CN113038702A - Rigid-flexible high-frequency circuit board limited by reinforced core strip - Google Patents
Rigid-flexible high-frequency circuit board limited by reinforced core strip Download PDFInfo
- Publication number
- CN113038702A CN113038702A CN202110251199.5A CN202110251199A CN113038702A CN 113038702 A CN113038702 A CN 113038702A CN 202110251199 A CN202110251199 A CN 202110251199A CN 113038702 A CN113038702 A CN 113038702A
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- China
- Prior art keywords
- plate
- rigid
- circuit board
- layer plate
- frequency circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 claims abstract description 13
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 21
- 238000002955 isolation Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007123 defense Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A soft and hard combined high-frequency circuit board limited by a reinforced core strip comprises two rigid plates and a flexible plate connected with the two rigid plates; the rigid plates comprise an upper layer plate, a middle layer plate and a lower layer plate from top to bottom, the middle layer plate on one opposite side of the two rigid plates is inwards sunken to be provided with a mounting groove, and the end part of the flexible plate is positioned in the mounting groove; the upper layer plate, the middle layer plate and the lower layer plate are all polyphenyl ether plates; the flexible board comprises a first polyimide film and a second polyimide film which are arranged in a stacked mode. Therefore, the signal matching degree is good, and the high-frequency-resistant high-voltage power supply has the advantages of high temperature resistance, low loss, good high-frequency performance and the like and is reliable in connection.
Description
Technical Field
The invention relates to the technical field of high-frequency circuit board products, in particular to a soft-hard combined high-frequency circuit board limited by a reinforcing core strip.
Background
With the rapid development of the electronic information industry, the electronic products are updated faster, the digital operation speed is faster and faster, the signal frequency is higher and higher, and the electronic products are increasingly integrated, miniaturized and multifunctional, so that more requirements on the technology, the process and the materials are provided for the circuit board industry, such as the requirement on high integration, high operation speed and the like of the products. The rigid-flexible circuit board is used as a branch of the circuit board, a simple method for integrating a plurality of rigid circuit boards through flexible connecting parts is provided, each multi-layer rigid circuit board is used as a switching carrier through the flexible connecting parts, and electronic components such as the rigid circuit board, a display, an input or a memory are connected through ultrathin flexible circuit tapes without wires, cables or connectors. The rigid-flexible circuit board product is mainly supplied to markets in the fields of commercial use, aerospace and national defense. The rigid circuit board of the existing rigid-flexible combined circuit board uses an epoxy resin glass cloth multilayer circuit board, and the flexible connecting part uses a flexible circuit belt made of polyimide film. The rigid circuit board and the flexible connecting part are made of two completely different materials, so that the problem of poor signal matching exists; the epoxy resin glass cloth multilayer circuit board cannot meet the requirements of high temperature resistance and low loss, and has lower high-frequency performance; the connection between the flexible connecting part and the rigid circuit board is unreliable and easy to fall off.
Disclosure of Invention
In view of this, the invention provides a rigid-flex high-frequency circuit board which has good signal matching degree, has the advantages of high temperature resistance, low loss, good high-frequency performance and the like, is reliably connected and is limited by a reinforcing core bar, so as to solve the problems.
A soft and hard combined high-frequency circuit board limited by a reinforced core strip comprises two rigid plates and a flexible plate connected with the two rigid plates; the rigid plates comprise an upper layer plate, a middle layer plate and a lower layer plate from top to bottom, the middle layer plate on one opposite side of the two rigid plates is inwards sunken to be provided with a mounting groove, and the end part of the flexible plate is positioned in the mounting groove; the upper layer plate, the middle layer plate and the lower layer plate are all polyphenyl ether plates; the flexible plate comprises a first polyimide film and a second polyimide film which are arranged in a stacked mode; and a reinforcing core strip penetrating through the upper plate, the flexible plate and the lower plate.
