JPH0553237U - Heat resistant terminals for electronic components - Google Patents

Abstract

(57) [Summary] [Object] The present invention aims to provide a heat-resistant terminal for an electronic component, which prevents deformation of the terminal 20 by absorbing thermal stress due to heat applied to the terminal 20 and eliminates soldering failure. I am trying. [Structure] In an electronic component to be soldered, a structure having elasticity is provided between a soldering side of a terminal of the electronic component and an electronic component body side.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a mechanical structure of terminals of an electronic component for mounting the electronic component on a printed circuit board and soldering.

[0002]

[Prior Art]

 Conventionally, as shown in FIGS. 3 and 4, the structure of the terminal 20 of the electronic component to be soldered is a straight structure and has a high rigidity, and the thermal expansion of the terminal 20 is caused when it is affected by heat during soldering. Due to the deformation of the terminal 20 due to the above, the soldering failure cannot be completely banished.

Therefore, in the case of soldering the terminals 20 of the electronic component using the solder bath during mass production, it was not possible to completely eliminate the soldering failure of the terminals in the printed circuit board assembly in the above structure.

As shown in FIG. 3, the shape of the terminal 20 of the conventional electronic component is a straight shape over the entire length, and when the terminal 20 and the electronic part are affected by the heat of the molten solder 6 in the solder bath. First, the product body 1, the printed circuit board 3, and the conductive lands 4 are expanded by their respective thermal expansion coefficients. At this time, thermal stress acts in the a, a, direction and the terminals are deformed in the a, a, direction. Next, when the printed circuit board is pulled up from the solder bath, because the outside air temperature is low, thermal stress acts on the terminals 20 in the b, b, directions as shown in Fig. 4, and the terminals 20 deform in the b, b, directions. . Due to the deformation, stress acts on the solder 7 to cause defective soldering.

[0005]

[Problems to be solved by the device]

 An object of the present invention is to provide a heat-resistant terminal 2 for an electronic component, which prevents deformation of the terminal 20 by absorbing thermal stress caused by the heat applied to the terminal 20 and eliminates soldering failure.

[0006]

[Means for Solving the Problems]

 In the electronic component to be soldered, a structure having elasticity is provided between the soldering side of the terminal of the electronic component and the electronic component body side.

[0007]

[Action]

 The heat-resistant terminal 2 of the electronic component having the above-described structure has the structure portion 2a having elastic characteristics for thermal stresses a, a, which are exerted on the terminal 2 under the influence of heat when the terminal is in the molten solder 6 in the solder bath. Is absorbed, and when the printed circuit board 3 is pulled up from the solder bath, the thermal stress b, b, which acts on the heat-resistant terminal 2 is absorbed by the structural portion 2a having elastic characteristics, and the terminal deformation is prevented, and the terminal deformation acts on the solder. It is possible to prevent the stress that occurs and to eliminate defective soldering.

[0008]

【Example】

 1 is a cross-sectional view showing an embodiment of the present invention, 2 is a heat resistant terminal, 2a is a structural portion having elastic characteristics, 1 is an electronic component body, 3 is a printed circuit board, 4 is a conductive land, 5 is an insertion hole, and 6 Indicates molten solder in the solder bath. At this time, when it is affected by heat, the heat resistant terminal 2, the electronic component body 1, the printed board 3, and the conductive land 4 expand due to thermal expansion of each. In particular, thermal stress acts on the heat-resistant terminal 2 in the a, a, direction and tends to be deformed, but the structural portion 2a having elastic characteristics absorbs the thermal stress a, a, to prevent deformation.

Also, FIG. 2 corresponds to FIG. 1 and shows a state in which the printed circuit board 3 is pulled up from the molten solder 6 in the solder bath. At this time, in particular, thermal stress b, b, Although it tends to work and deform in the direction, the structural portion 2a having elastic characteristics absorbs the thermal stresses b, b, and prevents the deformation. Therefore, the stress acting on the solder 7 can be prevented and the soldering failure can be eliminated.

Although only one heat-resistant terminal 2 is shown in FIGS. 1 and 2 for the sake of convenience of explanation, it is naturally intended to be plural, and the R shape of the structural portion 2a having elastic characteristics is also shown. 1 is not limited to the shape shown in FIGS. 1 and 2, and the position thereof is not limited to the position shown in FIGS. 1 and 2, and is provided at a free position between the soldering side of the tip and the electronic component body side. Of course, the same effect can be obtained.

[0011]

[Effect of the device]

 As described above, the present invention absorbs the deformation of the terminal, which is a thermal effect at the time of soldering, by providing the structure having elasticity between the soldering side of the terminal and the electronic component body. It is possible to eliminate defective soldering in automatic assembly of printed circuit boards.

[Brief description of drawings]

FIG. 1 is a sectional view (in a solder bath) showing an embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention (when pulled up)

FIG. 3 is a sectional view showing a conventional example (in a solder bath).

FIG. 4 is a sectional view showing a conventional example (when pulled up)

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component main body 2 Heat-resistant terminal 2a Elastic structure 20 terminal 3 Printed circuit board 4 Conductive land 5 Insertion hole 6 Melted solder in solder bath 7 Solder

Claims (1)

[Scope of utility model registration request] 1. A heat-resistant terminal for an electronic component, wherein the electronic component to be soldered has a structure having elasticity between the soldering side of the terminal of the electronic component and the electronic component body side.