CN211792208U

CN211792208U - Conductive adhesive tape for connecting PCB (printed circuit board)

Info

Publication number: CN211792208U
Application number: CN201922374232.4U
Authority: CN
Inventors: 闫李; 孙顺彪; 王才志
Original assignee: Suzhou Pingshengyuan Electronic Technology Co ltd
Current assignee: Suzhou Pingshengyuan Electronic Technology Co ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-10-27
Anticipated expiration: 2029-12-26

Abstract

The utility model relates to an electronic equipment is with electrically conductive sticky tape field discloses a PCB board is connected with electrically conductive sticky tape. Including electrically conductive basic unit, binder layer, filler layer and from type protective layer, electrically conductive basic unit, binder layer, filler layer and from type protective layer from inside to outside range upon range of setting gradually, electrically conductive basic unit is graphite alkene layer, and the binder layer is polyurethane conductive adhesive layer, and the filler layer is thermosetting epoxy, is provided with conductive particle at the filler in situ, and conductive particle is used for reinforcing transmission and conduction current. The utility model discloses an adopt thermosetting epoxy, make conductive adhesive tape when the temperature is higher, not reduce with the area of contact of conducting object, and lead to droing, improved conductive adhesive tape's stability and reliability. The conductive performance of the conductive adhesive tape is enhanced by adopting the gold and nickel conductive layers. By adopting the polyethylene layer, the conductive adhesive tape has the effects of high wear resistance and corrosion resistance.

Description

Conductive adhesive tape for connecting PCB (printed circuit board)

Technical Field

The utility model relates to an electronic equipment is with electrically conductive sticky tape field, in particular to PCB board is connected and is used electrically conductive sticky tape.

Background

With the development of the consumer electronics industry, consumer electronics products increasingly exhibit the characteristics of miniaturization, light weight and thinness, and under the trend, the integration level of the electronic products is higher and higher, the volume is smaller and smaller, and the power is stronger and stronger; therefore, the trend of high power, high integration and narrow application space is bringing a series of problems of electric conduction, radiation interference and the like to consumer electronics; the conductive adhesive tape has light weight, thin thickness, certain bonding capability and corresponding conductivity, and is widely applied to the consumer electronics industry to meet the requirements of electrostatic grounding and electromagnetic shielding inside electronic products. However, the contact performance between the conventional conductive tape and the conductive object is unstable, and when the temperature is too high, the contact area between the conductive tape and the conductive object is easily reduced, so that the conductivity is reduced, and the use of the conductive tape in electronic products is also restricted.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a PCB board is connected and is used electrically conductive sticky tape through adopting thermosetting epoxy, makes electrically conductive sticky tape when the temperature is higher, does not reduce with the area of contact of conducting object, and leads to droing, has improved electrically conductive sticky tape's stability and reliability. The conductive performance of the conductive adhesive tape is enhanced by adopting the gold and nickel conductive layers. By adopting the polyethylene layer, the conductive adhesive tape has the effects of high wear resistance and corrosion resistance.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a conductive adhesive tape for PCB connection comprises a conductive base layer, an adhesive layer, a filler layer and a release protective layer; the conductive base layer, the adhesive layer, the filler layer and the release protective layer are sequentially stacked from inside to outside; the conductive base layer is a graphene layer; the adhesive layer is a polyurethane conductive adhesive layer; the filler layer is made of thermosetting epoxy resin, and conductive particles are arranged in the filler layer and used for enhancing transmission and conducting current.

As a preferred embodiment of the present invention, the conductive particles are of a multilayer structure, and adopt two conductive layers of gold and nickel.

As an optimal scheme of the utility model, it has the polyethylene layer for the surface coating to leave the type protective layer, and thickness is 30 to 150 microns.

As a preferable aspect of the present invention, the thickness of the conductive base layer is 50 to 70 μm.

To sum up, the utility model discloses following beneficial effect has: the utility model discloses an adopt thermosetting epoxy, make conductive adhesive tape when the temperature is higher, not reduce with the area of contact of conducting object, and lead to droing, improved conductive adhesive tape's stability and reliability. The conductive performance of the conductive adhesive tape is enhanced by adopting the gold and nickel conductive layers. By adopting the polyethylene layer, the conductive adhesive tape has the effects of high wear resistance and corrosion resistance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention.

The corresponding part names indicated by the numbers and letters in the drawings:

1-release protective layer 2-filler layer 3-adhesive layer 4-conductive base layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Examples

As shown in fig. 1, the utility model relates to a PCB board is connected and is used electrically conductive sticky tape, including electrically conductive basic unit 4, binder layer 3, filler layer 2 and from type protective layer 1. Specifically, the conductive base layer 4, the adhesive layer 3, the filler layer 2, and the release protective layer 1 are sequentially stacked from inside to outside. The conductive base layer 4 is a graphene layer, has a thickness of 50 to 70 microns, and has good conductivity. The adhesive layer 3 is a polyurethane conductive adhesive layer, so that the adhesive strength is high, and the conductive adhesive tape is prevented from falling off. The filler layer 2 is made of thermosetting epoxy resin, so that the contact area of the conductive adhesive tape and a conductive object is not reduced at a higher temperature to cause falling off, and the stability and the reliability of the conductive adhesive tape are improved. Within the filler layer 2 are arranged electrically conductive particles for enhancing transport and conducting current. The conductive particles are of a multilayer structure, and two conductive layers of gold and nickel are adopted, so that the conductivity of the conductive adhesive tape is improved. The release protective layer 1 is formed by coating a polyethylene layer on the surface, and the thickness is 30-150 micrometers, so that the conductive adhesive tape has high wear resistance and corrosion resistance.

In the embodiment, the thermosetting epoxy resin is adopted, so that the contact area of the conductive adhesive tape and a conductive object is not reduced when the temperature is higher, the conductive adhesive tape falls off, and the stability and the reliability of the conductive adhesive tape are improved. The conductive performance of the conductive adhesive tape is enhanced by adopting the gold and nickel conductive layers. By adopting the polyethylene layer, the conductive adhesive tape has the effects of high wear resistance and corrosion resistance.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A conductive adhesive tape for PCB board connection is characterized by comprising a conductive base layer, an adhesive layer, a filler layer and a release protective layer; the conductive base layer, the adhesive layer, the filler layer and the release protective layer are sequentially stacked from inside to outside; the conductive base layer is a graphene layer; the adhesive layer is a polyurethane conductive adhesive layer; the filler layer is made of thermosetting epoxy resin, and conductive particles are arranged in the filler layer and used for enhancing transmission and conducting current.

2. The conductive tape for connecting a PCB of claim 1, wherein the conductive particles have a multi-layer structure using two conductive layers of gold and nickel.

3. The conductive tape for connecting a PCB as claimed in claim 1, wherein the release protection layer is a polyethylene layer coated on the surface and has a thickness of 30 to 150 μm.

4. The conductive tape for PCB connection according to claim 1, wherein the conductive base layer has a thickness of 50 to 70 μm.