CN111609743A - Heat superconducting radiating plate, radiator and 5G base station equipment - Google Patents
Heat superconducting radiating plate, radiator and 5G base station equipment Download PDFInfo
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- CN111609743A CN111609743A CN202010345046.2A CN202010345046A CN111609743A CN 111609743 A CN111609743 A CN 111609743A CN 202010345046 A CN202010345046 A CN 202010345046A CN 111609743 A CN111609743 A CN 111609743A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a thermal superconducting heat dissipation plate, a radiator and 5G base station equipment. The heat superconducting radiating plate comprises a first radiating area and a second radiating area positioned on the upper part of the first radiating area; first heat dissipation pipelines are distributed in the first heat dissipation area and distributed in a polygonal honeycomb shape; second heat dissipation pipelines are distributed in the second heat dissipation area and comprise a plurality of second main pipelines and a plurality of second branches connected among the second main pipelines, the second main pipelines extend along the width direction of the heat superconducting heat dissipation plate, and one ends, far away from the device, of the second main pipelines incline towards the direction departing from the first heat dissipation area; the first heat dissipation pipeline and the second heat dissipation pipeline are communicated with each other and are both heat superconducting heat dissipation pipelines, heat transfer working media are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media in the first heat dissipation pipeline comprise liquid. The invention is helpful for improving the heat dissipation efficiency and the heat dissipation uniformity.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a thermal superconducting heat dissipation plate, a heat radiator and 5G base station equipment.
Background
Along with the rapid development of the 5G communication technology, the integration level of power components is higher and higher, the power density is higher and higher, and the equipment is developed towards the miniaturization, light weight, high heat flow density, device temperature equalization and the like, while the existing all-aluminum sheet gear shaping radiator or die-casting radiator is large and heavy, and meanwhile, the defects of uneven heat dissipation, low heat dissipation efficiency and the like exist, and the heat dissipation requirement of the 5G communication base station equipment cannot be met.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a thermal superconducting heat sink, a heat sink, and a 5G base station device, for solving the problems of the prior art that an all-aluminum plate gear-shaping heat sink or a die-casting heat sink is bulky and heavy, and also has the disadvantages of uneven heat dissipation and low heat dissipation efficiency, and the heat dissipation requirements of a 5G communication base station device with high integration level, high power, miniaturization, light weight, and high heat flow density cannot be met.
To achieve the above and other related objects, the present invention provides a thermal superconducting heat dissipating plate, including a first heat dissipating region and a second heat dissipating region located above the first heat dissipating region; first heat dissipation pipelines are distributed in the first heat dissipation area and distributed in a polygonal honeycomb shape; second heat dissipation pipelines are distributed in the second heat dissipation area and comprise a plurality of second main pipelines and a plurality of second branches connected among the second main pipelines, the second main pipelines extend along the width direction of the heat superconducting heat dissipation plate, and one ends, far away from the device, of the second main pipelines incline upwards; the first heat dissipation pipeline and the second heat dissipation pipeline are communicated with each other and are both heat superconducting heat dissipation pipelines, heat transfer working media are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media in the first heat dissipation pipeline comprise liquid.
Optionally, the superconducting heat dissipation plate further includes a third heat dissipation region located at an upper portion of the second heat dissipation region, third heat dissipation pipelines are distributed in the third heat dissipation region, each third heat dissipation pipeline includes a plurality of third main pipelines and a third branch connected between the third main pipelines, the third main pipelines extend along a width direction of the superconducting heat dissipation plate, one end, far away from the device, of each third main pipeline is inclined upwards, and the third branch is located at one end, far away from the device, of each third heat dissipation region; the third heat dissipation pipeline is communicated with the second heat dissipation pipeline and is a thermal superconducting heat dissipation pipeline.
Optionally, the sum of the heights of the first heat dissipation area and the second heat dissipation area accounts for 50% -70% of the height of the thermal superconducting heat dissipation plate, and the heat transfer working mediums in the second heat dissipation pipeline and the third heat dissipation pipeline are gaseous substances.
