CN109677055A - A kind of copper foil high frequency laminate and preparation method thereof - Google Patents
A kind of copper foil high frequency laminate and preparation method thereof Download PDFInfo
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- CN109677055A CN109677055A CN201710970496.9A CN201710970496A CN109677055A CN 109677055 A CN109677055 A CN 109677055A CN 201710970496 A CN201710970496 A CN 201710970496A CN 109677055 A CN109677055 A CN 109677055A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/552—Fatigue strength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
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Abstract
The invention discloses a kind of copper foil high frequency laminate and preparation method thereof, the copper coated foil plate includes copper foil layer, insulating medium layer, strip resistance copper foil layer, and the insulating medium layer side is covered with copper foil layer, and another layer is covered with strip resistance copper foil layer；The mass ratio of the copper foil layer, strip resistance copper foil layer and the insulating medium layer is 10%-25%:10%-25%:55%-80%.Preparation method includes the following steps: 1) glass cloth surface pre-processes；2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；3) insulating medium layer (prepreg) processed；4) typesetting, hot pressing, water cooling.Copper foil high frequency laminate dielectric constant prepared by the present invention is stable, accurate and consistency is good, have low dielectric loss, surface insulation resistance and the characteristics such as volumetric resistivity value is big, with high temperature resistant, water absorption rate is low, it is anti-aging, the advantages that anti-radiation is manufacture microwave prototype part and the ideal material of microstrip antenna.
Description
Technical field
The present invention relates to electronic information technology product preparation field more particularly to a kind of copper foil high frequency laminate and its preparations
Method.
Background technique
With the rapid development of electronic communication industry, the high-frequency communication part frequency range of former military use give it is civilian, remote
Distance communication, navigation, medical treatment, transport, traffic, the extensive use in field of storing in a warehouse, make the big great development of civilian high-frequency communication, and satellite is logical
Letter, microwave communication, fiber optic communication, bus location and hyperfrequency play program, all develop to high frequency direction, electronic information
Product high frequency, high speed, to printed board high frequency characteristics, more stringent requirements are proposed.
Since polytetrafluoroethylene (PTFE) has excellent electric property, resistant to chemical etching, heat-resisting, use temperature range is wide, water suction
Property is low, and high-frequency range dielectric constant, dielectric loss are with low uncertainty, are highly suitable for the substrate material as high-speed digitization and high frequency
Material, especially the fields such as terrestrial microwave video signal, satellite communication, cell phone, military project radar, space flight and aviation, missile guidance is wide
General demand application.But soft since the thermal expansion coefficient of polyfluoroethylene resin is big, product bending strength is small, mechanical performance
Difference limits it in the application of printed circuit board industry.
Summary of the invention
It is an object of the invention to overcome problems of the prior art, a kind of copper foil high frequency laminate and its system are provided
Preparation Method.
The technical scheme is that
A kind of copper foil high frequency laminate, including copper foil layer, insulating medium layer, strip resistance copper foil layer, insulating medium layer side
It is covered with copper foil layer, another layer is covered with strip resistance copper foil layer；Copper foil layer, strip resistance copper foil layer heat through vacuum high-temperature hydraulic press, add
Pressure is compound in insulating medium layer two sides up and down respectively, wherein the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer is
10%-25%:10%-25%:55%-80%, copper foil layer with a thickness of 0.018-0.035mm, strip resistance copper foil layer with a thickness of
0.025mm-0.07mm。
A kind of preparation method of copper foil high frequency laminate, comprising the following steps:
1) surface is carried out using high temperature furnace to micarex cloth to be heat-treated；
Heat treatment parameter is as follows:
Temperature: 190-260 DEG C；Pretreatment time: 18-35 minutes；Speed control: 0.5-0.7 ms/min；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；
Polytetrafluoroethylene (PTFE) dispersion emulsion constituent is by mass ratio as follows: polyflon: 65-120 parts；Isophthalic
Diamines: 12-25 parts；20-50 parts of sedimentation agent, 2-20 parts of lubricant；
Wherein, lubricant group is as methylimidazole: 1-3 parts；Silane coupling agent: 0.15-3 parts；Tripropylene glycol monomethyl Ether: 6-
19 parts；Sedimentation agent group is as acetone: 15-30 parts；
The allotment of polytetrafluoroethylene (PTFE) dispersion emulsion:
A. lubricant is added sequentially in reaction kettle according to the ratio, turn on agitator, 40-75 DEG C of temperature, revolving speed 1000-
It 1800 revs/min, persistently stirs 15 minutes, is warming up to 120-140 DEG C, and continue to be stirred to react 25-40 minutes, performed polymer is made
Component A；
B. polyflon, m-phenylene diamine (MPD) are sequentially added by formula ratio in stirred tank, after addition, in 130-
Pre-polymerization 20-40 minutes at 150 DEG C, cooling obtained B component is poured out；
C. component A and B component are uniformly mixed, and sedimentation agent is added, poured into stirred tank, and continue to keep 1000-
1800 revs/min of revolving speed stirs 4-6 hours, and the allotment of polytetrafluoroethylene (PTFE) dispersion emulsion is completed；
3) insulating medium layer (prepreg) processed；
Polytetrafluoroethylene (PTFE) dispersion emulsion is impregnated with micarex cloth, is impregnated by vertical glue dipping machine, and passes through heat radiation type
Baking oven drying and high temperature sintering, repeat 3-4 times, are made insulating medium layer (prepreg), solid content accounts for 50%-70%；
4) hot pressing, water cooling；
It is 10%-25%:10%-25%:55%- by the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer
80% overlapping is cut into same size size, 10-30 one group, then heats by vacuum high-temperature hydraulic press, compound system of pressurizeing
At, it is recycled finally by cooling water, temperature is made to be down to 20-30 DEG C, obtained copper foil high frequency laminate.
Further technical solution, heat radiation type baking oven are divided into three warm areas, and state modulator is as follows:
Temperature: top: 220 DEG C -310 DEG C；
Middle part: 160 DEG C -200 DEG C；
Lower part: 90 DEG C -110 DEG C；
Speed: 0.5 m/min -0.75 m/min.
Further technical solution, vacuum high-temperature hydraulic press pressing parameter are as follows:
Vacuum degree: 0.02-0.04Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 90-240 DEG C；
Contact pressure: 50-80psi；
Briquetting pressure: 135-600psi；
The molding pressing time: 40-60 minutes.
Further technical solution, copper foil high frequency laminate can have various types of specifications, such as: 460 × 610,
600 × 500,914 × 1220,1220 × 1000,1500 × 1000 (units: mm).
Beneficial effects of the present invention:
1, preparation process of the present invention is easy, and production cost is low, and dielectric constant is stable when batch production and consistency is good, gained
Product high temperature resistant, it is anti-aging, it is anti-radiation, have low dielectric loss, surface insulation resistance and volumetric resistivity value big, dielectric constant essence
The characteristics such as really, are the manufacture microwave prototype parts and optimal material of microstrip antenna, and it is logical to can be widely applied to space flight, aviation, satellite
News, electronic countermeasure, radio and television and all kinds of communication fields.
2, since polytetrafluoroethylene (PTFE) has excellent electric property, resistant to chemical etching, heat-resisting, use temperature range is wide, inhales
Aqueous low, high-frequency range dielectric constant, dielectric loss are with low uncertainty, and using it as basic resin, the copper-clad plate being made is situated between
Electric constant it is minimum can to 2.2, dielectric loss can to 0.0010 hereinafter, and there is high-fire resistance, be suitable for subsequent applications completely.
3, baking oven is divided into three warm areas in insulating medium layer processed by the present invention, by adjusting left, center, right area temperature, is disappeared
The inconsistent situation of the lateral solidifcation being likely to occur except prepreg, reduces internal stress, make angularity control 0.7% with
It is interior.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Wherein, 1, insulating medium layer, 2, copper foil layer, 3, strip resistance copper foil layer.
Specific embodiment
Below by non-limiting embodiment, the present invention is further explained, understands the present invention.
The embodiment of the present invention 1:
It is heat-treated 1. pair micarex cloth carries out surface using high temperature furnace；
To micarex cloth carry out high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, speed
0.55 m/min.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 110 parts of polyflon, m-phenylene diamine (MPD) 18
Part, 0.2 part of silane, 0.1 part of methylimidazole, 9 parts of tripropylene glycol methyl ether, 10 parts of silicon powder, 15 parts of acetone；
Allotment:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1000 revs/min of revolving speed
Clock keeps lasting stirring and control flume temperature is at 30 DEG C, persistently stirs 12 minutes, add the silicon powder of formula ratio, add
After persistently stir 20 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add
Efficiently shearing and emulsification 1.5 hours are opened after adding, while carrying out cooling water circulation, and A is made at 30 DEG C in retention groove temperature
Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made
Part；
C. component A and B component are uniformly mixed, adds acetone, be added in stirred tank, and continue to be kept for 1000 revs/min
The revolving speed of clock stirs 5 hours, and adhesive allotment is completed.
3. polytetrafluoroethylglass glass cloth (prepreg) processed
It is repeated 3 times, fixture contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering
It measures to 60% and stops, being made polytetrafluoroethylglass glass cloth (prepreg).
Impregnation parameter:
Impregnation temperature: top: 270 DEG C；Middle part: 160 DEG C；Lower part: 90 DEG C；
Speed: 0.7 m/min.
4. typesetting, hot pressing
It is that 15%:15%:70% is overlapped by the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer, is cut into
Same size size, is then combined by the heating of vacuum high-temperature hydraulic press, pressurization by 10 one group.
Pressing parameter control is as follows:
Vacuum degree: 0.02Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 120 DEG C；
Contact pressure: 62psi；
Briquetting pressure: 184psi；
The molding pressing time: 48 minutes.
5. copper coated foil plate performance parameter:
Embodiment 2:
1. glass cloth surface pre-processes
Glass cloth progress high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, 0.55 m/min of speed
Clock.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 120 parts of polyflon, m-phenylene diamine (MPD) 19
Part, 0.15 part of silane, 0.1 part of methylimidazole, 9.5 parts of tripropylene glycol methyl ether, 12 parts of silicon powder, 15 parts of acetone；
Concocting method:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1200 revs/min of revolving speed
Clock keeps lasting stirring and control flume temperature is at 40 DEG C, persistently stirs 15 minutes, add the silicon powder of formula ratio, add
After persistently stir 22 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add
Efficiently shearing and emulsification 1.8 hours are opened after adding, while carrying out cooling water circulation, and A is made at 40 DEG C in retention groove temperature
Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made
Part；
C. component A and B component are uniformly mixed, adds acetone, be added in stirred tank, and continue to be kept for 1200 revs/min
The revolving speed of clock stirs 5 hours, and adhesive allotment is completed.
3. polytetrafluoroethylglass glass cloth (prepreg) processed
It is repeated 3 times, solids contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering
Stop when amount is to 55%, is made polytetrafluoroethylglass glass cloth (prepreg).
Impregnation parameter:
Impregnation temperature: top: 290 DEG C；Middle part: 170 DEG C；Lower part: 90 DEG C；
Speed: 0.7 m/min.
4. typesetting, hot pressing
It is that 15%:15%:70% is overlapped by the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer, is cut into
Same size size, is then combined by the heating of vacuum high-temperature hydraulic press, pressurization by 12 one group.
Pressing parameter control is as follows:
Vacuum degree: 0.025Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 120 DEG C；
Contact pressure: 60psi；
Briquetting pressure: 180psi；
The molding pressing time: 45 minutes.
5. copper coated foil plate performance parameter:
Embodiment 3:
1. glass cloth surface pre-processes
Glass cloth progress high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, 0.55 m/min of speed
Clock.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 115 parts of polyflon, m-phenylene diamine (MPD) 20
Part, 0.35 part of silane, 0.45 part of methylimidazole, 10 parts of tripropylene glycol methyl ether, 15 parts of silicon powder, 15 parts of acetone；
Concocting method:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1100 revs/min of revolving speed
Clock keeps lasting stirring and control flume temperature is at 35 DEG C, persistently stirs 14 minutes, add the silicon powder of formula ratio, add
After persistently stir 24 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add
Efficiently shearing and emulsification 2.5 hours are opened after adding, while carrying out cooling water circulation, and A is made at 35 DEG C in retention groove temperature
Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made
Part；
C. component A and B component are uniformly mixed, adds acetone, be added in stirred tank, and continue to be kept for 1100 revs/min
The revolving speed of clock stirs 6 hours, and adhesive allotment is completed.
3. polytetrafluoroethylglass glass cloth (prepreg) processed
It is repeated 3 times, solids contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering
Stop when amount is up to 65%, is made polytetrafluoroethylglass glass cloth (prepreg).
Impregnation parameter:
Impregnation temperature: top: 285 DEG C；Middle part: 180 DEG C；Lower part: 100 DEG C；
Speed: 0.75 m/min.
4. typesetting, hot pressing
It is that 15%:15%:70% is overlapped by the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer, is cut into
Same size size, is then combined by the heating of vacuum high-temperature hydraulic press, pressurization by 16 one group.
Pressing parameter control is as follows:
Vacuum degree: 0.03Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 125 DEG C；
Contact pressure: 67psi；
Briquetting pressure: 200psi；
The molding pressing time: 55 minutes.
5. copper coated foil plate performance parameter:
In conclusion copper foil high frequency laminate dielectric constant obtained above is stable, accurate and consistency is good, products obtained therefrom
High temperature resistant, water absorption rate is low, anti-aging, anti-radiation, has low dielectric loss, surface insulation resistance and volumetric resistivity value big etc. special
Property, it is manufacture microwave prototype part and the ideal material of microstrip antenna, is fully able to meet space flight, aviation, satellite communication, electronics pair
Anti-, radio and television and all kinds of communication fields demands.
Claims (5)
1. a kind of copper foil high frequency laminate, which is characterized in that described exhausted including copper foil layer, insulating medium layer, strip resistance copper foil layer
Edge dielectric layer side is covered with copper foil layer, and another layer is covered with strip resistance copper foil layer；The copper foil layer, strip resistance copper foil layer are through vacuum height
The heating of warm hydraulic press, pressurization are compound in insulating medium layer two sides up and down respectively, wherein the copper foil layer, strip resistance copper foil layer with
The mass ratio of the insulating medium layer is 10%-25%:10%-25%:55%-80%, and the copper foil layer is with a thickness of 0.018-
0.035mm, the strip resistance copper foil layer is with a thickness of 0.025mm-0.07mm.
2. a kind of preparation method of copper foil high frequency laminate, which comprises the following steps:
1) surface is carried out using high temperature furnace to micarex cloth to be heat-treated；
Heat treatment parameter is as follows:
Temperature: 190-260 DEG C；Pretreatment time: 18-35 minutes；Speed control: 0.5-0.7 ms/min；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；
Polytetrafluoroethylene (PTFE) dispersion emulsion constituent is by mass ratio as follows: polyflon: 65-120 parts；Isophthalic two
Amine: 12-25 parts；20-50 parts of sedimentation agent, 2-20 parts of lubricant；
Wherein, lubricant group is as methylimidazole: 1-3 parts；Silane coupling agent: 0.15-3 parts；Tripropylene glycol monomethyl Ether: 6-19
Part；Sedimentation agent group is as acetone: 15-30 parts；
The allotment of polytetrafluoroethylene (PTFE) dispersion emulsion:
A. lubricant is added sequentially in reaction kettle according to the ratio, turn on agitator, 40-75 DEG C of temperature, revolving speed 1000-1800
Rev/min, it persistently stirs 15 minutes, is warming up to 120-140 DEG C, and continue to be stirred to react 25-40 minutes, performed polymer A group is made
Part；
B. polyflon, m-phenylene diamine (MPD) are sequentially added by formula ratio in stirred tank, after addition, in 130-150
Pre-polymerization 20-40 minutes at DEG C, cooling obtained B component is poured out；
C. component A and B component are uniformly mixed, and sedimentation agent are added, poured into stirred tank, and continue keep 1000-1800 turn/
The revolving speed of minute stirs 4-6 hours, and the allotment of polytetrafluoroethylene (PTFE) dispersion emulsion is completed；
3) insulating medium layer (prepreg) processed；
Polytetrafluoroethylene (PTFE) dispersion emulsion is impregnated with micarex cloth, is impregnated by vertical glue dipping machine, and passes through heat radiation type baking oven
Drying and high temperature sintering repeat 3-4 times, are made insulating medium layer (prepreg)；
4) hot pressing, water cooling；
It is 10%-25%:10%-25%:55%-80% compacting by the mass ratio of copper foil layer, strip resistance copper foil layer and insulating medium layer, cuts out
It is cut into same size size, 10-30 one group, is then combined by the heating of vacuum high-temperature hydraulic press, pressurization, finally by
Cooling water circulation, makes temperature be down to 20-30 DEG C, and copper foil high frequency laminate is made.
3. a kind of preparation method of copper foil high frequency laminate according to claim 2, which is characterized in that the heat radiation type
Baking oven is divided into three warm areas, and state modulator is as follows:
Temperature: top: 220 DEG C -310 DEG C；
Middle part: 160 DEG C -200 DEG C；
Lower part: 90 DEG C -110 DEG C；
Speed: 0.5 m/min -0.75 m/min.
4. a kind of preparation method of copper foil high frequency laminate according to claim 2, which is characterized in that the vacuum high-temperature
Hydraulic press pressing parameter is as follows:
Vacuum degree: 0.02-0.04Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 90-240 DEG C；
Contact pressure: 50-80 psi；
Briquetting pressure: 135-600psi；
The molding pressing time: 40-60 minutes.
5. a kind of preparation method of copper foil high frequency laminate according to claim 2, which is characterized in that the copper foil high frequency
Laminate can have various types of specifications, such as: 460 × 610,600 × 500,914 × 1220,1220 × 1000,1500
× 1000(unit: mm).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970496.9A CN109677055A (en) | 2017-10-18 | 2017-10-18 | A kind of copper foil high frequency laminate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970496.9A CN109677055A (en) | 2017-10-18 | 2017-10-18 | A kind of copper foil high frequency laminate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109677055A true CN109677055A (en) | 2019-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710970496.9A Pending CN109677055A (en) | 2017-10-18 | 2017-10-18 | A kind of copper foil high frequency laminate and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110994167A (en) * | 2019-12-03 | 2020-04-10 | 浙江清华柔性电子技术研究院 | High-temperature-resistant flexible array antenna and manufacturing method thereof |
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| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN2880486Y (en) * | 2005-12-30 | 2007-03-21 | 顾根山 | Width dielectric constant copper foil board with polytetrafluoroethylene glass layer |
| CN102711378A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency metal-base circuit base board |
| CN202941039U (en) * | 2012-09-12 | 2013-05-15 | 金安国纪科技股份有限公司 | Composite substrate high-frequency copper-clad plate |
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| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN2880486Y (en) * | 2005-12-30 | 2007-03-21 | 顾根山 | Width dielectric constant copper foil board with polytetrafluoroethylene glass layer |
| CN102711378A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency metal-base circuit base board |
| CN202941039U (en) * | 2012-09-12 | 2013-05-15 | 金安国纪科技股份有限公司 | Composite substrate high-frequency copper-clad plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110994167A (en) * | 2019-12-03 | 2020-04-10 | 浙江清华柔性电子技术研究院 | High-temperature-resistant flexible array antenna and manufacturing method thereof |
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