JPS6310599B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is applicable to consumer electronic equipment such as radio receivers, television receivers, and calculators, and industrial electronic equipment such as computers, which are equipped with parts such as flat packages and ICs. The present invention relates to a through-hole printed wiring board that can be used in manufacturing products.

Conventional configurations and their problems Generally, when mass producing radio receivers, etc.
A method is used in which IC components, flat package components, etc. are temporarily fixed onto a printed wiring board using a thermosetting adhesive or the like, and then completely fixed using dip solder or the like in the final process. Furthermore, in today's era where higher density products are required, it is becoming common for printed wiring boards on which components are mounted to be double-sided, such as through-hole printed wiring boards. Therefore, the above
There are also cases where IC parts, flat package parts, etc. are mounted at positions where through holes are made on the above-mentioned through hole printed wiring board.

FIG. 1 is a sectional view showing a state in which electronic components are temporarily fixed to a conventional through-hole printed wiring board.
A conventional example will be explained below with reference to the drawings. An insulating substrate 2 on which a conductive pattern 1 is formed as shown in FIG.
A through hole 3 is provided in the through hole 3, and a through hole conductive layer 4 is formed in the through hole 3 by coating, printing, plating, etc. to prevent silver migration and scratch prevention on the through hole conductive layer 4 exposed on the surface of the insulating substrate 2. A protective layer 5 is provided by coating, printing, etc., and then, in order to temporarily fix the electronic component 6 on the protective layer 5, an adhesive 7 such as a thermosetting type is applied to temporarily attach the electronic component 6. Stop it. However, if a defect or misalignment occurs in the electronic components 6 such as the IC components or flat package components that have been temporarily fixed, it is necessary to replace the electronic components 6. However, in the above structure, when the temporarily fixed electronic component 6 is removed, the through-hole conductive layer 4 located below the adhesive 7 has a strong adhesive force.
There was a problem of peeling and destruction.

For this reason, in the past, lead wires were installed in the parts corresponding to the peeled or broken through-holes, or in some cases, the through-hole printed wiring board was discarded as a defective product, resulting in a huge loss in terms of cost. There was a problem.

OBJECTS OF THE INVENTION The present invention eliminates these conventional drawbacks, and provides a through-hole printed wiring board that has a simple structure and prevents peeling and destruction of the through-hole portions.

Structure of the Invention In order to achieve the above object, the through-hole printed wiring board of the present invention is provided by providing a through-hole in an insulating substrate having a conductive pattern formed on at least one surface, forming a through-hole conductive layer in the through-hole, and providing the through-hole printed wiring board as described above. A protective layer is provided on the through-hole conductive layer exposed on the surface of the insulating substrate, and at least that protective layer is covered with a release layer, and by providing the release layer on the protective layer, it can be temporarily fixed with adhesive etc. Even when replacing electronic parts or the like on the through-holes, the through-holes will not be peeled off or destroyed simply by peeling off the release layer.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a cross-sectional view showing a state in which electronic components are temporarily fixed to a through-hole printed wiring board according to an embodiment of the present invention. , forming a through-hole conductive layer 11 in the through-hole 10 by coating, printing, plating, etc., and providing a protective layer 12 on the through-hole conductive layer 11 exposed on the surface of the insulating substrate 9 by coating, printing, etc.; A protective layer 12 on top of it
A release layer 13 was provided by coating, printing, etc. so as to cover it.

In the through-hole printed wiring board as described above, in order to temporarily fix the electronic components 14 on the peeling layer 13, a thermosetting adhesive 15 is applied to temporarily fix the electronic components 14, and then the electronic components 14 are temporarily fixed on the release layer 13. Part 14
When a positional shift or defect is found in the electronic component 14, only the release layer 13 adheres to the adhesive 15 and is removed, so the protective layer 12 and the through-hole conductive layer 11 are not removed or destroyed.

Here, generally as the ink for the protective layer 12,
A thermosetting material such as epoxy, polyimide, or polyamide is used, and UV ink such as acrylic is used for the release layer 13, and the adhesive 15 and release layer 13 are bonded between the protective layer 12 and the release layer 13. Combine inks so that their adhesive strength is weaker than their adhesive strength.

In this case, the protective layer 12 and the release layer 13 can be overprinted if necessary. In addition, protective layer 1
2. When forming the peeling layer 13, it is advantageous that a service map printed on the surface of the insulating substrate 9 to indicate the connection state of resistors, capacitors, etc. can be formed at the same time.

Effects of the Invention As described above, the present invention provides a through hole in an insulating substrate having a conductive pattern formed on at least one surface, a through hole conductive layer is formed in the through hole, and the through hole exposed on the surface of the insulating substrate. A through-hole printed wiring board is formed by providing a protective layer on a conductive layer and covering at least that protective layer with a release layer, and the provision of the release layer on the protective layer may cause defects or misalignment. This makes it possible to remove electronic components without damaging the through holes, which is extremely advantageous in practice.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing a state in which electronic components are temporarily fixed to a conventional through-hole printed wiring board, and Fig. 2 is a sectional view showing a state in which electronic components are temporarily fixed to a through-hole printed wiring board in an embodiment of the present invention. It is. 8... Conductive pattern, 9... Insulating substrate, 10...
...Through hole, 11...Through hole conductive layer, 12...
Protective layer, 13...Peeling layer.

Claims (1)

[Claims] 1. A through hole is provided in an insulating substrate with a conductive pattern formed on at least one surface, a through hole conductive layer is formed in the through hole, a protective layer is provided on the through hole conductive layer exposed on the surface of the insulating substrate, and at least A through-hole printed wiring board whose protective layer is covered with a release layer.