JPS63128701A - Chip film resistance element - Google Patents
Chip film resistance elementInfo
- Publication number
- JPS63128701A JPS63128701A JP61277026A JP27702686A JPS63128701A JP S63128701 A JPS63128701 A JP S63128701A JP 61277026 A JP61277026 A JP 61277026A JP 27702686 A JP27702686 A JP 27702686A JP S63128701 A JPS63128701 A JP S63128701A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resistance element
- chip
- resistor
- film resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 239000012528 membrane Substances 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、混成集積回路に組み込むのに適したチップ形
膜抵抗素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type membrane resistor element suitable for incorporation into a hybrid integrated circuit.
近年、混成集積回路を製造するのに１その回路基板とし
て、アルミ板や鉄板などの金属基板に特殊な絶縁膜を作
シ、その上に配線導体を形成した。In recent years, in order to manufacture hybrid integrated circuits, a special insulating film is formed on a metal substrate such as an aluminum plate or a steel plate, and wiring conductors are formed on the circuit board.
いわゆる金属絶縁基板を用いたものがある。そして、こ
の金属絶縁基板に実装される部品は、主に面実装可能な
チップタイプの能動部品、受動部品が一般的である。There is one that uses a so-called metal insulating substrate. The components mounted on this metal insulating substrate are generally chip-type active components and passive components that can be surface mounted.
ところで、従来より一般的に使用されているチップ形膜
抵抗素子は、第２図に示すように、長方形の基板１上に
その長手方向に沿って印刷法などくより被着形成された
膜抵抗体２ａと、この膜抵抗体２ａの両端にそれぞれ接
続して形成された電極としての電極導体３，４から構成
され、これら２つの電極導体３，４が基板１上の両側よ
り取り出された構造を有している。By the way, as shown in FIG. 2, a chip-type film resistance element that has been commonly used in the past is a film resistance that is formed on a rectangular substrate 1 by a printing method or other method along its longitudinal direction. The structure is composed of a body 2a and electrode conductors 3 and 4 as electrodes connected to both ends of the film resistor 2a, respectively, and these two electrode conductors 3 and 4 are taken out from both sides of the substrate 1. have.
しかして、かかる構造のチップ形膜抵抗素子を混成集積
回路に組み込むには、第３図に示すように、アルミ板な
どの金属基板１１上に被着された絶縁膜」２とその表面
に所定パターンｔ−有して形成された配線導体１３から
成る金属絶縁基板１４を回路基板として用い、この基板
１４の配線導体１３上に上記チップ形膜抵抗素子５の各
電極導体３．４を半田１５により接続して実装されてい
る。In order to incorporate a chip-type film resistance element having such a structure into a hybrid integrated circuit, as shown in FIG. A metal insulating substrate 14 consisting of wiring conductors 13 formed with a pattern t is used as a circuit board, and each electrode conductor 3.4 of the chip-type membrane resistance element 5 is soldered 15 on the wiring conductor 13 of this substrate 14. It is connected and implemented by
このとき、チップ形膜抵抗素子の基板素材は主にセラミ
ックであり、実装される金属基板１１との間に熱膨張係
数の差が生じてしまう。また、この線膨張係数の差によ
り接続箇所が受ける応力の大きさは、実装りの長さが長
い程大きいことが実験的にわかっている。At this time, the substrate material of the chip-type film resistance element is mainly ceramic, and a difference in thermal expansion coefficient occurs between it and the metal substrate 11 on which it is mounted. Additionally, it has been experimentally found that the greater the length of the mounting, the greater the stress applied to the connection location due to the difference in linear expansion coefficients.
ところが、上記した従来のチップ形膜抵抗素子は、その
基板１上の膜抵抗体２ａの両側から電極導体３，４が引
き出された構造を有しているので、抵抗素子自体が大型
化すればする程、実装長りが長くなり、温度サイクル等
の耐久テストにおいて接続箇所が応力を受けやすく、半
田１５の劣化や。However, since the conventional chip-type membrane resistance element described above has a structure in which the electrode conductors 3 and 4 are drawn out from both sides of the membrane resistor 2a on the substrate 1, if the resistance element itself becomes large, The longer the mounting length becomes, the more the connection points are susceptible to stress during durability tests such as temperature cycling, and the solder 15 deteriorates.
