JPS59119787A - Method of preventing shortcircuit in integrated circuit board - Google Patents
Method of preventing shortcircuit in integrated circuit boardInfo
- Publication number
- JPS59119787A JPS59119787A JP22681982A JP22681982A JPS59119787A JP S59119787 A JPS59119787 A JP S59119787A JP 22681982 A JP22681982 A JP 22681982A JP 22681982 A JP22681982 A JP 22681982A JP S59119787 A JPS59119787 A JP S59119787A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- conductor
- lead
- preventing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、集積回路基板における導体と、電解コンデン
サ等のリードセンの短絡防止に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to prevention of short circuit between a conductor in an integrated circuit board and a lead sensor such as an electrolytic capacitor.
第１図に従来の集積回路基板の断面図を示す。 FIG. 1 shows a cross-sectional view of a conventional integrated circuit board.
絶縁基板１上に、導体２および導体６ビ印刷し、ガラス
レジスト４ケ印刷したのち、リード部品。After printing conductors 2 and 6 conductors on insulating substrate 1, and printing 4 glass resists, lead parts were formed.
５のリードセン６′？：挿入穴７に挿入する。そののち
リード部品のリードセン６と導体３は、半田８により固
着される。ここで導体２とリード部品のリードセン６は
、半田レジスト４により絶縁されるが、通常半田レジス
ト４は熱及び機械的ストレスに耐し、十分な耐久力Ｚも
だないため基板保管時や、リードセン挿入時に半田レジ
スト４の絶縁が劣化し、導体２とリードセン６が短絡す
る現象が発生した。5 lead sen 6′? : Insert into insertion hole 7. Thereafter, the lead sensor 6 of the lead component and the conductor 3 are fixed with solder 8. Here, the conductor 2 and the lead sensor 6 of the lead component are insulated by a solder resist 4, but since the solder resist 4 normally resists heat and mechanical stress and does not have sufficient durability Z, During insertion, the insulation of the solder resist 4 deteriorated, causing a short circuit between the conductor 2 and the lead sensor 6.
を発明の目的〕
本発明の目的は、上記した従来技術の欠点をなくし、集
積回路基板の導体と、リード部品のリードセンの絶縁Ｙ
改善するものである。An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to improve insulation between the conductor of an integrated circuit board and the lead sensor of a lead component.
It is something to improve.
上記した従来技術の欠点をなくすため、集積回路基板の
導体上に、誘電体ガラスの印刷を行ない、導体とリード
部品のリードセンの絶縁を改善するものである。In order to eliminate the above-mentioned drawbacks of the prior art, dielectric glass is printed on the conductor of the integrated circuit board to improve the insulation between the conductor and the lead sensor of the lead component.
以下、本発明の実施例を矛２図により説明する。絶縁基
板１上に、導体２および導体３乞印刷し、牙１誘電体ガ
ラス９１，１−２誘電体ガラス１０．半田レジスト４乞
印刷する。そののちリード部品のリードセン６は、挿入
穴７に挿入され、半田８により導体６と固着されるが、
矛１誘電体１０．半田レジスト４で構成される絶縁層に
より、導体２とリード部品のリードセン６は十分に絶縁
される。Embodiments of the present invention will be described below with reference to FIG. The conductor 2 and the conductor 3 are printed on the insulating substrate 1, and the dielectric glass 91, 1-2 dielectric glass 10. Print 4 pieces of solder resist. After that, the lead sensor 6 of the lead component is inserted into the insertion hole 7 and fixed to the conductor 6 with solder 8.
Spear 1 Dielectric 10. The conductor 2 and the lead sensor 6 of the lead component are sufficiently insulated by the insulating layer composed of the solder resist 4.
なお上記実施例では誘電体ガラスの印刷７２層としたが
、１層でもよ（、又半田レジストの印刷はなくてもよい
。In the above embodiment, 72 layers of dielectric glass were printed, but it may be one layer (or printing of solder resist may not be necessary).
