JPH10341065A - Reinforced printed wiring board - Google Patents
Reinforced printed wiring boardInfo
- Publication number
- JPH10341065A JPH10341065A JP14906997A JP14906997A JPH10341065A JP H10341065 A JPH10341065 A JP H10341065A JP 14906997 A JP14906997 A JP 14906997A JP 14906997 A JP14906997 A JP 14906997A JP H10341065 A JPH10341065 A JP H10341065A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- reinforcing plate
- wiring board
- adhesive
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント配線板に補
強板を接着することにより構成される補強板付きプリン
ト配線板に関し、特にフレキシブルプリント配線板を補
強するように構成される補強板付きプリント配線板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board with a reinforcing plate formed by bonding a reinforcing plate to a printed wiring board, and more particularly to a printed wiring board with a reinforcing plate configured to reinforce a flexible printed wiring board. Regarding the board.
【０００２】[0002]
【従来の技術】従来、フレキシブルプリント配線板（以
後ＦＰＣ；Flexible Printed Circuitと呼ぶ）に部品を
搭載する場合や、コネクタに挿入する際には、ＦＰＣの
縁端部に補強板を接着するようにしている。2. Description of the Related Art Conventionally, when a component is mounted on a flexible printed wiring board (hereinafter referred to as a FPC; Flexible Printed Circuit) or inserted into a connector, a reinforcing plate is adhered to the edge of the FPC. ing.
【０００３】図４は従来の補強板付きプリント配線板の
概略構成を示す図であり、（Ａ）は平面図、（Ｂ）は
（Ａ）のＹ−Ｙ線に沿う断面図である。補強板付きプリ
ント配線板４０のＦＰＣ４１には、パターン４１ａ，４
１ｂなどがプリントされており、またその縁端部の両面
には、補強板としてリジッドプリント配線板（以後ＰＷ
Ｂ；Printed Writing Boadと呼ぶ）４２，４３が接着剤
４４，４５によってそれぞれ接着されている。ＰＷＢ４
２，４３を接着することにより、柔らかいＦＰＣ４１上
に部品を搭載したり、コネクタに挿入することが可能と
なる。FIGS. 4A and 4B are diagrams showing a schematic configuration of a conventional printed wiring board with a reinforcing plate, wherein FIG. 4A is a plan view and FIG. 4B is a cross-sectional view taken along the line Y--Y of FIG. The FPC 41 of the printed wiring board 40 with the reinforcing plate has patterns 41a, 4
1b etc. are printed, and a rigid printed wiring board (hereinafter referred to as PW
B; called Printed Writing Boad) 42 and 43 are adhered by adhesives 44 and 45, respectively. PWB4
By bonding the components 2 and 43, components can be mounted on the soft FPC 41 or inserted into the connector.
【０００４】[0004]
【発明が解決しようとする課題】ところで、ＦＰＣ４１
で最も多く使用されているポリイミド樹脂は、吸水率が
０．４３％と高く、さらにこれを加工した銅張ポリイミ
ドフィルムでは、吸水率が２．８％と一段と高くなって
いる。したがって、吸湿した状態の補強板付きプリント
配線板４０を半田付けなどのために加熱すると、水分が
膨張して接着４４，４５とＦＰＣ４１との接合部分が剥
離するおそれがあった。By the way, FPC41
The most frequently used polyimide resin has a high water absorption of 0.43%, and the processed copper-clad polyimide film has a much higher water absorption of 2.8%. Therefore, when the printed wiring board 40 with the reinforcing plate in a moisture-absorbed state is heated for soldering or the like, there is a possibility that the moisture expands and the joint portion between the adhesives 44 and 45 and the FPC 41 is separated.
【０００５】このため、従来は、半田付けの直前に、ベ
ーキングを行うか、徹底した防湿管理を必要としていた
ため、作業効率が悪く、コスト高ともなっていた。本発
明はこのような点に鑑みてなされたものであり、材料の
吸湿状態の影響を低減して接着性を高めることのできる
補強板付きプリント配線板を提供することを目的とす
る。[0005] For this reason, conventionally, baking or thorough moisture-proof control was required immediately before soldering, so that the work efficiency was poor and the cost was high. The present invention has been made in view of such a point, and an object of the present invention is to provide a printed wiring board with a reinforcing plate capable of reducing the influence of the moisture absorbing state of a material and improving the adhesiveness.