その半田１５と配線導体１３の境界でクラック１６（第
３図参照）が発生して断線等の不具合を生ずる欠点があ
った。There is a drawback that a crack 16 (see FIG. 3) occurs at the boundary between the solder 15 and the wiring conductor 13, resulting in problems such as disconnection.
本発明は上記のような従来の欠点を除去するためになさ
れたもので、その目的は、混成集積回路に組み込む際に
実装後の熱応力の影響も少なくして、信頼性を向上させ
たチップ形膜抵抗素子を提供することＫある。The present invention has been made in order to eliminate the above-mentioned conventional drawbacks, and its purpose is to reduce the influence of thermal stress after mounting when incorporated into a hybrid integrated circuit, thereby improving reliability of the chip. It is another object of the present invention to provide a shaped film resistive element.
本発明に係るチップ形膜抵抗素子は、セラミックなどの
基板上にその一辺側を除く他の周辺に沿って膜抵抗体を
形成するとともに、該膜抵抗体の両端をその一辺側に引
き出した構造と成し、前記膜抵抗体の両端にそれぞれ接
続された電極を前記基板の一辺側に形成して、これら電
極を同一方向に取り出すようにしたものである。The chip-type membrane resistance element according to the present invention has a structure in which a membrane resistor is formed on a substrate made of ceramic or the like along the periphery of the substrate except for one side, and both ends of the membrane resistor are drawn out to the one side. Electrodes connected to both ends of the film resistor are formed on one side of the substrate, and these electrodes are taken out in the same direction.
本発明においては、膜抵抗体の２つの電極をその基板の
一辺を共有する方向に取り出すことにより、実装長を実
質的に短かくでき、実装後の熱応力の影Ｖｔ−低減でき
ることとなる。In the present invention, by taking out the two electrodes of the film resistor in a direction that shares one side of the substrate, the mounting length can be substantially shortened, and the effect of thermal stress after mounting, Vt, can be reduced.
以下、本発明を図面に示す実施例に基づいて説明する。 Hereinafter, the present invention will be explained based on embodiments shown in the drawings.
第１図は本発明の一実施例によるチップ形膜抵抗素子の
平面図である。この実施例のチップ形膜抵抗素子は、セ
ラミックなどの長方形の基板１上にその短辺側の一辺を
除く他の周辺に沿って膜抵抗体２を被着形成して、この
膜抵抗体２０両端をその一辺側に引き出した構造とする
。そして、前記膜抵抗体２０両端に所定パターンの電極
導体３゜４をそれぞれ接続して形成し、これら２つの電
極導体３，４を基板１上の一辺側から同一方向に取シ出
すようにしたものでおる。FIG. 1 is a plan view of a chip-type membrane resistance element according to an embodiment of the present invention. The chip-type film resistance element of this embodiment has a film resistor 2 formed on a rectangular substrate 1 made of ceramic or the like along the periphery of the substrate except for one short side. It has a structure in which both ends are pulled out to one side. Then, electrode conductors 3 and 4 of a predetermined pattern were connected to both ends of the membrane resistor 20, respectively, and these two electrode conductors 3 and 4 were taken out from one side of the substrate 1 in the same direction. It's something.
このように構成されたチップ形膜抵抗素子によると、膜
抵抗体２の各電極３．４を同一方向に取り出す構造にす
ることにより、抵抗素子の大電力化、高抵抗化に伴う大
型化の際、その実装長り。According to the chip-type membrane resistance element constructed in this way, by adopting a structure in which each electrode 3.4 of the membrane resistor 2 is taken out in the same direction, it is possible to reduce the size of the resistance element due to the increase in power and resistance. However, its implementation will take a long time.