Optionally, the second main pipeline and the third main pipeline are circular arc-shaped pipelines, and arc-shaped protrusions of the second main pipeline and the third main pipeline face downwards.
Optionally, the second main pipeline and the third main pipeline are circular arc-shaped pipelines, and arc-shaped protrusions of the second main pipeline and the third main pipeline face upwards.
Optionally, the first heat dissipation pipelines are distributed in a hexagonal honeycomb shape; the second branch and the third branch are vertical pipelines, and the distribution density of the second branch is greater than that of the third branch.
The invention also provides a heat superconducting radiator, which comprises a radiator substrate and a plurality of heat superconducting radiating plates in any scheme; the radiator substrate is provided with a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing devices from bottom to top; the plurality of heat superconducting radiating plates are arranged on the second surface of the radiator substrate in parallel at intervals, and each heat superconducting radiating plate extends along the longitudinal direction.
Optionally, the second surface of the heat sink substrate has a groove, and one end of the thermal superconducting heat dissipation plate has a bent portion, and the bent portion is inserted into the groove.
Optionally, the number of the mounting areas is three, and the three mounting areas correspond to the first heat dissipation area, the second heat dissipation area and the third heat dissipation area one to one.
The invention also provides 5G base station equipment, the 5G base station equipment comprises a device and the thermal superconducting radiator in any scheme, and the device of the 5G base station equipment is arranged in the installation area of the radiator substrate.
As described above, the thermal superconducting heat sink, the heat sink and the 5G base station device of the present invention have the following advantages:
the improved and optimized heat-dissipating pipeline structure design of the heat-superconducting heat-dissipating plate solves the problems of local dry-up and high temperature of an upper heat source in the heat-superconducting heat-dissipating plate caused by the shortage of the liquid heat-conducting working medium, can reduce the total amount of the heat-conducting working medium, reduce the weight and the volume of the heat-superconducting heat-dissipating plate/heat radiator, simultaneously remarkably improve the heat-dissipating uniformity and the heat-dissipating efficiency, and can fully meet the development requirements of miniaturization, light weight, high integration degree, uniform temperature and the like of 5G base station equipment. The 5G base station equipment based on the thermal superconducting radiator can obviously improve the heat dissipation performance, and is beneficial to prolonging the service life of the equipment and improving the performance of the equipment.
Drawings
Fig. 1 to 3 are schematic structural views of a superconducting heat sink according to a first embodiment.
Fig. 4 is a schematic structural diagram of a superconducting heat sink according to a second embodiment.
Fig. 5 is a partially enlarged view showing the connection of the superconducting heat dissipating plate and the heat sink substrate.
Fig. 6 is a schematic structural view of a superconducting heat sink based on the superconducting heat dissipation plate according to the first embodiment.
Fig. 7 is a schematic structural view of a superconducting heat sink based on the superconducting heat dissipating plate according to the second embodiment.
Description of the element reference numerals
1 Heat sink base plate
2 device
3 thermal superconducting radiating plate
30 non-pipeline island region
31 a bent part
32 vertical main pipeline
A first heat dissipation area
B second heat dissipation area
C third heat dissipation area
341 second main line
342 second branch
351 third main pipeline
352 third branch
4 Heat transfer working medium
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 7. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention in a schematic manner, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
As shown in fig. 1 to 3, the present invention provides a thermal superconducting heat dissipation plate 3, wherein the thermal superconducting heat dissipation plate 3 includes a first heat dissipation region a and a second heat dissipation region B located above the first heat dissipation region a; first heat dissipation pipelines 33 are distributed in the first heat dissipation area A, and the first heat dissipation pipelines 33 are distributed in a polygonal honeycomb shape; a second heat dissipation pipeline is distributed in the second heat dissipation area B, the second heat dissipation pipeline includes a plurality of second main pipelines 341 and a plurality of second branches 342 connected between the second main pipelines 341, the second main pipelines 341 extend along the width direction of the thermal superconducting heat dissipation plate 3, and one end (substantially, also the end away from the heat dissipation substrate 1) of the second main pipelines 341 away from the device 2 inclines towards the direction away from the first heat dissipation area (i.e., inclines upwards); the first heat dissipation pipeline 33 and the second heat dissipation pipeline are communicated with each other and are both heat superconducting heat dissipation pipelines, heat transfer working media 4 are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media 4 in the first heat dissipation pipeline 33 comprise liquid.
