CN102810738A - Dual-band antenna and electronic equipment - Google Patents
Dual-band antenna and electronic equipment Download PDFInfo
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- CN102810738A CN102810738A CN2012102689626A CN201210268962A CN102810738A CN 102810738 A CN102810738 A CN 102810738A CN 2012102689626 A CN2012102689626 A CN 2012102689626A CN 201210268962 A CN201210268962 A CN 201210268962A CN 102810738 A CN102810738 A CN 102810738A
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Abstract
The invention provides a dual-band antenna comprising a medium substrate, a fist antenna element and a second antenna element which are symmetrically arranged on the surface of the medium substrate, a feeding point and a ground point. The fist antenna element comprises a belt-shaped radial arm, and two radial branches which are bent to the two sides of the radial arm. The radial arm and the two radial branches are connected through a plurality of conductive bars. The invention further provides a set of electronic equipment which uses the dual-band antenna. The dual-band antenna provided by the invention has the advantages that two work frequency bands are realized through a simple structure design, the wireless transceiver of the electromagnetic signals of the two frequency bands is realized, the gain is high, further the loss of the dual-band antenna is reduced by combining the used low-loss medium substrate and the gain is improved, so that the antenna has a good wireless signal transceiver effect. The electronic equipment which uses the dual-band antenna realizes good wireless information interaction.
Description
Technical field
The invention belongs to communication equipment field, be specifically related to the dual-band antenna of communications such as a kind of Wi-Fi of can be used for or bluetooth and use the electronic equipment of this antenna.
Background technology
Wi-Fi be a kind of can be with PC, handheld device terminals such as (like PDA, mobile phones) with the interconnected technology of wireless mode.Wi-Fi uses more and more widely on the equipment of communication field, like intelligent wireless equipment, wireless router and family digital STB etc.Wi-Fi has bigger coverage and the transmission rate of Geng Gao, so Wi-Fi equipment becomes the fashion of present mobile communication industry.
Present especially wireless mobile Internet high speed development based on the IEEE802.11 agreement; Wireless mobile internet device, system and subsystem propose higher technical parameter (parameters such as yield value, standing wave and many isolation between antennas) requirement to antenna device, and antenna also becomes restriction line mobile internet device, system and the unified important technology bottleneck of subsystem.Therefore need be provided for improved antenna, antenna system and and the application of radio-based electronic devices.
Further; The dual-band antenna scheme need be considered the inside structure of existing equipment; Therefore require in the electronic device mechanism design basically in the remaining unchanged; With being located in the antenna among the apparatus casing, under the condition that does not change antenna and motherboard layout, realized antenna forward radiation and improve the technical problem that antenna gain faces as far as possible.
Summary of the invention
In order to solve the problem that exists in the prior art; The present invention realizes the built-in of antenna through in the confined space in electronic equipment antenna structure being designed, and produces the effect that radiation efficiency is high, match; To achieve these goals, the present invention adopts following technical scheme:
A kind of dual-band antenna, said antenna comprises: a medium substrate, be arranged at first antenna oscillator and second antenna oscillator, a distributing point and an earth point on said medium substrate surface symmetrically; Said first antenna oscillator comprises banded radiation arm, is bent to two radiation branches of said radiation arm both sides, and said radiation arm is connected through some buss with said two radiation branches.
Further, said radiation branch is parallel with said radiation arm.
Further, said bus is two.
Further, said bus is provided with said Department of Radiation is vertical.
Further, the width of said radiation arm is 2～5 times of said radiation branch.
Further, said two radiation branches are about the center line symmetry of said radiation arm.
Further, said two radiation branches are curve, straight line or the broken line setting with width on said medium substrate surface.
Further, said first antenna oscillator and the said second antenna oscillator material are metal material or electrically conductive ink.
Further, the relative end of said first antenna oscillator and said second antenna oscillator distributing point and earth point each other.
Said medium substrate component comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
A kind of electronic equipment comprises circuit board, also comprises the above-mentioned dual-band antenna that is electrically connected with said circuit board.
Dual-band antenna of the present invention realizes that through simple structural design antenna has two working frequency range; Realized wireless receiving and dispatching, and had higher gain, the low loss dielectric substrate that is used in combination two frequency range electromagnetic signals; Can further reduce the loss of dual-band antenna; Improve its gain, make antenna have good wireless signal transmitting and receiving effect, use the electronic equipment of this antenna and realize the good wireless information interaction.
Description of drawings
Fig. 1 is the structural representation of a kind of execution mode of dual-band antenna of the present invention;
Fig. 2 is the S11 simulation curve figure of Fig. 1 dual-band antenna;
Fig. 3 is the voltage standing wave ratio curve chart of Fig. 1 dual-band antenna;
Fig. 4 is the Smith chart of Fig. 1 dual-band antenna.
