CN109677061A - A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof - Google Patents

A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof Download PDF

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Publication number
CN109677061A
CN109677061A CN201710970981.6A CN201710970981A CN109677061A CN 109677061 A CN109677061 A CN 109677061A CN 201710970981 A CN201710970981 A CN 201710970981A CN 109677061 A CN109677061 A CN 109677061A
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insulating medium
medium layer
dielectric constant
wide
polytetrafluoroethylene
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朱德明
王刚
沈振春
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WANGLING INSULATING MATERIAL PLANT TAIZHOU
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WANGLING INSULATING MATERIAL PLANT TAIZHOU
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B32B17/10027—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet the glass sheet not being an outer layer
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/02—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica the layer of fibres or particles being impregnated or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
    • B32B19/045—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
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    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion

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  • Physics & Mathematics (AREA)
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Abstract

The invention discloses a kind of wide-dielectric constant insulating medium layer copper coated foil plates and preparation method thereof, the copper coated foil plate includes band passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer, the polytetrafluoroethylene film layer is overlying on insulating medium layer, and two sides, the copper foil are overlying on polytetrafluoroethylene film layer up and down；Preparation method includes the following steps: 1) glass cloth surface pre-processes；2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；3) insulating medium layer (prepreg) processed；4) typesetting, hot pressing, water cooling.The advantages that wide-dielectric constant insulating medium layer copper coated foil plate dielectric constant prepared by the present invention is stable, accurate and consistency is good, has low dielectric loss, surface insulation resistance and the characteristics such as volumetric resistivity value is big, has high temperature resistant, and water absorption rate is low, anti-aging, anti-radiation.