In a further example, the thermal superconducting heat dissipation plate 3 further includes a third heat dissipation region C located above the second heat dissipation region B (i.e. the first heat dissipation region a, the second heat dissipation region B and the third heat dissipation region C are distributed on the thermal superconducting heat dissipation plate 3 from bottom to top), a third heat dissipation pipeline is distributed in the third heat dissipation area C, and the third heat dissipation pipeline includes a plurality of third main pipelines 351 and a third branch 352 connected between the third main pipelines 351 (likewise, the third branch 352 and the third main pipelines 351 are also communicated with each other), the third main pipe 351 extends along the width direction of the thermal superconducting heat sink 3 and one end of the third main pipe 351 away from the device 2 is inclined (i.e. inclined upwards) in a direction away from the second heat dissipation region B, the third branch 352 is located at one end of the third heat dissipation area C away from the device 2; the third heat dissipation pipeline is communicated with the second heat dissipation pipeline and is a thermal superconducting heat dissipation pipeline, and the heat transfer working medium 4 in the second heat dissipation pipeline and the third heat dissipation pipeline is preferably gaseous substances.
Under the influence of gravity, the liquid heat transfer working medium 4 is stored in the first heat dissipation area A at the lower part of the heat superconducting heat dissipation plate 3 in a liquid state under the condition that the liquid heat transfer working medium is not heated or does not reach the gasification temperature, and when the heat superconducting heat dissipation plate 3 receives heat emitted by the device 2 from the side surface of the heat superconducting heat dissipation plate and reaches the gasification temperature, the heat transfer working medium 4 in the first heat dissipation area A forms a pool boiling to generate bubbles, because the first heat dissipation pipeline 33 is in polygonal honeycomb distribution, the pipeline channels are more, the fluid resistance is small, the separation and the movement of the bubbles and the supplement of the liquid working medium are facilitated, and therefore the bubbles can be moved to a position (the device 2) far away from a heat source in time and the liquid working medium. Because a gas-liquid mixture is generated in the first heat dissipation area A, the liquid level of the working medium rises, a gas-liquid mixing area where rising steam and condensed reflux liquid coexist is formed in the second heat dissipation area B, and a heat source (device 2) positioned on the side surface of the second heat dissipation area B conducts heat to the gas-liquid mixed heat transfer working medium 4 in the pipeline, and surface evaporation is carried out on the interface (the inner surface of a gas bubble) of the gas bubble and the liquid; the amount of steam generated in the second heat dissipation area B is large, the amount of liquid is small, the design of the inclined second main pipe 341 and the second branch pipe 342 is adopted, the steam is guided to flow in the tooth crest direction of the heat superconducting heat dissipation plate 3 through the inclined second main pipe 341 to realize heat dissipation, the condensed liquid flows to the tooth root part of the heat superconducting plate near the heat source by virtue of gravity, the second branch pipe 342 connected between the second main pipes 341 is convenient for the gas to flow upwards and the liquid to flow downwards, the pressure of each inclined second main pipe 341 is balanced, and the improvement of the temperature uniformity is facilitated. In the case where the third heat dissipation area C is provided, the third heat dissipation area C is mainly formed by the inclined third main line 351, the area is mainly a steam condensation area, the liquid near the heat source is mainly a liquid working medium condensed by steam, the amount of the liquid working medium is small, the liquid condensed by steam naturally flows to the vicinity of the heat source on the side of the superconducting heat dissipation plate 3 along the third main line 351 by gravity, and the steam evaporated by the heat source from the part of the condensed liquid working medium flows to the vicinity of the tooth top away from the heat source side along the third main line 351, so that the condensed liquid is fully utilized to prevent the temperature of the upper heat source from increasing due to the lack of liquid in the upper heat source. Based on the working principle, the heat superconducting radiating plate 3 can reduce the total amount (especially the total weight) of the heat transfer working medium 4, reduce the weight and the volume of the heat superconducting radiating plate 3, obviously improve the radiating uniformity and the radiating efficiency, and fully meet the development requirements of miniaturization, light weight, high integration degree, temperature equalization and the like of 5G base station equipment.
