JPH08307056A - Multilayer interconnection board - Google Patents

Abstract

PURPOSE: To provide a multilayer interconnection board which is excellent in impedance matching and is so constructed that its thickness is small. CONSTITUTION: This multilayer interconnection board comprises a through hole dense region 2 where a plurality of through holes 1 are crowded; a wiring region 3 where signal wiring films 4, 5 and power supply wiring films 6-8 are arranged, and a connecting wiring film region 2a where the through holes 1 in the through hole dense region 2 are connected with the signal wiring films 4, 5, or power supply wiring films 6-8 in the wiring region 3. The impedance of the signal wiring films 4, 5 in the wiring region 3 is controlled by the power supply films 7, 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board,
In particular, the present invention relates to a technique effective when applied to a multilayer wiring board having a wiring structure with excellent impedance matching.

[0002]

2. Description of the Related Art A multilayer wiring board is used in various electric equipment including a semiconductor integrated circuit device, and the wiring structure of the multilayer wiring board becomes finer as the integration and performance of the semiconductor integrated circuit device become higher. There is a demand for a highly reliable wiring structure.

In recent years, as a wiring structure of a multilayer wiring board,
The impedance of the signal wiring layer is controlled in order to achieve a highly reliable wiring structure.To this end, a micro stop line is constructed by combining the signal wiring film and the power supply wiring film to achieve impedance matching. There is something.

In this case, in order to control the impedance in the multilayer wiring board, the ratio of the width of the signal wiring film to the film thickness of the signal wiring film and the film thickness of the interlayer insulating film between the power supply wiring film and the signal wiring film are controlled. It is performed by adjusting the ratio of the dielectric constant to the dielectric constant.

As a document describing a wiring board on which a semiconductor integrated circuit device is mounted, there is, for example, one disclosed in Japanese Patent Laid-Open No. 59-202654.

[0006]

However, the present inventor has found that the above-mentioned multilayer wiring board has various problems as described below.

That is, since the signal wiring film and the power supply wiring film are paired in the wiring structure of the multilayer wiring board, through holes when mounting components such as a semiconductor integrated circuit device on the multilayer wiring board are formed. Since the signal wiring film is increased in density and the number of wirings that can be passed between the through holes is increased, the problem that the board thickness of the multilayer wiring board becomes thick occurs.

In this case, if the electrodes of a component such as a semiconductor integrated circuit device mounted on the multilayer wiring board have a short length,
Since the thickness of the multilayer wiring board becomes larger than the length of the electrode, there arises a problem that sufficient solder connection cannot be achieved when the electrodes of the component are electrically connected to the multilayer wiring board by soldering.

Further, when components such as a semiconductor integrated circuit device are mounted on the multilayer wiring board at high density or when components having a narrow electrode pitch are mounted, impedance control in the multilayer wiring board used for the components is controlled. However, since the number of signal wiring films increases, the problem that the substrate of the multi-layer wiring substrate becomes thick occurs.

An object of the present invention is to provide a multilayer wiring board having a structure in which the impedance is excellent and the board thickness is small.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0012]

The typical ones of the inventions disclosed in the present invention will be outlined below.

In the multilayer wiring board of the present invention, a through hole dense area in which a plurality of through holes are densely arranged, a wiring area in which a signal wiring film and a power supply wiring film are arranged, and each through hole and wiring in the through hole dense area It is assumed that there is a connection wiring film region to which the signal wiring film or the power supply wiring film in the region is electrically connected, and the impedance of the signal wiring film in the wiring region is controlled by the power supply wiring film.

[0014]

(1) According to the above-described multilayer wiring board of the present invention, the impedance of the signal wiring film in the wiring region is controlled by the power supply wiring film in the same wiring region as the signal wiring film. Since the signal wiring film in (1) can be impedance-matched, the multilayer wiring board has excellent impedance matching.

(2) According to the above-described multilayer wiring board of the present invention, a through hole dense area where a plurality of through holes are densely arranged, and each through hole in the through hole dense area and a signal wiring film or a power supply wiring in the wiring area. Since it is not necessary to control impedance in the connection wiring film region where the films are electrically connected, it is possible to eliminate the need for a wiring film for controlling impedance and an insulating film between those wiring films. As a result, the thickness of the multilayer wiring board can be minimized, so that the multilayer wiring board has a structure with a small thickness.

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. In all the drawings for explaining the embodiments, those having the same function are designated by the same reference numerals, and a duplicate description will be omitted.

