CN114126323A

CN114126323A - Radiator for power electronic equipment

Info

Publication number: CN114126323A
Application number: CN202010882309.3A
Authority: CN
Inventors: 牟永斌; 赵秀红
Original assignee: Shanghai Xunke Energy Saving Technology Co ltd
Current assignee: Suzhou Shengrongyuan Electronic Technology Co ltd
Priority date: 2020-08-30
Filing date: 2020-08-30
Publication date: 2022-03-01
Anticipated expiration: 2040-08-30
Also published as: CN114126323B

Abstract

The invention discloses a radiator for power electronic equipment, which comprises a shell, an opening group, a pipe body group and a filling pipe. The housing includes a cover plate and a base plate which are joined to form a chamber therein. The chamber has a first capillary tissue and a second capillary tissue. At least one opening group is positioned on the cover plate. Each opening group comprises a first opening and an odd number of second openings. The tube body group and the opening group are in one-to-one correspondence. The number of the tube bodies in the tube body group is half of the sum of the number of the first open holes and the second open holes in the open hole group, the tube bodies are provided with two ports, in the same tube body group, the two ports of one tube body are communicated with the first open holes and the second open holes of the open hole group, and the two ports of the other tube bodies are communicated with the two second open holes of the open hole group. The radiator for the power electronic equipment has high radiating efficiency, and is particularly suitable for the situation that a heat source is vertically or obliquely arranged.

Description

Radiator for power electronic equipment

Technical Field

The invention belongs to the technical field of heat dissipation, and relates to a heat radiator for power electronic equipment.

Background

The air-cooled radiator has the advantages of simplicity, reliability, low price and the like, and is widely applied to the field of power electronic heat dissipation. However, with the rapid development of industries such as big data, AI, internet of things and the like, the power consumption of a hardware integrated circuit is larger and larger, and the heating value and the heat flux density are also larger and larger. The heat dissipation capability of the traditional air-cooled radiator such as a heat pipe radiator and a temperature-equalizing plate is more and more difficult to meet the requirement. Particularly, when a heat source in the equipment is vertically or obliquely arranged, the heat dissipation effect of the radiator is affected, and the performance is reduced. Therefore, a need exists for an air-cooled heat sink with higher efficiency and higher adaptability for electronic devices.

Disclosure of Invention

In order to solve the problem of difficult heat dissipation of the current power electronic equipment, the invention provides the heat radiator which has the advantages of high heat dissipation capacity, high efficiency, strong adaptability and the like and is particularly suitable for the situation that a heat source in the power electronic equipment is vertically or obliquely arranged.

The invention adopts the following technical scheme:

a heat sink for a power electronic device, comprising:

the shell comprises a cover plate and a bottom plate, wherein the cover plate is combined with the bottom plate, and a cavity is formed inside the cover plate;

the first capillary tissue is positioned in the cavity and fixed on the bottom plate, the second capillary tissue is positioned in the cavity and fixed on the cover plate, and the first capillary tissue and the second capillary tissue are directly or indirectly contacted or connected;

at least one opening group, which is arranged on the cover plate and comprises a first opening and an odd number of second openings, wherein the second openings are covered with the second capillary tissues, and the first openings are not provided with the second capillary tissues, so that the first openings and the cavity are penetrated;

the pipe body groups correspond to the opening groups one by one, the number of the pipe bodies in each pipe body group is half of the sum of the number of the first opening and the second opening in the opening group, each pipe body is provided with two ports, in the same pipe body group, the two ports of one pipe body are communicated with the first opening and the second opening of the opening group, and the two ports of the other pipe bodies are communicated with the two second openings of the opening group;

and one end of the filling pipe is closed, and the other end of the filling pipe is communicated with the cavity.

Optionally, in the same trompil group, the position is adjacent and communicates two differences respectively two of body between the second trompil the apron is located there is the sunk structure on the surface of chamber side, the sunk structure with form the passageway between the second capillary tissue, the passageway communicates above-mentioned two second trompils.