It should be noted that the devices are components capable of implementing predetermined functions, including but not limited to microprocessors, memories, rf generators, power amplifiers, filters, power managers, etc., which generate heat during operation to cause temperature increase, and excessive temperature may reduce the operating speed of the devices or even damage the devices, so that the devices need to dissipate heat in time.
As an example, the thermal superconducting heat dissipation plate 3 realizes heat transfer based on a thermal superconducting heat transfer technology; the heat superconducting technology is a phase-change heat transfer technology which fills the heat transfer working medium 4 in sealed and mutually communicated micro-channels and realizes heat superconducting heat transfer through evaporation or condensation phase change of the heat transfer working medium 4. Specifically, the thermal superconducting heat dissipation plate 3 is a composite plate structure, and includes a first plate and a second plate, the thermal superconducting pipe is formed by a roll-and-blow process or a die-forming brazing process, the first plate and the second plate are made of a metal material with good thermal conductivity, such as copper, a copper alloy, aluminum, an aluminum alloy, titanium, a titanium alloy, or any combination of any one or more of them, that is, the first plate and the second plate may be a single-layer material layer or a multi-layer material layer, but an inner layer is preferably an aluminum material layer. For example, in an example, the first plate and the second plate may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, an iron-aluminum composite plate including an iron material layer and an aluminum material layer, or an aluminum-alloy-aluminum composite plate including an aluminum-alloy material layer and an aluminum material layer; the aluminum material layers in the first plate and the second plate are in contact, namely the second material layer in the first plate is the aluminum material layer, and the second material layer in the second plate is the aluminum material layer. Will first panel reaches the inlayer of second panel sets for the aluminium material layer, works as first panel reaches when the second panel is aluminium copper composite board, can ensure the copper material layer is located the outside, promptly the surface of heat superconducting radiating panel 3 is the copper layer, can directly braze or the soldering, the operation of being convenient for, and stable in quality can solve the welding problem between heat superconducting radiating panel 3 and radiator base plate 1. The heat superconducting heat dissipation plate 3 may be in a single-side expansion form, that is, the heat superconducting heat dissipation pipeline (including the first heat dissipation pipeline 33, the second heat dissipation pipeline, and the third heat dissipation pipeline) protrudes only on one surface of the heat superconducting heat dissipation plate 3, or in a double-side expansion form, that is, the heat superconducting heat dissipation pipeline protrudes on both surfaces of the heat superconducting heat dissipation plate 3. In this embodiment, a single-side expansion is preferred, and when a plurality of the thermal superconducting heat dissipation plates 3 are disposed in the same thermal superconducting heat sink (for example, the thermal superconducting heat sink in the fourth embodiment), the protrusions of the plurality of thermal superconducting heat dissipation plates 3 are preferably distributed symmetrically outward (based on the central line of the thermal superconducting heat sink, the thermal superconducting heat dissipation pipelines on the surfaces of the thermal superconducting heat dissipation plates 3 on both sides are protruded in the direction away from the central line), so as to ensure that the thermal superconducting heat sink has good heat dissipation performance and a more balanced and stable structure. As an example, the surface of the thermal superconducting heat sink 3 may be anodized to form an oxide film (not shown) on the surface of the thermal superconducting heat sink 3, or subjected to a powder spraying process or a painting process, so as to improve the corrosion resistance of the thermal superconducting heat sink 3, and improve the emissivity of the thermal superconducting heat sink 3 to enhance the heat exchange with the ambient air.
