JPH10341065A - Reinforced printed wiring board - Google Patents

Reinforced printed wiring board

Info

Publication number
JPH10341065A
JPH10341065A JP14906997A JP14906997A JPH10341065A JP H10341065 A JPH10341065 A JP H10341065A JP 14906997 A JP14906997 A JP 14906997A JP 14906997 A JP14906997 A JP 14906997A JP H10341065 A JPH10341065 A JP H10341065A
Authority
JP
Japan
Prior art keywords
printed wiring
reinforcing plate
wiring board
adhesive
fpc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14906997A
Other languages
Japanese (ja)
Inventor
Osamu Asagi
攻 浅黄
Naoko Sato
尚子 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP14906997A priority Critical patent/JPH10341065A/en
Publication of JPH10341065A publication Critical patent/JPH10341065A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

PROBLEM TO BE SOLVED: To lessen the effects of moisture absorption of a material, of which a flexible printed wiring board having reinforcing plates adhered thereto is made. SOLUTION: A flexible printed wiring board(FPC) 11 has adhesive regions 11c formed with through-holes P11, P12, P13. Rigid printed wiring boards(PWB) 12, 13 are adhered to the region 1c at the both sides of the FPC 11 with an adhesive of the identical material as that of the FPC 11, e.g. a polyimide adhesive 14 coated to sufficiently fill up the through-holes P11-P13, thereby coupling adhesive parts 14a, 14b at the both sides of the adhesive 14 via the through-holes P11-P13.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はプリント配線板に補
強板を接着することにより構成される補強板付きプリン
ト配線板に関し、特にフレキシブルプリント配線板を補
強するように構成される補強板付きプリント配線板に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board with a reinforcing plate formed by bonding a reinforcing plate to a printed wiring board, and more particularly to a printed wiring board with a reinforcing plate configured to reinforce a flexible printed wiring board. Regarding the board.

【0002】[0002]

【従来の技術】従来、フレキシブルプリント配線板(以
後FPC;Flexible Printed Circuitと呼ぶ)に部品を
搭載する場合や、コネクタに挿入する際には、FPCの
縁端部に補強板を接着するようにしている。
2. Description of the Related Art Conventionally, when a component is mounted on a flexible printed wiring board (hereinafter referred to as a FPC; Flexible Printed Circuit) or inserted into a connector, a reinforcing plate is adhered to the edge of the FPC. ing.

【0003】図4は従来の補強板付きプリント配線板の
概略構成を示す図であり、(A)は平面図、(B)は
(A)のY−Y線に沿う断面図である。補強板付きプリ
ント配線板40のFPC41には、パターン41a,4
1bなどがプリントされており、またその縁端部の両面
には、補強板としてリジッドプリント配線板(以後PW
B;Printed Writing Boadと呼ぶ)42,43が接着剤
44,45によってそれぞれ接着されている。PWB4
2,43を接着することにより、柔らかいFPC41上
に部品を搭載したり、コネクタに挿入することが可能と
なる。
FIGS. 4A and 4B are diagrams showing a schematic configuration of a conventional printed wiring board with a reinforcing plate, wherein FIG. 4A is a plan view and FIG. 4B is a cross-sectional view taken along the line Y--Y of FIG. The FPC 41 of the printed wiring board 40 with the reinforcing plate has patterns 41a, 4
1b etc. are printed, and a rigid printed wiring board (hereinafter referred to as PW
B; called Printed Writing Boad) 42 and 43 are adhered by adhesives 44 and 45, respectively. PWB4
By bonding the components 2 and 43, components can be mounted on the soft FPC 41 or inserted into the connector.

【0004】[0004]

【発明が解決しようとする課題】ところで、FPC41
で最も多く使用されているポリイミド樹脂は、吸水率が
0.43%と高く、さらにこれを加工した銅張ポリイミ
ドフィルムでは、吸水率が2.8%と一段と高くなって
いる。したがって、吸湿した状態の補強板付きプリント
配線板40を半田付けなどのために加熱すると、水分が
膨張して接着44,45とFPC41との接合部分が剥
離するおそれがあった。
By the way, FPC41
The most frequently used polyimide resin has a high water absorption of 0.43%, and the processed copper-clad polyimide film has a much higher water absorption of 2.8%. Therefore, when the printed wiring board 40 with the reinforcing plate in a moisture-absorbed state is heated for soldering or the like, there is a possibility that the moisture expands and the joint portion between the adhesives 44 and 45 and the FPC 41 is separated.