【０００６】[0006]
【課題を解決するための手段】本発明では上記課題を解
決するために、フレキシブルプリント配線板に補強板を
接着することにより構成される補強板付きプリント配線
板において、前記フレキシブルプリント配線板の少なく
とも前記補強板の接着される領域に貫通孔が形成され、
前記貫通孔に充填されるように前記接着剤が塗布されて
前記補強板が接着されていることを特徴とする補強板付
きプリント配線板が提供される。According to the present invention, there is provided a printed wiring board with a reinforcing plate formed by bonding a reinforcing plate to a flexible printed wiring board. A through hole is formed in a region where the reinforcing plate is bonded,
The printed wiring board with a reinforcing plate is provided, wherein the adhesive is applied so as to fill the through hole, and the reinforcing plate is bonded.
【０００７】このような補強板付きプリント配線板で
は、フレキシブルプリント配線板の少なくとも補強板の
接着される領域に貫通孔を形成し、その貫通孔に充填さ
れるように接着剤を塗布して補強板を接着する。これに
より、貫通孔に充填された接着剤によって、接着強度が
高められるので、基板材料の吸湿状態の影響をほとんど
受けることがない。In such a printed wiring board with a reinforcing plate, a through-hole is formed at least in a region of the flexible printed wiring board to which the reinforcing plate is bonded, and an adhesive is applied so as to fill the through-hole and reinforcement is applied. Glue the boards. As a result, the bonding strength is increased by the adhesive filled in the through-holes, so that the substrate material is hardly affected by the moisture absorption state.
【０００８】[0008]
【発明の実施の形態】以下、本発明の一形態を図面を参
照して説明する。図１は本形態の補強板付きプリント配
線板の概略構成を示す図であり、（Ａ）は平面図、
（Ｂ）は（Ａ）のＸ−Ｘ線に沿う断面図である。補強板
付きプリント配線板１０のＦＰＣ１１は、例えばポリイ
ミド樹脂で形成されている。このＦＰＣ１１には、パタ
ーン１１ａ，１１ｂなどがプリントされている。また、
ＦＰＣ１１の縁端部の両面には、補強板としてＰＷＢ１
２，１３が接着されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a printed wiring board with a reinforcing plate of this embodiment, (A) is a plan view,
(B) is a sectional view taken along line XX of (A). The FPC 11 of the printed wiring board 10 with a reinforcing plate is formed of, for example, a polyimide resin. On the FPC 11, patterns 11a and 11b are printed. Also,
On both sides of the edge of the FPC 11, PWB1 is used as a reinforcing plate.
2, 13 are adhered.
【０００９】ＦＰＣ１１のＰＷＢ１２，１３が接着され
る接着領域１１ｃには、貫通孔Ｐ11，Ｐ12，Ｐ13が形成
されている。貫通孔Ｐ11，Ｐ12，Ｐ13は、パターン１１
ａ，１１ｂを避けて形成されている。この貫通孔Ｐ11，
Ｐ12，Ｐ13は、単に孔を開けただけでもよいし、スルー
ホールとして形成してもよい。[0009] Through holes P 11 , P 12 and P 13 are formed in an adhesion area 11 c of the FPC 11 to which the PWBs 12 and 13 are adhered. The through holes P 11 , P 12 , and P 13 correspond to the pattern 11
It is formed avoiding a and 11b. This through hole P 11 ,
P 12 and P 13 may be simply formed holes or may be formed as through holes.
【００１０】このようなＦＰＣ１１の両面の接着領域１
１ｃには、例えばＦＰＣ１１の材質と同じポリイミド系
の接着剤１４によってＰＷＢ１２，１３が接着されてい
る。このとき、接着剤１４は、貫通孔Ｐ11，Ｐ12，Ｐ13
にも充填されるように塗布される。これにより、接着剤
１４の両側の接着部分１４ａ，１４ｂは、貫通孔Ｐ11，
Ｐ12，Ｐ13を介して結合される。The bonding areas 1 on both sides of the FPC 11
PWBs 12 and 13 are adhered to 1c by, for example, the same polyimide adhesive 14 as the material of the FPC 11. At this time, the adhesive 14 is applied to the through holes P 11 , P 12 , P 13
It is applied so that it is also filled. Thereby, the bonding portions 14a and 14b on both sides of the adhesive 14 are connected to the through holes P 11 and P 11 , respectively.