FIG. 1 is a schematic plan view showing a multilayer wiring board which is an embodiment of the present invention, FIG. 2 is a schematic sectional view showing a cross section taken along the line AA in FIG. 1, and FIG. 3 is a sectional view taken along the line BB in FIG. FIG. 4 is a schematic enlarged cross-sectional view showing a cross-section taken along the arrow, and FIG. 4 is a schematic enlarged cross-sectional view showing the cross-section taken along the line CC of FIG.

The multilayer wiring board of the present invention and the method for manufacturing the same will be specifically described with reference to FIGS.

As shown in FIGS. 1 to 4, in the multilayer wiring board of this embodiment, a through hole dense region 2 in which a large number of through holes 1 are densely arranged, a signal wiring film and a power wiring film are arranged. The through-holes 1 in the wiring region 3 and the through-hole dense region 2 and the signal wiring film or the power supply wiring film in the wiring region 3 are composed of a connection wiring film region 2a electrically connected by the wiring film.

The wiring region 3 has a multi-layered signal wiring film 4,
5 and the power supply wiring films 6 to 8 having a multilayer structure are arranged via insulating layers 9 to 18 having a function of an interlayer insulating film.

In addition, the signal wiring films 4 and 4 in the wiring region 3
5 and the power supply wiring films 7 and 8 employ a microstrip run structure in which the signal wiring films 4 and 5 are paired.
Since the impedance of 5 is controlled, the impedance matching of the signal wiring films 4 and 5 is completed.

The first-layer power supply wiring film 6 arranged on the first-layer wiring film in the wiring region 3 is formed on the surface of the first-layer insulating layer 9 in the multilayer wiring board. Also,
The power supply wiring film 6 of the first layer is electrically connected to the through holes 1a in the through hole dense area 2 by the wiring film 19 in the connection wiring film area 2a. Through hole 1
A conductor is provided on the inner walls of all the through-holes 1 including a, though not shown for the sake of simplicity.

The first-layer signal wiring film 4 arranged on the second-layer wiring film in the wiring region 3 is formed on the surface of the second-layer insulating layer 10 in the multilayer wiring board. Further, the signal wiring film 4 of the first layer is formed in the through hole dense region 2
Is electrically connected to the through hole 1i by the wiring film 20 in the connecting wiring film region 2a.

The wiring film 20 is formed on the surface of the second insulating layer 10 in the multilayer wiring board.

The first-layer signal wiring film 4a arranged on the second-layer wiring film in the wiring region 3 is formed on the surface of the second-layer insulating layer 10 in the multilayer wiring board. The signal wiring film 4a of the first layer is electrically connected to the through holes 1h in the through hole dense area 2 by the wiring film 21 and the pillar 28 in the connection wiring film area 2a.

The wiring film 21 is formed on the surface of the third insulating layer 11 in the multilayer wiring board. The pillar 28 has a through hole formed in the insulating layer 11,
It has a structure in which a pillar-shaped conductor is embedded in the through hole. The planar shape of the pillar-shaped pillar 28 is
For example, various shapes such as a circular shape or a square shape can be used.

The first-layer signal wiring film 4b arranged on the second-layer wiring film in the wiring region 3 is formed on the surface of the second-layer insulating layer 10 in the multilayer wiring board. The signal wiring film 4b of the first layer is electrically connected to the through hole 1g in the through hole dense area 2 by the wiring film 22 and the pillar 28a in the connection wiring film area 2a.

The wiring film 22 is formed on the surface of the fourth insulating layer 12 in the multilayer wiring board.

The first-layer signal wiring film 4c arranged on the second-layer wiring film in the wiring region 3 is formed on the surface of the second-layer insulating layer 10 in the multilayer wiring board. The signal wiring film 4c of the first layer is electrically connected to the through hole 1f in the through hole dense area 2 by the wiring film 23 and the pillar 28b in the connection wiring film area 2a.

The wiring film 23 is formed on the surface of the fifth insulating layer 13 in the multilayer wiring board.

The second-layer power supply wiring film 7 arranged on the third-layer wiring film in the wiring region 3 is formed on the surface of the fourth-layer insulating layer 12 in the multilayer wiring board. The power supply wiring film 7 of the second layer is electrically connected to the power supply wiring film 6 of the first layer by pillars in a region outside the drawing.

The power supply wiring film 7 is formed on the multilayer wiring board 4
It is formed on the surface of the second insulating layer 12 by the same manufacturing process as the wiring film 22 in the connection wiring film region 2a.

Further, the second-layer signal wiring film 5 arranged on the fourth-layer wiring film in the wiring region 3 is formed on the surface of the sixth-layer insulating layer 14 in the multilayer wiring board. Further, the second-layer signal wiring film 5 is connected to the through-holes 1e in the through-hole dense area 2 in the connection wiring film area 2
It is electrically connected by the wiring film 24 in a.

