CN211909297U

CN211909297U - PTFE high frequency circuit board for 5G signal communication

Info

Publication number: CN211909297U
Application number: CN202020952915.3U
Authority: CN
Inventors: 周得利
Original assignee: Shenzhen Synthetic Fast Electronic Technology Co ltd
Current assignee: Shenzhen Synthetic Fast Electronic Technology Co ltd
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2020-11-10
Anticipated expiration: 2030-05-29

Abstract

The utility model discloses a PTFE high frequency circuit board for 5G signal communication, including the circuit board body, the top fixedly connected with paster components and parts of circuit board body, the circuit board body includes the base plate layer, the top fixedly connected with tie coat on base plate layer, the top fixedly connected with line layer of tie coat, the top fixedly connected with insulating layer on line layer, the base plate layer adopts the polytetrafluoroethylene material to make. The utility model discloses a cooperation of circuit board body, paster components and parts, base plate layer, tie coat, circuit layer and insulating layer is used, and this circuit board can reduce cost, realizes electronic equipment small-size lightweight, high reliability, and polytetrafluoroethylene's dielectric constant and dielectric loss angle tangent are minimum, have fine high frequency characteristic, and excellent performance such as resistant height, low temperature and resistant ultraviolet radiation is the base plate of comparatively ideal, the biggest preparation high frequency circuit board of adoption volume at present.

Description

PTFE high frequency circuit board for 5G signal communication

Technical Field

The utility model relates to a circuit board technical field specifically is a PTFE high frequency circuit board for 5G signal communication.

Background

With the rapid development of electronics and communication industries, high frequency materials and ultrahigh frequency materials are more and more widely used, and in view of the excellent characteristics of the materials themselves, polytetrafluoroethylene (abbreviated as PTFE) copper clad plates are increasingly favored, and since PTFE has excellent dielectric properties (low dielectric constant and low dielectric loss) and good chemical stability and thermal stability, PTFE is mainly used in the fields of satellite communication, mobile radio communication, satellite broadcast and television radar equipment, computers and the like, ordinary circuit boards use epoxy resin glass fiber cloth as a base material, and then printed circuits are manufactured on the base material, and the electric signals of the circuit boards usually have large loss and cannot be used in communication equipment of high frequency electronics.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PTFE high frequency circuit board for 5G signal communication possesses the advantage that improves use intensity, has solved general circuit board and has all regarded as the substrate with epoxy glass fiber cloth, and the system has printed circuit again on the substrate, and this kind of circuit board signal of telecommunication has great loss usually, can not be used for the communication of high frequency electron to equip the problem on.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PTFE high frequency circuit board for 5G signal communication, includes the circuit board body, the top fixedly connected with paster components and parts of circuit board body, the circuit board body includes the base plate layer, the top fixedly connected with tie coat on base plate layer, the top fixedly connected with line layer on tie coat, the top fixedly connected with insulating layer on line layer.

Preferably, the substrate layer is made of polytetrafluoroethylene material, and the bonding layer is made of insulating epoxy resin glue.

Preferably, the circuit layer is a circuit pattern, gaps of the circuit pattern are filled with resin, the surface of the circuit layer is coated with a corrosion-resistant layer, and the corrosion-resistant layer is made of polyamide resin.

Preferably, the insulating layer is made of insulating epoxy resin glue and is bonded to the surface of the circuit board through screen printing.

Preferably, the substrate layer is bonded and connected with the circuit layer through a bonding layer, and the two sides of the bottom of the circuit board body are fixedly connected with insulating pads.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a cooperation of circuit board body, paster components and parts, base plate layer, tie coat, circuit layer and insulating layer is used, and this circuit board can reduce cost, realizes electronic equipment small-size lightweight, high reliability, and polytetrafluoroethylene's dielectric constant and dielectric loss angle tangent are minimum, have fine high frequency characteristic, and excellent performance such as resistant height, low temperature and resistant ultraviolet radiation is the base plate of comparatively ideal, the biggest preparation high frequency circuit board of adoption volume at present.

2. The utility model discloses a set up corrosion-resistant layer, through adopting the polyamide resin material, have higher corrosion resistance, guaranteed the life of this circuit board, through setting up the insulating layer, can effectually play waterproof insulating effect, through setting up insulating pad, can protect the bottom of this circuit board, improve the security.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the structure of the circuit board body of the present invention;

fig. 3 is a schematic view of the connection structure of the circuit layer and the insulating layer of the present invention.