As an example, the plurality of second main pipelines 341 may be parallel to each other, and the distances between two adjacent second main pipelines 341 may be the same or different. The plurality of second main pipelines 341 and the plurality of second branches 342 communicate with each other to form a plurality of non-pipe islands 30, and the non-pipe islands 30 may be in a parallelogram shape or other shapes, and refer to fig. 2 in particular.
In the case where only the first heat dissipation region a and the second heat dissipation region B are provided, the height of the first heat dissipation region a is not more than 50% of the height of the thermal superconducting heat dissipation plate 3, preferably 30% to 40%; in the case of providing the third heat dissipation area C, the sum of the heights of the first heat dissipation area a and the second heat dissipation area B is not more than 70% of the height of the thermal superconducting heat dissipation plate 3, such as 50% to 70% (inclusive), preferably 50% to 60%, and the design of the height of the first heat dissipation area a is actually an optimized design of the total volume of the liquid heat transfer medium 4, and by limiting the volume of the heat transfer medium 4 to 30% to 40% of the total volume of the internal space of the total heat transfer pipe, enough liquid is subjected to endothermic evaporation to become steam and steam is condensed to become liquid when heated and evaporated, and the circulation is continued to conduct heat, and meanwhile, part of the devices are not damaged at high temperature due to the lack of liquid.
In this embodiment, as an example, the second main pipe 341 and the third main pipe 351 are circular arc-shaped pipes, and arc-shaped protrusions of the second main pipe 341 and the third main pipe 351 face downward, and the second main pipe 341 and the third main pipe 351 are configured to be circular arc-shaped, which is beneficial to accelerating backflow of the condensed liquid working medium to the vicinity of the heat source.
As an example, the first heat dissipation pipes 33 are distributed in a hexagonal honeycomb shape, or the first heat dissipation pipes 33 enclose non-pipe islands 30 in a hexagonal shape, and as an example, the first heat dissipation pipes 33 are not distributed in a lower right region of the first heat dissipation region a, but the non-pipe islands 30 are formed in the lower right region of the first heat dissipation region a, or the first heat dissipation pipes 33 located at the bottommost portion of the first heat dissipation region a are inclined upward in a direction away from the device 2 (see fig. 3 for details, it can also be described that the distance between the first heat dissipation pipes 33 and the bottom surface of the thermal superconducting heat dissipation plate 3 gradually increases in a direction away from the device 2, so as to form a non-pipe island 30 below the first heat dissipation region a that gradually increases in a direction away from the device 2); through with first heat dissipation pipeline 33 sets up to be hexagonal honeycomb distribution and the first heat dissipation pipeline 33 of bottommost upwards slope (can see from the picture promptly, the right of the first heat dissipation pipeline 33 of bottommost is higher than the left side) for can set up more pipeline passageways in limited first heat dissipation area A, and this passageway is comparatively gentle, and fluid resistance is little, be favorable to breaking away from of vapor bubble to remove and the replenishment of liquid working medium, therefore can in time remove the vapor bubble to keeping away from heat source department (device 2) and can in time replenish the liquid working medium after the condensation near heat source department.
Illustratively, the second branch 342 and the third branch 352 are each preferably vertical tubes or approximately vertical, facilitating gas upward flow and liquid downward flow, such that the respective angled second 341 and third 351 main tubes are pressure balanced, which helps to improve temperature uniformity.
As an example, the distribution density of the second branch 342 is greater than the distribution density of the third branch 352. The second branches 342 are not only distributed at one end of the second heat dissipation area B far away from the device 2, but also distributed at the middle area of the second heat dissipation area B. The second heat dissipation area B is mainly a gas-liquid mixing area, a vertical second branch 342 is provided at the root of the tooth of the superconducting heat dissipation plate 3 near the device 2 to communicate with the circular arc-shaped second main pipe 341, and for the purpose of diversion and balance, the circular arc-shaped second main pipe 341 and the communicated second branch 342 ensure that the vapor flows to the far end of the device 2 in time and the liquid flows back to the vicinity of the device 2.