They are linked via P 12 and P 13 .
【００１１】したがって、ＦＰＣ１１が吸湿した状態に
あるときに半田付けなどにより加熱しても、接着剤１４
が剥離することがない。よって、半田付けの直前にベー
キングを行ったり、必要以上に防湿管理を行う必要がな
くなり、作業効率が向上し、コスト高も低減できる。Therefore, even when the FPC 11 is heated by soldering or the like while absorbing moisture, the adhesive 14
Does not peel off. Therefore, it is not necessary to perform baking immediately before soldering or to perform unnecessary moisture-proof management, thereby improving work efficiency and reducing cost.
【００１２】なお、図１では、３個の貫通孔Ｐ11，
Ｐ12，Ｐ13のみを示したが、接着領域全面にわたって均
等に多数の貫通孔を形成すれば、より確実に接着性を持
たせることが可能となる。In FIG. 1, three through holes P 11 ,
Although only P 12 and P 13 are shown, if a large number of through-holes are formed evenly over the entire surface of the bonding area, the bonding property can be more reliably provided.
【００１３】また、図では、分かりやすくするため接着
剤１４の接着部分１４ａ，１４ｂを厚く示したが、実際
にはＰＷＢ１２，１３などの厚みに対して十分に薄く塗
布される。In the figure, the adhesive portions 14a and 14b of the adhesive 14 are shown thicker for easy understanding, but they are actually applied sufficiently thinner than the thickness of the PWBs 12 and 13.
【００１４】図２は貫通孔の第２の形成例を示す平面図
である。なお、ここでは、ＦＰＣのみの構成を示す。Ｆ
ＰＣ２１の接着領域２１ａ全面には、パターン２１ｂ，
２１ｃ，２１ｄ等を避けて多数の貫通孔Ｐ21，Ｐ22，Ｐ
23，Ｐ24が形成されている。貫通孔の形状としては、貫
通孔Ｐ21のように円形、貫通孔Ｐ22のように長孔形、貫
通孔Ｐ23のように４角形、貫通孔Ｐ24のように３角形、
あるいはこの他にも６角形など様々な形状に形成するこ
とができる。FIG. 2 is a plan view showing a second example of forming a through hole. Here, only the configuration of the FPC is shown. F
On the entire surface of the bonding area 21a of the PC 21, a pattern 21b,
A large number of through holes P 21 , P 22 , P
23 and P 24 are formed. The shape of the through-hole, circular as through-hole P 21, Nagaanagata as through holes P 22, 4 square as the through-hole P 23, 3 square as the through hole P 24,
Alternatively, it can be formed in various shapes such as a hexagon.
【００１５】なお、図２では、都合上、一つのＦＰＣ２
１上に多種類形状の貫通孔を形成する例を示したが、実
際には、一つのＦＰＣにつき１種類の形状の貫通孔を形
成するほうが、作業の効率上好ましい。In FIG. 2, for convenience, one FPC 2
Although an example in which multiple types of through holes are formed on one is shown, in practice, it is preferable to form one type of through hole for one FPC in terms of work efficiency.
【００１６】図３は貫通孔の第３の形成例を示す平面図
である。ＦＰＣ３１の接着領域３１ａ全面には、メッシ
ュ状に多数の貫通孔Ｐ31が形成されている。メッシュ状
にすることにより、均等に貫通孔Ｐ31を配置できるの
で、補強板との接着をより確実にできる。FIG. 3 is a plan view showing a third example of forming a through hole. A large number of through holes P31 are formed in a mesh shape on the entire surface of the bonding area 31a of the FPC 31 . By a mesh, it is possible to uniformly arrange the through hole P 31, can be an adhesive between the reinforcing plate more reliably.
【００１７】また、配線構造に応じて貫通孔Ｐ31の配置
を変える必要がないので、孔開け加工も容易となる。た
だし、このようなメッシュ状の構成の適用は、パターン
３１ｂ，３１ｃ，３１ｄが、接着領域３１ａ部分で短絡
しても電気的に問題がない場合に限る。Further, since it is not necessary to change the arrangement of the through-hole P 31 according to the wiring structure, hole formation becomes easy. However, application of such a mesh-like configuration is limited to a case where the patterns 31b, 31c, and 31d have no electrical problem even if they are short-circuited at the bonding region 31a.
【００１８】[0018]
【発明の効果】以上説明したように本発明では、フレキ
シブルプリント配線板の少なくとも補強板の接着される
領域に貫通孔を形成し、その貫通孔に充填されるように
接着剤を塗布して補強板を接着するようにしたので、貫
通孔に充填された接着剤によって、両面の接着部が連結
され、接着強度を高めることができる。このため、ＦＰ
Ｃが吸湿した状態にあるときに半田付けなどにより加熱
しても、接着剤が剥離することがない。As described above, according to the present invention, a through-hole is formed at least in a region of the flexible printed wiring board to which the reinforcing plate is bonded, and an adhesive is applied so as to fill the through-hole and reinforcement is applied. Since the plates are bonded, the bonding portions on both sides are connected by the bonding agent filled in the through holes, and the bonding strength can be increased. Therefore, FP
Even when heating is performed by soldering or the like while C is in a moisture-absorbed state, the adhesive does not peel off.
【００１９】よって、半田付けの直前にベーキングを行
ったり、必要以上に防湿管理を行う必要がなくなり、作
業効率が向上し、コスト高も低減できる。Therefore, it is not necessary to perform baking immediately before soldering or to perform unnecessary moisture-proof management, thereby improving work efficiency and reducing cost.
【図１】本形態の補強板付きプリント配線板の概略構成
を示す図であり、（Ａ）は平面図、（Ｂ）は（Ａ）のＸ
−Ｘ線に沿う断面図である。FIGS. 1A and 1B are diagrams showing a schematic configuration of a printed wiring board with a reinforcing plate of the present embodiment, wherein FIG. 1A is a plan view and FIG.
It is sectional drawing which follows the X-ray.
【図２】貫通孔の第２の形成例を示す平面図である。FIG. 2 is a plan view showing a second example of forming a through hole.
【図３】貫通孔の第３の形成例を示す平面図である。FIG. 3 is a plan view showing a third example of forming a through hole.
【図４】従来の補強板付きプリント配線板の概略構成を
示す図であり、（Ａ）は平面図、（Ｂ）は（Ａ）のＹ−
Ｙ線に沿う断面図である。4A and 4B are diagrams showing a schematic configuration of a conventional printed wiring board with a reinforcing plate, wherein FIG. 4A is a plan view, and FIG.
It is sectional drawing which follows the Y line.
１０…補強板付きプリント配線板、１１…ＦＰＣ、１
２，１３…ＰＷＢ、１４…接着剤、２１，３１…ＦＰ
Ｃ、１１ａ，１１ｂ，２１ｂ，２１ｃ，２１ｄ…パター
ン、１１ｃ，１１ａ，３１ａ…接着領域、Ｐ11，Ｐ12，
Ｐ13，Ｐ21，Ｐ22，Ｐ23，Ｐ24，Ｐ31…貫通孔。10: printed wiring board with reinforcing plate, 11: FPC, 1
2,13 ... PWB, 14 ... adhesive, 21,31 ... FP
C, 11a, 11b, 21b, 21c, 21d... Pattern, 11c, 11a, 31a... Adhesive area, P 11 , P 12 ,
P 13, P 21, P 22 , P 23, P 24, P 31 ... through hole.
Claims (5)
接着することにより構成される補強板付きプリント配線
板において、 前記フレキシブルプリント配線板の少なくとも前記補強
板の接着される領域に貫通孔が形成され、前記貫通孔に
充填されるように前記接着剤が塗布されて前記補強板が
接着されていることを特徴とする補強板付きプリント配
線板。1. A printed wiring board with a reinforcing plate configured by bonding a reinforcing plate to a flexible printed wiring board, wherein a through hole is formed in at least a region of the flexible printed wiring board where the reinforcing plate is bonded, The printed wiring board with a reinforcing plate, wherein the adhesive is applied so as to fill the through hole and the reinforcing plate is bonded.
領域に１個ないしは複数個配置されていることを特徴と
する請求項１記載の補強板付きプリント配線板。2. The printed wiring board with a reinforcing plate according to claim 1, wherein one or a plurality of the through holes are arranged in a region where the reinforcing plate is bonded.
て形成されていることを特徴とする請求項２記載の補強
板付きプリント配線板。3. The printed wiring board with a reinforcing plate according to claim 2, wherein the through hole is formed so as to avoid the wiring pattern.
て前記補強板の接着される領域のほぼ全面にわたってメ
ッシュ状に形成されていることを特徴とする請求項１記
載の補強板付きプリント配線板。4. The printed wiring with a reinforcing plate according to claim 1, wherein the through-hole is formed in a mesh shape over substantially the entire region of the reinforcing plate including the wiring pattern to which the reinforcing plate is bonded. Board.
とする請求項１記載の補強板付きプリント配線板。5. The printed wiring board with a reinforcing plate according to claim 1, wherein the reinforcing plate is PWB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906997A JPH10341065A (en) | 1997-06-06 | 1997-06-06 | Reinforced printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906997A JPH10341065A (en) | 1997-06-06 | 1997-06-06 | Reinforced printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10341065A true JPH10341065A (en) | 1998-12-22 |
Family
ID=15467014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14906997A Pending JPH10341065A (en) | 1997-06-06 | 1997-06-06 | Reinforced printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10341065A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010074011A (en) * | 2000-11-28 | 2001-08-04 | 최병호 | Method of manufacturing for rigid flexible pwb |
| KR20020060656A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Flexible printed circuit board |
| JP2006080156A (en) * | 2004-09-07 | 2006-03-23 | Nitto Denko Corp | Wiring circuit board |
| KR100718212B1 (en) | 2003-07-01 | 2007-05-15 | 샤프 가부시키가이샤 | Method for bonding reinforcing plate |
| CN100391317C (en) * | 2003-03-31 | 2008-05-28 | 日本航空电子工业株式会社 | Electric connecting part |
| KR100839219B1 (en) | 2007-04-06 | 2008-06-17 | 김창수 | Reinforcement film cep method and machine for fpcb |
| JP2010034170A (en) * | 2008-06-23 | 2010-02-12 | Sumitomo Electric Ind Ltd | Wiring body, connection structure and electronic equipment |
| WO2012017664A1 (en) * | 2010-08-05 | 2012-02-09 | パナソニック株式会社 | Flexible printed wiring substrate and electronic equipment |
| US8767405B2 (en) | 2010-08-31 | 2014-07-01 | Kabushiki Kaisha Toshiba | Electronic apparatus and flexible printed circuit board |
| JP2020015209A (en) * | 2018-07-25 | 2020-01-30 | 東芝テック株式会社 | Inkjet head and inkjet recording device |
| CN113038702A (en) * | 2021-03-08 | 2021-06-25 | 浙江九通电子科技有限公司 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
-
1997
- 1997-06-06 JP JP14906997A patent/JPH10341065A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010074011A (en) * | 2000-11-28 | 2001-08-04 | 최병호 | Method of manufacturing for rigid flexible pwb |
| KR20020060656A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Flexible printed circuit board |
| CN100391317C (en) * | 2003-03-31 | 2008-05-28 | 日本航空电子工业株式会社 | Electric connecting part |
| KR100718212B1 (en) | 2003-07-01 | 2007-05-15 | 샤프 가부시키가이샤 | Method for bonding reinforcing plate |
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| KR100839219B1 (en) | 2007-04-06 | 2008-06-17 | 김창수 | Reinforcement film cep method and machine for fpcb |
| JP2010034170A (en) * | 2008-06-23 | 2010-02-12 | Sumitomo Electric Ind Ltd | Wiring body, connection structure and electronic equipment |
| WO2012017664A1 (en) * | 2010-08-05 | 2012-02-09 | パナソニック株式会社 | Flexible printed wiring substrate and electronic equipment |
| US8767405B2 (en) | 2010-08-31 | 2014-07-01 | Kabushiki Kaisha Toshiba | Electronic apparatus and flexible printed circuit board |
| JP2020015209A (en) * | 2018-07-25 | 2020-01-30 | 東芝テック株式会社 | Inkjet head and inkjet recording device |
| US10899128B2 (en) | 2018-07-25 | 2021-01-26 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet recording device |
| CN113038702A (en) * | 2021-03-08 | 2021-06-25 | 浙江九通电子科技有限公司 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
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