Optionally, in the same opening group, the positions of the two second openings which are adjacent to each other and respectively communicated with two different tube bodies are provided with a concave structure on the second capillary tissue, a channel is formed between the concave structure and the cover plate, and the channel is communicated with the two second openings.

Optionally, the first capillary tissue and the second capillary tissue are a composite structure of one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure, and the first capillary tissue and the second capillary tissue are the same structure or different structures.

Optionally, the first capillary tissue has an uneven pattern or is partially hollowed out.

Optionally, a third capillary tissue is arranged in the cavity, the third capillary tissue is in contact with or connected to the first capillary tissue and the second capillary tissue respectively to realize indirect contact with or connection with the first capillary tissue and the second capillary tissue, and the third capillary tissue is a composite structure of any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, or a powder porous structure.

Optionally, the inner surface of the pipe body is smooth or has a micro-rib structure.

Optionally, the tube body is a circular tube or a flat tube or a microchannel tube or a tube body with a part of a circular tube part being a flat tube.

Optionally, the outer surface of the pipe body is laid with a radiating fin group.

Optionally, a support body is arranged in the cavity, and the support body is connected with the cover plate and the bottom plate.

In summary, compared with the heat pipe, the heat sink of the present invention has a larger effective contact area with the heat source. And the flowing directions of the vapor working medium and the liquid working medium in the pipe body are consistent, so that the liquid working medium is prevented from being gathered on the inner wall of the pipe body. Especially when the heat source in the power electronic equipment is vertically or obliquely installed, the liquid working medium flows more smoothly under the action of gravity, and the condensation heat dissipation effect is better due to real-time gas-liquid separation.

Drawings

Fig. 1 is a schematic external view of a heat sink for power electronic equipment according to a first embodiment of the present invention;

fig. 2 is a cross-sectional view of a first embodiment of a heat sink for a power electronic device of the present invention;

FIG. 3 is a cross-sectional view of a tube of a heat sink for power electronics according to a first embodiment of the present invention;

fig. 4 is a cross-sectional view of a second embodiment of a heat sink for a power electronic device of the present invention;

FIG. 5 is a schematic structural diagram of a first capillary structure in a second embodiment of a heat sink for power electronic devices according to the present invention;

FIG. 6 is a schematic external view of a heat sink for power electronics according to a third embodiment of the present invention;

in the above figures: 1-shell, 2-tube group, 3-filling tube, 4-fin group, 11-cover plate, 12-bottom plate, 13-first capillary tissue, 14-second capillary tissue, 15-third capillary tissue, 16-support body, 20-tube, 201-micro rib structure, 202-micro channel, 100-cavity, 110-open hole group, 111-first open hole, 112-second open hole, 112 o-second open hole, 112 p-second open hole, 112 q-second open hole, 113-channel and A-heat source.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter may be practiced.

Referring to fig. 1 and fig. 2, there are shown an outline schematic view and a cross-sectional view of a heat sink for power electronic equipment according to a first embodiment of the present invention. It includes casing 1, body group 2 and fills notes pipe 3. The housing 1 includes a cover plate 11 and a base plate 12, and the periphery of the cover plate 11 is welded to the base plate 12, and the inner space thereof forms a chamber 100. One end of the filling pipe 3 is communicated with the chamber 100 to fill the working medium, and the other end is sealed. The tube assembly 2 includes two tubes 20. The cover 11 has an opening group 110, which includes a first opening 111 and

second openings

112o, 112p, 112q, and three second openings are sequentially arranged at one side of the first opening 111. Both ends of one pipe body 20 are inserted into the first opening 111 and the second opening 112o, respectively, and are welded and fixed. Both ends of the other tube 20 are inserted into the

second openings

112p and 112q, respectively, and are welded and fixed.

The chamber 100 has a first capillary tissue 13, a second capillary tissue 14, and a support body 16. The first capillary tissue 13 is fixed to the base plate 12, and the second capillary tissue 14 is fixed to the cover plate 11. The support body 16 connects the cover plate 11 and the base plate 12. The first opening 111 is penetrated through the chamber 100, and the second capillary 14 is formed at each of the

second openings

112o, 112p and 112 q. The portion of the second capillary tissue 14 between the second openings 112o and 112p has a concave structure and forms a channel 113 with the cover plate 11.