The third branches 352 are distributed only at one end of the third heat dissipation area C away from the device 2 (and at the same time, at one end close to the heat sink substrate 1 mentioned later, the straight distance of the third branches 352 from the heat sink substrate 1 is greater than half of the lateral distance of the second heat dissipation area B). The third heat dissipation area C is mainly a steam condensation area, the distribution amount of the third branch pipes is reduced, the third branch pipes are arranged at one end far away from the device 2 as far as possible, the circular-arc-shaped third main pipeline 351 is additionally arranged, liquid after steam condensation naturally flows to the position near a heat source on the side face of the heat superconducting heat dissipation plate 3 along the third main pipeline 351 by means of gravity, steam after the heat source evaporates the part of condensed liquid working medium flows to the position near the tooth tops far away from the heat source side along the third main pipeline 351, and therefore the condensed liquid is fully utilized to prevent the phenomenon that the local temperature of the heat source is increased due to the fact that the heat source lacks liquid.
Fig. 3 partially illustrates the flow of heat transfer medium 4 in the second heat dissipation area B. It can be seen that the liquid heat transfer working medium 4 is heated in the first heat dissipation area A to generate a gas-liquid mixture, so that the liquid level of the working medium rises to form a gas-liquid mixed surface evaporation area in which rising steam and condensed and refluxed liquid coexist in the second heat dissipation area B, and a heat source (device 2) positioned on the side surface of the second heat dissipation area B transfers heat to the gas-liquid mixed heat transfer working medium 4 in the pipeline, and surface evaporation is carried out on an interface (inner surface of a steam bubble) of the steam bubble and the liquid; the amount of the steam generated in the second heat dissipation area B is large, the amount of the liquid is small, the steam is guided to the tooth crest direction of the heat superconducting heat dissipation plate 3 through the inclined second main pipe 341 to flow, the condensed liquid flows to the tooth root of the heat superconducting plate near the heat source by gravity, and the second branch 342 connected between the second main pipes 341 facilitates the upward flow of the gas and the downward flow of the liquid. (the whole working principle of the heat superconducting radiator please refer to the foregoing)
Example two
As shown in fig. 4, the present invention also provides a heat-superconducting radiator plate 3 of another structure. The thermal superconducting heat sink 3 of the present embodiment is mainly different from the first embodiment in that, in the first embodiment, the second main pipe 341 and the third main pipe 351 are circular arc-shaped pipes, and the arc-shaped protruding directions of the second main pipe 341 and the third main pipe 351 are downward (that is, the side of the second main pipe 341 and the third main pipe 351 with smaller inclination angles is close to the device 2); in this embodiment, although the second main pipeline 341 and the third main pipeline 351 are also circular arc-shaped pipelines, the arc-shaped protrusions of the second main pipeline 341 and the third main pipeline 351 face upward (i.e., the side of the second main pipeline 341 and the third main pipeline 351 with larger inclination angles is close to the device 2). Through the design, the amount of the liquid working medium accumulated in the inclined pipeline close to the device 2 is more, particularly, the phenomenon of drying is not easy to occur in the gas condensation area at the middle upper part of the heat superconducting radiating plate 3, the heat conduction efficiency and the heat dissipation efficiency are better, and the heat conduction temperature equalization performance is better. Except for the difference, other structures of the thermal superconducting heat dissipation plate 3 of the present embodiment are the same as those of the first embodiment, and please refer to the first embodiment for brevity.
The heat superconducting radiating plate 3 can be directly connected with the devices 2 to realize heat dissipation, for example, a plurality of devices 2 can be directly attached to the side wall of the heat superconducting radiating plate 3 and vertically distributed along the longitudinal direction, and the heat dissipation mode through the single heat superconducting radiating plate 3 is particularly suitable for heat dissipation of low-power devices.
