JPH01208874A - Led head - Google Patents
Led headInfo
- Publication number
- JPH01208874A JPH01208874A JP63034475A JP3447588A JPH01208874A JP H01208874 A JPH01208874 A JP H01208874A JP 63034475 A JP63034475 A JP 63034475A JP 3447588 A JP3447588 A JP 3447588A JP H01208874 A JPH01208874 A JP H01208874A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor layer
- groove
- insulating layer
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子写真プリンタ装置に使用されるＬＥＤヘ
ッド、特にＬＥＤ電子素子の実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an LED head used in an electrophotographic printer, and particularly to a method for mounting an LED electronic element.
〔従来の技術）
従来、この種のＬＥＤヘッドは、同一平面上にＬＥＤ電
子素子を実装した構造となっていた。[Prior Art] Conventionally, this type of LED head has a structure in which LED electronic elements are mounted on the same plane.
このため、ＬＥＤ電子素子が上面からとび上り、ワイヤ
ボンディング等でワイヤーが素子のエツジに接触するこ
とがあった。As a result, the LED electronic element may jump up from the top surface, and the wire may come into contact with the edge of the element during wire bonding or the like.
また、放熱する時、信号回路面と同一であったため、ノ
イズの発生等の問題があった。In addition, since the surface was the same as the signal circuit surface during heat dissipation, there were problems such as generation of noise.
本発明によれば、電子回路基板上に第一の絶縁層−第一
の導体層−第二の絶縁層−第二の導体層を形成し、その
中央部に凹溝を設け、凹溝内の第一の導体層上にＬＥＤ
電子素子を実装したことを特徴とするＬＥＤヘッドが得
られる。According to the present invention, a first insulating layer, a first conductor layer, a second insulating layer, and a second conductor layer are formed on an electronic circuit board, a groove is provided in the center of the layer, and a groove is formed in the groove. LED on the first conductor layer of
An LED head characterized in that an electronic element is mounted is obtained.
次に、本発明の一実施例を示した図面を参照して、本発
明をより詳細に説明する。Next, the present invention will be described in more detail with reference to the drawings showing one embodiment of the present invention.
第１図および第２図を参照すると、本発明の一実施例に
よるＬＥＤヘッドにおいては、電子回路基板１上に、第
一の絶縁層２が印刷または蒸着により形成される。第一
の絶縁層２の上には、第一の導体層３が形成される。第
一の導体層３の上には、第二の絶縁層４が形成され、更
に、その上にＬＥＤ素子６と電気的接続するための第二
の導体層８が形成されている。基板の中央部には、凹溝
７が設けられ、凹溝７内の第一の導体層上に導体ペース
ト５が印刷され、その上にＬＥＤ素子６が実装されてい
る。Referring to FIGS. 1 and 2, in an LED head according to an embodiment of the present invention, a first insulating layer 2 is formed on an electronic circuit board 1 by printing or vapor deposition. A first conductor layer 3 is formed on the first insulating layer 2 . A second insulating layer 4 is formed on the first conductor layer 3, and a second conductor layer 8 for electrical connection with the LED element 6 is further formed thereon. A groove 7 is provided in the center of the substrate, a conductor paste 5 is printed on the first conductor layer in the groove 7, and an LED element 6 is mounted on the conductor paste 5.
以上説明したように、本発明によれば、ワイヤボンディ
ングのワイヤの接触ならびに放熱とノイズが改善できる
。As described above, according to the present invention, wire contact, heat radiation, and noise in wire bonding can be improved.
第１図は本発明の第一の実施例の平面図、第２図は第１
図のＡ−Ａ’断面図である。
１：電子回路基板、２：第一の絶縁層、３：第一の導体
層、４：第二の絶縁層、５：導体ペースト、６ ： Ｌ
ＥＤ電子素子、７：凹溝、８：第二の導体層。FIG. 1 is a plan view of the first embodiment of the present invention, and FIG. 2 is a plan view of the first embodiment of the present invention.
It is an AA' cross-sectional view of the figure. 1: Electronic circuit board, 2: First insulating layer, 3: First conductive layer, 4: Second insulating layer, 5: Conductive paste, 6: L
ED electronic element, 7: groove, 8: second conductor layer.
Claims (1)
の絶縁層−第二の導体層を形成し、その中央部に凹溝を
設け、前記凹溝内の前記第一の導体層上にＬＥＤ電子素
子を実装したことを特徴とするＬＥＤヘッド。A first insulating layer - a first conductor layer - a second insulating layer - a second conductor layer are formed on an electronic circuit board, a groove is provided in the center thereof, and the first insulating layer in the groove is formed. An LED head characterized in that an LED electronic element is mounted on a conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63034475A JPH01208874A (en) | 1988-02-16 | 1988-02-16 | Led head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63034475A JPH01208874A (en) | 1988-02-16 | 1988-02-16 | Led head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01208874A true JPH01208874A (en) | 1989-08-22 |
Family
ID=12415278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63034475A Pending JPH01208874A (en) | 1988-02-16 | 1988-02-16 | Led head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01208874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009081196A (en) * | 2007-09-25 | 2009-04-16 | Sanyo Electric Co Ltd | Light emitting module, and manufacturing method thereof |
-
1988
- 1988-02-16 JP JP63034475A patent/JPH01208874A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009081196A (en) * | 2007-09-25 | 2009-04-16 | Sanyo Electric Co Ltd | Light emitting module, and manufacturing method thereof |
| TWI407585B (en) * | 2007-09-25 | 2013-09-01 | Sanyo Electric Co | Light emitting module and manufacturing method thereof |
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