In this embodiment, the first capillary tissue 13 has a convex portion protruding toward the second capillary tissue 14 to contact or connect with the second capillary tissue 14, but is not limited thereto. The second capillary tissue 14 can also be provided with a convex part towards the first capillary tissue 13 so as to contact or connect with the first capillary tissue 13; or the first capillary tissue 13 and the second capillary tissue 14 each have a portion convex toward each other to contact or connect with each other. The connection manner of the first capillary structure 13 and the second capillary structure 14 may be sintering, but is not limited thereto.

The first capillary tissue 13 and the second capillary tissue 14 can be selected from a composite structure of any one or more of a silk screen, a foam metal, a metal felt, a fiber bundle and a powder porous structure. The first capillary structure 13 and the second capillary structure 14 are the same structure or different structures.

Fig. 3 is a cross-sectional view of a tube of a heat sink for power electronic equipment according to a first embodiment of the present invention. The tube body 20 can be selected as a round tube or a flat tube or a microchannel tube with microchannels 202, the inner surface of the tube body is smooth or has a micro-rib structure 201, and the shape of the micro-rib structure 201 is not limited.

The specific working principle is as follows: the chamber 100 is vacuumized through the filling pipe 3, then the working medium is filled, and finally the opening end of the filling pipe 3 is welded and sealed. At least one heat source is in contact with the base plate 12 of the heat sink of the present invention. The working medium in the first capillary tissue 13 absorbs the heat of the heat source and then is vaporized. Since the three second openings are covered with the second capillary structures 14, the working medium in vapor state cannot penetrate through the three second openings and is forced to enter the tube body 20 from the first openings 111 without capillary structures. The vapor working medium flows in the tube body 20 and gradually releases heat outwards, part of the working medium is condensed into liquid, and when the liquid working medium flows to the second opening 112o, the liquid working medium is adsorbed by the second capillary tissue 14 at the position, flows along the second capillary tissue 14, and returns to the first capillary tissue 13 through the contact part of the liquid working medium and the first capillary tissue 13. The vapor working medium continues to flow forward, enters the channel 113, enters the other tube 20 through the second opening 112p, and continues to release heat and condense. Finally, the working fluid condenses into a liquid state, enters the second capillary tissue 14 from the second opening 112q, and finally returns to the first capillary tissue 13. By so circulating, the heat is dissipated from the heat source to the environment.

Fig. 4 is a cross-sectional view of a heat sink for power electronic equipment according to a second embodiment of the present invention. As shown in the figure, it includes a housing 1, a tube body group 2, a filling tube 3 and a fin group 4. The fin set 4 is laid on the surface of the tube 20. The filling pipe 3 is located at the side of the cover plate 11. The chamber 100 includes a first capillary tissue 13, a second capillary tissue 14, a third capillary tissue 15, and a support 16. The third capillary tissue 15 is in contact with or connected to the first capillary tissue 13 and the second capillary tissue 14, respectively, to achieve indirect contact or connection of the first capillary tissue 13 and the second capillary tissue 14. The connection mode of the third capillary structure 15 and the first and second

capillary structures

13 and 14 may be sintering, but is not limited thereto. The third capillary structure 15 may be selected as a composite structure of any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. The portion of the cover plate 11 between the second openings 112o and 112p has a concave structure and forms a channel 113 with the second capillary tissue 14 therein.

Referring to fig. 5, in the present embodiment, the first capillary structure 13 has an uneven pattern (the pattern is not limited in shape). The first capillary structure 13 may have a hollow portion (not shown). The structure of other parts of this embodiment is the same as that of the first embodiment of the heat sink for power electronic device of the present invention, and will not be described again.