EXAMPLE III
As shown in fig. 5 to 7, the present invention further provides a thermal superconducting heat sink, which includes a heat sink substrate 1 and a plurality of thermal superconducting heat dissipation plates 3 according to any one of the first and second embodiments; the radiator substrate 1 is provided with a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing the devices 2 from bottom to top; the plurality of thermal superconducting heat dissipation plates 3 are arranged on the second surface of the heat sink substrate 1 in parallel at intervals, and each thermal superconducting heat dissipation plate 3 extends in the longitudinal direction (that is, the device 2 is located on the side surface of the thermal superconducting heat sink, that is, the thermal superconducting heat sink is heated and conducts heat on the side surface).
As an example, the number of the mounting areas is three, and the three mounting areas correspond to the first heat dissipation area a, the second heat dissipation area B, and the third heat dissipation area C one to one. The number of the devices 2 that can be mounted in a single mounting area may be one or more, and the types of the devices 2 mounted in different mounting areas may be the same or different, which is not limited in this embodiment. Of course, in other examples, more heat dissipation regions may be included according to the number of the devices 2, and the number is not limited in this embodiment. It should be noted that, each heat dissipation area is not completely physically independent, for example, a part of the pipelines of the third heat dissipation area C may extend into the second heat dissipation area B, and the first heat dissipation area a, the second heat dissipation area B and the third heat dissipation area C are located on a complete thermal superconducting heat dissipation plate 3, and the pipelines of each area are formed in the same process.
As an example, the second surface of the heat sink substrate 1 has a groove, and one end of the thermal superconducting heat dissipation plate 3 has a bent portion 31, and the bent portion 31 is inserted into the groove. Specifically, a plurality of slots are distributed at intervals in the channel, the plurality of thermal superconducting heat dissipation plates 3 are inserted into the slots through bending portions 31 in a one-to-one correspondence manner, and the positions of the heat sink substrate 1 corresponding to the first surfaces of the thermal superconducting heat dissipation plates 3 are installation areas where the devices 2 are placed, so that heat dissipated by the devices 2 can be conducted to the thermal superconducting heat sinks as soon as possible through a short path. In this embodiment, each groove is perpendicular to the surface of the heat sink substrate 1, and in practical use, each groove may also be inclined by a certain angle compared to the surface of the heat sink substrate 1, and the perpendicular direction is only used for indicating a direction trend, and does not mean that an included angle of 90 degrees is formed with the horizontal plane in a strict sense, which is not limited in this embodiment.
As an example, a sintered wick heat pipe (not shown) is buried in the heat sink substrate 1. Sintering core heat pipe for by the metal powder sintering of certain mesh number on the inner wall of a metal pipe and the integrative sintering powder tube core of pipe wall that forms, the sintering in metal powder on the metal pipe is inside forms the imbibition core capillary structure, makes sintering core heat pipe has higher capillary suction, makes sintering core heat pipe's heat conduction direction does not receive the influence of gravity, and sintering imbibition core capillary structure has strengthened evaporation heat absorption and condensation and has released heat, has improved the heat conductivility and the transmission power of heat pipe greatly, makes sintering core heat pipe has great axial equivalent coefficient of heat conductivity (be several hundred times to the thousand times of copper). The sintering core heat pipe is embedded in the radiator substrate 1, so that heat generated by a device 2 arranged on the surface of the radiator substrate 1 can be quickly diffused to other positions of the radiator substrate 1, the heat distribution on the radiator substrate 1 is uniform, and the heat dissipation efficiency and the heat dissipation capacity of the radiator can be effectively improved.
As an example, each of the thermal superconducting heat dissipation plates 3 is vertically (or may have a certain inclination, not limited to this embodiment) inserted into the groove, and the thermal superconducting heat dissipation plate 3 may be fixedly connected to the heat sink substrate 1 through any one or more of a mechanical extrusion process, a thermal conductive adhesive bonding process, or a brazing welding process, so as to increase the bonding strength as much as possible, reduce the bonding thermal resistance, and improve the heat dissipation capability and efficiency of the heat sink.
