JPS594098A - Method of protecting printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for protecting a printed circuit board, and in particular, a method for protecting a circuit conductor provided on a base material and preventing corrosion or short circuits between the conductor and electrical components connected thereto. 〇In general, after forming circuit conductors on a base material, a printed circuit board is designed to protect the parts where electronic components are mounted, such as connectors, etc. The parts other than the terminals to be connected are lined with broken lines using insulating film or insulating paint to protect the circuit conductors and prevent short circuits.

However, even if the circuit conductor parts are insulated as described above, corrosion from the terminal parts where electrical and electronic components are mounted, or short circuits in these parts are likely to occur, so such printed circuit boards are , overall reliability especially electronics.

There was a problem of low reliability when incorporated into electrical equipment and used over a long period of time.

The object of the present invention is to provide a circuit conductor provided on a base material and electricity connected to the conductor. It is an object of the present invention to provide a method for protecting a printed circuit board that can completely protect circuit conductors and prevent short circuits by covering both electronic components with an insulating material.

FIG. 1 shows a first embodiment of the present invention, in which conductors 2, 2 constituting a predetermined circuit pattern are provided on a base material l, and predetermined portions of the conductors 2, 2 are printed using, for example, a screen printing method. Then, an insulating material and an insulating paint are applied quickly to form a layer 3.3. Next, electrical and electronic parts l leads &i
Connect +A, &, and B with conductors, and 2.2 with soldering, etc., and then temporarily attach masking strips to the parts that do not need to be covered with insulating material E, and then attach the diagram of base material L. The middle upper surface side, that is, the conductor 2. By immersing the side on which λ and the part t are provided in an insulating substance bath, for example, an insulating paint bath, both the conductor, 2.2 and the part ≠? 1
1- Sew insulation paint coating 4! form. Then, the masking material is removed, and the insulating paint 3 is dried and/or
Or assimilate.

By the above method, the predetermined portions of the conductors 2, 2 are double sealed with the insulating paint 3 and the left side, and are sufficiently preserved against outside air, external shocks, and the like. Therefore, the parts themselves and the connection parts between the parts μ and the conductors 2, 2 are coated with insulating paint! Similarly, it is not affected by outside air, especially humidity, and there is no fear of corrosion, and accidents such as short circuits do not occur.

FIG. 2 shows a second embodiment of the present invention.
As in the case of the embodiment, a 2° conductor constituting the circuit pattern is formed on the paste material, and connections are made between predetermined locations of the conductor a2.2 and the lead wires lIA and 4B of the component group. After temporarily applying a masking material to the parts that do not require an insulating coating, an insulating material such as an insulating paint is sprayed onto both the conductor 2.2 and the component 1 to form a coating 1B. Then, the masking material is removed, and the coating layer t is dried and/or solidified.

In this embodiment as well, the conductors 2, 2, parts 1, and the connection parts between parts 1 and conductors 2, 2 are separated from the outside air by the ridge layer 2 made of insulating paint, which prevents corrosion, short circuits, etc. as described above. problems can be prevented.

According to the present invention, by coating both the circuit conductors provided on the base material of the printed circuit board and the electrical and electronic components connected to the four bodies with an insulating material, these conductors and components as well as the conductors and components can be separated. It is possible to disconnect the connection between the two from the outside, thereby preventing these corrosion, while also preventing the occurrence of short circuits at the connection between the two.
This ensures the reliability of the printed circuit board as a whole.

[Brief explanation of the drawing]

1 and 1 are cross-sectional views showing both embodiments of the printed circuit board storage method according to the present invention, respectively. Base material λ 01109. Conductor 3! ;, t , , , , coating layer l ・・・・・・ Part applicant Nippon Mectron Co., Ltd. Figure 1 Figure 2

Claims (1)

[Claims] 1. A method for protecting a printed circuit board, which comprises covering a circuit conductor provided on a base material and an electrical component connected to the conductor with an insulating material.