JPH04180211A - Capacitor - Google Patents
CapacitorInfo
- Publication number
- JPH04180211A JPH04180211A JP30978390A JP30978390A JPH04180211A JP H04180211 A JPH04180211 A JP H04180211A JP 30978390 A JP30978390 A JP 30978390A JP 30978390 A JP30978390 A JP 30978390A JP H04180211 A JPH04180211 A JP H04180211A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- printed circuit
- resin case
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- 239000004593 Epoxy Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電気回路に用いられるコンデンサに関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to capacitors used in various electrical circuits.
従来の技術
第２図は従来の樹脂ケース入りのコンデンサをプリント
基板に取付けた状態を示すものであり、図に示すように
コンデンサ素子１は樹脂ケース２にエポキシ等の充填剤
３によって埋設され、そのコンデンサ素子１より引き出
されたリード線４は、半田５によりプリント基板６に取
付けられている。Prior art Figure 2 shows a conventional capacitor encased in a resin case mounted on a printed circuit board.As shown in the figure, a capacitor element 1 is embedded in a resin case 2 with a filler 3 such as epoxy. A lead wire 4 drawn out from the capacitor element 1 is attached to a printed circuit board 6 with solder 5.
上記構成においてエポキシ等の充填剤３の表面とプリン
ト基板６の取付面との間には１■以下の空隙部すが生じ
ているのが一般的である。In the above structure, there is generally a gap of 1 square inch or less between the surface of the filler 3 such as epoxy and the mounting surface of the printed circuit board 6.
また、第３図は他の従来例の構成を示すものであり、コ
ンデンサ７のリード線８を屈曲させることにより、コン
デンサ７をプリント基板６に取付けるとき、コンデンサ
７とプリント基板６との間に空隙部ｅを設けようとする
ものである。Furthermore, FIG. 3 shows the configuration of another conventional example, in which the lead wire 8 of the capacitor 7 is bent, so that when the capacitor 7 is attached to the printed circuit board 6, there is a gap between the capacitor 7 and the printed circuit board 6. This is intended to provide a void e.
発明が解決しようとする課題
しかしながら上記従来のコンデンサでは、コンデンサ素
子１を内蔵したコンデンサまたはコンデンサ７とプリン
ト基板の熱膨脹率や熱収縮率の差、または第４図に示す
ようにプリント基板６が半田デイツプ時の熱により変位
ｆを持つこと等に起因して、リード線４の半田５による
取付は部分に対して応力が発生することになる。このた
め、プリント基板６が図に示す状態から元に戻ろうとす
る応力を緩和させるため、半田デイツプ工程後・にさら
に半田５に熱を加えて再半田付けを行う工程が必要とな
る。また温度変化が大きいため半田５による取付は部分
への応力が大きい場合や、温度変化が頻繁に起こり半田
５による取付は部分に対して繰り返し応力が働く場合に
は、半田５が応力に耐えることができずに亀裂が生じる
ことになる。亀裂の発生箇所は第５図の矢印Ｃで示す部
分であり、同じく矢印ｄの方向の応力が半田５による取
付は部分の亀裂の発生に最も大きく影響をおよぼし、こ
の亀裂がコンデンサの導通不良の原因となる。Problems to be Solved by the Invention However, in the conventional capacitor described above, there is a difference in the coefficient of thermal expansion or thermal contraction between the capacitor containing the capacitor element 1 or the capacitor 7 and the printed circuit board, or as shown in FIG. Due to the displacement f due to heat during dipping, stress is generated in the parts when the lead wires 4 are attached by solder 5. Therefore, in order to relieve the stress that causes the printed circuit board 6 to return to its original state from the state shown in the figure, it is necessary to perform a re-soldering process by further applying heat to the solder 5 after the solder dipping process. In addition, if mounting with solder 5 causes large stress on the part due to large temperature changes, or if temperature changes occur frequently and mounting with solder 5 repeatedly applies stress to the part, solder 5 may not be able to withstand the stress. This will result in cracks forming. The location where the crack occurs is the part shown by arrow C in Figure 5, and the stress in the direction of arrow d also has the greatest effect on the occurrence of cracks in the part where the solder 5 is used, and this crack is the cause of poor continuity in the capacitor. Cause.
また、第３図に示すような方法により空隙ｅを設ける構
成としたコンデンサ７は、コンデンサ７とプリント基板
６との熱膨脹率の差やプリント基板６の半田デイツプ時
の熱によるプリント基板６の反りに起因する半田５によ
る取付は部分への応力に対しては空隙ｅがこの応力を緩
和させる働きをする。しかしコンデンサ７をリード線８
のみで支えることになるため、振動等の外力を受けた場
合、リード線８の折れ曲がり等が発生し易くコンデンサ
の取付は状態が不安定となる。In addition, the capacitor 7 configured to provide the air gap e by the method shown in FIG. When mounting with solder 5 due to this, the gap e acts to relieve stress on the part. However, capacitor 7 is connected to lead wire 8.
Since the capacitor is supported by only the capacitor, the lead wire 8 is likely to bend when subjected to external force such as vibration, making the capacitor installation unstable.
本発明は上記課題を解決するものであり、半田付は信頼
性に優れた構造を有するコンデンサを提供することを目
的とするものである。The present invention is intended to solve the above problems, and an object of the present invention is to provide a capacitor having a structure with excellent soldering reliability.
課題を解決するための手段
本発明は上記目的を達成するために、樹脂ケースを備え
、コンデンサ素子を前記樹脂ケースに埋設する充填剤の
表面とプリント基板の取付は面との間に３Ｉｌｌ１以上
の空隙部を設けたものである。Means for Solving the Problems In order to achieve the above object, the present invention is provided with a resin case, and there is a gap of 3Ill1 or more between the surface of the filler for embedding the capacitor element in the resin case and the mounting surface of the printed circuit board. A cavity is provided.
作 用
したがって本発明の構成によれば、樹脂ケースによりコ
ンデンサを確実に固定てき、さらにそのコンデンサをプ
リント基板に取付けた時、プリント基板との間に３１１
Ｉ１以上の空隙を設けることによりコンデンサの取付は
箇所周辺の温度変化に起因し、発生する応力を緩和させ
ることができ、リード線の半田付部分への応力の負担を
軽減させることができる。Effect: Therefore, according to the configuration of the present invention, the capacitor is securely fixed by the resin case, and furthermore, when the capacitor is mounted on the printed circuit board, there is a gap of 311 mm between the capacitor and the printed circuit board.
By providing a gap of I1 or more, it is possible to alleviate the stress generated due to temperature changes around the mounting point of the capacitor, and it is possible to reduce the burden of stress on the soldered portion of the lead wire.
実施例
以下、本発明の一実施例について第１図とともに第２図
と同一部分については同一番号を付して詳しい説明を省
略し、相違する点について説明する。Embodiment Hereinafter, regarding one embodiment of the present invention, parts that are the same as those in FIG. 1 and FIG.
第１図は本発明のコンデンサをプリント基板に取付けた
状態を示す断面図であり、図に示すように、コンデンサ
素子１をエポキシ等の充填剤３によって樹脂ケース２に
埋設して構成したコンデンサをプリント基板６に取付け
た時、前記エポキシ等の充填剤３０表面とプリント基板
６の取付は面との間に３１以上の空隙部ａを設ける構造
としたものである。FIG. 1 is a sectional view showing a state in which the capacitor of the present invention is mounted on a printed circuit board. As shown in the figure, the capacitor is constructed by embedding a capacitor element 1 in a resin case 2 with a filler 3 such as epoxy. When attached to the printed circuit board 6, the structure is such that 31 or more gaps a are provided between the surface of the filler 30 such as epoxy and the surface of the printed circuit board 6.
次に上記構成においてその動作を説明する。Next, the operation of the above configuration will be explained.
