CN102694251B - A kind of CMMB antenna and Mobile multi-media broadcasting device - Google Patents
A kind of CMMB antenna and Mobile multi-media broadcasting device Download PDFInfo
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- CN102694251B CN102694251B CN201210143184.8A CN201210143184A CN102694251B CN 102694251 B CN102694251 B CN 102694251B CN 201210143184 A CN201210143184 A CN 201210143184A CN 102694251 B CN102694251 B CN 102694251B
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Abstract
The invention provides a kind of CMMB antenna, this CMMB antenna comprises radiating element, this radiating element comprises medium substrate, overlay on the first copper clad layers on medium substrate and the second copper clad layers respectively, be positioned at the copper strips of medium substrate, and be positioned at medium substrate edge and be distributed in some plated-through holes of copper strips both sides, first copper clad layers is provided with some microflutes, copper strips one end arranges the feeding interface running through described medium substrate, first copper clad layers and the second copper clad layers are electrically connected by plated-through hole, present invention also offers a kind of Multimedia Mobile broadcaster of this CMMB antenna of application.Namely CMMB antenna of the present invention meets the performance requirement of CMMB antenna by simple structural design, the low-loss antenna medium base material be combined, effect when CMMB antenna is built in Mobile multi-media broadcasting device is substantially identical with existing external CMMB antenna effect.
Description
Technical field
The invention belongs to communication equipment field, be specifically related to a kind of CMMB antenna and apply the Mobile multi-media broadcasting device of this antenna.
Background technology
Along with the development of wireless communication technique, wireless telecommunications system has had more and more higher requirement, in order to meet the requirement of communication, existing various wireless router adopts external antenna substantially, the surplus energy that the industrial design of very big limits product and mechanism design play, and external antenna also needs the impedance-matching connectors and the mechanism's module that design adaptation, these connectors and mechanism's module almost account for the cost of whole antenna more than 90 percent.
Antenna is as the radiating element of final radiofrequency signal and receiving device, and its operating characteristic will directly affect the service behaviour of whole electronic system.The installation of antenna not only needs the shape considering antenna itself, also need the electromagnetic radiation produced during the device busy more considering antenna place, particularly the high-frequency work of central processing unit creates electromagnetic radiation, this can receive antenna and send signal and cause bad impact, antenna even can be therefore caused normally to work, therefore, in electronic system, the placement of antenna needs the expensive time to consider and checking.
CMMB antenna is positioned over outside equipment more, can receive enough signals, arranges like this and can take larger space, also the aesthetics of CMMB equipment can be had influence on, therefore, need to design a kind of antenna, put the requirement that also can meet its communication in CMMB equipment.
Summary of the invention
In order to solve Problems existing in existing CMMB antenna, the invention provides a kind of CMMB antenna, namely this antenna meets the performance requirement of CMMB antenna by simple structural design, realizes CMMB antenna built-in simultaneously, to achieve these goals, the present invention is by the following technical solutions:
A kind of CMMB antenna, comprise radiating element, described radiating element comprises: a medium substrate, the first copper clad layers overlaying on the upper and lower surface of described medium substrate respectively and the second copper clad layers, be positioned at the copper strips of described medium substrate, and is positioned at described medium substrate edge and is distributed in some plated-through holes of described copper strips both sides, described first copper clad layers is provided with two relative open annular first microflutes of opening, second microflute and connect band shape the 3rd microflute of the bottom land of described first microflute and the bottom land of described second microflute, in the plane of described first copper clad layers, described first microflute overlaps with described second microflute around the central rotation 180 ° of described 3rd microflute, described copper strips is crossing with described 3rd microflute in the projection of described first copper clad layers, described copper strips one end arranges the feeding interface running through described medium substrate, described first copper clad layers and described second copper clad layers are electrically connected by described plated-through hole.
Further, the resonance band of described radiating element is 474-794MHz.
Further, described copper strips vertically divides described 3rd microflute equally in the projection of described first copper clad layers.
Further, described first microflute both ends to described 3rd microflute distance not etc.
Further, described first microflute is positioned at the end on the left of described 3rd microflute and is less than described first microflute to the distance of described 3rd microflute and is positioned at the distance of the end on the right side of described 3rd microflute to described 3rd microflute.