本発明によれば、リード部品のリードセンと集積回路基
板の導体との短絡が防止される。According to the present invention, short circuit between the lead sensor of the lead component and the conductor of the integrated circuit board is prevented.
矛１図は従来の集積回路基板の断面図１，３１７２図は
本発明の一実施例の集積回路基板の断面図である。
１・・・絶縁基板、２・・導体、６・・導体、４・・・
ガラスレジスト、５・・・リード部品、６・・・リード
部品のリードセン、７・・・挿入穴、８・・・半田、９
・・・・・・矛１誘電体層、１０・・・、３１−２銹ｍ
体層。Figure 1 is a sectional view of a conventional integrated circuit board, and Figure 3172 is a sectional view of an integrated circuit board according to an embodiment of the present invention. 1...Insulating substrate, 2...Conductor, 6...Conductor, 4...
Glass resist, 5... Lead component, 6... Lead sensor for lead component, 7... Insertion hole, 8... Solder, 9
....1 dielectric layer, 10..., 31-2 m
Body layer.
Claims (1)
板において、電解コンデンサ等のリード部品のり−ドセ
ンと、接続されるべきでない導体との短絡を防止するた
めに、導体上に誘電体ガラスの絶縁層を設けたこと乞特
徴とする集積回路基板における短絡防止法。In integrated circuit boards that have a structure in which conductors and components are fixed with solder, a layer of dielectric glass is placed on the conductor to prevent short circuits between lead components such as electrolytic capacitors and conductors that should not be connected. A method for preventing short circuits in integrated circuit boards, which is characterized by providing an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22681982A JPS59119787A (en) | 1982-12-27 | 1982-12-27 | Method of preventing shortcircuit in integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22681982A JPS59119787A (en) | 1982-12-27 | 1982-12-27 | Method of preventing shortcircuit in integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119787A true JPS59119787A (en) | 1984-07-11 |
Family
ID=16851087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22681982A Pending JPS59119787A (en) | 1982-12-27 | 1982-12-27 | Method of preventing shortcircuit in integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119787A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159873U (en) * | 1987-04-08 | 1988-10-19 |
-
1982
- 1982-12-27 JP JP22681982A patent/JPS59119787A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159873U (en) * | 1987-04-08 | 1988-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59119787A (en) | Method of preventing shortcircuit in integrated circuit board | |
| JP2507064Y2 (en) | Printed wiring board | |
| JPH1041605A (en) | Electronic component mounting structure | |
| JPS62108594A (en) | Hybrid integrated circuit | |
| JPH0231797Y2 (en) | ||
| JPS5998584A (en) | Printed circuit board | |
| JPS5835993A (en) | Printed circuit board | |
| JPH01789A (en) | Superconducting wiring printed board | |
| JPS6141272Y2 (en) | ||
| JPS6123391A (en) | Device for mounting chip circuit part | |
| JPS6010275Y2 (en) | insulated terminal | |
| JPS5880895A (en) | Both-side printed circuit board and both-side printed circuit board device as well as method of producing same | |
| JPS62200798A (en) | Multilayer board | |
| JPS594098A (en) | Method of protecting printed circuit board | |
| JPS60180186A (en) | Printed board | |
| JPS5914694A (en) | Printed board | |
| JPH04180211A (en) | Capacitor | |
| JPS6096868U (en) | printed wiring board | |
| JPS6230718B2 (en) | ||
| JPS62245697A (en) | Wet type multilayer ceramic board | |
| JPS6354714A (en) | Manufacture of hybrid integrated circuit | |
| JPS58118190A (en) | Both-side through hole printed circuit board and method of producing same | |
| JPS60119771U (en) | hybrid integrated circuit board | |
| JPS584996A (en) | Aluminum circuit board | |
| JPS59191765U (en) | Wet multilayer ceramic substrate |