Description

A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof
Technical field
The present invention relates to electronic information technology product preparation fields more particularly to a kind of wide-dielectric constant insulating medium layer to cover Copper foil plate and preparation method thereof.
Background technique
With the rapid development of electronic communication industry, the high-frequency communication part frequency range of former military use give it is civilian, remote Distance communication, navigation, medical treatment, transport, traffic, the extensive use in field of storing in a warehouse, make the big great development of civilian high-frequency communication, and satellite is logical Letter, microwave communication, fiber optic communication, bus location and hyperfrequency play program, all develop to high frequency direction, electronic information Product high frequency, high speed, to printed board high frequency characteristics, more stringent requirements are proposed.
Since polytetrafluoroethylene (PTFE) has excellent electric property, resistant to chemical etching, heat-resisting, use temperature range is wide, water suction Property is low, and high-frequency range dielectric constant, dielectric loss are with low uncertainty, are highly suitable for the substrate material as high-speed digitization and high frequency Material, especially the fields such as terrestrial microwave video signal, satellite communication, cell phone, military project radar, space flight and aviation, missile guidance is wide General demand application.In a wireless communication system, with needed in fixed-bandwidth by voice-and-data information increasingly increase, nothing Source intermodulation becomes a key factor of limitation power system capacity.As in active device, two or more frequencies Mixed in nonlinear device and just produce spurious signal --- passive intermodulation.When spuious inter-modulated signal falls in base station In frequency acceptance band, the sensitivity of receiver will be reduced, so as to cause speech quality or system carrier interference ratio, reduction, and The capacity of communication system is reduced.
And with the development of information, for electronic product, wiring board is carried to it different requirements, especially It is dielectric constant, the route plate of differing dielectric constant has different applications, as signaling rate needs low dielectric normal fastly Number, therefore need to develop differing dielectric constant, low-loss copper-clad plate for existing development need.
Summary of the invention
It is an object of the invention to overcome problems of the prior art, a kind of wide-dielectric constant insulating medium layer is provided Copper coated foil plate and preparation method thereof.
The technical scheme is that
A kind of wide-dielectric constant insulating medium layer copper coated foil plate, including band passive intermodulation index copper foil layer, polytetrafluoroethylene (PTFE) Film layer, insulating medium layer, the polytetrafluoroethylene film layer is overlying on insulating medium layer, and two sides, the copper foil are overlying on poly- four up and down On fluoroethylene film layer；The mass ratio with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer is 10%-25%:15%-40%:50%-75%；The polytetrafluoroethylene film layer is with a thickness of 0.03mm-0.08mm.
A kind of preparation method of wide-dielectric constant insulating medium layer copper coated foil plate, comprising the following steps:
1) surface is carried out using high temperature furnace to micarex cloth to be heat-treated；
Heat treatment parameter is as follows:
Temperature: 190-280 DEG C；Pretreatment time: 18-35 minutes；Speed control: 0.5-0.7 ms/min；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；
Polytetrafluoroethylene (PTFE) dispersion emulsion constituent is by mass ratio as follows: polyflon: 65-120 parts；Between Phenylenediamine: 12-25 parts；20-50 parts of sedimentation agent, 2-20 parts of lubricant；
Wherein, lubricant group is as methylimidazole: 1-3 parts；Silane coupling agent: 0.15-3 parts；Tripropylene glycol monomethyl Ether: 6- 19 parts；Sedimentation agent group is as acetone: 15-30 parts；
The allotment of polytetrafluoroethylene (PTFE) dispersion emulsion:
A. lubricant is added sequentially in reaction kettle according to the ratio, turn on agitator, 40-75 DEG C of temperature, revolving speed 1000- It 1800 revs/min, persistently stirs 15 minutes, is warming up to 120-140 DEG C, and continue to be stirred to react 25-40 minutes, pre-polymerization is made Body component A；
B. polyflon, m-phenylene diamine (MPD) are sequentially added by formula ratio in stirred tank, after addition, in 130- Pre-polymerization 20-40 minutes at 150 DEG C, cooling obtained B component is poured out；
C. component A and B component are uniformly mixed, and sedimentation agent is added, poured into stirred tank, and continue to keep 1000- 1800 revs/min of revolving speed stirs 4-6 hours, and the allotment of polytetrafluoroethylene (PTFE) dispersion emulsion is completed；
3) insulating medium layer (prepreg) processed；
Polytetrafluoroethylene (PTFE) dispersion emulsion is impregnated with micarex cloth, is impregnated by vertical glue dipping machine, and passes through heat radiation type Baking oven drying and high temperature sintering, repeat 3-4 times, are made insulating medium layer (prepreg)；
4) hot pressing, water cooling, typesetting；