The wiring film 24 is formed on the surface of the sixth insulating layer 14 in the multilayer wiring board by the same manufacturing process as the signal wiring film 5.

The second-layer signal wiring film 5a arranged on the fourth-layer wiring film in the wiring region 3 is formed on the surface of the sixth-layer insulating layer 14 in the multilayer wiring board. The second-layer signal wiring film 5a is electrically connected to the through hole 1d in the through hole dense area 2 by the wiring film 25 and the pillar 28c in the connection wiring film area 2a.

The wiring film 25 is formed on the surface of the seventh insulating layer 15 in the multilayer wiring board.

The second-layer signal wiring film 5b arranged on the fourth-layer wiring film in the wiring region 3 is formed on the surface of the sixth-layer insulating layer 14 in the multilayer wiring board. The second-layer signal wiring film 5b is electrically connected to the through hole 1c in the through hole dense area 2 by the wiring film 26 and the pillar 28d in the connection wiring film area 2a.

The wiring film 26 is formed on the surface of the eighth insulating layer 16 in the multilayer wiring board.

The second-layer signal wiring film 5c arranged on the fourth-layer wiring film in the wiring region 3 is formed on the surface of the sixth-layer insulating layer 14 in the multilayer wiring board. The second-layer signal wiring film 5c is electrically connected to the through hole 1b in the through hole dense area 2 by the wiring film 27 and the pillar 28e in the connection wiring film area 2a.

The wiring film 27 is formed on the surface of the ninth insulating layer 17 in the multilayer wiring board.

A tenth insulating layer 18 is formed on the surface of the multilayer wiring board including the wiring film 27 to protect the surface of the multilayer wiring board.

The third power supply wiring film 8 arranged on the fifth wiring film in the wiring region 3 is formed on the surface of the eighth insulating layer 16 of the multilayer wiring board. The power supply wiring film 8 of the third layer is electrically connected to the power supply wiring film 6 of the first layer by pillars in a region outside the drawing.

The power supply wiring film 8 is formed on the multilayer wiring board 8.
The wiring film 26 in the connection wiring film region 2a is formed on the surface of the insulating layer 16 of the second layer by the same manufacturing process.

In the method of manufacturing the multilayer wiring board of this embodiment, alumina is used as the substrate material and the insulating layer material, and a conductor such as silver or gold is used as the conductive material, and the conductor is printed by a printing technique. It may be performed by a ceramic substrate method in which a substrate or an insulating layer is formed. As another aspect of the method for manufacturing the multilayer wiring board of the present embodiment, for example, a metal substrate method using a substrate material such as aluminum or iron or a resin substrate method using a resin material such as epoxy or phenol is used. Etc. can be adopted and performed.

The multi-layer wiring board of this embodiment employs a combination of the signal wiring films 4 and 5 and the power wiring films 7 and 8 in the wiring region 3 to form a micro stop line, and to form a signal. The impedance of the wiring films 4 and 5 is controlled, and the impedance matching of the signal wiring films 4 and 5 is performed by a simple structure.

In this case, in order to control the impedance of the signal wiring films 4 and 5 in the multilayer wiring board, the ratio of the width of the signal wiring films 4 and 5 to the film thickness of the signal wiring films 4 and 5 and the power supply wiring film 7 are used. , 8 and the signal wiring films 4 and 5 are also adjusted by adjusting the ratio of the film thickness and the dielectric constant in the insulating layers 10 to 16.

Therefore, the multilayer wiring board of this embodiment is
The impedance of the signal wiring films 4 and 5 in the wiring region 3 is controlled, and excellent impedance matching of the signal wiring films 4 and 5 is performed, so that the multilayer wiring board has a wiring structure with high reliability. You can

Further, in the multilayer wiring board of the present embodiment, the through hole dense area 2 in which the plurality of through holes 1 are densely arranged.
Further, the connection wiring film region 2a in which the through holes 1a to 1i in the through hole dense region 2 and the signal wiring films 4 and 5 or the power supply wiring films 6 to 8 in the wiring region 3 are electrically connected controls impedance. Since the wiring film for impedance control and the insulating film between these wiring films can be eliminated by not requiring it, the thickness of the multilayer wiring board can be minimized. A multilayer wiring board having a structure in which the thickness of the board is small can be obtained.

Further, in the multilayer wiring board of the present embodiment, for example, even when the through holes 1 when mounting components such as a semiconductor integrated circuit device on the multilayer wiring board have a high density, the through hole dense area 2 and the connection wiring are formed. Since it is not necessary to control the impedance in the film region 2a, the thickness of the multilayer wiring board can be reduced to a multilayer wiring board having a structure.

Therefore, the multilayer wiring board of this embodiment is
Even if the through holes 1 have a high density, the thickness of the multilayer wiring board is small, so that even if the electrodes of the components mounted on the multilayer wiring board, such as a semiconductor integrated circuit device, have a short electrode length, Sufficient solder connection is possible when electrically connecting to the multilayer wiring board by solder.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say. Specifically, the method for manufacturing a multilayer wiring board of the present invention can be easily performed by a through-hole method, but can be performed by using a clearance method or a build-up method.

[0052]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1) According to the multilayer wiring board of the present invention, a micro stop line is formed by a combination of the signal wiring film and the power supply wiring film in the wiring region in a pair, and the combination of the signal wiring film and the power supply wiring film is used. Since the impedance is controlled, the impedance matching of the signal wiring film can be performed with a simple structure.

Therefore, the multilayer wiring board of the present invention has a highly reliable wiring structure because the impedance of the signal wiring film in the wiring region is controlled and the impedance matching of the signal wiring film is excellent. It can be a multilayer wiring board.

(2) According to the multilayer wiring board of the present invention, the through-hole dense area where a plurality of through-holes are densely arranged, each through hole in the through-hole dense area, and the signal wiring film or the power supply wiring film in the wiring area are provided. Since the connection wiring film region that is electrically connected does not need to control impedance, the wiring film for controlling impedance and the insulating film between these wiring films can be eliminated, Since the thickness of the multilayer wiring board can be set to the minimum value, the multilayer wiring board can have a structure in which the thickness of the board is small.

(3) According to the multilayer wiring board of the present invention, for example, even if the through holes when mounting components such as a semiconductor integrated circuit device on the multilayer wiring board have a high density, a dense area of through holes and a connection area are formed. Since it is not necessary to control the impedance in the wiring film region, the multilayer wiring board can be made to have a small thickness.

Therefore, in the multilayer wiring board of the present invention, even if the through holes have a high density, since the thickness of the multilayer wiring board is small, the electrodes of parts such as semiconductor integrated circuit devices to be mounted on the multilayer wiring board. Even when the length is short, sufficient solder connection can be achieved when the component electrodes are electrically connected to the multilayer wiring board by solder.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a multilayer wiring board that is an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing a cross section taken along the line AA in FIG.

FIG. 3 is a schematic enlarged cross-sectional view showing a cross section taken along the line BB in FIG.

FIG. 4 is a schematic enlarged cross-sectional view showing a cross section taken along the line C-C in FIG.

[Explanation of symbols]

 1, 1a to 1i Through hole 2 Through hole dense area 2a Connection wiring film area 3 Wiring area 4, 4a to 4c Signal wiring film 5, 5a to 5c Signal wiring film 6 to 8 Power supply wiring film 9 to 18 Insulation layer 19 to 27 Wiring film 28, 28a to 28c Pillar

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hajime Moriwaki 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi Computer Engineering Co., Ltd. (72) Teruo Isobe 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi Computer Data Engineering Co., Ltd.

Claims (4)

[Claims] 1. A through hole dense area in which a plurality of through holes are densely arranged, a wiring area in which a signal wiring film and a power supply wiring film are arranged, each through hole in the through hole dense area, and a signal wiring in the wiring area. A multilayer wiring board having a connection wiring film region to which a film or a power supply wiring film is electrically connected, and an impedance of the signal wiring film in the wiring region is controlled by the power supply wiring film. 2. The multilayer wiring board according to claim 1, wherein
A multilayer wiring board, wherein the impedance of the signal wiring film is controlled by arranging the signal wiring film and the power wiring film in pairs. 3. The multilayer wiring board according to claim 1, wherein the connection wiring film region in which each through hole in the through hole dense region and the signal wiring film or power supply wiring film in the wiring region are electrically connected A multilayer wiring board comprising a wiring film electrically connected to the through hole or a pillar electrically connecting the wiring film and the signal wiring film in the wiring region. 4. The multilayer wiring board according to claim 1, 2 or 3, wherein each through hole in the through hole dense area is electrically connected to a signal wiring film or a power wiring film in the wiring area. The region is a wiring film in a layer different from at least one of the plurality of signal wiring films in which a plurality of signal wiring films are arranged in the same layer, and the wiring film and the signal wiring film are electrically connected. A multi-layer wiring board, characterized in that it is provided with a pillar.