JPH0380599A - Electronic circuit module - Google Patents
Electronic circuit moduleInfo
- Publication number
- JPH0380599A JPH0380599A JP21680389A JP21680389A JPH0380599A JP H0380599 A JPH0380599 A JP H0380599A JP 21680389 A JP21680389 A JP 21680389A JP 21680389 A JP21680389 A JP 21680389A JP H0380599 A JPH0380599 A JP H0380599A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- rubber
- lead terminal
- mounted electronic
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 230000008602 contraction Effects 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気パターン金形成した配線基板上に電子部品
を実装した回路基板金モーＮド樹脂で覆う電子回路モジ
ューνに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic circuit module ν, which is a circuit board covered with gold mode resin and has electronic components mounted on a wiring board formed with electrical pattern gold.
従来の技術
従来この種の電子回路モジュー１ｖは第３図（ａｌ （
ｂｌに示すようなものであった。第３図（ａｌ （ｂｌ
Ｋ ｋいて。2. Prior Art Conventionally, this type of electronic circuit module 1v is shown in FIG.
It was as shown in bl. Figure 3 (al (bl)
K.K.
配線基板１上に電子部品２が実装され、この電子部品２
のリード線３は配線基板１の電子部品２実装側の面とは
反対側の面で半田付けされて配線基板ｌの電気パターン
に電気的に接続され、さらに、これら配線基板１および
実装電子部品２をエポキシ樹脂などの硬質のモーシト樹
脂４で直接覆っていた。An electronic component 2 is mounted on a wiring board 1, and this electronic component 2
The lead wires 3 are soldered to the surface of the wiring board 1 opposite to the surface on which the electronic components 2 are mounted, and are electrically connected to the electrical patterns of the wiring board 1. 2 was directly covered with a hard mosito resin 4 such as epoxy resin.
発明が解決しようとする課題
しかし上記従来の構成では、製品の使用条件によって温
度が上がったとき、実装電子部品２はモーシト樹脂４に
よって固定されているため、熱によるリード端子３の膨
張は半田付部分５にストレスとして加わり、半田付部分
５に亀裂を発生させ、電気的接続を絶ってし筐うという
大きな問題金有していた。Problems to be Solved by the Invention However, in the conventional configuration described above, when the temperature rises due to the usage conditions of the product, the mounted electronic component 2 is fixed by the Mosito resin 4, so the expansion of the lead terminal 3 due to heat is prevented by soldering. This caused a major problem in that stress was applied to the soldered portion 5, causing cracks in the soldered portion 5, and cutting off the electrical connection.
本発明は上記従来の間Ｍを解決するもので、実装電子部
品のリード線の熱膨張にょ多発生する半田付部分の亀裂
による電気的断線金防止することができる電子回路モジ
ュー〃を提供することを目的とするものである。The present invention solves the above-mentioned problems in the prior art, and provides an electronic circuit module that can prevent electrical disconnections caused by cracks in soldered parts that occur frequently due to thermal expansion of lead wires of mounted electronic components. The purpose is to
課題を解決するための手段
上記課題を解決するために本発明の電子回路モジュー〜
は、配線基板上に半田などにより接続された実装電子部
品のリード端子の少なくとも実装側のリード端子部のみ
を覆うゴム４ｆｃは軟質樹脂を設け、前記配線基板の少
なくとも前記実装電子部品側の面を前記実装電子部品と
ともに覆うモールド樹脂金設けたものである。Means for Solving the Problems In order to solve the above problems, the electronic circuit module of the present invention ~
The rubber 4fc is made of soft resin and covers at least only the lead terminal portion of the mounted electronic component connected to the wiring board by soldering or the like on the mounting side, and the rubber 4fc is made of soft resin and covers at least the surface of the wiring board on the mounted electronic component side. A molded resin metal is provided to cover the mounted electronic components.