It with mass ratio will be 10%- with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer 25%:15%-40%:50%-75% overlapping is cut into same size size, 10-30 one group, then passes through vacuum high-temperature Hydraulic press heating, pressurization are combined, and recycle finally by cooling water, temperature is made to be down to 20-30 DEG C, and wide-dielectric constant is made Insulating medium layer copper coated foil plate.
Further technical solution, heat radiation type baking oven are divided into three warm areas, and state modulator is as follows:
Temperature: top: 220 DEG C -310 DEG C；
Middle part: 160 DEG C -200 DEG C；
Lower part: 90 DEG C -110 DEG C；
Speed: 0.5 m/min -0.75 m/min.
Further technical solution, vacuum high-temperature hydraulic press pressing parameter are as follows:
Vacuum degree: 0.02-0.04Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 90-240 DEG C；
Contact pressure: 50-80psi；
Briquetting pressure: 135-600psi；
The molding pressing time: 40-60 minutes.
Further technical solution, wide-dielectric constant insulating medium layer copper coated foil plate can have various types of specification rulers It is very little, such as: 550 × 440,500 × 500,600 × 500,650 × 500,1000 × 850,1100 × 1000,1220 × 1000, 1500 × 1000 (units: mm).
Beneficial effects of the present invention:
1, preparation process of the present invention is easy, and production cost is low, and dielectric constant is stable when batch production and consistency is good, gained Product high temperature resistant, it is anti-aging, it is anti-radiation, have low dielectric loss, surface insulation resistance and volumetric resistivity value big, dielectric constant essence The characteristics such as really, are the manufacture microwave prototype parts and optimal material of microstrip antenna, and it is logical to can be widely applied to space flight, aviation, satellite News, electronic countermeasure, radio and television and all kinds of communication fields.
2, since polytetrafluoroethylene (PTFE) has excellent electric property, resistant to chemical etching, heat-resisting, use temperature range is wide, inhales Aqueous low, high-frequency range dielectric constant, dielectric loss are with low uncertainty, and using it as basic resin, the copper-clad plate being made is situated between Electric constant it is minimum can to 2.2, dielectric loss can to 0.0010 hereinafter, and there is high-fire resistance, be suitable for subsequent applications completely.
3, wide-dielectric constant insulating medium layer copper coated foil plate dielectric constant accuracy produced by the present invention is high, and error is controllable Within 2.5%, while dielectric loss is very low.It repeatedly impregnated, dried by micarex cloth and polytetrafluoroethylene (PTFE) dispersion emulsion Dry and high temperature sintering, improves surface insulation resistance and volume resistance, normality lower surface insulation resistance >=1 × 104M. Ω, volume Resistance >=1 × 106M Ω .cm.
4, the present invention has no chance intermodulation index copper foil using band, and the scope of application is more extensive.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Wherein, including 1, insulating medium layer, 2, polytetrafluoroethylene film layer, 3, band passive intermodulation index copper foil layer.
Specific embodiment
Below by non-limiting embodiment, the present invention is further explained, understands the present invention.
The embodiment of the present invention 1:
It is heat-treated 1. pair micarex cloth carries out surface using high temperature furnace；
To micarex cloth carry out high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, speed 0.55 m/min.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 75 parts of polyflon, m-phenylene diamine (MPD) 12 Part, 0.3 part of silane, 0.12 part of methylimidazole, 9 parts of tripropylene glycol methyl ether, 15 parts of silicon powder, 15 parts of acetone；
Allotment:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1000 revs/min of revolving speed Clock keeps lasting stirring and control flume temperature is at 30 DEG C, persistently stirs 12 minutes, add the silicon powder of formula ratio, add After persistently stir 20 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add Efficiently shearing and emulsification 1.5 hours are opened after adding, while carrying out cooling water circulation, and A is made at 30 DEG C in retention groove temperature Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made Part；
C. component A and B component are uniformly mixed, and acetone is added, be added in stirred tank, and continue to be kept for 1000 revs/min The revolving speed of clock stirs 5 hours, and adhesive allotment is completed.
3. insulating medium layer (prepreg) processed
It is repeated 3 times, fixture contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering It measures to 60% and stops, being made insulating medium layer (prepreg).
Impregnation parameter:
Impregnation temperature: top: 270 DEG C；Middle part: 160 DEG C；Lower part: 90 DEG C；
Speed: 0.7 m/min.
4. typesetting, hot pressing:
By with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer with mass ratio be 10%: The proportion of 25%:65% overlaps, and is cut into same size size, 10 one group, then heats, adds by vacuum high-temperature hydraulic press Pressure is combined.
Pressing parameter control is as follows:
Vacuum degree: 0.02Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 120 DEG C；
Contact pressure: 62psi；
Briquetting pressure: 184psi；
The molding pressing time: 48 minutes.
5. copper coated foil plate performance parameter:
Embodiment 2:
1. glass cloth surface pre-processes
Glass cloth progress high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, 0.55 meter of speed/ Minute.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 120 parts of polyflon, m-phenylene diamine (MPD) 22 Part, 0.13 part of silane, 0.2 part of methylimidazole, 9.8 parts of tripropylene glycol methyl ether, 12 parts of silicon powder, 15 parts of acetone
Concocting method:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1200 revs/min of revolving speed Clock keeps lasting stirring and control flume temperature is at 40 DEG C, persistently stirs 15 minutes, add the silicon powder of formula ratio, add After persistently stir 22 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add Efficiently shearing and emulsification 1.8 hours are opened after adding, while carrying out cooling water circulation, and A is made at 40 DEG C in retention groove temperature Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made Part；
C. component A and B component are uniformly mixed, and acetone is added, be added in stirred tank, and continue to be kept for 1200 revs/min The revolving speed of clock stirs 5 hours, and adhesive allotment is completed.
3. insulating medium layer (prepreg) processed
It is repeated 3 times, solids contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering Stop when amount is to 55%, is made insulating medium layer (prepreg).
Impregnation parameter:
Impregnation temperature: top: 290 DEG C；Middle part: 170 DEG C；Lower part: 90 DEG C；
Speed: 0.7 m/min.
4. typesetting, hot pressing
By with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer with mass ratio be 10%: The proportion of 25%:65% overlaps, and is cut into same size size, 12 one group, then heats, adds by vacuum high-temperature hydraulic press Pressure is combined.
Pressing parameter control is as follows:
Vacuum degree: 0.025Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 120 DEG C；
Contact pressure: 60psi；
Briquetting pressure: 180psi；
The molding pressing time: 45 minutes.
5. copper coated foil plate performance parameter:
Embodiment 3:
1. glass cloth surface pre-processes
Glass cloth progress high temperature furnace heat treatment, 220 DEG C of high temperature furnace temperature, heat treatment time 25 minutes, 0.55 meter of speed/ Minute.
2. modulating polytetrafluoroethylene (PTFE) dispersion emulsion；
Polytetrafluoroethylene (PTFE) dispersion emulsion formula rate (is counted) in mass ratio: 115 parts of polyflon, m-phenylene diamine (MPD) 25 Part, 0.33 part of silane, 0.45 part of methylimidazole, 10 parts of tripropylene glycol methyl ether, 10 parts of silicon powder, 15 parts of acetone
Concocting method:
A. tripropylene glycol methyl ether, silane are sequentially added in stirred tank according to the ratio, turn on agitator, 1100 revs/min of revolving speed Clock keeps lasting stirring and control flume temperature is at 35 DEG C, persistently stirs 14 minutes, add the silicon powder of formula ratio, add After persistently stir 24 minutes again, then sequentially add polyflon, m-phenylene diamine (MPD) by formula ratio in stirred tank, add Efficiently shearing and emulsification 2.5 hours are opened after adding, while carrying out cooling water circulation, and A is made at 35 DEG C in retention groove temperature Component；
B. methylimidazole is weighed by formula ratio, and tripropylene glycol methyl ether is added, be completely dissolved methylimidazole, B group is made Part；
C. component A and B component are uniformly mixed, and acetone is added, be added in stirred tank, and continue to be kept for 1100 revs/min The revolving speed of clock stirs 6 hours, and adhesive allotment is completed.
3. system gathers novel tetrafluoroethene glass cloth (prepreg)
It is repeated 3 times, solids contains with glass cloth dip bonding agent by vertical glue dipping machine dipping, drying and high temperature sintering Stop when amount is up to 65%, is made insulating medium layer (prepreg).
Impregnation parameter:
Impregnation temperature: top: 285 DEG C；Middle part: 180 DEG C；Lower part: 100 DEG C；
Speed: 0.75 m/min.
4. typesetting, hot pressing
By with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer with mass ratio be 10%: The proportion of 25%:65% overlaps, and is cut into same size size, 16 one group, then heats, adds by vacuum high-temperature hydraulic press Pressure is combined.
Pressing parameter control is as follows:
Vacuum degree: 0.03Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 125 DEG C；
Contact pressure: 67psi；
Briquetting pressure: 200psi；
The molding pressing time: 55 minutes.
5. copper coated foil plate performance parameter:
In conclusion wide-dielectric constant insulating medium layer copper coated foil plate dielectric constant obtained above is stable, accurate and one Good, the products obtained therefrom high temperature resistant of cause property, water absorption rate is low, anti-aging, anti-radiation, has low dielectric loss, surface insulation resistance and body The product characteristics such as resistance value is big, are manufacture microwave prototype part and the ideal material of microstrip antenna, be fully able to meet space flight, aviation, Satellite communication, electronic countermeasure, radio and television and all kinds of communication fields demand.

Claims (5)

1. a kind of wide-dielectric constant insulating medium layer copper coated foil plate, which is characterized in that including band passive intermodulation index copper foil layer, gather Tetrafluoroethene film layer, insulating medium layer, the polytetrafluoroethylene film layer are overlying on insulating medium layer two sides up and down, the copper foil It is overlying on polytetrafluoroethylene film layer；It is described with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer Mass ratio is 10%-25%:15%-40%:50%-75%；The polytetrafluoroethylene film layer is with a thickness of 0.03mm-0.08mm.
2. a kind of preparation method of wide-dielectric constant insulating medium layer copper coated foil plate, which comprises the following steps:
1) surface is carried out using high temperature furnace to micarex cloth to be heat-treated；
Heat treatment parameter is as follows:
Temperature: 190-280 DEG C；Pretreatment time: 18-35 minutes；Speed control: 0.5-0.7 ms/min；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is modulated；
Polytetrafluoroethylene (PTFE) dispersion emulsion constituent is by mass ratio as follows: polyflon: 65-120 parts；Isophthalic two Amine: 12-25 parts；20-50 parts of sedimentation agent, 2-20 parts of lubricant；
Wherein, lubricant group is as methylimidazole: 1-3 parts；Silane coupling agent: 0.15-3 parts；Tripropylene glycol monomethyl Ether: 6-19 Part；Sedimentation agent group is as acetone: 15-30 parts；
The allotment of polytetrafluoroethylene (PTFE) dispersion emulsion:
A. lubricant is added sequentially in reaction kettle according to the ratio, turn on agitator, 40-75 DEG C of temperature, revolving speed 1000-1800 Rev/min, it persistently stirs 15 minutes, is warming up to 120-140 DEG C, and continue to be stirred to react 25-40 minutes, performed polymer A group is made Part；
B. polyflon, m-phenylene diamine (MPD) are sequentially added by formula ratio in stirred tank, after addition, in 130-150 Pre-polymerization 20-40 minutes at DEG C, cooling obtained B component is poured out；
C. component A and B component are uniformly mixed, and sedimentation agent are added, poured into stirred tank, and continue keep 1000-1800 turn/ The revolving speed of minute stirs 4-6 hours, and the allotment of polytetrafluoroethylene (PTFE) dispersion emulsion is completed；
3) insulating medium layer (prepreg) processed；
Polytetrafluoroethylene (PTFE) dispersion emulsion is impregnated with micarex cloth, is impregnated by vertical glue dipping machine, and passes through heat radiation type baking oven Drying and high temperature sintering repeat 3-4 times, are made insulating medium layer (prepreg)；
4) hot pressing, water cooling, typesetting；
With mass ratio will be 10%-25% with passive intermodulation index copper foil layer, polytetrafluoroethylene film layer, insulating medium layer: 15%-40%:50%-75% overlapping is cut into same size size, 10-30 one group, then adds by vacuum high-temperature hydraulic press Temperature, pressurization are combined, and recycle finally by cooling water, temperature is made to be down to 20-30 DEG C, and wide-dielectric constant insulating medium layer is made Copper coated foil plate.
3. a kind of preparation method of wide-dielectric constant insulating medium layer copper coated foil plate according to claim 2, feature exist In the heat radiation type baking oven is divided into three warm areas, and state modulator is as follows:
Temperature: top: 220 DEG C -310 DEG C；
Middle part: 160 DEG C -200 DEG C；
Lower part: 90 DEG C -110 DEG C；
Speed: 0.5 m/min -0.75 m/min.
4. a kind of preparation method of wide-dielectric constant insulating medium layer copper coated foil plate according to claim 2, feature exist In the vacuum high-temperature hydraulic press pressing parameter is as follows:
Vacuum degree: 0.02-0.04Mpa；
Heating rate: 10 DEG C/min；
Forming temperature: 90-240 DEG C；
Contact pressure: 50-80 psi；
Briquetting pressure: 135-600psi；
The molding pressing time: 40-60 minutes.
5. a kind of preparation method of wide-dielectric constant insulating medium layer copper coated foil plate according to claim 2, feature exist In the wide-dielectric constant insulating medium layer copper coated foil plate can have various types of specifications, such as: 550 × 440,500 × 500,600 × 500,650 × 500,1000 × 850,1100 × 1000,1220 × 1000,1500 × 1000(unit: mm).
CN201710970981.6A 2017-10-18 2017-10-18 A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof Pending CN109677061A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050121226A1 (en) * 2003-10-21 2005-06-09 Park Electrochemical Corporation Laminates having a low dielectric constant, low disapation factor bond core and method of making same
CN102427666A (en) * 2011-09-25 2012-04-25 顾根山 Manufacturing method of high frequency microwave circuit board base material
CN106113802A (en) * 2016-08-16 2016-11-16 中国电子科技集团公司第三十八研究所 A kind of preparation method of the microwave copper-clad plate reducing Z axis thermal coefficient of expansion

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050121226A1 (en) * 2003-10-21 2005-06-09 Park Electrochemical Corporation Laminates having a low dielectric constant, low disapation factor bond core and method of making same
CN102427666A (en) * 2011-09-25 2012-04-25 顾根山 Manufacturing method of high frequency microwave circuit board base material
CN106113802A (en) * 2016-08-16 2016-11-16 中国电子科技集团公司第三十八研究所 A kind of preparation method of the microwave copper-clad plate reducing Z axis thermal coefficient of expansion

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Application publication date: 20190426