コンデンサの実使用状態においてコンデンサの取付は箇
所周辺の温度が変化して発生するコンデンサとプリント
基板６の熱膨脹率の差や、または第４図に示すようにプ
リント基板６の反りによる変位ｆ等によって、リード線
４の半田５による取付は部分に亀裂が発生する場合、そ
の亀裂の発生に最も大きな影響をおよぼす第５図に示す
ところの矢印ｄの方向の応力は前記した３ｍｍ以上の空
隙部ａにあるリード線４のゆとりによって緩和され、負
荷を軽減させることができ、したがって半田５の部分に
発生する亀裂を防ぐことができるのである。When the capacitor is actually used, the installation of the capacitor is affected by the difference in thermal expansion coefficient between the capacitor and the printed circuit board 6 caused by changes in the temperature around the location, or by the displacement f due to the warpage of the printed circuit board 6 as shown in Fig. 4. When the lead wire 4 is attached with the solder 5, if a crack occurs in the part, the stress in the direction of the arrow d shown in FIG. The looseness of the lead wires 4 at the bottom can reduce the load and prevent cracks from occurring in the solder 5 portion.
下記の表は、リード線４として半田メツキ銅線を使用し
、そのリード線４の直径と空隙部ａの寸法を変えて、冷
熱衝撃試験（試験条件ニー４０℃−８０℃、各３０分、
２００サイクル）を行った結果を示すものであり、本発
明による３ｍ以上の空隙部ａを有するコンデンサは半田
付は部分の亀裂の発生が極めて小さいか、または発生し
ていない。空隙部ａの寸法が１ｍであった従来のコンデ
ンサはいずれも半田付は部分に亀裂が発生している。The table below shows a thermal shock test (test conditions: 40°C to 80°C, 30 minutes each, using solder-plated copper wire as the lead wire 4 and varying the diameter of the lead wire 4 and the dimension of the gap a).
200 cycles), and in the capacitor according to the present invention having a gap a of 3 m or more, the occurrence of cracks in the soldered portion is extremely small or no cracks occur. In all conventional capacitors in which the dimension of the gap a is 1 m, cracks occur in the soldered area.
このように上記実施例によれば、空隙部ａの部分の寸法
を３１ｗ１１以上とすることにより、コンデンサとプリ
ント基板６の熱膨脹率の差による応力によって発生する
亀裂をもっと効果的に防止できるものである。According to the embodiment described above, by setting the dimension of the gap a to 31w11 or more, cracks caused by stress caused by the difference in coefficient of thermal expansion between the capacitor and the printed circuit board 6 can be more effectively prevented. be.
なお、空隙部ａが３ｗｌに満たない場合は、亀裂が発生
する場合があるので、本発明の範囲外である。It should be noted that if the void portion a is less than 3 wl, cracks may occur, which is outside the scope of the present invention.
発明の効果
本発明は上記実施例から明らかなように、樹脂ケースに
よりコンデンサをプリント基板に確実に同定でき、さら
に充填剤の表面とプリント基板の取付は面との間の空隙
部を３ｍｍ以上設けているためにコンデンサを取付けた
プリント基板周辺の温度変化に起因して発生するリード
線の半田付は部分への応力を緩和することができ、した
がって半田の亀裂等によるコンデンサの導通不良を防止
することができる。Effects of the Invention As is clear from the above embodiments, the present invention makes it possible to reliably identify the capacitor to the printed circuit board using the resin case, and furthermore, when mounting the filler to the printed circuit board, a gap of 3 mm or more is provided between the surface of the filler and the surface of the printed circuit board. Soldering the lead wires can relieve stress on the parts caused by temperature changes around the printed circuit board on which the capacitor is attached, thus preventing poor conduction of the capacitor due to cracks in the solder, etc. be able to.