【0005】このため、従来は、半田付けの直前に、ベ
ーキングを行うか、徹底した防湿管理を必要としていた
ため、作業効率が悪く、コスト高ともなっていた。本発
明はこのような点に鑑みてなされたものであり、材料の
吸湿状態の影響を低減して接着性を高めることのできる
補強板付きプリント配線板を提供することを目的とす
る。
[0005] For this reason, conventionally, baking or thorough moisture-proof control was required immediately before soldering, so that the work efficiency was poor and the cost was high. The present invention has been made in view of such a point, and an object of the present invention is to provide a printed wiring board with a reinforcing plate capable of reducing the influence of the moisture absorbing state of a material and improving the adhesiveness.

【0006】[0006]

【課題を解決するための手段】本発明では上記課題を解
決するために、フレキシブルプリント配線板に補強板を
接着することにより構成される補強板付きプリント配線
板において、前記フレキシブルプリント配線板の少なく
とも前記補強板の接着される領域に貫通孔が形成され、
前記貫通孔に充填されるように前記接着剤が塗布されて
前記補強板が接着されていることを特徴とする補強板付
きプリント配線板が提供される。
According to the present invention, there is provided a printed wiring board with a reinforcing plate formed by bonding a reinforcing plate to a flexible printed wiring board. A through hole is formed in a region where the reinforcing plate is bonded,
The printed wiring board with a reinforcing plate is provided, wherein the adhesive is applied so as to fill the through hole, and the reinforcing plate is bonded.

【0007】このような補強板付きプリント配線板で
は、フレキシブルプリント配線板の少なくとも補強板の
接着される領域に貫通孔を形成し、その貫通孔に充填さ
れるように接着剤を塗布して補強板を接着する。これに
より、貫通孔に充填された接着剤によって、接着強度が
高められるので、基板材料の吸湿状態の影響をほとんど
受けることがない。
In such a printed wiring board with a reinforcing plate, a through-hole is formed at least in a region of the flexible printed wiring board to which the reinforcing plate is bonded, and an adhesive is applied so as to fill the through-hole and reinforcement is applied. Glue the boards. As a result, the bonding strength is increased by the adhesive filled in the through-holes, so that the substrate material is hardly affected by the moisture absorption state.

【0008】[0008]

【発明の実施の形態】以下、本発明の一形態を図面を参
照して説明する。図1は本形態の補強板付きプリント配
線板の概略構成を示す図であり、(A)は平面図、
(B)は(A)のX−X線に沿う断面図である。補強板
付きプリント配線板10のFPC11は、例えばポリイ
ミド樹脂で形成されている。このFPC11には、パタ
ーン11a,11bなどがプリントされている。また、
FPC11の縁端部の両面には、補強板としてPWB1
2,13が接着されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a printed wiring board with a reinforcing plate of this embodiment, (A) is a plan view,
(B) is a sectional view taken along line XX of (A). The FPC 11 of the printed wiring board 10 with a reinforcing plate is formed of, for example, a polyimide resin. On the FPC 11, patterns 11a and 11b are printed. Also,
On both sides of the edge of the FPC 11, PWB1 is used as a reinforcing plate.
2, 13 are adhered.

【0009】FPC11のPWB12,13が接着され
る接着領域11cには、貫通孔P11,P12,P13が形成
されている。貫通孔P11,P12,P13は、パターン11
a,11bを避けて形成されている。この貫通孔P11
12,P13は、単に孔を開けただけでもよいし、スルー
ホールとして形成してもよい。
[0009] Through holes P 11 , P 12 and P 13 are formed in an adhesion area 11 c of the FPC 11 to which the PWBs 12 and 13 are adhered. The through holes P 11 , P 12 , and P 13 correspond to the pattern 11
It is formed avoiding a and 11b. This through hole P 11 ,
P 12 and P 13 may be simply formed holes or may be formed as through holes.