作用
上記構成により、実装電子部品のり、−ド端子部分に直
接硬質のモーシト樹脂がつかないように少なくとも実装
側のリード端子部分をゴムまたは軟質樹脂で覆うように
したので、モーシト樹脂の硬化後、実装電子部品のリー
ド端子に熱による膨張が発生しても、リード端子部を覆
うゴムまたは軟質樹脂によりストレスが吸収され、リー
ド端子が接続されている半田付部分の亀裂の発生はなく
なり、配線基板の電気パターンと実装電子部品のリード
端子との断線が防止されることになる。Effect With the above structure, at least the lead terminal portion on the mounting side is covered with rubber or soft resin to prevent the hard Morsito resin from directly adhering to the mounted electronic component glue or negative terminal portion, so that after the Morsito resin hardens, Even if the lead terminals of mounted electronic components expand due to heat, the stress is absorbed by the rubber or soft resin that covers the lead terminals, eliminating the occurrence of cracks in the soldered parts where the lead terminals are connected, and improving the wiring board. This will prevent disconnection between the electrical pattern and the lead terminal of the mounted electronic component.
実施例
以下、本発明の実施例について図面５ｃ参照しながら説
明する。なか、従来例と同一の作用効果上奏するものに
は同一の符号上付してその説明を省略する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG. 5c. Among them, those having the same functions and effects as those of the conventional example will be given the same reference numerals and their explanation will be omitted.
第１図（ａｌｌｂｌｄ本発明の一実施例金示す電子回路
モジュールの一部破断斜視図および断面図である。FIG. 1 is a partially cutaway perspective view and a sectional view of an electronic circuit module according to an embodiment of the present invention.
第１図（ａｌ （ｂｌにかいて、ゴムまたは軟質樹脂１
１で少なくとも実装側のリード端子１２部上積った後、
配線基板１０両面ｆｒ：実装電子部品２とともに、エポ
キシ樹脂などの硬質のモーシト樹脂１３で覆ったもので
ある。Figure 1 (al (bl) shows rubber or soft resin 1
After stacking at least 12 lead terminals on the mounting side in step 1,
Both sides fr of wiring board 10: Covered with hard Mosito resin 13 such as epoxy resin together with mounted electronic components 2.
上記構成により、以下、その作用を説明する。The operation of the above configuration will be explained below.
ゴム１ｆｃは軟質樹脂１１が配線基板１上で実装された
電子部品２のリード端子１２を覆っていることにより、
リード端子１２の周囲温度上昇などによるリード端子１
２の膨脹分はゴムまたは軟質樹脂１１によシ吸収されて
半田付部分１４にストレスが加わらないようになってい
る。１ｆｃ、モーシト樹脂１３自体の膨張収縮によるリ
ード端子１２へのストレスも同様に、ゴムまたは軟質樹
脂１１で吸収されて半田付部分１４に大きなストレスが
加わるようなことは起らない。The rubber 1fc has a soft resin 11 covering the lead terminals 12 of the electronic component 2 mounted on the wiring board 1.
Lead terminal 1 due to rise in ambient temperature of lead terminal 12, etc.
The expansion part 2 is absorbed by the rubber or soft resin 11 so that no stress is applied to the soldered part 14. 1fc, the stress on the lead terminal 12 due to expansion and contraction of the Morsito resin 13 itself is similarly absorbed by the rubber or soft resin 11, so that no large stress is applied to the soldered portion 14.
第２図ｆａｔ （ｂｌは本発明の他の実施例を示すもの
で。Figure 2 fat (bl shows another embodiment of the present invention.
配線基板１上で、実装電子部品２分有する面のみが実装
電子部品２とともにモーシト樹脂１５で覆われているも
のである。第２図の実施例でも、実装電子部品２の実装
側のリード端子１６は、ゴムまたは軟質樹脂１７で覆わ
れてＤυ、第１図の実施例と同様の効果が得られ、半田
付部分１８にリード端子１６の熱膨張によるストレスが
加わることなく、従来のように、半田付部分１８に亀裂
が発生するような不具合は解消される。On the wiring board 1, only the surface having two mounted electronic components is covered with the Mosito resin 15 together with the mounted electronic components 2. In the embodiment shown in FIG. 2 as well, the lead terminals 16 on the mounting side of the mounted electronic component 2 are covered with rubber or soft resin 17 to obtain the same effect as the embodiment shown in FIG. The stress caused by the thermal expansion of the lead terminal 16 is not applied to the lead terminal 16, and problems such as cracks occurring in the soldered portion 18, which are conventional, are eliminated.