第１図は本発明の一実施例のコンデンサの断面図、第２
図は従来のコンデンサの断面図、第３図は他の従来例の
プリント基板への取付は状態を示す部分断面側面図、第
４図はコンデンサ取付は状態におけるプリント基板の変
位を示す正面図、第５図は第２図のコンデンサの要部拡
大断面図である。
１・・・・・・コンデンサ素子、２・・・・・・樹脂ケ
ース、３・・・・・・エポキシ樹脂等の充填剤、６・・
・・・・プリント基板、ａ・・・・・・空隙部。
代理人の氏名 弁理士小蝦治 明ほか２名１−一一つり
テ゛ノｖｉ＋
２− 峯ト九アス
第 １ 図
３ｍｍ−−工ｙ、”−ｙソ＃ｒ”１１ｇ７．＞ｔ
４ｉ４α−徨隙郭
第２図
第 ４ 図
第 ５１２１Fig. 1 is a sectional view of a capacitor according to an embodiment of the present invention;
Figure 3 is a cross-sectional view of a conventional capacitor; Figure 3 is a partial cross-sectional side view showing the state in which the capacitor is mounted on a printed circuit board; Figure 4 is a front view showing the displacement of the printed circuit board in the state in which the capacitor is mounted; FIG. 5 is an enlarged sectional view of a main part of the capacitor shown in FIG. 2. 1... Capacitor element, 2... Resin case, 3... Filler such as epoxy resin, 6...
...Printed circuit board, a...Gap. Name of agent: Patent attorney Akira Koeji and two others
3mm--work y, "-y so#r" 11g7. >t
4i4α-Gap Figure 2 Figure 4 Figure 5121
Claims (1)
スを備え、コンデンサ素子を前記樹脂ケースに埋設する
充填剤の表面とプリント基板の取付け面との間に３ｍｍ
以上の空隙部を設けたコンデンサ。A capacitor to be mounted on a printed circuit board, comprising a resin case, with a distance of 3 mm between the surface of a filler for embedding a capacitor element in the resin case and the mounting surface of the printed circuit board.
A capacitor with a gap larger than that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309783A JP2928377B2 (en) | 1990-11-14 | 1990-11-14 | Capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309783A JP2928377B2 (en) | 1990-11-14 | 1990-11-14 | Capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04180211A true JPH04180211A (en) | 1992-06-26 |
| JP2928377B2 JP2928377B2 (en) | 1999-08-03 |
Family
ID=17997194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2309783A Expired - Fee Related JP2928377B2 (en) | 1990-11-14 | 1990-11-14 | Capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2928377B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6885538B1 (en) | 2004-03-22 | 2005-04-26 | Mitsubishi Denki Kabushiki Kaisha | Capacitor mounting structure |
| KR100865440B1 (en) * | 2006-01-12 | 2008-10-28 | 후지쓰 메디아 데바이스 가부시키가이샤 | Winding type condenser and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897824U (en) * | 1981-12-25 | 1983-07-02 | 松下電器産業株式会社 | capacitor |
| JPS60220904A (en) * | 1984-04-17 | 1985-11-05 | 日立コンデンサ株式会社 | Method of producing electronic part |
| JPS6155330U (en) * | 1984-09-14 | 1986-04-14 |
-
1990
- 1990-11-14 JP JP2309783A patent/JP2928377B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897824U (en) * | 1981-12-25 | 1983-07-02 | 松下電器産業株式会社 | capacitor |
| JPS60220904A (en) * | 1984-04-17 | 1985-11-05 | 日立コンデンサ株式会社 | Method of producing electronic part |
| JPS6155330U (en) * | 1984-09-14 | 1986-04-14 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6885538B1 (en) | 2004-03-22 | 2005-04-26 | Mitsubishi Denki Kabushiki Kaisha | Capacitor mounting structure |
| DE102004047302B4 (en) * | 2004-03-22 | 2009-12-31 | Mitsubishi Denki K.K. | Mounting arrangement for a capacitor and electrical control unit with such a mounting arrangement |
| KR100865440B1 (en) * | 2006-01-12 | 2008-10-28 | 후지쓰 메디아 데바이스 가부시키가이샤 | Winding type condenser and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2928377B2 (en) | 1999-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |