and wiring pattern density in order to reduce the area. In other words, the wiring density around the integrated circuit chip is high, and the occupied area for mounting the integrated circuit chip (1 mm x 1 m
Since there is a wide positioning land (m), a wiring pattern in which the checker land cannot be arranged is generated, and the circuit components connected to this wiring pattern are electrically connected,
The problem that the operation cannot be inspected, or conversely, by mounting the component without placing the positioning land for placing the checker land, a defective item such as a solder bridge occurs when mounting the component. Had the problem.

In order to solve the above problems, the present invention connects a checker land in a region where a wiring density around the integrated circuit chip is high and a positioning land for mounting the integrated circuit chip is present. An object of the present invention is to provide a printed wiring board capable of inspecting the continuity and operation of a circuit component connected to a wiring pattern that is impossible.

[0011]

In order to achieve the above object, the present invention is to connect a positioning land of an integrated circuit chip and a wiring pattern in which a checker land cannot be arranged with a copper foil pattern.

[0012]

According to the present invention, the positioning land can be used as a checker land due to the above-mentioned structure.

[0013]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a partial plan view of a printed wiring board according to a first embodiment of the present invention, in which 1 is a printed circuit board body, 2 is an integrated circuit chip, 3 is connectors, 4, 5 and 6 are through-hole lands, 7 to 13 are wiring patterns, 14, 15, 16
Is a checker land, 17 and 18 are positioning lands,
19 to 27 are copper foil lands for pin connection of the integrated circuit chip 2, 28 to 31 are copper foil lands for pin connection of the connector 3, and 32 is a copper foil pattern for connecting the wiring pattern 11 and the positioning land 17. . Further, in FIG. 1, shaded portions are copper foil portions entirely covered with the resist, and hatched portions are copper foil portions entirely covered with the resist, and the copper foil is exposed.

The printed wiring board is basically composed of a printed circuit board body 1 and circuit components (integrated circuit chip 2, connector 3, etc.) mounted on the printed circuit board body 1. The circuit components (integrated circuit chip 2, connector 3, etc.) are solder-mounted on the copper foil lands 19-27, 28-31, etc. on the printed circuit board body 1, and each copper foil land is connected to the wiring pattern 7-.
Connected by 11 and 13, circuit parts (integrated circuit chip 2,
The pins of the connector 3) are electrically connected. In addition, the through hole land 4 is the wiring pattern 12 and is the copper foil land 2.
5 is electrically connected.

In this printed wiring board, the minimum wiring pattern width is 0.15 mm and the minimum wiring pattern interval is 0.15 mm due to the restriction of the pattern design of the printed circuit board body 1.
And the wiring patterns 7 to 13 have a pattern width of 0.15 m.
m, the portion of the wiring patterns 7, 8 and 9 with the smallest pattern interval has a pattern interval of 0.15 mm. The checker lands 14, 15, 16 are round lands having a diameter of 0.7 mm, the through hole lands 4, 5 are round lands having a diameter of 0.6 mm, the through hole lands 6 are round lands having a diameter of 0.8 mm, and the positioning land 17 is used. , 18 are 1 mm square corner lands. In addition, checker land 14, 15, 16,
Through hole lands 4, 5, 6, copper foil lands 19 to 31
The land-to-land distance is 0.4 mm or more, the checker lands 14 and 15, excluding the land-to-land distance of the same component (for example, the land distance between the copper foil lands 19 and 20: 0.2 mm).
16, through hole land 4, 5, 6, copper foil land 19
.About.31 and the unconnected wiring patterns 7 to 13, the copper foil pattern 32, and the distance between lands are required to be 0.2 mm or more. In FIG. 1, the checker lands 14, 15, 16 are provided so as to satisfy this constraint. Through hole land 4, 5,
6, copper foil lands 19 to 31, wiring patterns 7 to 13, and copper foil patterns 32 are arranged.

The manufacturing, mounting, and inspection of the printed wiring board configured as described above will be described below. There are roughly two items in the manufacturing process of a printed wiring board. One is the mounting of the circuit component on the printed circuit board body 1, and the second is the inspection process after the circuit component mounting.