Furthermore, the upper layer plate, the middle layer plate and the lower layer plate are bonded with each other through polyphenyl ether bonding sheets.
Further, the reinforced core bar is a copper bar.
Furthermore, the outer side of the upper plate on the reinforcing core strip is provided with an insulating ring.
Furthermore, the rigid plate is provided with a strip-shaped isolation hole at the outer side of the end part of the flexible plate, and a conducting layer is arranged on the inner side wall of the isolation hole.
Furthermore, a plurality of corners of the rigid plate are provided with first mounting holes.
Furthermore, the reinforcing strips are arranged on two sides of the soft and hard combined high-frequency circuit board limited by the reinforcing core strips and connected with the rigid plate through a plurality of connecting blocks.
Compared with the prior art, the soft and hard combined high-frequency circuit board limited by the reinforced core strip comprises two rigid plates and a soft plate connected with the two rigid plates; the rigid plates comprise an upper layer plate, a middle layer plate and a lower layer plate from top to bottom, the middle layer plate on one opposite side of the two rigid plates is inwards sunken to be provided with a mounting groove, and the end part of the flexible plate is positioned in the mounting groove; the upper layer plate, the middle layer plate and the lower layer plate are all polyphenyl ether plates; the flexible plate comprises a first polyimide film and a second polyimide film which are arranged in a stacked mode; and a reinforcing core strip penetrating through the upper plate, the flexible plate and the lower plate. Therefore, the signal matching degree is good, and the high-frequency-resistant high-voltage power supply has the advantages of high temperature resistance, low loss, good high-frequency performance and the like and is reliable in connection.
Drawings
Embodiments of the invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic top view of a rigid-flex high-frequency circuit board limited by a reinforcing core bar according to the present invention.
Fig. 2 is a schematic side view of the rigid-flex high-frequency circuit board limited by the reinforcing core bar according to the invention.
Detailed Description
Specific embodiments of the present invention will be described in further detail below based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 and 2, the rigid-flex high frequency circuit board limited by the reinforcing core bar according to the present invention includes two rigid boards 10 and a flexible board 20 connecting the two rigid boards 10.
The rigid plate 10 comprises an upper plate 11, a middle plate 12 and a lower plate 13 from top to bottom, the middle plate 12 on one opposite side of the two rigid plates 10 is inwards recessed to form a mounting groove, and the end part of the flexible plate 20 is positioned in the mounting groove. The upper plate 11, the middle plate 12 and the lower plate 13 are all polyphenyl ether plates, and the upper plate 11, the middle plate 12 and the lower plate 13 are bonded with each other through polyphenyl ether bonding sheets.
The flexible board 20 includes a first polyimide film 21 and a second polyimide film 22 stacked on each other.
The rigid-flexible high-frequency circuit board limited by the reinforced core strip is also provided with a reinforced core strip 201 penetrating through the upper plate 11, the flexible plate 20 and the lower plate 13, and the reinforced core strip 201 is a copper strip. The reinforcing core bar 201 can improve the reliability of the connection between the flexible board 20 and the rigid board 10, and prevent the flexible board 20 from coming off.
The upper plate 11 is provided with an insulating ring 202 outside the reinforcing core 201 to prevent signal crosstalk.
The rigid board 10 is provided with a strip-shaped isolation hole 101 on the outer side of the end portion of the flexible board 20, and a conductive layer is provided on the inner side wall of the isolation hole 101. To isolate other signals on the rigid plate 10 and reduce interference.
A plurality of corners of the rigid plate 10 are provided with first mounting holes 103.
In order to facilitate the production and processing of the soft and hard combined high-frequency circuit board limited by the reinforcing core strip, the reinforcing strips 30 are arranged on two sides of the circuit board before final forming, the reinforcing strips 30 are connected with the rigid plate 10 through a plurality of connecting blocks 31, and the rigid plate 10 and the flexible plate 20 can be kept in a horizontal state by the reinforcing strips 30, so that the deformation in the production and processing processes is avoided.
