CN102810738B - A kind of dual-band antenna and electronic equipment - Google Patents

A kind of dual-band antenna and electronic equipment Download PDF

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Publication number
CN102810738B
CN102810738B CN201210268962.6A CN201210268962A CN102810738B CN 102810738 B CN102810738 B CN 102810738B CN 201210268962 A CN201210268962 A CN 201210268962A CN 102810738 B CN102810738 B CN 102810738B
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antenna
dual
radiation
radiation arm
band antenna
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CN102810738A (en
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刘若鹏
徐冠雄
邱奇
岳艳涛
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Kuang Chi Institute of Advanced Technology
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Kuang Chi Innovative Technology Ltd
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Abstract

The invention provides a kind of dual-band antenna, this antenna comprises: a medium substrate, the first day linear oscillator being arranged at medium substrate surface symmetrically and the second antenna oscillator, a distributing point and an earth point; First day linear oscillator comprises banded radiation arm, is bent to two radiation branches of described radiation arm both sides, and radiation arm is connected by some buss with two radiation branches; Present invention also offers a kind of electronic equipment of this dual-band antenna of application.Dual-band antenna of the present invention realizes antenna by simple structural design and has two working frequency range, achieve the wireless receiving and dispatching to two frequency range electromagnetic signals, and there is higher gain, the low loss dielectric substrate be combined, the loss of dual-band antenna can be reduced further, improve its gain, make antenna have good wireless signal transmitting-receiving effect, the electronic equipment applying this antenna realizes good wireless information interaction.