When mounting the first circuit component, automatic mounting using a component mounter (chip mounter) is performed.
The component mounter first sucks the circuit components to be mounted (integrated circuit chip 2, connector 3, etc.) individually by suction nozzles, and the sucked circuit components are copper foil lands 19 to 27, 2.
8 to 31 are arranged on the printed circuit board body 1 on which cream solder is applied, and an operation of separating the suction nozzle is performed. When mounting this circuit component, it is necessary to accurately align the copper foil lands 19 to 27, 28 to 31 and the like on the printed circuit board body 1 to arrange the circuit component. In particular, in a circuit component having a narrow pitch (0.5 mm pitch) such as the integrated circuit chip 2, unless the alignment is accurately performed, many solder bridges are generated in the copper foil lands 19 to 27 and the like. Therefore, the positioning lands 17 and 18 for accurately mounting the integrated circuit chip 2 are used. Usually, the positioning lands 17 and 18 are 1 mm square copper foil lands and are not covered with resist. The component mounter uses positioning lands 17, 18 when arranging the integrated circuit chip 2.
The converged light is irradiated in the vicinity, and the position having the highest reflectance of the irradiated light is detected and used as the reference point for mounting the component, and the integrated circuit chip 2
To place. For a circuit component having a large number of pins on four sides like the integrated circuit chip 2, it is necessary to perform accurate alignment in the X-axis direction and the Y-axis direction of the component. Therefore, as shown in FIG. 1, two positioning lands 17 and 18 are arranged at diagonal positions with respect to the integrated circuit chip 2. Although the copper foil pattern 32 is connected to the positioning land 17, since the copper foil pattern 32 is covered with the resist, the irradiation light from the component mounter is less reflected than the copper foil portion. Therefore, it has little influence on the detection of the position having the highest reflectance of the irradiation light. Therefore, the component mounter places the integrated circuit chip 2 at an appropriate position on the printed circuit board body 1.

In the inspection process after mounting the second circuit component,
An inspection machine (checker) for detecting the continuity of wiring and the operation of a circuit is used. As the inspection direction, a method is used in which the inspection probe pins of the inspection machine are brought into contact with the checker lands 14, 15, 16 and the like on the printed wiring board to inspect the continuity between the pins of each component and the operation of the circuit component. In the inspection, the inspection probe pin and the checker land 14, 1
Positive contact with 5, 16 is required. Therefore, a round land having a diameter of 0.7 mm or more is used as the checker land. The checker lands 14, 15, 16 are connected to wiring patterns 8, 10, 13 for electrically connecting the pins of the integrated circuit chip 2 and the pins of the connector 3 of FIG. Since the positioning land 17 is connected to the wiring pattern 11 by the copper foil pattern 32,
Electrical continuity between the pins of the integrated circuit chip 2 connected to the copper foil lands 19 and the wiring of the connector 3 connected to the copper foil lands 30 using an inspection machine, and the circuit portion composed of the integrated circuit chip 2 and the connector 3 and the like. Inspect the behavior of.

FIG. 2 is a partial plan view of a printed wiring board according to a second embodiment of the present invention, and FIG. 3 is a partial perspective view of the same. In FIG. 2, 1 is a printed circuit board body, 2 is an integrated circuit chip, 3
Are connectors 4, 5, 6 are through hole lands, 7-1
3 is a wiring pattern, 14, 15 and 16 are checker lands, 17 and 18 are positioning lands, 19 to 27 are copper foil lands for pin connection of the integrated circuit chip 2, 28 to 31 are pin connection of the connector 3. Copper foil lands, 33 is a hermetically sealed interlayer connection via hole surface layer land, and 34 is a copper foil pattern that connects the hermetically sealed interlayer connection via hole surface layer land 33 and the copper foil land 19. In FIG. 2, the shaded area is the copper foil area covered with the resist, and the hatched area is the copper foil area covered with the resist, and the copper foil is exposed.

In FIG. 3, 17 is a positioning land,
19 is a copper foil land for connecting pins of the integrated circuit chip 2, 1
1 is a wiring pattern, 33 is a hermetically sealed interlayer connection via hole surface layer land, 34 is a copper foil pattern connecting the hermetically sealed interlayer connection via hole surface layer land 33 and the copper foil land 19, 35 is a hermetically sealed interlayer connection via hole body, and 36 is a hermetically sealed type Interlayer connection via hole inner layer land, 37 is a sealed interlayer connection via hole surface layer land in the positioning land 17, 38 is a sealed interlayer connection via hole body, 39 is a sealed interlayer connection via hole inner layer land, 40 is a sealed interlayer connection via hole inner layer An inner layer copper foil pattern connecting the land 36 and the closed-type interlayer connection via hole inner layer land 39, 41 is a surface layer of the printer board body 1, 42 is an inner layer of the printed board body 1, 43
Is a back layer of the printed circuit board body 1.