Further, be provided with can the loading interfaces of contact resistance for the described copper strips other end.
Further, described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprises the compound with described epoxy resin generation cross-linking reaction.
Present invention also offers a kind of Mobile multi-media broadcasting device, comprise main frame, also comprise described CMMB antenna.
Further, described Mobile multi-media broadcasting device is vehicle-mounted CMMB terminal.
Further, described vehicle-mounted CMMB terminal is fixed on upper end, seat, and described CMMB antenna is arranged at the inner side of the close vehicle window of the head rest cover of coated described vehicle-mounted CMMB terminal.
CMMB antenna of the present invention make use of micro-band transmission principle, namely the performance requirement of CMMB antenna is met by simple structural design, existing Mobile multi-media broadcasting device can be applied to flexibly, the low-loss antenna medium base material be combined, effect when CMMB antenna is built in Mobile multi-media broadcasting device is substantially identical with existing external CMMB antenna effect.
Accompanying drawing explanation
Fig. 1 is the radiating element plan structure schematic diagram of CMMB antenna of the present invention;
Fig. 2 is that the radiating element of CMMB antenna of the present invention looks up structural representation;
Fig. 3 is the schematic diagram of radiating element copper strips on medium substrate of CMMB antenna of the present invention;
Fig. 4 is the schematic diagram of radiating element plated-through hole on medium substrate of CMMB antenna of the present invention;
Fig. 5 is the structural representation of Mobile multi-media broadcasting device of the present invention.
Embodiment
Now in detail with reference to the embodiment described in accompanying drawing.In order to complete understanding the present invention, refer to numerous detail in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can realize without the need to these details.In other embodiments, known method is not described in detail.Process, assembly and circuit, in order to avoid unnecessarily make embodiment fuzzy.
See the first copper clad layers 1 being respectively CMMB antenna 10 radiating element shown in Fig. 1-4, second copper clad layers 2, the structure of medium substrate 3 and copper strips 4 and the distribution of plated-through hole 8, the radiating element of this CMMB antenna 10 comprises the first copper clad layers 1, second copper clad layers 2, medium substrate 3, copper strips 4 and plated-through hole 8, first copper clad layers 1, second copper clad layers 2 overlays on the upper of medium substrate 3 respectively, lower surface, first copper clad layers 1 is provided with the first microflute 11, second microflute 12 and the 3rd microflute 13, first microflute 11 is the open annular that opening is relative with the second microflute 12, 3rd microflute 13 is in banded, the bottom land of connection first microflute 11 that the 3rd microflute 13 is vertical and the second microflute 12, first microflute 11 overlaps with the second microflute 12 around the central rotation 180 ° of the 3rd microflute 13, namely the first microflute 11 and the second microflute 12 are centrosymmetric about the center of the 3rd microflute 13, first microflute 11 is positioned at the end on the left of the 3rd microflute 13 and is less than the first microflute 11 to the distance of the 3rd microflute 13 and is positioned at the distance of the end on the right side of the 3rd microflute 13 to the 3rd microflute 13, copper strips 4 is positioned at medium substrate 3, and copper strips 4 vertically divides the 3rd microflute 13 equally in the projection of the first copper clad layers 1, is provided with feeding interface 6 and loading interfaces 7 at the two ends of copper strips 4, and feeding interface 6 and loading interfaces 7 run through medium substrate 3 and the second copper clad layers 2, plated-through hole 8 is provided with multiple, be positioned at medium substrate 3 edge, and the both sides being distributed in copper strips 4 of symmetry, plated-through hole 8 is evenly distributed in the surrounding of medium substrate 3, distribution in everywhere can regard one group as, can regard often group in the present embodiment as and only have a plated-through hole 8, also can arrange multiple, plated-through hole 8 is electrically connected the first copper clad layers 1 and the second copper clad layers 2.
See in Fig. 1, first copper clad layers 1 is formed open circuit with copper strips 4 by the annulus hole 14 of the first copper clad layers 1, and the feeding interface 6 of radiating element connects coaxial line, for the constrained input of the signal of telecommunication, loading interfaces 7 can increase by a resistance, changes the electromagnetic wavy manner that radiating element gives off.
