JPS63181499A - Printed wiring - Google Patents
Printed wiringInfo
- Publication number
- JPS63181499A JPS63181499A JP1381787A JP1381787A JPS63181499A JP S63181499 A JPS63181499 A JP S63181499A JP 1381787 A JP1381787 A JP 1381787A JP 1381787 A JP1381787 A JP 1381787A JP S63181499 A JPS63181499 A JP S63181499A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- component
- bridging
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプリント配線板、特に部品挿入孔を有するプリ
ント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board having component insertion holes.
［従来の技術］
従来、プリント配線板の回路パターンに必要なコンデン
サー、その他の部品を実装する場合には、第２図に示す
如く、前記プリント配線板ｌの回路パターン２面より部
品３の端子４の挿入面５側に貫通する部品端子挿入用の
スルーホール６を基板７に開口するとともにスルーホー
ル６に部品３の端子４を挿入セットした状態下に回路パ
ターン２面側より７ラツクスおよびハンダ９をディップ
することにより部品３の端子４を回路パターン２側のラ
ンド８に電気的、ａ械的に接続して部品３を実装してい
る。[Prior Art] Conventionally, when mounting capacitors and other components necessary for the circuit pattern of a printed wiring board, as shown in FIG. A through hole 6 for inserting a component terminal, which penetrates through the insertion surface 5 side of the circuit pattern 4, is opened in the board 7, and with the terminal 4 of the component 3 inserted into the through hole 6 and set, 7 lux and solder are inserted from the circuit pattern 2 side. By dipping 9, the terminal 4 of the component 3 is electrically and mechanically connected to the land 8 on the circuit pattern 2 side, and the component 3 is mounted.
［発明が解決しようとする問題点］
しかるに、前記従来のプリント配線板１における部品３
の実装に当っては、フラクッスおよびハンダ９のディッ
プ時にフラクッス及びハンダ９がスルーホール６を介し
て、部品３の挿入面５側にまで付き廻゛す、部品３の挿
入面５側における端子４間あるいは挿入面５側に形成さ
れる他の回路（図示しない）にハンダが付着してブリッ
ジを生じる欠点を有し、かかるブリッジの点検並びに修
正作業が要求される等の欠点を有していた。[Problems to be Solved by the Invention] However, the components 3 in the conventional printed wiring board 1
When mounting the terminal 4 on the insertion surface 5 side of the component 3, the flux and solder 9 extend to the insertion surface 5 side of the component 3 through the through hole 6 when the flux and solder 9 are dipped. This has the disadvantage that solder adheres to other circuits (not shown) formed between the terminals or on the side of the insertion surface 5, resulting in bridges, and inspection and correction work for such bridges is required. .
因って、本発明はこれら従来のプリント配線板における
欠点に鑑みて開発されたもので、部品挿入面側における
ブリッジを防止し得るプリント配線板の提供を目的とす
るものである。Therefore, the present invention was developed in view of the drawbacks of these conventional printed wiring boards, and an object of the present invention is to provide a printed wiring board that can prevent bridging on the component insertion surface side.
［問題点を解決するための手段］
本発明のプリント配線板は、少なくとも部品挿入孔の、
部品の端子挿入孔側の外周に多層のブリッジの防止皮膜
を設けて成るものである。[Means for Solving the Problems] The printed wiring board of the present invention has at least the component insertion hole.
A multilayer bridge prevention coating is provided on the outer periphery of the component on the terminal insertion hole side.
［作 用］
本発明はプリント配線板は部品挿入孔の、部品の端子挿
入孔側の外周に施した多層のブリッジ防止皮膜により部
品挿入面側におけるフラックスおよびハンダの付き廻り
を阻止するものである。[Function] The printed wiring board of the present invention prevents flux and solder from running around on the component insertion surface side by using a multilayer bridging prevention coating applied to the outer periphery of the component insertion hole on the terminal insertion hole side of the component. .
［実施例］
以下本発明プリント配線板の一実施例を図面とともに説
明する。[Example] An example of the printed wiring board of the present invention will be described below with reference to the drawings.
第１図は本発明プリント配線板の要部の拡大断面図であ
る。FIG. 1 is an enlarged sectional view of the main parts of the printed wiring board of the present invention.
しかして、プリント配線板ｌの部品挿入面側におけるス
ルーホール６の外周には２層のブリッジ防止皮膜ｌＯを
設けることにより構成しである。Therefore, a two-layer anti-bridging film 1O is provided on the outer periphery of the through hole 6 on the component insertion surface side of the printed wiring board 1.
また、前記ブリッジ防止皮＠ｉｏはフラックスおよびハ
ンダ９の付着を防止し得る絶縁性の、例えばシリコンお
よびフッソ系樹脂またはこれらを含有する印刷インクを
シルク印刷等の手段にてコーティングすることにより形
成することができる。Further, the bridging prevention skin @io is formed by coating with an insulating material capable of preventing the adhesion of flux and solder 9, such as silicone and fluorocarbon resin, or a printing ink containing these, by means such as silk printing. be able to.
尚、前記２層のブリッジ防止皮ｆｉｌＯは前記印刷イン
クによるコーティング処理を２回施すことにより形成す
ることができるとともにコーティングインクの性能によ
り、絶縁性を有する他に、耐腐食性、耐湿性、耐熱性お
よび耐薬品性等の諸性質を有するものを使用して実施す
ることができる。The two-layer anti-bridging skin filO can be formed by coating twice with the printing ink, and due to the properties of the coating ink, it has not only insulation properties but also corrosion resistance, moisture resistance, and heat resistance. This can be carried out using materials having various properties such as durability and chemical resistance.