The printed wiring board is basically composed of a printed circuit board body 1 and circuit components (integrated circuit chip 2, connector 3, etc.) mounted on the printed circuit board body 1. The circuit components (integrated circuit chip 2, connector 3, etc.) are solder-mounted on the copper foil lands 19-27, 28-31, etc. on the printed circuit board body 1, and each copper foil land is connected to the wiring pattern 7-.
Connected by 11 and 13, circuit parts (integrated circuit chip 2,
The pins of the connector 3) are electrically connected. In addition, the through hole land 4 is the wiring pattern 12 and is the copper foil land 2.
5 is electrically connected. Furthermore, as shown in FIG.
The closed type interlayer connection via hole surface layer land 37, the closed type interlayer connection via hole body 38, and the closed type interlayer connection via hole inner layer land 39 lead to the inner layer 42 of the printed circuit board body, and the inner layer copper foil pattern 40 is used to form the closed type interlayer connection via hole. The inner layer land 39 and the hermetically sealed interlayer connection via hole inner layer land 36 are electrically connected to each other, and the hermetically sealed interlayer connection via hole inner layer land 36, the hermetically sealed interlayer connection via hole main body 35, and the hermetically sealed interlayer connection via hole surface layer land 33 allow the printed circuit board main body Guided to the surface layer 41, the closed type interlayer connection via hole surface layer land 33 to the copper foil pattern 34.
Is connected to the copper foil land 19.

In the printed wiring board of FIG. 2, the minimum wiring pattern width is 0.15 mm and the minimum wiring pattern interval is 0.15 m due to the restrictions on the pattern design of the printed circuit board body 1.
m, and the wiring patterns 7 to 13 have a pattern width of 0.15.
mm, the narrowest pattern interval of the wiring patterns 7, 8 and 9 has a pattern interval of 0.15 mm. Further, the checker lands 14, 15, 16 are round lands having a diameter of 0.7 mm, the through hole lands 4, 5 are round lands having a diameter of 0.6 mm, the through hole lands 6 are round lands having a diameter of 0.8 mm, and a sealed interlayer connection is provided. The via hole surface layer land 33 is a round land having a diameter of 0.6 mm, and the positioning lands 17 and 18 are 1 mm square lands. Furthermore, the checker lands 14, 15, and 16, the through hole lands 4, 5, and 6, the sealed type interlayer connection via hole surface layer land 33, and the copper foil land 1
The distance between lands 9 to 31 is the distance between lands of the same component (for example, the distance between lands of copper foil lands 19 and 20: 0.2 m).
0.4 mm or more, except for m), checkerland 1
4, 15, 16, through-hole lands 4, 5, 6, patterns of copper foil lands 19-31 and unconnected wiring patterns 7-13, copper foil pattern 34, distance between lands is 0.2.
2 mm or more is required, and in FIG. 2, checker lands 14, 15, 16, through hole lands 4, 5, 6, copper foil lands 19 to 31, wiring pattern 7 are provided so as to satisfy this constraint.
To 13, a copper foil pattern 34, and a sealed interlayer connection via hole surface layer land 33 are arranged.

The structure, mounting, and inspection of the printed wiring board having the above structure will be described below. There are roughly two items in the manufacturing process of a printed wiring board. One is the mounting of the circuit component on the printed circuit board body 1, and the second is the inspection process after the circuit component mounting. 1
When mounting the third circuit component, automatic mounting using a component mounter (chip mounter) is performed. The component mounter
First, the circuit components to be mounted (integrated circuit chip 2, connector 3
And the like) are individually adsorbed by the adsorption nozzle, and the adsorbed circuit components are arranged on the printed circuit board body 1 in which cream solder is applied to the copper foil lands 19 to 27, 28 to 31, etc.,
The suction nozzle is released. When mounting this circuit component, copper foil lands 19 to 27 on the printed circuit board main body 1,
It is necessary to accurately align 28-31 and the like and arrange circuit components. Especially integrated circuit chip 2
If a circuit component having such a narrow pitch (0.5 mm pitch) as described above is not accurately aligned, many solder bridges are generated in the copper foil lands 19 to 27 and the like. Therefore, the positioning lands 17 and 1 for accurately mounting the integrated circuit chip 2 are provided.
8 is used. Normally, this positioning land 17, 18
Is a 1 mm square copper foil land and is not covered with resist. The component mounter irradiates the positioning lands 17 and 18 with convergent light when arranging the integrated circuit chip 2 and detects the position where the reflectance of the radiated light is the highest to be a reference point for mounting the component. Place 2. For a circuit component having a large number of pins on four sides like the integrated circuit chip 2, it is necessary to perform accurate alignment in the X-axis direction and the Y-axis direction of the component. Therefore, as shown in FIG. 3, the positioning lands 17 and 18 are arranged at two diagonal positions with respect to the integrated circuit chip 2. The closed land interlayer connection via hole surface layer land 37 is overlaid on the positioning land 17, but the shape of the positioning land 17 is the same as that when the closed interlayer connection via hole surface land 37 is not overlaid because of the closed type. Therefore, it is possible to favorably detect the position having the highest reflectance of the irradiation light. Therefore, the component mounter places the integrated circuit chip 2 at an appropriate position on the printed circuit board body 1.

In the inspection process after mounting the second circuit component,
An inspection machine (checker) for inspecting the continuity of wiring and the operation of a circuit is used. As a wiring method, a method is used in which checker lands 14, 15, 16 on the printed wiring board are brought into contact with inspection probe pins of an inspection machine to inspect continuity between pins of each component and operation of circuit components. In the inspection, the inspection probe pin and the checker land 14, 1
Positive contact with 5, 16 is required. Therefore, a round land having a diameter of 0.7 mm or more is used as the checker land. The checker lands 14, 15, 16 are connected to wiring patterns 8, 10, 13 for electrically connecting the pins of the integrated circuit chip 2 and the pins of the connector 3 of FIG. Since the positioning lands 17 are connected to the wiring pattern 11 by the connection paths shown in FIG. 3, the pins of the integrated circuit chip 2 connected to the copper foil lands 19 using an inspection machine and the copper foil lands are used. The continuity of the wiring of the connector 3 connected to the connector 30, the operation of the integrated circuit chip 2, and the operation of the circuit portion constituted by the connector 3 and the like are inspected.

[0026]

As described above, according to the present invention, it is possible to accurately detect the component mounting position by using the component positioning land when mounting the component, the wiring density around the integrated circuit chip is high, and the integrated circuit is integrated. Positioning this wiring pattern to inspect the continuity and operation of the circuit components connected to the wiring pattern where the checker land cannot be connected in the area where the positioning land for mounting the circuit chip exists. The printed wiring board made possible by connecting the land for use can be realized.

[Brief description of drawings]

FIG. 1 is a partial plan view of a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a partial plan view of a printed wiring board according to a second embodiment of the present invention.

FIG. 3 is a partial perspective view of a printed wiring board according to a second embodiment of the present invention.

FIG. 4 is a partial plan view of a conventional printed wiring board.

[Explanation of symbols]

 1 Printed Circuit Board Main Body 2 Integrated Circuit Chip 3 Connector 4-6 Through Hole Land 7-13 Wiring Pattern 14-16 Checker Land 17, 18 Positioning Land 19-31 Copper Foil Land 32 Copper Foil Pattern 33 Sealed Interlayer Connection Via Hole Surface Layer Land 34 copper foil pattern 35 hermetically sealed interlayer connection via hole body 36 hermetically sealed interlayer connection via hole inner layer land 37 hermetically sealed interlayer connection via hole surface layer land 38 hermetically sealed interlayer connection via hole body 39 hermetically sealed interlayer connection via hole inner layer land 40 inner layer copper foil pattern 41 printed circuit board Surface layer of main body 42 Inner layer of printed circuit board body 43 Back layer of printed circuit board body

Claims (2)

[Claims] 1. A single or a plurality of circuit parts, a positioning land for mounting the circuit parts, a first wiring pattern for electrically connecting the circuit parts, the positioning land and the first circuit pattern. And a first copper foil pattern for electrically connecting the wiring pattern with the wiring pattern, the circuit component electrically connected to the first wiring pattern using the positioning land is subjected to a continuity test and a function test. A printed wiring board characterized by the above. 2. A copper foil of said positioning land is used as a first land instead of said first copper foil pattern, and a second land is provided in a layer different from the substrate layer in which said positioning land is present. The sealed interlayer connection via hole, and the first
A second wiring pattern of a substrate layer different from the substrate layer in which the positioning land electrically connected to the second land of the sealed interlayer connection via hole, the second wiring pattern, and the first land And a second hermetically sealed interlayer connection via hole or through through hole having a second land on the substrate layer in which the positioning land is present, and a second hermetically sealed interlayer connection via hole or through through hole. 2. The first wiring pattern and the positioning land are electrically connected by using a second copper foil pattern that electrically connects the land and the first wiring pattern. Printed wiring board.