JPH0350616Y2 - - Google Patents

Info

Publication number
JPH0350616Y2
JPH0350616Y2 JP4918287U JP4918287U JPH0350616Y2 JP H0350616 Y2 JPH0350616 Y2 JP H0350616Y2 JP 4918287 U JP4918287 U JP 4918287U JP 4918287 U JP4918287 U JP 4918287U JP H0350616 Y2 JPH0350616 Y2 JP H0350616Y2
Authority
JP
Japan
Prior art keywords
conductor
base
films
film
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4918287U
Other languages
Japanese (ja)
Other versions
JPS63155270U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4918287U priority Critical patent/JPH0350616Y2/ja
Publication of JPS63155270U publication Critical patent/JPS63155270U/ja
Application granted granted Critical
Publication of JPH0350616Y2 publication Critical patent/JPH0350616Y2/ja
Expired legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【考案の詳細な説明】 (産業上の利用分野) この考案はチツプジヤンパーに関する。[Detailed explanation of the idea] (Industrial application field) This idea is related to Chippuji Jumper.

(従来の技術) セラミツクのような絶縁性の基体の表面に、導
体膜を形成し、その両端を端子としてなるチツプ
ジヤンパーは、すでによく知られている。しかし
従来の構成は基体の一方の表面にのみ導体膜を設
けるようにしていた。
(Prior Art) Chip jumpers are already well known, in which a conductive film is formed on the surface of an insulating substrate such as ceramic, and both ends of the conductive film are used as terminals. However, in the conventional configuration, a conductor film is provided only on one surface of the base.

そのため一つの基体に2個の導体膜を設ける必
要があるとき、両導体膜が接触し合つたりして、
電気的不良を起しやすい欠点がある。これを避け
るためには、両導体膜の間隔を充分にとつておく
必要がある。しかしこのように間隔を充分にとる
ようにすると、基体を大きくしなければならず、
これでは実装密度が低下するようになる。
Therefore, when it is necessary to provide two conductor films on one substrate, the two conductor films may come into contact with each other.
It has the disadvantage of being prone to electrical failures. In order to avoid this, it is necessary to leave a sufficient distance between the two conductor films. However, in order to provide sufficient spacing like this, the base must be made larger.
This will reduce the packaging density.

(考案が解決しようとする問題点) この考案は基体の表面に形成する導体膜が互い
になんらの制約を受けることなく、かつ基体の大
型化をともなうことなく、2個の導体膜の形成を
可能とすることを目的とする。
(Problem that the invention aims to solve) This invention enables the formation of two conductive films on the surface of the substrate without any restrictions on each other and without increasing the size of the substrate. The purpose is to

(問題点を解決するための手段) この考案は絶縁性の基体の表面と裏面との両方
に、それぞれ電気的に独立する導体膜を設け、各
導体膜の各端部を端子としたことを特徴とする。
(Means for solving the problem) This idea provides electrically independent conductive films on both the front and back surfaces of an insulating substrate, and each end of each conductive film is used as a terminal. Features.

(実施例) この考案の実施例を図によつて説明する。図に
おいて1はセラミツクその他の材料からなる絶縁
性の基体で、その表面2に第1の導体膜3を設け
るととも、同じく裏面4にも第2の導体膜5を設
ける。6,7は導体膜3の両端部、8,9は導体
膜5の両端部で、これらはいずれも端子として使
用される。
(Example) An example of this invention will be described with reference to the drawings. In the figure, reference numeral 1 denotes an insulating base made of ceramic or other material, on whose front surface 2 a first conductor film 3 is provided, and also on its back surface 4 a second conductor film 5 is provided. 6 and 7 are both ends of the conductor film 3, and 8 and 9 are both ends of the conductor film 5, both of which are used as terminals.

この場合図のように各端子となる導体膜3,5
の端部を、基体1の端面にまで導出しておくと、
これを基板上にハンダづけするとき便利である。
このときひとつの端面に両端部6,8あるいは
7,9の屈曲部分が現れるようにすると、各屈曲
部分と基板上の回路導体とをハンダづけすると
き、そのハンダ同志が接触し合う恐れがあるの
で、そのハンダによる接触を回避するために、端
面の中央にくぼみ1Aを設けておくとよい。
In this case, as shown in the figure, conductor films 3 and 5 that become each terminal
If the end of is led out to the end surface of the base 1,
This is convenient when soldering it onto a board.
At this time, if the bent parts of both ends 6, 8 or 7, 9 are made to appear on one end face, when each bent part and the circuit conductor on the board are soldered, there is a risk that the solders will come into contact with each other. Therefore, in order to avoid contact with the solder, it is advisable to provide a recess 1A in the center of the end face.

第2図は第1図の中央線に沿つて切断したとき
の断面図で、10,11は導体膜3,5を保護す
る保護膜である。この保護膜10,11は絶縁性
のものが好ましい。
FIG. 2 is a cross-sectional view taken along the center line of FIG. 1, and 10 and 11 are protective films that protect the conductor films 3 and 5. The protective films 10 and 11 are preferably insulating.

