JPH01789A - Superconducting wiring printed board - Google Patents
Superconducting wiring printed boardInfo
- Publication number
- JPH01789A JPH01789A JP62-155685A JP15568587A JPH01789A JP H01789 A JPH01789 A JP H01789A JP 15568587 A JP15568587 A JP 15568587A JP H01789 A JPH01789 A JP H01789A
- Authority
- JP
- Japan
- Prior art keywords
- superconducting wiring
- wiring
- superconducting
- insulating substrate
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000001934 delay Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012671 ceramic insulating material Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は超電導配線プリント板の構造に関する〔従来の
技術〕
従来、電導配線プリント板は、絶縁基板上に銅配線を行
なうかあるいはセラミック基板上にタングステンを印刷
配線するのが通例である。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to the structure of a superconducting printed circuit board [Prior Art] Conventionally, a conductive printed circuit board has been fabricated using copper wiring on an insulating substrate or a ceramic substrate. It is customary to print tungsten on the wire.
しかし、上記従来技術によると、銅配線あるいはタング
ステン配線の配線抵抗が大きく、電気回路のスイッチン
グ、スピードを遅延させるという問題点があった。However, according to the above-mentioned conventional technology, there is a problem that the wiring resistance of the copper wiring or tungsten wiring is large, which delays the switching speed of the electric circuit.
本発明は、かかる従来技術の問題点をなくし、プリント
板の配線を超電導配線となし、プリント板配線抵抗によ
る電気回路のスイッチング、スピードの遅延をなくする
事を目的とする。It is an object of the present invention to eliminate the problems of the prior art, to use superconducting wiring for printed board wiring, and to eliminate delays in switching and speed of electric circuits due to printed board wiring resistance.
上記問題点を解決するために、本発明は、−層及び多層
プリント板において、少なくとも超電導配線を行なう事
を基本とし、且つ少なくともプリント板端部のコネクタ
部に少なくとも超電導配線することを基本的な手段とす
る。In order to solve the above-mentioned problems, the present invention basically provides at least superconducting wiring in -layer and multilayer printed boards, and also basically provides superconducting wiring at least in the connector section at the end of the printed board. Use as a means.
以下、実施例により本発明を詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図は本発明の一実施例を示す８ｉ電導配線プリント
板の断面図である。すなわち、アルミナ等からなるセラ
ミックの絶縁素材ｌの表面には、イツトリウム、バリウ
ム、銅酸化物から成る超電導配線２が施されると共に、
前記絶縁基板ｌの端部又はスルーホール部内のコネクタ
部３にも超電導配線か施されて成る。尚、超電導配線上
には銅や金のメツキが一部又は全部に施されてもその超
電導配線が有機材の場合には絶縁基板はベークライト等
であっても良い事はいうまでもない。FIG. 1 is a sectional view of an 8i conductive wiring printed board showing an embodiment of the present invention. That is, superconducting wiring 2 made of yttrium, barium, or copper oxide is applied to the surface of a ceramic insulating material l made of alumina or the like, and
Superconducting wiring is also provided at the end of the insulating substrate 1 or at the connector section 3 within the through-hole section. It goes without saying that even if the superconducting wiring is partially or entirely plated with copper or gold, if the superconducting wiring is made of an organic material, the insulating substrate may be made of Bakelite or the like.
第２図は本発明の他の実施例を示す多層超電導配線プリ
ント板の断面図である。すなわち、第１の絶縁基板１１
６表面には第１の超電導配線１２が配され、更にその上
に第２の絶縁基板１３が貼付けられ、該第２の絶縁基板
１３の上には第２のｍ電導配線１４が、コンタクト部１
５及びコネクタ部１６まで埋めて配されて成る。FIG. 2 is a sectional view of a multilayer superconducting wiring printed board showing another embodiment of the present invention. That is, the first insulating substrate 11
A first superconducting wiring 12 is disposed on the surface of 6, and a second insulating substrate 13 is attached thereon, and a second superconducting wiring 14 is placed on the second insulating substrate 13 at the contact portion. 1
5 and the connector portion 16 are buried.
本発明により、プリント板に組み込まれた電気回路のス
イッチング速度（ギリシャ文字でタウ）τは配線抵抗Ｒ
が極めて小となるためにで＝ＣＨの式より、極めて高速
性が得られると言う効果がある。According to the present invention, the switching speed (Tau in Greek) of the electrical circuit incorporated in the printed circuit board is determined by the wiring resistance R
is extremely small, which has the effect of providing extremely high speed compared to the =CH equation.
第１図及びｉ２図は、本発明の実施例を示す超電導配線
プリント基板の断面図である。
ｌ・・・絶縁基板
２・・・超電導配線
３・・・コネクタ部
１１・・・第１の絶縁基板
１２・・・ｉｌの超電導基板
１３・・・第２の絶縁基板
１４・・・ｆ５２のａ電導配線
１５・・・コンタクト部
１６・・・コネクタ部
以上
出願人 セイコーエプソン株式会社FIGS. 1 and 12 are cross-sectional views of a superconducting printed circuit board showing an embodiment of the present invention. l...Insulating substrate 2...Superconducting wiring 3...Connector portion 11...First insulating substrate 12...il superconducting substrate 13...Second insulating substrate 14...f52 a Conductive wiring 15...Contact part 16...Connector part and above Applicant Seiko Epson Corporation
Claims (2)
て形成され、且つ、前記第１の絶縁基板の少なくとも端
部には超電導配線がコネクタ部として形成されて成る事
を特徴とする超電導配線プリント板。(1) A first superconducting wiring is printed and formed on a first insulating substrate, and a superconducting wiring is formed as a connector part at least at an end of the first insulating substrate. Superconducting wiring printed board.
の絶縁基板上には第２の絶縁基板が形成されると共に、
該第２の絶縁基板に開けられたコンタクト穴を通して第
２の超電導配線がなされた事を特徴とする特許請求の範
囲第１項記載の超電導配線プリント板。(2) the first superconducting wiring on which the first superconducting wiring is formed;
A second insulating substrate is formed on the insulating substrate, and
2. The superconducting wiring printed board according to claim 1, wherein the second superconducting wiring is formed through a contact hole made in the second insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155685A JPH01789A (en) | 1987-06-23 | Superconducting wiring printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155685A JPH01789A (en) | 1987-06-23 | Superconducting wiring printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64789A JPS64789A (en) | 1989-01-05 |
| JPH01789A true JPH01789A (en) | 1989-01-05 |
Family
ID=
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