JPH0331091Y2 - - Google Patents

Description

[Detailed explanation of the idea] (b) Industrial application fields The present invention relates to a mounting structure for electrical components.

(b) Prior art LED (light emitting diode) elements 1 with a segment structure as shown in Fig. 3 are widely used for numerical displays in electronic devices, for example, channel displays in television receivers, and their installation is done using an LED drive. It can be mounted on a printed board together with the peripheral circuit elements constituting the circuit, for example, as described in Japanese Utility Model Publication No. 12227/1983, or it can be mounted on a printed wiring board such as a paper phenol board or a glass epoxy board as shown in Fig. 4. After inserting into 2, it is soldered and fixed by solder depping.

However, in recent years, due to the demand for smaller and thinner electronic devices, leadless small parts called chip parts have been mounted after printing and firing wiring conductors and resistors on insulating substrates such as ceramic boards. Hybrid integrated circuits constructed using thick film technology have become widespread, and
The LED element 1 is also mounted on the ceramic substrate 3 together with other hybrid integrated circuit components as shown in FIG. The terminal pin 4 of the LED element 1 is connected to the substrate 3.
After being inserted into the mounting hole 5 of the board 3, the tip of the terminal pin 4 protruding from the back side 3a of the board 3 is bent and temporarily fixed as shown in FIG. After this, the above
The LED element 1 is soldered 6 to a conductor pattern (not shown) provided on the back surface of the ceramic substrate 3 by a solder dipping method.

By the way, the LED element 1 is molded with synthetic resin and has a large coefficient of thermal expansion, whereas the coefficient of thermal expansion of the ceramic substrate 3 is very small compared to that of the synthetic resin. However, there is a drawback that cracks occur in the ceramic substrate 3 due to the heat during solder tapping described above and the difference in thermal expansion coefficients. In the case of this conventional example, the leg portion 1a of the LED element 1 that comes into contact with the substrate presses the substrate 3 during expansion and contraction, causing a crack at the portion indicated by arrow A. Furthermore, Figures 5 and 6
In the figure, 7 is a mini-mold transistor, 8
indicates a lead frame, and illustrations of printed resistors and the like are omitted.

(c) Purpose of the invention The present invention was devised to eliminate the above-mentioned drawbacks, and prevents cracks from occurring on the board when electrical components made of synthetic resin are soldered to an insulating board such as a ceramic board. The purpose is to

(d) Structure of the invention The present invention involves inserting a terminal pin of an electrical component molded with synthetic resin into a mounting hole provided in an insulating substrate and bending the electrical component, temporarily fixing the electrical component to the insulating substrate. , an electrical component mounting structure in which the terminal pin is soldered to the insulating substrate, characterized in that a silicone resin is interposed at a contact portion between the electrical component and the insulating substrate.

(E) Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2, in which the same parts as in FIGS. 5 and 6 are given the same reference numerals. After screen-printing and firing the electrodes and the like, silicone resin 9 (for example, Toshiba Silicon TSE322) is screen-printed and cured to an appropriate thickness on the ceramic substrate 3 where the leg portions 1a of the LED elements 1 come into contact. The silicone resin 9 is interposed at the abutting portion between the LED element 1 and the ceramic substrate 3.

With such a configuration, the heat generated during solder depping
Since the stress caused by expansion and contraction of the LED element is absorbed and alleviated by the elastic force of the silicone resin 1, the occurrence of cracks in the ceramic substrate 3 can be avoided.

(f) Effects of the invention According to the invention, when an electrical component molded with synthetic resin is temporarily fixed to an insulating substrate such as a ceramic substrate and soldered, the difference in thermal expansion coefficient between the electrical component and the insulating substrate is reduced. Damage to the board caused by this can be prevented.

[Brief explanation of drawings]

Figure 1 is a perspective view showing the mounting structure of the present invention, Figure 2 is a perspective view showing the mounting structure of the present invention.
The figure is a sectional view of the main part. FIG. 3 is a perspective view of the LED element. FIG. 4 is a perspective view showing a conventional mounting structure. FIGS. 5 and 6 are a perspective view and a sectional view, respectively, showing other conventional examples. 1... LED element (electrical component), 3... Ceramic substrate (insulating substrate), 4... Terminal pin, 5... Mounting hole, 9... Silicone resin.

Claims (1)

[Claims for Utility Model Registration] A terminal pin of an electrical component molded with a synthetic resin having a large coefficient of thermal expansion is inserted into a mounting hole provided in an insulating substrate made of ceramic or the like which has a coefficient of thermal expansion smaller than that of the synthetic resin. In the electrical component mounting structure, the terminal pin is soldered to the insulating substrate while the electrical component is temporarily fixed to the insulating substrate by bending, A mounting structure for an electrical component, characterized in that a silicone resin that prevents cracking of the insulating substrate due to a difference in coefficient of thermal expansion with the substrate is interposed at a contact portion between the electrical component and the insulating substrate.