以上の構成によれば一つの基体1に2個の導体
膜が設けられたことになる。そして各導体膜3,
5は、基体1の表面および裏面に互いに独立して
設けられているので、基体1の大型化をともなう
ことなく、しかも両導体膜はその大きさに互いに
なんらの制約を受けることなく、任意の大きさに
形成することができる。そしてこのように任意の
大きさに形成しても、両導体膜は基体1の表裏面
に分かれているので、互いに接触し合うといつた
事故は確実に回避される。
According to the above configuration, two conductor films are provided on one base 1. And each conductor film 3,
5 are provided independently from each other on the front and back surfaces of the base 1, so the base 1 does not need to be enlarged, and both conductor films can be formed into arbitrary shapes without being subject to any restrictions on their size. Can be formed to any size. Even if the conductor films are formed to have an arbitrary size as described above, since both conductor films are separated into the front and back surfaces of the base 1, accidents such as contacting each other can be reliably avoided.

なお図のように各導体膜3,5として、広い面
積を具備するように形成すると、それだけ放熱面
積が広くなるし、また抵抗値もそれだけ小さくな
つて都合がよい。なお抵抗値の調整を膜面積で行
なう場合、基体1の側面にまで導体膜を延長して
形成するようにしてもよい。
It is advantageous if each of the conductor films 3 and 5 is formed to have a large area as shown in the figure, since the heat dissipation area becomes larger and the resistance value becomes smaller accordingly. Note that when the resistance value is adjusted by the film area, the conductor film may be formed to extend to the side surface of the base 1.

第1図に示す例では端部6,7は基体1の一方
の側縁に、また端部8,9は反対側の側縁にそれ
ぞれ設けているので、両導体膜3,5は等価的に
互いに平行して位置するようになる。これに対し
第2図に示すように端部6,7を基体1の互いに
反対の側縁に、また端部8,9も同様に互いに反
対の側縁に設けるようにすると、両導体膜3,5
は等価的に互いに交差して位置するようになる。
In the example shown in FIG. 1, the ends 6 and 7 are provided on one side edge of the base 1, and the ends 8 and 9 are provided on the opposite side edge, so both conductor films 3 and 5 are equivalently provided. become parallel to each other. On the other hand, if the ends 6 and 7 are provided on opposite side edges of the base 1, and the ends 8 and 9 are similarly provided on opposite side edges as shown in FIG. ,5
become equivalently located across each other.

したがつてたとえば基板上の回路同志を互いに
交差して接続するような場合、これを使用すると
好適である。このとき前記回路を構成している導
体の上に基体が載るようになるが、保護膜10,
11が絶縁性であることにより、導体膜が直接そ
の回路の導体に接するようなことは回避される。
Therefore, it is suitable to use this when, for example, circuits on a board are connected to each other by crossing each other. At this time, the base body comes to rest on the conductor constituting the circuit, but the protective film 10,
Since 11 is insulative, the conductor film is prevented from coming into direct contact with the conductor of the circuit.

(考案の効果) 以上詳述したようにこの考案によれば、一つの
基体に2個の導体膜を設ける場合でも、各導体膜
をその基体の表裏両面に互いに独立して設けるよ
うにしているので、基体の大型化をともなうこと
なく、かつ各導体膜をその大きさになんらの制約
を受けることなく、形成することができるととも
に、任意の大きさに形成しても、両導体膜が互い
に接触し合うという事故は、これをもつて確実に
回避できるといつた効果を奏する。
(Effects of the invention) As detailed above, according to this invention, even when two conductor films are provided on one base, each conductor film is provided independently on both the front and back sides of the base. Therefore, each conductive film can be formed without increasing the size of the substrate and without any restrictions on its size, and even if formed to any size, both conductive films will not interfere with each other. This has the effect that accidents such as contact with each other can be reliably avoided.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の実施例を示す斜視図、第2
図は同断面図、第3図はこの考案の他の実施例を
示す斜視図である。 1……基体、2……表面、3,5……導体膜、
4……裏面、6〜9……端部。
Figure 1 is a perspective view showing an embodiment of this invention;
This figure is a sectional view of the same, and FIG. 3 is a perspective view showing another embodiment of this invention. 1...Substrate, 2...Surface, 3, 5...Conductor film,
4...back side, 6-9...ends.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性の基体の表面と裏面との少なくとも両方
に、それぞれ電気的に独立するジヤンパー用の導
体膜を設け、前記各導体膜の各端部を端子として
なるチツプジヤンパー。
A chip jumper comprising electrically independent conductor films for jumpers provided on at least both the front and back surfaces of an insulating base, and each end of each conductor film serving as a terminal.
JP4918287U 1987-03-31 1987-03-31 Expired JPH0350616Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4918287U JPH0350616Y2 (en) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4918287U JPH0350616Y2 (en) 1987-03-31 1987-03-31

Publications (2)

Publication Number Publication Date
JPS63155270U JPS63155270U (en) 1988-10-12
JPH0350616Y2 true JPH0350616Y2 (en) 1991-10-29

Family

ID=30871396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4918287U Expired JPH0350616Y2 (en) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPH0350616Y2 (en)

Also Published As

Publication number Publication date
JPS63155270U (en) 1988-10-12

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