During the external radiated electromagnetic wave of radiating element, the signal of telecommunication is advanced to loading interfaces 7 along copper strips 4 from feeding interface 6, and the signal of telecommunication intercouples between the first microflute 11, second microflute 12 and the 3rd microflute 13, externally gives off electromagnetic wave.
Fig. 1-4 also shows a kind of concrete execution mode of CMMB antenna of the present invention, and the radiating element of this CMMB antenna is 50 × 60mm
2the groove width of the first microflute 11, second microflute 12 and the 3rd microflute 13 is 2mm, it is 3mm that first microflute 11 is positioned at the end on the left of the 3rd microflute 13 to the distance of the 3rd microflute 13, and the corresponding distance in right side is 7mm, the width of copper strips 4 is 2mm, the resonance band of this radiating element is 474-794MHz, and present embodiment also can connect 50-150 Ω resistance in loading interfaces 7, and other embodiments can according to demand through repeatedly modulated test acquisition.
Medium substrate 3 component comprises glass-fiber-fabric, epoxy resin and the compound with this epoxy resin generation cross-linking reaction, below by way of embodiment, this medium substrate is described.
First kind execution mode is as follows:
In such execution mode, for the production of the infiltration solution of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier part or similar application part etc.) in processing the present invention.Described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.Wherein the first component and the second component configure mixing according to a certain percentage.Above-mentioned first component, the second component and one or more solvents described are made into described infiltration solution.Described infiltration solution after stirring, a described glass-fiber-fabric are infiltrated in described infiltration solution the first component and the second component are adsorbed in glass-fiber-fabric or on the surface; Then baking is copied described glass-fiber-fabric and is made one or more solvent evaporates described, and makes the first component and the mutual chemical combination of the second component be cross-linked to form semi-solid preparation thing or solidfied material.Semi-solid preparation thing refers to be copied in the relatively low environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the soft mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.Solidfied material refers to be copied in the relatively high environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the relatively hard mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.Wherein said semi-solid preparation or solidfied material, at 1GHz operation at frequencies, have≤nominal dielectric constant of 4.0 and the electrical loss tangent amount of≤0.01.
In the present embodiment, the described glass-fiber-fabric infiltrated forms semi-solid preparation thing (in the form of sheets) by low-temperature bake, then described semi-solid preparation thing is cut into and cuts out sheet, needs described multi-disc to cut out sheet superimposed and carry out the multilayer dielectric substrate (i.e. multilayer laminate or sheet) that is hot pressed into described in this enforcement according to thickness.Wherein hot pressing process object makes the first component comprise epoxy resin and chemical combination cross-linking reaction all occurs the second component inclusion compound exactly.
Can certainly understand, the described glass-fiber-fabric infiltrated directly forms solidfied material by high-temperature baking, i.e. single-layer medium substrate of the present invention (i.e. individual layer laminated sheet or sheet).
In the particular embodiment, the compound of described second component can select the copolymer comprised by polarity macromolecule and non-polar high polymer chemical combination, as styrene maleic anhydride copolymer.Be understandable that, can all can be used for the Formulation Ingredients of present embodiment with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6,8 styrene or any number in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, described epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing, thus be namely infiltration solution of the present invention after making the epoxy resin in described solution and styrene maleic anhydride copolymer Homogeneous phase mixing.
In the particular embodiment, impelling gel (selecting gel ambient temperature 171 DEG C) in above-mentioned infiltration solution 200-400 second by adding certain promoter, wherein promoting that about 260 seconds above-mentioned infiltration solution gelatinizing time (as 258-260 second or 250-270 second etc.) effect is better.Described promoter can be selected and be included but not limited to tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
One or more solvents described can select the mixed solvent including but not limited in acetone, butanone, DMF, EGME, toluene be mixed to form between any one or above-mentioned two or more solvent.
In another embodiment, described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of described second component selects styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.Wherein said cyanate performed polymer concentration 75%.Promoter selects methylimidazole; Butanone selected by described solvent.This execution mode infiltrates solution and specifically fills a prescription as following table:
In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, all can there is chemical combination cross-linking reaction with epoxy resin in both simultaneously.