In the figure: 1. a circuit board body; 101. a substrate layer; 102. a bonding layer; 103. a circuit layer; 104. an insulating layer; 2. mounting a component; 3. a corrosion-resistant layer; 4. an insulating pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The components adopted by the utility model are all universal standard components or components known by the technicians in the field, and the structure and the principle of the components are known by the technicians through technical manuals or conventional experimental methods.

Referring to fig. 1-3, a PTFE high frequency circuit board for 5G signal communication, includes a circuit board body 1, a chip component 2 fixedly connected to the top of the circuit board body 1, the circuit board body 1 includes a substrate layer 101, the substrate layer 101 is made of teflon, an adhesive layer 102 is made of insulating epoxy resin, the substrate layer 101 is bonded to a circuit layer 103 through the adhesive layer 102, insulation pads 4 are fixedly connected to both sides of the bottom of the circuit board body 1, the top of the substrate layer 101 is fixedly connected to the adhesive layer 102, the top of the adhesive layer 102 is fixedly connected to the circuit layer 103, the circuit layer 103 is a circuit pattern, gaps of the circuit pattern are filled with resin, the surface of the circuit layer 103 is coated with a corrosion-resistant layer 3, the corrosion-resistant layer 3 is made of polyamide resin, the top of the circuit layer 103 is fixedly connected to an insulation layer 104, the insulation layer, the anti-corrosion layer 3 is arranged and the polyamide resin material is adopted, so that the anti-corrosion performance is higher, the service life of the circuit board is ensured, the insulating layer 104 can effectively play a role of waterproof insulation, and the insulating pad 4 can protect the bottom of the circuit board, improve the safety, through the matching use of the circuit board body 1, the chip component 2, the substrate layer 101, the bonding layer 102, the circuit layer 103 and the insulating layer 104, the circuit board can reduce cost, realize miniaturization, light weight and high reliability of electronic equipment, has the smallest dielectric constant and dielectric loss angle tangent of polytetrafluoroethylene, has good high-frequency characteristics, and the substrate has excellent performances of high temperature resistance, low temperature resistance, ultraviolet radiation resistance and the like, and is an ideal substrate for manufacturing a high-frequency circuit board with the largest adoption amount at present.

During the use, base plate layer 101 adopts the polytetrafluoroethylene material to make, can satisfy the high frequency demand, and the clearance of circuit layer 103 is filled the resin, is provided with corrosion-resistant layer 3 that the polyamide resin material was made, has higher corrosion resistance to can satisfy the requirement in aspects such as high frequency communication and adverse operating environment.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PTFE high frequency circuit board for 5G signal communication, includes circuit board body (1), its characterized in that: the circuit board comprises a circuit board body (1), wherein a patch element (2) is fixedly connected to the top of the circuit board body (1), the circuit board body (1) comprises a substrate layer (101), a bonding layer (102) is fixedly connected to the top of the substrate layer (101), a circuit layer (103) is fixedly connected to the top of the bonding layer (102), and an insulating layer (104) is fixedly connected to the top of the circuit layer (103).

2. The PTFE high-frequency circuit board for 5G signal communication according to claim 1, wherein: the substrate layer (101) is made of polytetrafluoroethylene materials, and the bonding layer (102) is made of insulating epoxy resin glue.

3. The PTFE high-frequency circuit board for 5G signal communication according to claim 1, wherein: the circuit layer (103) is a circuit pattern, gaps of the circuit pattern are filled with resin, the surface of the circuit layer (103) is coated with a corrosion-resistant layer (3), and the corrosion-resistant layer (3) is made of polyamide resin.

4. The PTFE high-frequency circuit board for 5G signal communication according to claim 1, wherein: the insulating layer (104) is made of insulating epoxy resin glue and is bonded on the surface of the circuit layer (103) through screen printing.

5. The PTFE high-frequency circuit board for 5G signal communication according to claim 1, wherein: the circuit board is characterized in that the substrate layer (101) is connected with the circuit layer (103) in an adhesion mode through an adhesive layer (102), and insulating pads (4) are fixedly connected to two sides of the bottom of the circuit board body (1).