The radiator of the invention is particularly suitable for the situation that the heat source is vertically or obliquely arranged, as shown in figure 4. Heat source a is mounted vertically and base plate 12 is in thermal contact with heat source a. The working medium absorbs the heat of the heat source and then is vaporized, and enters the tube body 20 from the first opening 111. By means of the gravity, the working medium flows more smoothly, particularly, the condensed liquid working medium flows downwards along the tube body 20 and is adsorbed by the second capillary tissue 14 when flowing to the second opening 112o, so that vapor-liquid separation is realized, the liquid working medium returns to the first capillary tissue 13 through the third capillary tissue 15, and the vapor working medium passes through the channel 113, enters the other tube body 20 through the second opening 112p, and continues to release heat and condense outwards. The working fluid eventually condenses and returns to the first capillary structure 13. By so circulating, the heat is dissipated from the heat source to the environment.

Fig. 6 is a schematic external view of a heat sink for power electronic devices according to a third embodiment of the present invention. The difference between the first embodiment and the second embodiment is that two opening sets 110 are provided on the cover plate 11, and each opening set 110 includes a first opening 111 and five second openings 112. The number of the opening sets 110 is equal to the number of the tube body sets 2. The number of the tubes 20 in the tube assembly 2 is half of the sum of the number of the first openings 111 and the second openings 112. Thus, in this embodiment there are two tube sets 2, three tubes 20 in each tube set. The number of the openings 110 and the tube sets 2 and the number of the tubes 20 in the tube sets 2 are not limited, and are set according to the specific requirements of the user. The outer surface of the tube 20 can also be laid with the radiating fin group 4 to increase the radiating area.

Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, rather than limitations, and that many variations and modifications of the invention are possible to those skilled in the art, without departing from the spirit and scope of the invention.

Claims

1. A heat sink for a power electronic device, comprising:

the pipe body group corresponds to the opening group one by one, the number of the pipe bodies in the pipe body group is half of the sum of the first opening and the second opening in the opening group where the pipe bodies are located, each pipe body is provided with two ports, in the same pipe body group, the two ports of one pipe body are communicated with one first opening and one second opening of the opening group where the pipe body is located, and the two ports of the other pipe bodies are communicated with the two second openings of the opening group where the pipe bodies are located;

2. The heat sink for power electronic equipment according to claim 1, characterized in that:

in the same trompil group, the position is adjacent and communicates two differences respectively two of body between the second trompil the apron is located there is the sunk structure on the surface of chamber side, the sunk structure with form the passageway between the second capillary tissue, the passageway communicates above-mentioned two second trompils.

3. The heat sink for power electronic equipment according to claim 1, characterized in that:

in the same opening group, the positions of the two second openings which are adjacent and respectively communicated with two different pipe bodies are provided with a sunken structure on the second capillary tissue, a channel is formed between the sunken structure and the cover plate, and the channel is communicated with the two second openings.

4. The heat sink for power electronic equipment according to claim 1, characterized in that:

the first capillary tissue and the second capillary tissue are composite structures of any one or more of silk screen, foamed metal, metal felt, fiber bundle or powder porous structures, and the first capillary tissue and the second capillary tissue are the same structures or different structures.

5. The heat sink for power electronic equipment according to claim 1, characterized in that:

the first capillary tissue is provided with an uneven pattern or a part of hollow.

6. The heat sink for power electronic equipment according to claim 1, characterized in that:

the cavity is internally provided with a third capillary tissue, the third capillary tissue is respectively contacted or connected with the first capillary tissue and the second capillary tissue so as to realize indirect contact or connection of the first capillary tissue and the second capillary tissue, and the third capillary tissue is a composite structure of any one or more of a silk screen, a foamed metal, a metal felt, a fiber bundle or a powder porous structure.

7. The heat sink for power electronic equipment according to claim 1, characterized in that:

the inner surface of the pipe body is smooth or has a micro-rib structure.

8. The heat sink for power electronic equipment according to claim 1, characterized in that:

the pipe body is a round pipe or a flat pipe or a micro-channel pipe or a pipe body with a part of the round pipe as the flat pipe.

9. The heat sink for power electronic equipment according to claim 1, characterized in that:

and the outer surface of the pipe body is laid with a radiating fin group.

10. The heat sink for power electronic equipment according to claim 1, characterized in that:

and a support body is arranged in the cavity and is connected with the cover plate and the bottom plate.