Equations of The Second Kind execution mode is as follows:
In Equations of The Second Kind execution mode of the present invention, the composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier part or similar application part etc.) in production the present invention, described composition comprises glass-fiber-fabric, the first component and the second component, and the first component comprises epoxy resin; Second component comprises the compound with described epoxy resin generation cross-linking reaction.Wherein said composition, at 1GHz operation at frequencies, has≤nominal dielectric constant of 4.0 and the electrical loss tangent amount of≤0.01.Wherein in present embodiment, described composition, at 1GHz operation at frequencies, has≤electrical loss tangent the amount of 0.005.
Described composition fabrication processes also comprises following technique:
First, the second component is comprised compound that crosslinked reaction occurs with described epoxy resin and described epoxy resin is prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.In the particular embodiment, described compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and the copolymer of wherein preferred embodiment can select styrene maleic anhydride copolymer.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6 or 8 styrene in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, make the epoxy resin in described solution and styrene maleic anhydride copolymer can carry out chemical combination cross-linking reaction under certain condition, depend on described glass-fiber-fabric after there is chemical combination cross-linking reaction, thus form medium substrate of the present invention.
One or more solvents described can select to include but not limited in acetone, butanone, DMF, EGME, toluene any one or above-mentioned between mixed solvent.
The various component ratio of described solution one specific embodiment is as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, both are all cross-linked with epoxy resin energy chemical combination simultaneously.
Then, from above-mentioned solution, extracting described a small amount of test sample book, the solution gelatinizing time described in a certain specified temp environmental testing, regulating described solution at this fixed temperature environment gel time by adding promoter.The gel within 200-400 time second of above-mentioned solution can be impelled by adding one or more promoter, wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures, in present embodiment, carrying out gel time by being set in 171 degrees Celsius of environment, making above-mentioned solution better in gel time about 260 seconds (as 258-260 second or 250-270 second etc.) effect.Described promoter can be selected and be included but not limited to select tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
3rd step, when above-mentioned test sample book during gel, takes out oven dry after being infiltrated by glass-fiber-fabric in described solution in 200-400 time range second, forms composition.In these concrete steps, glass-fiber-fabric to be immersed in solution fully to infiltrate and ensure that described epoxy resin and styrene maleic anhydride copolymer to be adsorbed in glass-fiber-fabric or on the surface, then the glass cloth of solution is immersed by hanging on air dry oven 180 DEG C of bakings about 5 minutes, solvent butanone fully volatilizees by object exactly, and make described epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, the product of glass cloth and described chemical combination cross-linking reaction obtains semi-solid preparation composition.Be understandable that, extend baking time and or improve baking temperature, can hardening composition be formed.General a large amount of industrial production adopts in vertical gluing machine and completes in impregnation subsystem and baking oven subsystem.
Finally, the change composition of oven dry and conductive foil are carried out pressing.In these concrete steps, by change composition (prepreg or prepreg) and conductive foil pressing in vacuum hotpressing machine of drying.Described conductive foil is selected and is comprised the obtained electric conducting material such as copper, silver, gold, aluminium or above-mentioned material alloy material.Because the price of copper product is relatively low, the conductive foil be made of copper therefore is selected to be suitable for industrialization.
Simultaneously in order to applicable antenna system or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination and form multilayer laminate.Apply these laminated sheets and can effectively reduce antenna recombination loss, and then ensure aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer laminate be processed into antenna substrate, pcb board, copper-clad base plate, chip carrier part or similar application part, reduced dielectric constant and the dielectric loss of above-mentioned product (antenna substrate, pcb board, copper-clad base plate, chip carrier part or similar application part, single or multiple lift press presser blade) by the form introducing polarity and non-polar high polymer copolymer, thus meet its demand applied in the electronic device.
Be illustrated in figure 5 a kind of structural representation of Mobile multi-media broadcasting device, this Mobile multi-media broadcasting device is vehicle-mounted CMMB terminal 20, this CMMB terminal 20 comprises main frame (not shown), head rest cover 201, display screen 202, connecting rod 203, power line 204 and CMMB antenna 10, this vehicle-mounted CMMB terminal 20 is fixed on the upper end at seat by connecting rod 203, head rest cover 201 is coated with the main frame of vehicle-mounted CMMB terminal 20, the surrounding of CMMB antenna 10 and display screen 202, CMMB antenna 10 is placed on the inner side of the close vehicle window of head rest cover 201, so that receive and send CMMB signal.