Description

A kind of dual-band antenna and electronic equipment
Technical field
The invention belongs to communication equipment field, be specifically related to the dual-band antenna of the communications such as a kind of Wi-Fi of can be used for or bluetooth and use the electronic equipment of this antenna.
Background technology
Wi-Fi is the technology that the terminals such as PC, handheld device (as PDA, mobile phone) can wirelessly be connected to each other by one.Wi-Fi applies more and more extensive on the equipment of communication field, as wireless smart devices, wireless router and family digital Set Top Box etc.Wi-Fi has larger coverage and the transmission rate of Geng Gao, and therefore Wi-Fi equipment becomes the fashion of current mobile communication industry.
The present especially Wireless Mobile Internet high speed development based on IEEE 802.11 agreement, Wireless Mobile Internet equipment, system and subsystem propose the higher technical parameter requirement such as (yield value, standing wave and multiple antennas isolation parameter) to antenna device, and antenna also becomes restriction line mobile internet device, system and the unified important technology bottleneck of subsystem.Therefore the antenna of the improvement being provided for radio-based electronic devices, antenna system and and application is needed.
Further, dual band antenna solutions needs the inside structure considering existing equipment, therefore require while electronic device mechanism design substantially remaining unchanged, to be located among apparatus casing in antenna, under the condition not changing antenna and motherboard layout, achieve antenna forward radiation improve the technical problem that antenna gain faces as far as possible.
Summary of the invention
In order to solve problems of the prior art, the present invention designs antenna structure by the confined space in the electronic device, realizes the built-in of antenna, and produces the effect that radiation efficiency is high, match, to achieve these goals, the present invention is by the following technical solutions:
A kind of dual-band antenna, described antenna comprises: a medium substrate, the first day linear oscillator being arranged at described medium substrate surface symmetrically and the second antenna oscillator, a distributing point and an earth point; Described first day linear oscillator and described second antenna oscillator comprise banded radiation arm respectively, are bent to two radiation branches of described radiation arm both sides, described radiation arm is connected by some buss with described two radiation branches, wherein, described two radiation branches are distributed in the both sides of described radiation arm symmetrically, and symmetrical center line is the longitudinal centre line of described radiation arm.
Further, described radiation branch is parallel with described radiation arm.
Further, described bus is two.
Further, described bus is vertical with described Department of Radiation is arranged.
Further, the width of described radiation arm is 2 ~ 5 times of described radiation branch.
Further, described two radiation branches are symmetrical about the center line of described radiation arm.
Further, described two radiation branches are arranged in having the curve of width, straight line or broken line on the surface at described medium substrate.
Further, described first day linear oscillator and described second antenna oscillator material are metal material or electrically conductive ink.
Further, relative end distributing point and the earth point each other of described first day linear oscillator and described second antenna oscillator.
Described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprises the compound with described epoxy resin generation cross-linking reaction.
A kind of electronic equipment, comprises circuit board, also comprises the above-mentioned dual-band antenna be electrically connected with described circuit board.
Dual-band antenna of the present invention realizes antenna by simple structural design and has two working frequency range, achieve the wireless receiving and dispatching to two frequency range electromagnetic signals, and there is higher gain, the low loss dielectric substrate be combined, the loss of dual-band antenna can be reduced further, improve its gain, make antenna have good wireless signal transmitting-receiving effect, the electronic equipment applying this antenna realizes good wireless information interaction.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of execution mode of dual-band antenna of the present invention;
Fig. 2 is the S11 simulation curve figure of Fig. 1 dual-band antenna;
Fig. 3 is the voltage standing wave ratio curve chart of Fig. 1 dual-band antenna;
Fig. 4 is the Smith chart of Fig. 1 dual-band antenna.
Embodiment
Now in detail with reference to the embodiment described in accompanying drawing.In order to complete understanding the present invention, refer to numerous detail in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can realize without the need to these details.In other embodiments, be not described in detail known method, process, assembly and circuit, in order to avoid unnecessarily make embodiment fuzzy.
See the structural representation being respectively a kind of execution mode of dual-band antenna of the present invention shown in Fig. 1 and Fig. 2, figure bend part represents metal level, this dual-band antenna comprises medium substrate 1, first day linear oscillator 2, second antenna oscillator 3, distributing point 4 and earth point 5, first day linear oscillator 2 and the second antenna oscillator 3 are arranged on one of medium substrate 1 on the surface, first day linear oscillator 2 and the second antenna oscillator 3 are about medium substrate 1 cross central line symmetry, therefore first day linear oscillator 2 and the second antenna oscillator 3 shape, equal and opposite in direction, therefore only the structure of first day linear oscillator 2 is described further.First day linear oscillator 2 comprises radiation arm 21, two radiation branch 22,23 and two bus 24,25, radiation arm 21 is in banded, two radiation branches 22,23 are in the linearity with one fixed width, and two radiation branches 22,23 are parallel with radiation arm 21, through bending the symmetrical both sides being distributed in radiation arm 21, symmetrical center line is the longitudinal centre line of radiation arm 21; Bus 24,25 parallel settings, all vertically connect radiation branch 22, radiation arm 21 and radiation branch 23; Distributing point 4 and earth point 5 are separately positioned on the relative end of first day linear oscillator 2 and the second antenna oscillator 3, for the input and output of signal.
The material of first day linear oscillator and the second antenna oscillator is metal or electrically conductive ink, metal material can adopt gold, silver, copper, aluminium or iron etc., consider for cost and effect etc., copper can be selected as the material of first day linear oscillator and the second antenna oscillator.
In other embodiments, two radiation branches in curve, the form such as straight line or broken line with width, can also can change the electromagnetic response frequency range of antenna oscillator on the surface at medium substrate.
The width of radiation arm is greater than the width of radiation branch, can make a choice between 2 ~ 5, increase that also can be suitable or reduce the stand out distance of radiation arm and radiation branch.
The number of bus can change the transmission path of the signal of telecommunication in antenna oscillator, changes the radiation pattern of antenna oscillator, employs two buss among present embodiment, in other embodiments can choice for use one or three or more.
Symmetrical due to first day linear oscillator and the second antenna oscillator, the connection corresponding contact point that distributing point and earth point can exchange, and the overall performance of antenna can not be had influence on.
Shown in Fig. 1, ab section is the radiation arm of first day linear oscillator 2, acf section and agj section are radiation branch, hd section and ie section are bus, the effect length antenna low-frequency range of radiation arm and radiation branch, cf section and gj section affect the high band of antenna, and it is particularly evident that ef section and ij section affect high band, regulate hd section and the position of ie section in ab section to improve HFS, improve the gain of wherein part frequency.
Medium substrate 1 component comprises glass-fiber-fabric, epoxy resin and the compound with this epoxy resin generation cross-linking reaction, below by way of embodiment, this medium substrate is described.
First kind execution mode is as follows:
In such execution mode, for the production of the infiltration solution of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate) in processing the present invention.Described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.Wherein the first component and the second component configure mixing according to a certain percentage.Above-mentioned first component, the second component and one or more solvents described are made into described infiltration solution.Described infiltration solution after stirring, a described glass-fiber-fabric are infiltrated in described infiltration solution the first component and the second component are adsorbed in glass-fiber-fabric or on the surface; Then baking is copied described glass-fiber-fabric and is made one or more solvent evaporates described, and makes the first component and the mutual chemical combination of the second component be cross-linked to form semi-solid preparation thing or solidfied material.Semi-solid preparation thing refers to be copied in the relatively low environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the soft mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.Solidfied material refers to be copied in the relatively high environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the relatively hard mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.