Embodiment
Now in detail with reference to the embodiment that describes in the accompanying drawing.For complete understanding the present invention, numerous details in following detailed description, have been mentioned.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method, process, assembly and circuit, in order to avoid unnecessarily make embodiment fuzzy.
Referring to the structural representation that is respectively a kind of execution mode of dual-band antenna of the present invention illustrated in figures 1 and 2; The figure bend is partly represented metal level; This dual-band antenna comprises medium substrate 1, first antenna oscillator 2, second antenna oscillator 3, distributing point 4 and earth point 5; First antenna oscillator 2 and second antenna oscillator 3 are arranged on the surface of medium substrate 1; First antenna oscillator 2 and second antenna oscillator 3 are about medium substrate 1 cross central line symmetry, and therefore therefore first antenna oscillator 2 and second antenna oscillator, 3 shapes, equal and opposite in direction only do further describing to the structure of first antenna oscillator 2.First antenna oscillator 2 comprises a radiation arm 21, two radiation branches 22,23 and two buss 24,25; It is banded that radiation arm 21 is; Two radiation branches 22,23 are the linearity with certain width; And two radiation branches 22,23 are parallel with radiation arm 21, and through the both sides that are distributed in radiation arm 21 of bending symmetry, symmetrical center line is the longitudinal centre line of radiation arm 21; The setting that bus 24,25 is parallel all vertically connects radiation branch 22, radiation arm 21 and radiation branch 23; Distributing point 4 and earth point 5 are separately positioned on the relative end of first antenna oscillator 2 and second antenna oscillator 3, are used for the input and output of signal.
The material of first antenna oscillator and second antenna oscillator is metal or electrically conductive ink; Metal material can adopt gold, silver, copper, aluminium or iron etc.; Take all factors into consideration from cost and effect etc., can select the material of copper for use as first antenna oscillator and second antenna oscillator.
In other embodiments, two radiation branches can also be the forms such as curve, straight line or broken line with width on the medium substrate surface, can change the electromagnetic response frequency range of antenna oscillator.
The width of radiation arm can make a choice at 2～5 greater than the width of radiation branch, increase that also can be suitable or the stand out distance of dwindling radiation arm and radiation branch.
The number of bus can change the transmission path of the signal of telecommunication in antenna oscillator, changes the radiation pattern of antenna oscillator, among this execution mode, has used two buss, can select to use one or three or more a plurality of in other embodiments.
Because the symmetrical distribution of first antenna oscillator and second antenna oscillator, distributing point and earth point can exchange is connected the corresponding contact point, and can not have influence on the overall performance of antenna.
Shown in Fig. 1, the ab section is the radiation arm of first antenna oscillator 2, and acf section and agj section are the radiation branch; Hd section and ie section are bus; The effect length antenna low-frequency range of radiation arm and radiation branch, cf section and gj section influence the high band of antenna, and it is particularly evident that ef section and ij section influence high band; Regulate hd section and the position of ie section on the ab section and can improve HFS, improve the gain of center part-frequency point.
Medium substrate 1 component comprise glass cloth, epoxy resin and with the compound of this epoxy resin generation cross-linking reaction, below through this medium substrate of embodiment explanation.
First kind execution mode is following:
In such execution mode, be used for the infiltration solution of some low dielectric constant and low loss of production and processing the present invention's medium substrate (comprising single or multiple lift lamination plate).Said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.Wherein first component and second component dispose mixing according to a certain percentage.Above-mentioned first component, second component and said one or more solvents are made into said infiltration solution.Said infiltration solution is through stirring the back, will a said glass cloth soaking into first component and second component are adsorbed in the glass cloth perhaps on the surface; Baking is copied said glass cloth and is made said one or more solvent evaporates then, and makes first component and the mutual chemical combination of second component be cross-linked to form semi-solid preparation thing or solidfied material.The semi-solid preparation thing is meant to be copied the glass cloth of absorption first component and second component in the relatively low environment of temperature in baking, and first component comprises the soft mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Solidfied material be meant with the glass cloth of absorption first component and second component baking copy temperature relatively than high ambient in, first component comprises the relative harder mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.
In this execution mode; The glass cloth of said infiltration forms semi-solid preparation thing (in the form of sheets) through low-temperature bake; Said then semi-solid preparation thing is cut into cuts out sheet, and it is superimposed and be hot pressed into this and implement described multilayer dielectricity substrate (being multilayer layer pressing plate or sheet) according to the thickness needs said multi-disc to be cut out sheet.Wherein the hot pressing process purpose makes the component of winning comprise epoxy resin and the chemical combination cross-linking reaction all takes place the second component inclusion compound exactly.
Can certainly understand, the glass cloth of said infiltration directly forms solidfied material, single-layer medium substrate promptly of the present invention (being individual layer laminated sheet or sheet) through high-temperature baking.
In concrete embodiment, the compound of said second component can be selected the copolymer that comprises by polarity macromolecule and non-polar high polymer chemical combination for use, like styrene maleic anhydride copolymer.It is understandable that, can all can be used for the prescription composition of this execution mode with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6,8 styrene or any number in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, said epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process; Like common agitator and agitated reactor epoxy resin is evenly mixed with styrene maleic anhydride copolymer, thus make in the said solution epoxy resin with promptly be infiltration solution according to the invention after styrene maleic anhydride copolymer evenly mixes.
In concrete embodiment; Impel above-mentioned infiltration solution 200-400 gel in second (selecting 171 ℃ of gel ambient temperatures for use) through adding certain promoter, promote wherein about the above-mentioned 260 seconds infiltration solution gelatinizing time that (like 258-260 second or 250-270 second etc.) effect is better.Said promoter can be selected for use and included but not limited to tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, mix the mixed solvent that forms in dinethylformamide, EGME, the toluene between any one or the above-mentioned two or more solvent.
In another embodiment, said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of said second component selects for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.Wherein said cyanate performed polymer concentration 75%.Promoter is selected methylimidazole for use; Said solvent is selected butanone for use.This execution mode soaks into solution specifically fills a prescription like following table:
In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, the chemical combination cross-linking reaction all can take place with epoxy resin in both.
Second type of execution mode is following:
In second type of execution mode of the present invention; The composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate among production the present invention (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.); Said composition comprises glass cloth, first component and second component, and first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction.Wherein said composition is worked under the 1GHz frequency, has≤4.0 nominal dielectric constant and≤0.01 electrical loss tangent amount.Wherein in this execution mode, said composition is worked under the 1GHz frequency, has≤0.005 electrical loss tangent amount.
Said composition fabrication processes also comprises following technology:
At first, second component is comprised the compound and the said epoxy resin that crosslinked reaction take place with said epoxy resin prepare, add the certain amount of solvent wiring solution-forming then according to the ratio of sense value.In concrete embodiment, said compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and wherein the copolymer of preferred embodiment can be selected styrene maleic anhydride copolymer for use.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, and like common agitator and agitated reactor epoxy resin are evenly mixed with styrene maleic anhydride copolymer.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6 or 8 styrene in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, make epoxy resin and styrene maleic anhydride copolymer in the said solution can carry out the chemical combination cross-linking reaction under certain condition, take place to depend on said glass cloth after the chemical combination cross-linking reaction, thereby form medium substrate of the present invention.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, in dinethylformamide, EGME, the toluene any one or above-mentioned between mixed solvent.
Said various component ratios of solution one specific embodiment such as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, both are all crosslinked with epoxy resin ability chemical combination.
Then, from above-mentioned solution, extract said a small amount of test sample book,, regulate said solution at this fixed temperature environment gel time through adding promoter in a certain specified temp environmental testing said solution gelatinizing time.Can impel above-mentioned solution in 200-400 gel in time second through adding one or more promoter; Wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures; At this execution mode; Carry out gel time through being set in 171 degrees centigrade of environment, make above-mentioned solution preferable in gel time about 260 seconds (like 258-260 second or 250-270 second etc.) effect.Said promoter can be selected for use and included but not limited to select for use tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
The 3rd step is when above-mentioned test sample book during gel, is soaked into the back with glass cloth and taken out oven dry in 200-400 time range second, the formation composition in said solution.In these concrete steps; Glass cloth immersed fully to soak in the solution guarantee that said epoxy resin and styrene maleic anhydride copolymer are adsorbed in the glass cloth perhaps on the surface; The glass cloth that immerses solution then is through hanging on air dry oven 180 ℃ of bakings about 5 minutes; Purpose is fully volatilized the solvent butanone exactly, and makes said epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, and the product of glass cloth and said chemical combination cross-linking reaction makes the semi-solid preparation composition.It is understandable that, prolong stoving time with or improve baking temperature, can form hardening composition.General a large amount of commercial production adopts in the vertical gluing machine and accomplishes in the impregnation subsystem and baking oven subsystem.
At last, change composition and the conductive foil with oven dry carries out pressing.In these concrete steps, with change composition (prepreg or prepreg) and conductive foil pressing in the vacuum hotpressing machine of oven dry.Said conductive foil is selected for use and is comprised the electric conducting material that copper, silver, gold, aluminium or above-mentioned material alloy material etc. make.Because the price of copper product is relatively low, the conductive foil of therefore selecting for use copper to become is suitable for industrialization.
