KR910001141Y1 - Printed circuit board for magnetic head - Google Patents
Printed circuit board for magnetic head Download PDFInfo
- Publication number
- KR910001141Y1 KR910001141Y1 KR2019870006112U KR870006112U KR910001141Y1 KR 910001141 Y1 KR910001141 Y1 KR 910001141Y1 KR 2019870006112 U KR2019870006112 U KR 2019870006112U KR 870006112 U KR870006112 U KR 870006112U KR 910001141 Y1 KR910001141 Y1 KR 910001141Y1
- Authority
- KR
- South Korea
- Prior art keywords
- mounting plate
- circuit board
- printed circuit
- magnetic head
- printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/52—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with simultaneous movement of head and record carrier, e.g. rotation of head
- G11B5/53—Disposition or mounting of heads on rotating support
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 일실시예에 관한 자기 헤드용 프린트 기판의 사시도.1 is a perspective view of a printed circuit board for a magnetic head according to an embodiment of the present invention.
제2도는 제1도의 프린트 기판을 금속설치판에 설치한 상태를 나타내는 사시도이다.FIG. 2 is a perspective view showing a state in which the printed board of FIG. 1 is mounted on a metal mounting plate. FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 설치판 2 : 프린트 기판1: mounting plate 2: printed board
3,4 프린트배선 패턴 5 : 금속 코팅층3,4 printed wiring pattern 5: metal coating layer
본 고안은 자기 헤드용 프린트 기판에 관한 것으로, 특히 자기 헤드에 있어서 금속 설치판에 접착되는 프린트 기판에 관련한 것이다.The present invention relates to a printed circuit board for a magnetic head, and more particularly, to a printed circuit board bonded to a metal mounting plate in a magnetic head.
자기 헤드, 예를들면 VTR에 사용되는 영상헤드에 있어서는, 황동(黃銅)등으로 이루어진 금속설치판에 베이클라이트재로 이루어진 프린트 기판을 접착하는 공정이 있다.In a magnetic head, for example, an image head used in a VTR, there is a process of adhering a printed board made of bakelite material to a metal mounting plate made of brass or the like.
이 프린트 기판은 편면(片面)프린트 기판으로서, 한쪽의 면에만 프린트배선 패턴이 실시되고 있으나, 다른쪽의 면에는 프린트배선 패턴이 실시되지 않고 베이클라이트재가 노출되어 있다. 그리고 베이클라이트재의 노출된 다른쪽의 면이 금속 설치판에 자외선 경화형 혐기성 접착제를 사용하여 접착됨과 동시에, 프린트 기판의 베이클라이트재는 경화촉진 처리, 즉 프라이마 처리가 실시한다.This printed board is a one-sided printed board, and the printed wiring pattern is applied only to one surface, but the printed wiring pattern is not applied to the other surface, and the bakelite material is exposed. The exposed other side of the bakelite material is adhered to the metal mounting plate by using an ultraviolet curable anaerobic adhesive, and at the same time, the bakelite material of the printed board is subjected to a curing accelerator treatment, that is, a prima treatment.
종래와 같이 황동등으로 이루어지는 금속설치판에 프린트 기판의 베이클라이트재를 접착하면, 금속과 베이클라이트재 때문에 접착이 완전히 되지 않고 접착강도 부족, 벗겨지거나 부분적인 들뜸에 의한 미접착부분이 발생한다는 문제점이 있다.If the bakelite material of the printed circuit board is bonded to a metal mounting plate made of brass or the like as in the prior art, there is a problem that the adhesion between the metal and the bakelite material is not completely completed and that the unbonded part is generated due to insufficient adhesive strength, peeling or partial lifting. .
본 고안의 목적은 상기 문제점을 감안하여, 금속설치판에 확실하게 접착되는 자기 헤드용 프린트 기판을 제공하는데 있다.SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a printed circuit board for magnetic head that is reliably adhered to a metal mounting plate.
본 고안의 자기 헤드용 프린트 기판은 자기 헤드에 있어서 금속설치판에 접착되는 프린트 기판이고, 그 프린트 기판은 상기 금속설치판에 접착되는 측의 면에 금속 코팅층이 실시되고 그 금속 코팅층이 실시된 프린트 기판의 면이 상기 금속설치판에 접착되어 있다.The printed circuit board for a magnetic head of the present invention is a printed board bonded to a metal mounting plate in a magnetic head, and the printed board is a printed metal coating layer applied to a surface of the side bonded to the metal mounting plate and the metal coating layer is applied. The surface of the substrate is adhered to the metal mounting plate.
본 고안의 자기 헤드용 프린트 기판에서는 금속설치판에 접착되는 측의 프린트 기판의 면에 금속 코팅층을 실시하고, 이 금속 코팅층이 실시된 프린트 기판의 면이 설치판에 접착되어 있다.In the printed circuit board for magnetic heads of this invention, the metal coating layer is given to the surface of the printed board by the side adhere | attached to a metal mounting plate, and the surface of the printed board on which this metal coating layer was given is adhered to the mounting plate.
이하, 도면을 이용하여 본 고안의 실시예를 설명한다. 제2도는 본 고안의 일실시예에 관한 자기 헤드용 프린트 기판(2)을 설치한 금속설치판(1)의 사시도이다.Hereinafter, embodiments of the present invention will be described with reference to the drawings. 2 is a perspective view of a metal mounting plate 1 provided with a printed circuit board 2 for magnetic heads according to an embodiment of the present invention.
도면에 있어서는 황동등으로 이루어지는 금속설치판(1)위에 U자형의 프린트 기판(2)이 접착되어 있다.In the figure, a U-shaped printed board 2 is bonded to a metal mounting plate 1 made of brass or the like.
이 프린트 기판(2)은 제1도에 확대하여 나타낸 바와 같이 금속설치판(1)에 접착되어 있는 축과 반대의 면위에 동으로 이루어지는 프린트배선 패턴(3,4)이 설치되고, 반대의 금속설치판(1)에 접착되는 면, 즉 접착면측에는 동박(銅箔)으로 이루어지는 금속 코팅층(5)이 코팅처리에 의하여 전면적으로 설치되어 있다.As shown in the enlarged view of FIG. 1, the printed circuit board 2 is provided with printed wiring patterns 3 and 4 made of copper on the surface opposite to the axis bonded to the metal mounting plate 1, and the opposite metal. On the surface bonded to the mounting plate 1, that is, on the adhesive surface side, a metal coating layer 5 made of copper foil is provided on the entire surface by a coating treatment.
이와같이 한쪽의 면에 프린트배선 패턴(3,4)이 설치되고 다른쪽면에 동박으로 이루어지는 금속코팅층(5)이 설치되어 있는 프린트 기판(2)을 제2도에 나타낸 바와같이 금속설치판(1)위에 배치하고, 대향하는 양판의 면사이에 자외선 경화형 혐기성 접착제를 도포하여 혐기성을 유지하면서, 즉 공기를 차단하도록 하면서 접착한다.Thus, as shown in FIG. 2, the printed circuit board 2 in which the printed wiring patterns 3 and 4 are provided on one side and the metal coating layer 5 made of copper foil is provided on the other side, as shown in FIG. Placed on the top, the UV curable anaerobic adhesive is applied between the faces of the opposing positive plates to maintain anaerobic, ie, to block air.
이와같이 함으로써 순간접착의 효과도 가능하게 됨과 동시에, 금속설치판(1)의 프린트 기판(2)은 서로 금속면끼리 확실하게 접착된다. 상기 금속코팅층(5)은 프린트배선 패턴(3,4)과 동일하게 형성될 수 있고, 구체적으로 양면프린트 기판을 사용하면 된다.In this way, the effect of instantaneous bonding is also possible, and the printed circuit boards 2 of the metal mounting plate 1 are securely bonded to each other. The metal coating layer 5 may be formed in the same manner as the printed wiring patterns 3 and 4, and specifically, a double-sided printed board may be used.
또한, 본 실시예의 자기 헤드용 프린트 기판(2)의 경우, 종래 프린트 기판(2)의 베이클라이트재를 경화촉진하기 위해 행해지고 있던 1차처리는 프린트 기판(2)이 확실하게 금속설치판(1)에 접착되기 때문에 불필요하게 된다.In the case of the print head 2 for the magnetic head of the present embodiment, the primary treatment, which has been conventionally performed to cure and promote the bakelite material of the print head 2, ensures that the printed board 2 is secured to the metal mounting plate 1. Since it is adhered to, it becomes unnecessary.
이상 설명한 바와같이 본 고안에 의하면, 금속설치판에 접착되는 측의 프린트 기판의 면에 금속코팅을 설치하고, 이 금속 코팅층이 설치된 프린트 기판의 면이 금속설치판에 접착되어 있기 때문에, 프린트 기판은 금속설치판에 확실하게 접착되어, 접착강도는 대폭적으로 향상되어 신뢰성이 향상됨과 동시에, 종래에 필요하였던 프라이마 처리가 불필요하게 되기 때문에 경제화도 달성된다는 효과가 있다.As described above, according to the present invention, since the metal coating is provided on the surface of the printed board on the side bonded to the metal mounting plate, and the surface of the printed board on which the metal coating layer is installed is bonded to the metal mounting plate, the printed board is Since it is reliably adhered to a metal mounting plate, adhesive strength is greatly improved and reliability improves, the priming process conventionally required becomes unnecessary, and there is an effect that economicalization is achieved.
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986152982U JPS6358313U (en) | 1986-10-03 | 1986-10-03 | |
| JP?86-152982 | 1986-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR880009078U KR880009078U (en) | 1988-06-30 |
| KR910001141Y1 true KR910001141Y1 (en) | 1991-02-25 |
Family
ID=31071457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019870006112U KR910001141Y1 (en) | 1986-10-03 | 1987-04-25 | Printed circuit board for magnetic head |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6358313U (en) |
| KR (1) | KR910001141Y1 (en) |
-
1986
- 1986-10-03 JP JP1986152982U patent/JPS6358313U/ja active Pending
-
1987
- 1987-04-25 KR KR2019870006112U patent/KR910001141Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6358313U (en) | 1988-04-19 |
| KR880009078U (en) | 1988-06-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| LAPS | Lapse due to unpaid annual fee |