発明の効果
以上のように本発明によれば、実装電子部品の少なくと
も実装側のリード端子部分をゴムまたは軟質樹脂で覆っ
た後に１回路基板両而または電子部品実装側の片面のみ
ｔモールド樹脂で覆うことにより、温度上昇によるリー
ド端子の熟膨張分をゴムまたは軟ｆｆ樹脂で吸収できて
、リード端子の半田付部分にス）Ｌ／スが加わらないの
で、半田付部分の亀裂上防止することができ、配線基板
の電気パターンと実装部品のリード端子との断線を防止
することができ、これによυ、容易かつ効果的に製品の
耐久性りよび信頼性を向上させることができるものであ
る。Effects of the Invention As described above, according to the present invention, at least the lead terminal portion on the mounting side of the mounted electronic component is covered with rubber or soft resin, and then both of one circuit board or only one side of the electronic component mounting side is coated with T-molding resin. By covering it, the rubber or soft FF resin can absorb the ripening expansion of the lead terminal due to temperature rise, and the soldered part of the lead terminal is not exposed to S)L/S, which prevents cracking of the soldered part. It is possible to prevent disconnection between the electrical pattern on the wiring board and the lead terminal of the mounted component, which can easily and effectively improve the durability and reliability of the product. be.
第１図は本発明の一実施例を示す電子回路モジューνの
一部破断斜視図りよび断面図、第２図は本発明の別の一
実施例を示す電子回路モジューＮの一部破断斜視図りよ
び断面図、第３図は従来の電子回路モジュー〃の一部破
断斜視図および断面図である。
１・・・配線基板、２・・・実装電子部品、１１．１７
・・・ゴムまたは軟質樹脂％１２ 、１６・・・リード
端子、１３．１５・・・モールド樹脂、１４．１８・・
・半田付部分。FIG. 1 is a partially cutaway perspective view and sectional view of an electronic circuit module ν showing one embodiment of the present invention, and FIG. 2 is a partially cutaway perspective view of an electronic circuit module N showing another embodiment of the present invention. FIG. 3 is a partially cutaway perspective view and a sectional view of a conventional electronic circuit module. 1... Wiring board, 2... Mounted electronic component, 11.17
...Rubber or soft resin%12, 16...Lead terminal, 13.15...Mold resin, 14.18...
・Soldering part.
Claims (1)
品のリード端子の少なくとも実装側のリード端子部のみ
を覆うゴムまたは軟質樹脂を設け、前記配線基板の少な
くとも前記実装電子部品側の面を前記実装電子部品とと
もに覆うモールド樹脂を設けた電子回路モジユール。1. Rubber or soft resin is provided on the wiring board to cover at least the lead terminal portion of the mounted electronic component connected by solder or the like, and at least the surface of the wiring board on the mounted electronic component side is covered with the mounted electronic component. An electronic circuit module with a molded resin covering the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21680389A JPH0380599A (en) | 1989-08-23 | 1989-08-23 | Electronic circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21680389A JPH0380599A (en) | 1989-08-23 | 1989-08-23 | Electronic circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380599A true JPH0380599A (en) | 1991-04-05 |
Family
ID=16694134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21680389A Pending JPH0380599A (en) | 1989-08-23 | 1989-08-23 | Electronic circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380599A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09501359A (en) * | 1994-05-02 | 1997-02-10 | ファン ブランドウェイク システムズ プログラミング ベスローテン フェンノートシャップ | Continuous belt press |
| FR2753044A1 (en) * | 1996-08-27 | 1998-03-06 | Siemens Automotive Sa | Encapsulated electronic circuit board assembly process |
-
1989
- 1989-08-23 JP JP21680389A patent/JPH0380599A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09501359A (en) * | 1994-05-02 | 1997-02-10 | ファン ブランドウェイク システムズ プログラミング ベスローテン フェンノートシャップ | Continuous belt press |
| FR2753044A1 (en) * | 1996-08-27 | 1998-03-06 | Siemens Automotive Sa | Encapsulated electronic circuit board assembly process |
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