In order to be suitable for antenna system or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination formation multilayer layer pressing plate simultaneously.Use these laminated sheets and can effectively reduce the antenna recombination loss, and then guarantee the aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer layer pressing plate to be processed into antenna substrate, pcb board, copper-clad base plate, chip carrier spare or similar application part; Reduce the dielectric constant and the dielectric loss of above-mentioned product (antenna substrate, pcb board, copper-clad base plate, chip carrier spare or similar application part, single or multiple lift are pressed presser blade) through the form of introducing polarity and non-polar high polymer copolymer, thereby satisfy its demands of applications in electronic equipment.
As shown in Figure 1 again; Ab segment length 23mm in first antenna oscillator 2, wide 8mm, ij segment length 3.4mm; As Fig. 2, Fig. 3 and shown in Figure 4 be S11 simulation curve figure, voltage standing wave ratio figure and the Smith chart of dual-band antenna shown in Figure 1, wherein choose specific frequency mark on the S11 simulation curve figure like following table:
| Frequency/GHz | Loss/dB |
| 2.4 | -17.743 |
| 2.44 | -18.287 |
| 2.48 | -17.288 |
| 4.9 | -9.3779 |
| 5.3 | -16.18 |
| 5.725 | -14.924 |
| 5.75 | -14.126 |
| 5.85 | -11.466 |
Choosing specific frequency on the voltage standing wave ratio curve chart marks like following table:
| Frequency/GHz | VSWR |
| 2.4 | 1.29 |
| 2.44 | 1.24 |
| 2.48 | 1.26 |
| 4.9 | 2.24 |
| 5.3 | 1.61 |
| 5.725 | 1.31 |
| 5.75 | 1.33 |
| 5.85 | 1.47 |
In conjunction with above table and Smith chart shown in Figure 4; The return loss of this electronic equipment under 2.4-2.48GHz and 4.9-5.85GHz two electromagnetic wave bands is less; Voltage standing wave ratio is many between 1.2-1.6, has embodied antenna and under above-mentioned electromagnetic wave band, has had less return loss and good matching effect.
Dual-band antenna of the present invention can directly be electrically connected with the circuit board of electronic equipment; On circuit board, wifi communication module or bluetooth communication etc. can be set; Satisfy the requirement of electronic equipment corresponding communication, electronic equipment includes, but are not limited to PDA, mobile phone, notebook, TV etc. among the present invention.
Combine accompanying drawing that preferred embodiment of the present invention is described above; But the present invention is not limited to above-mentioned embodiment; Those of ordinary skill in the art is under enlightenment of the present invention; Make under the scope situation that aim of the present invention and claim protect not breaking away from, all within protection of the present invention.
Claims (11)
1. a dual-band antenna is characterized in that, said antenna comprises: a medium substrate, be arranged at first antenna oscillator and second antenna oscillator, a distributing point and an earth point on said medium substrate surface symmetrically; Said first antenna oscillator comprises banded radiation arm, is bent to two radiation branches of said radiation arm both sides, and said radiation arm is connected through some buss with said two radiation branches.
2. dual-band antenna according to claim 1 is characterized in that, said radiation branch is parallel with said radiation arm.
3. dual-band antenna according to claim 1 is characterized in that, said bus is two.
4. according to claim 1 or 2 or 3 described dual-band antennas, it is characterized in that said bus is provided with said Department of Radiation is vertical.
5. dual-band antenna according to claim 1 and 2 is characterized in that, the width of said radiation arm is 2～5 times of said radiation branch.
6. dual-band antenna according to claim 1 is characterized in that, said two radiation branches are about the center line symmetry of said radiation arm.
7. according to claim 1 or 6 described dual-band antennas, it is characterized in that said two radiation branches are curve, straight line or the broken line setting with width on said medium substrate surface.
8. dual-band antenna according to claim 1 is characterized in that, said first antenna oscillator and the said second antenna oscillator material are metal material or electrically conductive ink.
9. dual-band antenna according to claim 1 is characterized in that, the relative end of said first antenna oscillator and said second antenna oscillator is distributing point and earth point each other.
10. dual-band antenna according to claim 1 is characterized in that, said medium substrate component comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
11. an electronic equipment comprises circuit board, it is characterized in that, also comprises the described dual-band antenna of the claim 1-10 that is electrically connected with said circuit board.
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| CN103633427A (en) * | 2012-12-28 | 2014-03-12 | 中国科学院电子学研究所 | Broadband antenna based on planar resistor technology |
| WO2015085593A1 (en) * | 2013-12-13 | 2015-06-18 | 华为终端有限公司 | Communication terminal and antenna system thereof |
| CN105869372A (en) * | 2016-04-22 | 2016-08-17 | 周丹 | Underground mineral product detector with video acquisition unit |
| CN110546814A (en) * | 2017-04-05 | 2019-12-06 | 利腾股份有限公司 | Antenna with frequency selective element |
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Effective date of registration: 20210412 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 18B, building a, CIC international business center, 1061 Xiangmei Road, Futian District, Shenzhen, Guangdong 518034 Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |
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