【0010】このようなFPC11の両面の接着領域1
1cには、例えばFPC11の材質と同じポリイミド系
の接着剤14によってPWB12,13が接着されてい
る。このとき、接着剤14は、貫通孔P11,P12,P13
にも充填されるように塗布される。これにより、接着剤
14の両側の接着部分14a,14bは、貫通孔P11
12,P13を介して結合される。
The bonding areas 1 on both sides of the FPC 11
PWBs 12 and 13 are adhered to 1c by, for example, the same polyimide adhesive 14 as the material of the FPC 11. At this time, the adhesive 14 is applied to the through holes P 11 , P 12 , P 13
It is applied so that it is also filled. Thereby, the bonding portions 14a and 14b on both sides of the adhesive 14 are connected to the through holes P 11 and P 11 , respectively.
They are linked via P 12 and P 13 .

【0011】したがって、FPC11が吸湿した状態に
あるときに半田付けなどにより加熱しても、接着剤14
が剥離することがない。よって、半田付けの直前にベー
キングを行ったり、必要以上に防湿管理を行う必要がな
くなり、作業効率が向上し、コスト高も低減できる。
Therefore, even when the FPC 11 is heated by soldering or the like while absorbing moisture, the adhesive 14
Does not peel off. Therefore, it is not necessary to perform baking immediately before soldering or to perform unnecessary moisture-proof management, thereby improving work efficiency and reducing cost.

【0012】なお、図1では、3個の貫通孔P11
12,P13のみを示したが、接着領域全面にわたって均
等に多数の貫通孔を形成すれば、より確実に接着性を持
たせることが可能となる。
In FIG. 1, three through holes P 11 ,
Although only P 12 and P 13 are shown, if a large number of through-holes are formed evenly over the entire surface of the bonding area, the bonding property can be more reliably provided.

【0013】また、図では、分かりやすくするため接着
剤14の接着部分14a,14bを厚く示したが、実際
にはPWB12,13などの厚みに対して十分に薄く塗
布される。
In the figure, the adhesive portions 14a and 14b of the adhesive 14 are shown thicker for easy understanding, but they are actually applied sufficiently thinner than the thickness of the PWBs 12 and 13.

【0014】図2は貫通孔の第2の形成例を示す平面図
である。なお、ここでは、FPCのみの構成を示す。F
PC21の接着領域21a全面には、パターン21b,
21c,21d等を避けて多数の貫通孔P21,P22,P
23,P24が形成されている。貫通孔の形状としては、貫
通孔P21のように円形、貫通孔P22のように長孔形、貫
通孔P23のように4角形、貫通孔P24のように3角形、
あるいはこの他にも6角形など様々な形状に形成するこ
とができる。
FIG. 2 is a plan view showing a second example of forming a through hole. Here, only the configuration of the FPC is shown. F
On the entire surface of the bonding area 21a of the PC 21, a pattern 21b,
A large number of through holes P 21 , P 22 , P
23 and P 24 are formed. The shape of the through-hole, circular as through-hole P 21, Nagaanagata as through holes P 22, 4 square as the through-hole P 23, 3 square as the through hole P 24,
Alternatively, it can be formed in various shapes such as a hexagon.

【0015】なお、図2では、都合上、一つのFPC2
1上に多種類形状の貫通孔を形成する例を示したが、実
際には、一つのFPCにつき1種類の形状の貫通孔を形
成するほうが、作業の効率上好ましい。
In FIG. 2, for convenience, one FPC 2
Although an example in which multiple types of through holes are formed on one is shown, in practice, it is preferable to form one type of through hole for one FPC in terms of work efficiency.

【0016】図3は貫通孔の第3の形成例を示す平面図
である。FPC31の接着領域31a全面には、メッシ
ュ状に多数の貫通孔P31が形成されている。メッシュ状
にすることにより、均等に貫通孔P31を配置できるの
で、補強板との接着をより確実にできる。
FIG. 3 is a plan view showing a third example of forming a through hole. A large number of through holes P31 are formed in a mesh shape on the entire surface of the bonding area 31a of the FPC 31 . By a mesh, it is possible to uniformly arrange the through hole P 31, can be an adhesive between the reinforcing plate more reliably.

【0017】また、配線構造に応じて貫通孔P31の配置
を変える必要がないので、孔開け加工も容易となる。た
だし、このようなメッシュ状の構成の適用は、パターン
31b,31c,31dが、接着領域31a部分で短絡
しても電気的に問題がない場合に限る。
Further, since it is not necessary to change the arrangement of the through-hole P 31 according to the wiring structure, hole formation becomes easy. However, application of such a mesh-like configuration is limited to a case where the patterns 31b, 31c, and 31d have no electrical problem even if they are short-circuited at the bonding region 31a.