In the present embodiment, the described glass-fiber-fabric infiltrated forms semi-solid preparation thing (in the form of sheets) by low-temperature bake, then described semi-solid preparation thing is cut into and cuts out sheet, needs described multi-disc to cut out sheet superimposed and carry out the multilayer dielectric substrate (i.e. multilayer laminate or sheet) that is hot pressed into described in this enforcement according to thickness.Wherein hot pressing process object makes the first component comprise epoxy resin and chemical combination cross-linking reaction all occurs the second component inclusion compound exactly.
Can certainly understand, the described glass-fiber-fabric infiltrated directly forms solidfied material by high-temperature baking, i.e. single-layer medium substrate of the present invention (i.e. individual layer laminated sheet or sheet).
In the particular embodiment, the compound of described second component can select the copolymer comprised by polarity macromolecule and non-polar high polymer chemical combination, as styrene maleic anhydride copolymer.Be understandable that, can all can be used for the Formulation Ingredients of present embodiment with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6,8 styrene or any number in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, described epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing, thus be namely infiltration solution of the present invention after making the epoxy resin in described solution and styrene maleic anhydride copolymer Homogeneous phase mixing.
In the particular embodiment, impelling gel (selecting gel ambient temperature 171 DEG C) in above-mentioned infiltration solution 200-400 second by adding certain promoter, wherein promoting that about 260 seconds above-mentioned infiltration solution gelatinizing time (as 258-260 second or 250-270 second etc.) effect is better.Described promoter can be selected and be included but not limited to tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
One or more solvents described can select the mixed solvent including but not limited in acetone, butanone, DMF, EGME, toluene be mixed to form between any one or above-mentioned two or more solvent.
In another embodiment, described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of described second component selects styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.Wherein said cyanate performed polymer concentration 75%.Promoter selects methylimidazole; Butanone selected by described solvent.This execution mode infiltrates solution and specifically fills a prescription as following table:
In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, all can there is chemical combination cross-linking reaction with epoxy resin in both simultaneously.
Equations of The Second Kind execution mode is as follows:
In Equations of The Second Kind execution mode of the present invention, the composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier part or similar application part etc.) in production the present invention, described composition comprises glass-fiber-fabric, the first component and the second component, and the first component comprises epoxy resin; Second component comprises the compound with described epoxy resin generation cross-linking reaction.Wherein said composition, at 1GHz operation at frequencies, has≤nominal dielectric constant of 4.0 and the electrical loss tangent amount of≤0.01.Wherein in present embodiment, described composition, at 1GHz operation at frequencies, has≤electrical loss tangent the amount of 0.005.
Described composition fabrication processes also comprises following technique:
First, the second component is comprised compound that crosslinked reaction occurs with described epoxy resin and described epoxy resin is prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.In the particular embodiment, described compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and the copolymer of wherein preferred embodiment can select styrene maleic anhydride copolymer.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6 or 8 styrene in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, make the epoxy resin in described solution and styrene maleic anhydride copolymer can carry out chemical combination cross-linking reaction under certain condition, depend on described glass-fiber-fabric after there is chemical combination cross-linking reaction, thus form medium substrate of the present invention.
One or more solvents described can select to include but not limited in acetone, butanone, DMF, EGME, toluene any one or above-mentioned between mixed solvent.
The various component ratio of described solution one specific embodiment is as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, both are all cross-linked with epoxy resin energy chemical combination simultaneously.
Then, from above-mentioned solution, extracting described a small amount of test sample book, the solution gelatinizing time described in a certain specified temp environmental testing, regulating described solution at this fixed temperature environment gel time by adding promoter.The gel within 200-400 time second of above-mentioned solution can be impelled by adding one or more promoter, wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures, in present embodiment, carrying out gel time by being set in 171 degrees Celsius of environment, making above-mentioned solution better in gel time about 260 seconds (as 258-260 second or 250-270 second etc.) effect.Described promoter can be selected and be included but not limited to select tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
3rd step, when above-mentioned test sample book during gel, takes out oven dry after being infiltrated by glass-fiber-fabric in described solution in 200-400 time range second, forms composition.In these concrete steps, glass-fiber-fabric to be immersed in solution fully to infiltrate and ensure that described epoxy resin and styrene maleic anhydride copolymer to be adsorbed in glass-fiber-fabric or on the surface, then the glass cloth of solution is immersed by hanging on air dry oven 180 DEG C of bakings about 5 minutes, solvent butanone fully volatilizees by object exactly, and make described epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, the product of glass cloth and described chemical combination cross-linking reaction obtains semi-solid preparation composition.Be understandable that, extend baking time and or improve baking temperature, can hardening composition be formed.General a large amount of industrial production adopts in vertical gluing machine and completes in impregnation subsystem and baking oven subsystem.
Finally, the change composition of oven dry and conductive foil are carried out pressing.In these concrete steps, by change composition (prepreg or prepreg) and conductive foil pressing in vacuum hotpressing machine of drying.Described conductive foil is selected and is comprised the obtained electric conducting material such as copper, silver, gold, aluminium or above-mentioned material alloy material.Because the price of copper product is relatively low, the conductive foil be made of copper therefore is selected to be suitable for industrialization.
Simultaneously in order to applicable antenna system or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination and form multilayer laminate.Apply these laminated sheets and can effectively reduce antenna recombination loss, and then ensure aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer laminate be processed into antenna substrate, pcb board, copper-clad base plate, chip carrier part or similar application part, reduced dielectric constant and the dielectric loss of above-mentioned product (antenna substrate, pcb board, copper-clad base plate, chip carrier part or similar application part, single or multiple lift press presser blade) by the form introducing polarity and non-polar high polymer copolymer, thus meet its demand applied in the electronic device.
Again as shown in Figure 1, ab segment length 23mm in first day linear oscillator 2, wide 8mm, ij segment length 3.4mm, be S11 simulation curve figure, voltage standing wave ratio figure and the Smith chart of dual-band antenna shown in Fig. 1 as shown in Figure 2, Figure 3 and Figure 4, wherein S11 simulation curve figure choose specific frequency mark as following table:
Frequency/GHz Loss/dB
2.4 -17.743
2.44 -18.287
2.48 -17.288
4.9 -9.3779
5.3 -16.18
5.725 -14.924
5.75 -14.126
5.85 -11.466
Voltage standing wave ratio curve chart is chosen specific frequency mark as following table:
Frequency/GHz VSWR
2.4 1.29
2.44 1.24
2.48 1.26
4.9 2.24
5.3 1.61
5.725 1.31
5.75 1.33
5.85 1.47
In conjunction with the Smith chart shown in above table and Fig. 4, the return loss of this electronic equipment under 2.4-2.48GHz and 4.9-5.85GHz two electromagnetic wave band is less, voltage standing wave ratio is many between 1.2-1.6, embodies antenna under above-mentioned electromagnetic wave band, has less return loss and good matching effect.
Dual-band antenna of the present invention can directly be electrically connected with the circuit board of electronic equipment, wifi communication module or bluetooth communication etc. can be set on circuit boards, meet the corresponding communicating requirement of electronic equipment, in the present invention, electronic equipment includes, but are not limited to PDA, mobile phone, notebook, TV etc.
By reference to the accompanying drawings preferred embodiment of the present invention is described above; but the present invention is not limited to above-mentioned embodiment; those of ordinary skill in the art is under enlightenment of the present invention; to make under the ambit that present inventive concept and claim protect, all within protection of the present invention not departing from.