（Ｌｘ＜Ｌ）は、第２図に示す従来例のものより短かく
て済む。これによって、本発明のチップ形膜抵抗素子を
第３図に示す金属絶縁基板１４上に半田１５により実装
して混成集積回路を構成した場合、それら基板１と金属
基板１１間の素材の線膨張係数の差による応力の影響を
緩和できる利点がある。(Lx<L) may be shorter than that of the conventional example shown in FIG. As a result, when a hybrid integrated circuit is constructed by mounting the chip-type film resistance element of the present invention on the metal insulating substrate 14 shown in FIG. This has the advantage of being able to alleviate the effects of stress caused by differences in coefficients.
なお、上記実施例では基板１として長方形のものを用い
た場合であったが、本発明はこれに限らず、膜抵抗体２
の２つの電極を多角形の一辺を共有する方向に取シ出す
ように構成することもできる。Although the above embodiment uses a rectangular substrate 1, the present invention is not limited to this, and the film resistor 2
It is also possible to configure the two electrodes to be taken out in a direction that shares one side of the polygon.
以上のように本発明によれば、基板上の一辺側に膜抵抗
体の両端を引き出した構造とし、この膜抵抗体の両端に
電極をそれぞれ接続して、これら電極を一方向に取り出
すことにより、実装長を短かくして、混成集積回路用基
板との接続箇所の応力を緩和できるので、温度サイクル
等の耐久テストで半田の劣化や断線等もなく、高信頼度
の混成集積回路が実現できる効果がある。As described above, according to the present invention, the structure is such that both ends of the membrane resistor are drawn out on one side of the substrate, electrodes are connected to both ends of the membrane resistor, and these electrodes are taken out in one direction. , the mounting length can be shortened and the stress at the connection point with the hybrid integrated circuit board can be alleviated, so there is no solder deterioration or disconnection during durability tests such as temperature cycles, and highly reliable hybrid integrated circuits can be realized. There is.
第１図は本発明の一実施例によるチップ形膜抵抗素子の
平面図、第２因は従来のチップ形膜抵抗素子の平′面図
、第３図は第２図のチップ形膜抵抗素子を金属絶縁基板
上に実装したときの断面図である。
１・・・・基板、２・・・・膜抵抗体、３，４・・・・
電極導体、１１・・・・金属基板、１２・・・・絶縁膜
、１３・・・・配線導体、１４・・・・金属絶縁基板、
１５・・−・半田。FIG. 1 is a plan view of a chip-type membrane resistance element according to an embodiment of the present invention, the second factor is a plan view of a conventional chip-type membrane resistance element, and FIG. 3 is a plan view of the chip-type membrane resistance element of FIG. 2. FIG. 3 is a cross-sectional view of the device mounted on a metal insulating substrate. 1...Substrate, 2...Membrane resistor, 3, 4...
Electrode conductor, 11...metal substrate, 12...insulating film, 13...wiring conductor, 14...metal insulating substrate,
15...Solder.
Claims (2)
周辺に沿つて膜抵抗体を形成するとともに、該膜抵抗体
の両端をその一辺側に引き出した構造と成し、前記膜抵
抗体の両端にそれぞれ接続された電極を前記基板の一辺
側に形成して、これら電極を一方向に取り出すようにし
たことを特徴とするチップ形膜抵抗素子。(1) A film resistor is formed on a substrate such as ceramic along the periphery of the substrate except for one side, and both ends of the film resistor are drawn out to the one side, and the film resistor is 1. A chip-type membrane resistance element, characterized in that electrodes connected to both ends of the substrate are formed on one side of the substrate, and these electrodes are taken out in one direction.
抗体の各電極を一方向に取り出すことを特徴とする特許
請求の範囲第１項記載のチップ形膜抵抗素子。(2) The chip-type membrane resistance element according to claim 1, wherein the substrate has a rectangular shape, and each electrode of the membrane resistor is taken out in one direction from one of the shorter sides of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61277026A JPS63128701A (en) | 1986-11-19 | 1986-11-19 | Chip film resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61277026A JPS63128701A (en) | 1986-11-19 | 1986-11-19 | Chip film resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128701A true JPS63128701A (en) | 1988-06-01 |
Family
ID=17577736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61277026A Pending JPS63128701A (en) | 1986-11-19 | 1986-11-19 | Chip film resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128701A (en) |
-
1986
- 1986-11-19 JP JP61277026A patent/JPS63128701A/en active Pending
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