【0018】[0018]

【発明の効果】以上説明したように本発明では、フレキ
シブルプリント配線板の少なくとも補強板の接着される
領域に貫通孔を形成し、その貫通孔に充填されるように
接着剤を塗布して補強板を接着するようにしたので、貫
通孔に充填された接着剤によって、両面の接着部が連結
され、接着強度を高めることができる。このため、FP
Cが吸湿した状態にあるときに半田付けなどにより加熱
しても、接着剤が剥離することがない。
As described above, according to the present invention, a through-hole is formed at least in a region of the flexible printed wiring board to which the reinforcing plate is bonded, and an adhesive is applied so as to fill the through-hole and reinforcement is applied. Since the plates are bonded, the bonding portions on both sides are connected by the bonding agent filled in the through holes, and the bonding strength can be increased. Therefore, FP
Even when heating is performed by soldering or the like while C is in a moisture-absorbed state, the adhesive does not peel off.

【0019】よって、半田付けの直前にベーキングを行
ったり、必要以上に防湿管理を行う必要がなくなり、作
業効率が向上し、コスト高も低減できる。
Therefore, it is not necessary to perform baking immediately before soldering or to perform unnecessary moisture-proof management, thereby improving work efficiency and reducing cost.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本形態の補強板付きプリント配線板の概略構成
を示す図であり、(A)は平面図、(B)は(A)のX
−X線に沿う断面図である。
FIGS. 1A and 1B are diagrams showing a schematic configuration of a printed wiring board with a reinforcing plate of the present embodiment, wherein FIG. 1A is a plan view and FIG.
It is sectional drawing which follows the X-ray.

【図2】貫通孔の第2の形成例を示す平面図である。FIG. 2 is a plan view showing a second example of forming a through hole.

【図3】貫通孔の第3の形成例を示す平面図である。FIG. 3 is a plan view showing a third example of forming a through hole.

【図4】従来の補強板付きプリント配線板の概略構成を
示す図であり、(A)は平面図、(B)は(A)のY−
Y線に沿う断面図である。
4A and 4B are diagrams showing a schematic configuration of a conventional printed wiring board with a reinforcing plate, wherein FIG. 4A is a plan view, and FIG.
It is sectional drawing which follows the Y line.

【符号の説明】[Explanation of symbols]

10…補強板付きプリント配線板、11…FPC、1
2,13…PWB、14…接着剤、21,31…FP
C、11a,11b,21b,21c,21d…パター
ン、11c,11a,31a…接着領域、P11,P12
13,P21,P22,P23,P24,P31…貫通孔。
10: printed wiring board with reinforcing plate, 11: FPC, 1
2,13 ... PWB, 14 ... adhesive, 21,31 ... FP
C, 11a, 11b, 21b, 21c, 21d... Pattern, 11c, 11a, 31a... Adhesive area, P 11 , P 12 ,
P 13, P 21, P 22 , P 23, P 24, P 31 ... through hole.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 フレキシブルプリント配線板に補強板を
接着することにより構成される補強板付きプリント配線
板において、 前記フレキシブルプリント配線板の少なくとも前記補強
板の接着される領域に貫通孔が形成され、前記貫通孔に
充填されるように前記接着剤が塗布されて前記補強板が
接着されていることを特徴とする補強板付きプリント配
線板。
1. A printed wiring board with a reinforcing plate configured by bonding a reinforcing plate to a flexible printed wiring board, wherein a through hole is formed in at least a region of the flexible printed wiring board where the reinforcing plate is bonded, The printed wiring board with a reinforcing plate, wherein the adhesive is applied so as to fill the through hole and the reinforcing plate is bonded.
【請求項2】 前記貫通孔は、前記補強板の接着される
領域に1個ないしは複数個配置されていることを特徴と
する請求項1記載の補強板付きプリント配線板。
2. The printed wiring board with a reinforcing plate according to claim 1, wherein one or a plurality of the through holes are arranged in a region where the reinforcing plate is bonded.
【請求項3】 前記貫通孔は、前記配線パターンを避け
て形成されていることを特徴とする請求項2記載の補強
板付きプリント配線板。
3. The printed wiring board with a reinforcing plate according to claim 2, wherein the through hole is formed so as to avoid the wiring pattern.
【請求項4】 前記貫通孔は、前記配線パターンを含め
て前記補強板の接着される領域のほぼ全面にわたってメ
ッシュ状に形成されていることを特徴とする請求項1記
載の補強板付きプリント配線板。
4. The printed wiring with a reinforcing plate according to claim 1, wherein the through-hole is formed in a mesh shape over substantially the entire region of the reinforcing plate including the wiring pattern to which the reinforcing plate is bonded. Board.
【請求項5】 前記補強板は、PWBであることを特徴
とする請求項1記載の補強板付きプリント配線板。
5. The printed wiring board with a reinforcing plate according to claim 1, wherein the reinforcing plate is PWB.
JP14906997A 1997-06-06 1997-06-06 Reinforced printed wiring board Pending JPH10341065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14906997A JPH10341065A (en) 1997-06-06 1997-06-06 Reinforced printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14906997A JPH10341065A (en) 1997-06-06 1997-06-06 Reinforced printed wiring board