Claims (6)

1. a dual-band antenna, is characterized in that, described antenna comprises: a medium substrate, the first day linear oscillator being arranged at described medium substrate surface symmetrically and the second antenna oscillator, a distributing point and an earth point; Described first day linear oscillator and described second antenna oscillator comprise banded radiation arm respectively, are bent to two radiation branches of described radiation arm both sides, and described radiation arm is connected by two buss with described two radiation branches,
Wherein, described two radiation branches are parallel with described radiation arm, and described two buss are vertical with described radiation arm arranges;
Described two radiation branches are distributed in the both sides of described radiation arm symmetrically, and symmetrical center line is the longitudinal centre line of described radiation arm;
The end of the radiation arm of described first day linear oscillator and described second antenna oscillator toward each other, and distributing point and earth point each other.
2. dual-band antenna according to claim 1, is characterized in that, the width of described radiation arm is 2 ~ 5 times of described radiation branch.
3. dual-band antenna according to claim 1, is characterized in that, described two radiation branches are arranged in having the curve of width, straight line or broken line on the surface at described medium substrate.
4. dual-band antenna according to claim 1, is characterized in that, described first day linear oscillator and described second antenna oscillator material are metal material or electrically conductive ink.
5. dual-band antenna according to claim 1, is characterized in that, described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprises the compound with described epoxy resin generation cross-linking reaction.
6. an electronic equipment, comprises circuit board, it is characterized in that, also comprises the dual-band antenna as described in any one of claim 1-5 be electrically connected with described circuit board.
CN201210268962.6A 2012-07-31 2012-07-31 A kind of dual-band antenna and electronic equipment Active CN102810738B (en)

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CN103633427B (en) * 2012-12-28 2015-02-04 中国科学院电子学研究所 Broadband antenna based on planar resistor technology
WO2015085593A1 (en) * 2013-12-13 2015-06-18 华为终端有限公司 Communication terminal and antenna system thereof
CN105869372B (en) * 2016-04-22 2019-03-15 青海齐鑫地质矿产勘查股份有限公司 A kind of underground mineral products detector with video acquisition unit
JP6946455B2 (en) * 2017-04-05 2021-10-06 ライテン・インコーポレイテッドLyten, Inc. Antenna with frequency selectivity element

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