The reinforcing bar 30 is further provided with a plurality of second mounting holes 32.
Compared with the prior art, the soft and hard combined high-frequency circuit board limited by the reinforced core strip comprises two rigid plates 10 and a flexible plate 20 connected with the two rigid plates 10; the rigid plate 10 comprises an upper plate 11, a middle plate 12 and a lower plate 13 from top to bottom, the middle plate 12 on one opposite side of the two rigid plates 10 is inwards recessed to form a mounting groove, and the end part of the flexible plate 20 is positioned in the mounting groove; the upper plate 11, the middle plate 12 and the lower plate 13 are all polyphenyl ether plates; the flexible board 20 includes a first polyimide film 21 and a second polyimide film 22 stacked on each other. Therefore, the signal matching degree is good, and the high-frequency-resistant high-voltage power supply has the advantages of high temperature resistance, low loss, good high-frequency performance and the like and is reliable in connection.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (7)
1. The utility model provides a through spacing soft or hard combination high frequency circuit board of enhancement core strip which characterized in that: comprises two rigid plates and a flexible plate connected with the two rigid plates; the rigid plates comprise an upper layer plate, a middle layer plate and a lower layer plate from top to bottom, the middle layer plate on one opposite side of the two rigid plates is inwards sunken to be provided with a mounting groove, and the end part of the flexible plate is positioned in the mounting groove; the upper layer plate, the middle layer plate and the lower layer plate are all polyphenyl ether plates; the flexible plate comprises a first polyimide film and a second polyimide film which are arranged in a stacked mode; and a reinforcing core strip penetrating through the upper plate, the flexible plate and the lower plate.
2. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: the upper layer plate, the middle layer plate and the lower layer plate are bonded with each other through polyphenyl ether bonding sheets.
3. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: the reinforced core strip is a copper strip.
4. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: and an insulating ring is arranged on the outer side of the reinforced core strip of the upper plate.
5. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: the rigid plate is provided with a strip-shaped isolation hole at the outer side of the end part of the flexible plate, and a conducting layer is arranged on the inner side wall of the isolation hole.
6. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: a plurality of edges of the rigid plate are provided with first mounting holes.
7. The rigid-flex high-frequency circuit board limited by the reinforced core strip according to claim 1, wherein: the two sides of the soft and hard combined high-frequency circuit board limited by the reinforcing core strips are provided with reinforcing strips, and the reinforcing strips are connected with the rigid plate through a plurality of connecting blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110251199.5A CN113038702A (en) | 2021-03-08 | 2021-03-08 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110251199.5A CN113038702A (en) | 2021-03-08 | 2021-03-08 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113038702A true CN113038702A (en) | 2021-06-25 |
Family
ID=76466799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110251199.5A Pending CN113038702A (en) | 2021-03-08 | 2021-03-08 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113038702A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10341065A (en) * | 1997-06-06 | 1998-12-22 | Sony Corp | Reinforced printed wiring board |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| CN105934092A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled flexible circuit board |
| CN209250940U (en) * | 2018-09-28 | 2019-08-13 | 遂川亚恒电路有限公司 | A kind of steady type rigid-flex circuit board |
| CN112020217A (en) * | 2019-05-28 | 2020-12-01 | 深圳华麟电路技术有限公司 | Rigid-flex board and manufacturing method thereof |
-
2021
- 2021-03-08 CN CN202110251199.5A patent/CN113038702A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10341065A (en) * | 1997-06-06 | 1998-12-22 | Sony Corp | Reinforced printed wiring board |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| CN105934092A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled flexible circuit board |
| CN209250940U (en) * | 2018-09-28 | 2019-08-13 | 遂川亚恒电路有限公司 | A kind of steady type rigid-flex circuit board |
| CN112020217A (en) * | 2019-05-28 | 2020-12-01 | 深圳华麟电路技术有限公司 | Rigid-flex board and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210625 |