Publications (1)

Publication Number Publication Date
JPH10341065A true JPH10341065A (en) 1998-12-22

Family

ID=15467014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14906997A Pending JPH10341065A (en) 1997-06-06 1997-06-06 Reinforced printed wiring board

Country Status (1)

Country Link
JP (1) JPH10341065A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010074011A (en) * 2000-11-28 2001-08-04 최병호 Method of manufacturing for rigid flexible pwb
KR20020060656A (en) * 2002-06-24 2002-07-18 민병성 Flexible printed circuit board
JP2006080156A (en) * 2004-09-07 2006-03-23 Nitto Denko Corp Wiring circuit board
KR100718212B1 (en) 2003-07-01 2007-05-15 샤프 가부시키가이샤 Method for bonding reinforcing plate
CN100391317C (en) * 2003-03-31 2008-05-28 日本航空电子工业株式会社 Electric connecting part
KR100839219B1 (en) 2007-04-06 2008-06-17 김창수 Reinforcement film cep method and machine for fpcb
JP2010034170A (en) * 2008-06-23 2010-02-12 Sumitomo Electric Ind Ltd Wiring body, connection structure and electronic equipment
WO2012017664A1 (en) * 2010-08-05 2012-02-09 パナソニック株式会社 Flexible printed wiring substrate and electronic equipment
US8767405B2 (en) 2010-08-31 2014-07-01 Kabushiki Kaisha Toshiba Electronic apparatus and flexible printed circuit board
JP2020015209A (en) * 2018-07-25 2020-01-30 東芝テック株式会社 Inkjet head and inkjet recording device
CN113038702A (en) * 2021-03-08 2021-06-25 浙江九通电子科技有限公司 Rigid-flexible high-frequency circuit board limited by reinforced core strip

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010074011A (en) * 2000-11-28 2001-08-04 최병호 Method of manufacturing for rigid flexible pwb
KR20020060656A (en) * 2002-06-24 2002-07-18 민병성 Flexible printed circuit board
CN100391317C (en) * 2003-03-31 2008-05-28 日本航空电子工业株式会社 Electric connecting part
KR100718212B1 (en) 2003-07-01 2007-05-15 샤프 가부시키가이샤 Method for bonding reinforcing plate
JP2006080156A (en) * 2004-09-07 2006-03-23 Nitto Denko Corp Wiring circuit board
KR100839219B1 (en) 2007-04-06 2008-06-17 김창수 Reinforcement film cep method and machine for fpcb
JP2010034170A (en) * 2008-06-23 2010-02-12 Sumitomo Electric Ind Ltd Wiring body, connection structure and electronic equipment
WO2012017664A1 (en) * 2010-08-05 2012-02-09 パナソニック株式会社 Flexible printed wiring substrate and electronic equipment
US8767405B2 (en) 2010-08-31 2014-07-01 Kabushiki Kaisha Toshiba Electronic apparatus and flexible printed circuit board
JP2020015209A (en) * 2018-07-25 2020-01-30 東芝テック株式会社 Inkjet head and inkjet recording device
US10899128B2 (en) 2018-07-25 2021-01-26 Toshiba Tec Kabushiki Kaisha Ink jet head and ink jet recording device
CN113038702A (en) * 2021-03-08 2021-06-25 浙江九通电子科技有限公司 Rigid-flexible high-frequency circuit board limited by reinforced core strip

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