By reference to the accompanying drawings preferred embodiment of the present invention is described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (9)
1. a CMMB antenna, comprise radiating element, it is characterized in that, described radiating element comprises: a medium substrate, the first copper clad layers overlaying on the upper and lower surface of described medium substrate respectively and the second copper clad layers, be positioned at the copper strips of described medium substrate internal layer, and is positioned at described medium substrate edge and is distributed in some plated-through holes of described copper strips both sides, described first copper clad layers is provided with two relative open annular first microflutes of opening, second microflute and connect band shape the 3rd microflute of the bottom land of described first microflute and the bottom land of described second microflute, in the plane of described first copper clad layers, described first microflute overlaps with described second microflute around the central rotation 180 ° of described 3rd microflute, described copper strips is crossing with described 3rd microflute in the projection of described first copper clad layers, described copper strips one end arranges the feeding interface running through described medium substrate, the described copper strips other end arranges the loading interfaces of contact resistance, described first copper clad layers and described second copper clad layers are electrically connected by described plated-through hole.
2. CMMB antenna according to claim 1, is characterized in that, the resonance band of described radiating element is 474-794MHz.
3. CMMB antenna according to claim 1, is characterized in that, described copper strips vertically divides described 3rd microflute equally in the projection of described first copper clad layers.
4. CMMB antenna according to claim 3, is characterized in that, the both ends of described first microflute to described 3rd microflute distance not etc.
5. CMMB antenna according to claim 1, it is characterized in that, described first microflute is positioned at the end on the left of described 3rd microflute and is less than described first microflute to the distance of described 3rd microflute and is positioned at the distance of the end on the right side of described 3rd microflute to described 3rd microflute.
6. the CMMB antenna according to any one of claim 1-5, is characterized in that, described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprises the compound with described epoxy resin generation cross-linking reaction.
7. a Mobile multi-media broadcasting device, comprises main frame, it is characterized in that, also comprises the CMMB antenna described in any one of claim 1-6.
8. Mobile multi-media broadcasting device according to claim 7, is characterized in that, described Mobile multi-media broadcasting device is vehicle-mounted CMMB terminal.
9. Mobile multi-media broadcasting device according to claim 8, is characterized in that, described vehicle-mounted CMMB terminal is fixed on upper end, seat, and described CMMB antenna is arranged at the inner side of the close vehicle window of the head rest cover of coated described vehicle-mounted CMMB terminal.
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| CN201210143184.8A CN102694251B (en) | 2012-05-10 | 2012-05-10 | A kind of CMMB antenna and Mobile multi-media broadcasting device |
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| CN201210143184.8A CN102694251B (en) | 2012-05-10 | 2012-05-10 | A kind of CMMB antenna and Mobile multi-media broadcasting device |
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| CN102694251B true CN102694251B (en) | 2015-10-07 |
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| CN1832252A (en) * | 2006-03-22 | 2006-09-13 | 北京航空航天大学 | Cross feed broad-band omnidirectional antenna |
| KR100859711B1 (en) * | 2006-12-08 | 2008-09-23 | 한국전자통신연구원 | Antenna Using Aperture Coupling Feed for RFID Sensor Tags |
| WO2010049984A1 (en) * | 2008-10-27 | 2010-05-06 | 三菱電機株式会社 | Wireless communication apparatus |
| CN101867074A (en) * | 2010-05-04 | 2010-10-20 | 华东交通大学 | Broadband filter based on defect ground plane integrated waveguide (DGW) structure |
| CN101982898A (en) * | 2010-08-24 | 2011-03-02 | 浙江大学 | Millimetre wave planar antenna and array thereof |
| CN102130379B (en) * | 2011-03-18 | 2014-07-16 | 中兴通讯股份有限公司 | Miniature microstrip antenna |
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Effective date of registration: 20201127 Address after: No.288, Changjiang West Road, Hai'an hi tech Zone (former Hai'an town), Hai'an City, Nantong City, Jiangsu Province 226600 Patentee after: Jiangsu Xuhui Electronics Co., Ltd Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |