CN219981139U - Flexible circuit board, antenna structure and electronic equipment - Google Patents
Flexible circuit board, antenna structure and electronic equipment Download PDFInfo
- Publication number
- CN219981139U CN219981139U CN202320777867.2U CN202320777867U CN219981139U CN 219981139 U CN219981139 U CN 219981139U CN 202320777867 U CN202320777867 U CN 202320777867U CN 219981139 U CN219981139 U CN 219981139U
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- Prior art keywords
- circuit board
- flexible circuit
- base film
- composite base
- layer
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- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002131 composite material Substances 0.000 claims abstract description 37
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 26
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 239000004642 Polyimide Substances 0.000 claims abstract description 10
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The present disclosure relates to a flexible circuit board, an antenna structure, and an electronic device. The flexible circuit board composite base film comprises a liquid crystal polymer unit and a polyimide unit; the metal wiring layer is arranged on at least one side surface of the composite base film; the protective film is arranged on the surface of the metal wiring layer, which is away from the composite base film.
Description
Technical Field
The disclosure relates to the technical field of terminals, and in particular relates to a flexible circuit board, an antenna structure and electronic equipment.
Background
At present, for some occasions needing to transmit high-frequency signals, the used high-frequency plates are usually LCP (Liquid Crystal Polymer ) plates, but the LCP plates have high cost and high melting point, so that higher temperature is needed in the process of preparing the plates, uneven thickness of the film is easy to cause, and the process difficulty is increased.
Disclosure of Invention
The present disclosure provides a flexible circuit board, an antenna structure, and an electronic device to solve the deficiencies in the related art.
According to a first aspect of embodiments of the present disclosure, there is provided a flexible wiring board including:
a composite base film including a liquid crystal polymer unit and a polyimide unit;
the metal wiring layer is arranged on at least one side surface of the composite base film;
the protective film is arranged on the surface of the metal wiring layer, which is away from the composite base film.
Optionally, the protective film includes a reduced graphene oxide unit and a polyimide unit.
Optionally, at least one of the surfaces of the metal routing layer facing toward and away from the composite base film has a roughness of less than or equal to 1.5 micrometers.
Optionally, the liquid crystal polymer unit has a particle size of less than or equal to 1 micron.
Optionally, the metal wiring layer is arranged on a group of surfaces of the composite base film which are oppositely arranged;
the flexible circuit board further comprises a via hole, the via hole penetrates through the composite base film, and the inner side surface of the via hole is covered with the metal wiring layer.
Optionally, the protection film is disposed on a side of each metal routing layer facing away from the composite base film.
Optionally, the metal routing layer includes a copper layer.
Optionally, the method further comprises:
and the bonding layer is bonded between the metal wiring layer and the composite base film.
According to a second aspect of embodiments of the present disclosure, there is provided an antenna structure comprising:
a bracket;
the flexible circuit board according to any one of the above embodiments, wherein the flexible circuit board is disposed on the support, and the metal routing layer of the flexible circuit board is a radiator.
According to a third aspect of embodiments of the present disclosure, there is provided an electronic device, including a flexible circuit board according to any one of the embodiments described above; or comprises an antenna structure as in any one of the embodiments above.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:
as can be seen from the above embodiments, compared with the solution of using an LCP substrate in the related art, the present disclosure can improve the dielectric constant of the composite base film 1 by adding LCP powder into PI to meet the signal transmission requirement, and meanwhile, compared with the LCP substrate, the composite base film 1 of the present disclosure has more favorable bending performance, is more suitable for the development requirement of the current foldable electronic device, and the cost of PI is reduced compared with the LCP substrate, and the process is simpler and more stable.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic cross-sectional view of a flexible circuit board according to an exemplary embodiment.
Fig. 2 is a schematic cross-sectional view of another flexible circuit board shown according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
Currently, with the development of 5G communication technology, there is a higher requirement on the number and performance of antennas in electronic devices. In the related art, an FPC flexible board is generally used in combination with a BTB connector, instead of a conventional coaxial line, for radio frequency signal transmission. The substrate material of the conventional FPC flexible board is generally LCP (Liquid Crystal Polymer, industrialized liquid crystal polymer) so as to meet the requirement of the transmission of the high-frequency signals of the antenna on the electrical performance of the medium. However, LCP is not used as a collection, and its wide application is limited by the high cost in addition to process limitations.
As shown in fig. 1, the present disclosure provides a flexible circuit board 100, as shown in fig. 1, the flexible circuit board 100 may include a composite base film 1, a metal routing layer 2 and a protective film 3, the composite base film 1 may include a liquid crystal polymer unit (LCP, liquid Crystal Polymer) and a Polyimide unit (PI, polyimide), the metal routing layer 2 is disposed on a side surface of the composite base film 1, and the protective film 3 is disposed on a side surface of the metal routing layer 2 facing away from the composite base film 1, so that circuit routing can be performed through the metal routing layer 2, and dust-proof, water-proof, and oxidation-proof protection can be performed on the metal routing layer 2 through the protective film 3. The composite base film 1 may be obtained by filling 8.5% by mass of liquid crystal polymer powder in a polyimide solution and then curing the polyimide solution in steps.
Based on this, compared with the scheme of adopting the LCP substrate in the related art, the present disclosure can improve the dielectric constant of the composite base film 1 by adding the LCP powder into the PI to meet the signal transmission requirement, and meanwhile, compared with the LCP substrate, the composite base film 1 of the present disclosure has more favorable bending performance, is more suitable for the development requirement of the current folding electronic device, and the cost of the PI is reduced compared with the LCP substrate, so that the process is simpler and more stable.
In the above embodiment, the protective film 3 may include a reduced graphene oxide unit and a polyimide unit, so that PI is filled through the reduced graphene oxide unit, on one hand, the protection, dust prevention and water prevention effects of the protective film 3 can be achieved, on the other hand, a certain shielding effect is provided for electromagnetic radiation, and the protective film 3 has the characteristic of structural-shielding multifunctional integration. Specifically, the PI solution may be filled with reduced graphene oxide powder with a mass fraction of 5%, and then subjected to step curing to form a film, thereby obtaining the protective film 3.
At least one of the surfaces of the metal wiring layer 2 facing and departing from the composite base film 1 has a roughness less than or equal to 1.5 micrometers so as to improve the flatness of the contact surfaces of metal and nonmetal, thereby avoiding breakage caused by signal transmission on a rough surface and being beneficial to ensuring the signal transmission quality. When the flexible circuit board 100 is used as an antenna structure, the metal trace layer 2 is a radiator.
In the above embodiments, the particle diameter of the liquid crystal polymer unit may be less than or equal to 1 μm, avoiding that the larger-diameter liquid crystal polymer unit is filled in PI, affecting the bending characteristics and the node constant of the composite base film 1.
In the embodiment shown in fig. 1, the flexible circuit board 100 is illustrated as a single panel, and in other embodiments, the flexible circuit board 100 may be a double-sided board as shown in fig. 2.
Specifically, the metal routing layer 2 may be disposed on a set of opposite surfaces of the composite base film 1, that is, as shown in fig. 2, the metal routing layer 2 is disposed on both the upper surface and the lower surface of the composite base film 1, the flexible circuit board 100 may further include a via hole 4, the via hole 4 may penetrate through the composite base film 1, and the inner side of the via hole 4 may cover the metal routing layer 2, so that the metal routing layers 2 disposed on different sides of the composite base film 1 may be conducted. In particular, a portion of the metal trace layer 2 may be electroplated within the via 4 to effect conduction.
Of course, for protecting the metal routing layers 2 on both sides, the protection film 3 may be disposed on the surface of each metal routing layer 2 facing away from the composite base film 1, so as to improve the dustproof, waterproof and antioxidant capabilities of the whole flexible circuit board 100.
In the above embodiment, the metal wiring layer 2 may include a copper layer, and the metal wiring layer 2 may be formed after exposure and development by using a mask. The flexible circuit board 100 may further include an adhesive layer (not shown, the adhesive layer adheres to the metal routing layer 2 and the composite base film 1, specifically, a layer of glue is coated on the surface of the composite base film 1, then a layer of metal is processed, and the metal routing layer 2 is obtained by a process.
Based on the flexible circuit board 100 in the above embodiments, the present disclosure further provides an antenna structure, which may include a bracket and the flexible circuit board described in any one of the above embodiments, where the flexible circuit board is disposed on the bracket, and the metal wiring layer 2 serves as an antenna radiator. The antenna structure has good transmission characteristics while having low cost, and can better adapt to the development trend of folding electronic equipment. The support can be a middle frame support of the electronic equipment, so that space and materials can be saved.
Based on the flexible circuit board 100 in the foregoing embodiments, the present disclosure further provides an electronic device, where the electronic device may include the flexible circuit board in any one of the foregoing embodiments, and the flexible circuit board may be a conventional circuit board in the electronic device, or the flexible circuit board may also be an FPC antenna in the electronic device.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A flexible circuit board, comprising:
a composite base film including a liquid crystal polymer unit and a polyimide unit;
the metal wiring layer is arranged on at least one side surface of the composite base film;
the protective film is arranged on the surface of the metal wiring layer, which is away from the composite base film.
2. The flexible wiring board according to claim 1, wherein the protective film includes a reduced graphene oxide unit and a polyimide unit.
3. The flexible circuit board of claim 1, wherein at least one of a surface of the metal trace layer facing toward and away from the composite base film has a roughness of less than or equal to 1.5 microns.
4. The flexible circuit board of claim 1 wherein the liquid crystal polymer units have a particle size of less than or equal to 1 micron.
5. The flexible circuit board of claim 1, wherein the metal trace layer is disposed on a set of oppositely disposed surfaces of the composite base film;
the flexible circuit board further comprises a via hole, the via hole penetrates through the composite base film, and the inner side surface of the via hole is covered with the metal wiring layer.
6. The flexible circuit board of claim 5, wherein the protective film is disposed on a side of each of the metal trace layers facing away from the composite base film.
7. The flexible circuit board of claim 1, wherein the metal trace layer comprises a copper layer.
8. The flexible circuit board of claim 1, further comprising:
and the bonding layer is bonded between the metal wiring layer and the composite base film.
9. An antenna structure comprising:
a bracket;
the flexible circuit board of any of claims 1-8, wherein the flexible circuit board is disposed on the support, and the metal routing layer of the flexible circuit board is a radiator.
10. An electronic device comprising the flexible circuit board of any of claims 1-8; or comprises an antenna structure as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320777867.2U CN219981139U (en) | 2023-04-10 | 2023-04-10 | Flexible circuit board, antenna structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320777867.2U CN219981139U (en) | 2023-04-10 | 2023-04-10 | Flexible circuit board, antenna structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219981139U true CN219981139U (en) | 2023-11-07 |
Family
ID=88587990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320777867.2U Active CN219981139U (en) | 2023-04-10 | 2023-04-10 | Flexible circuit board, antenna structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219981139U (en) |
-
2023
- 2023-04-10 CN CN202320777867.2U patent/CN219981139U/en active Active
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