また、図示の実施例においては２層のブリッジ防止皮膜
１０について示したが、必要に応じて２層以上の多層の
ブリッジ防止皮膜を設けて実施することは勿論可能であ
る。さらに図示の実施例においては、スルーホール６の
外周にのみ２層のブリッジ防止皮膜１０を設けた場合に
ついて示したが、これを部品挿入側の全面に設けて実施
することも可能である。第１図中、その他の構成につい
ては、第２図のプリント配線板ｌの構成と同一の構成部
品に同一番号を付して、その説明を省略する。Furthermore, although the illustrated embodiment shows a two-layer anti-bridging coating 10, it is of course possible to provide a multi-layer anti-bridging coating of two or more layers as required. Further, in the illustrated embodiment, the two-layer anti-bridging film 10 is provided only on the outer periphery of the through hole 6, but it is also possible to provide this on the entire surface of the component insertion side. In FIG. 1, for other configurations, the same components as in the configuration of the printed wiring board 1 in FIG. 2 are given the same numbers, and the explanation thereof will be omitted.
［発明の効果］
本発明によれば、プリント配線板における部品挿入面側
における部品の端子間あるいはその他の回路間における
ブリッジを防止し、電気的性能を向上せしめるとともに
、ブリッジ修正作業等を不要ならしめ１作業性を向上せ
しめることができる。特に一層のみのブリッジ防止皮膜
を設ける場合に比較してより的確なブリッジ防止効果が
得られ、製品の安全性を向上し得る。[Effects of the Invention] According to the present invention, bridging between terminals of components or other circuits on the component insertion side of a printed wiring board is prevented, electrical performance is improved, and bridge repair work is not required. 1. Workability can be improved. In particular, a more accurate bridging prevention effect can be obtained compared to the case where only one layer of bridging prevention film is provided, and product safety can be improved.
第１図は本発明プリント配線板の一実施例を示す要部の
拡大断面図、第２図は従来のプリント配線板の要部の拡
大断面図である。
ｌ・・・プリント配線板
２・・・回路パターン
３・・・部品
４・・・端子
５・・・部品挿入面
６・・・スル−ホール
７・・・基板
８・・・ランド
９…ハンダ
１０・・・２層のブリッジ防止皮膜
特許出願人 日本シイエムケイ株式会社第２図FIG. 1 is an enlarged sectional view of the main parts of an embodiment of the printed wiring board of the present invention, and FIG. 2 is an enlarged sectional view of the main parts of a conventional printed wiring board. l...Printed wiring board 2...Circuit pattern 3...Component 4...Terminal 5...Component insertion surface 6...Through hole 7...Board 8...Land 9...Solder 10...Two-layer anti-bridging film Patent applicant Nippon CMK Co., Ltd. Figure 2
Claims (4)
外周面に多層のブリッジ防止皮膜を設けて成るプリント
配線板。(1) A printed wiring board comprising a multilayer anti-bridging coating provided on at least the outer peripheral surface of the component insertion hole on the terminal insertion hole side of the component.
パターン面に於けるランドに電気的に接続するフラクッ
スの付着を防止し得る多層の絶縁皮膜から成る特許請求
の範囲第１項記載のプリント配線板。(2) The print according to claim 1, wherein the bridge prevention film is a multilayer insulating film capable of preventing the adhesion of flux that electrically connects the terminal of the component to the land on the circuit pattern surface. wiring board.
系樹脂またはこれらを含有する印刷インクをコーティン
グして成る特許請求の範囲第１項記載又は第２項記載の
プリント配線板。(3) The printed wiring board according to claim 1 or 2, wherein the anti-bridging film is formed by coating silicone, fluorine resin, or printing ink containing these.
板の部品挿入孔側の全面に設けて成る特許請求の範囲第
１項記載のプリント配線板。(4) The printed wiring board according to claim 1, wherein the multilayer anti-bridging film is provided on the entire surface of the printed wiring board on the component insertion hole side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1381787A JPS63181499A (en) | 1987-01-23 | 1987-01-23 | Printed wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1381787A JPS63181499A (en) | 1987-01-23 | 1987-01-23 | Printed wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63181499A true JPS63181499A (en) | 1988-07-26 |
Family
ID=11843831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1381787A Pending JPS63181499A (en) | 1987-01-23 | 1987-01-23 | Printed wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63181499A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998584A (en) * | 1983-11-01 | 1984-06-06 | 松下電器産業株式会社 | Printed circuit board |
| JPS5929065B2 (en) * | 1975-12-29 | 1984-07-18 | 富士写真フイルム株式会社 | Phenoxypropylamine |
| JPS6010692A (en) * | 1983-06-30 | 1985-01-19 | 石井 銀弥 | Printed circuit board |
| JPS60158695A (en) * | 1984-01-27 | 1985-08-20 | 松下電器産業株式会社 | Both-side through hole printed board |
-
1987
- 1987-01-23 JP JP1381787A patent/JPS63181499A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929065B2 (en) * | 1975-12-29 | 1984-07-18 | 富士写真フイルム株式会社 | Phenoxypropylamine |
| JPS6010692A (en) * | 1983-06-30 | 1985-01-19 | 石井 銀弥 | Printed circuit board |
| JPS5998584A (en) * | 1983-11-01 | 1984-06-06 | 松下電器産業株式会社 | Printed circuit board |
| JPS60158695A (en) * | 1984-01-27 | 1985-08-20 | 松下電器産業株式会社 | Both-side through hole printed board |
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