The heat generated when a heat source (device 2) on the surface of the radiator substrate 1 works is rapidly transferred to the whole radiator substrate 1 through the sintering core heat pipe, the radiator substrate 1 rapidly transfers the heat to each thermal superconducting radiating plate 3, the liquid heat transfer working medium 4 is heated to form a pool boiling to generate bubbles, the bubbles rise to bring the heat to a radiating point far away from the heat source, and the condensed heat transfer working medium 4 after heat exchange flows back to perform the next heat exchange.
As an example, a vertical main pipeline 32 is disposed in a region adjacent to the bent portion 31 on the thermal superconducting heat dissipation plate 3 (the vertical main pipeline 32 is substantially adjacent to the heat dissipation substrate 1, and can achieve an effect of rapid heat conduction), the vertical main pipeline 32 is communicated with the first heat dissipation pipeline 33, the second heat dissipation pipeline, and the third heat dissipation pipeline, and certainly, the vertical main pipeline 32 is formed by communicating the first heat dissipation pipeline 33, the second heat dissipation pipeline, and the third heat dissipation pipeline on the same vertical line, and the condensed liquid working medium can be quickly returned to the first heat dissipation region a at the bottom through the vertical main pipeline 32.
The heat superconducting radiator can be used for radiating various electronic devices with high power density, can effectively improve the radiating uniformity and radiating efficiency, and is particularly suitable for radiating 5G communication base station equipment with high integration level, high power, miniaturization, light weight and high heat flow density.
Example four
The invention also provides 5G base station equipment, wherein the 5G base station equipment comprises a device and the thermal superconducting radiator in any embodiment, and the device of the 5G base station equipment is arranged in the installation area of the radiator substrate. For the introduction of the thermal superconducting heat sink, please refer to the first or second embodiment, which is not repeated for brevity. Including but not limited to a radio frequency generator, power amplifier, filter, microprocessor, memory, power manager, etc. The 5G base station equipment disclosed by the invention has the advantages that the heat dissipation efficiency and the heat dissipation uniformity can be greatly improved under the condition of not increasing the volume and the weight of the equipment, and the service life of the equipment is prolonged and the performance of the equipment is improved.
In summary, the present invention provides a thermal superconducting heat sink, a heat sink and a 5G base station device. The heat superconducting radiating plate comprises a first radiating area and a second radiating area positioned on the upper part of the first radiating area; first heat dissipation pipelines are distributed in the first heat dissipation area and distributed in a polygonal honeycomb shape; second heat dissipation pipelines are distributed in the second heat dissipation area and comprise a plurality of second main pipelines and a plurality of second branches connected among the second main pipelines, the second main pipelines extend along the width direction of the heat superconducting heat dissipation plate, and one ends, far away from devices, of the second main pipelines incline towards the direction departing from the first heat dissipation area; the first heat dissipation pipeline and the second heat dissipation pipeline are communicated with each other and are both heat superconducting heat dissipation pipelines, heat transfer working media are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media in the first heat dissipation pipeline comprise liquid. The invention solves the problems of local dry and high temperature of an upper heat source in a heat superconducting heat radiation plate due to the shortage of liquid heat conducting working medium by improving the optimized structural design of the heat superconducting pipeline, can obviously improve the heat radiation uniformity and the heat radiation efficiency while reducing the total amount of the heat conducting working medium and the weight and the volume of the heat superconducting heat radiation plate/radiator, and can fully meet the development requirements of miniaturization, light weight, high integration degree, uniform temperature and the like of 5G base station equipment. The 5G base station equipment based on the thermal superconducting radiator can obviously improve the heat dissipation performance, and is beneficial to prolonging the service life of the equipment and improving the performance of the equipment. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A heat-superconducting heat-dissipating plate, characterized in that the heat-superconducting heat-dissipating plate comprises a first heat-dissipating region and a second heat-dissipating region located above the first heat-dissipating region; first heat dissipation pipelines are distributed in the first heat dissipation area and distributed in a polygonal honeycomb shape; second heat dissipation pipelines are distributed in the second heat dissipation area and comprise a plurality of second main pipelines and a plurality of second branches connected among the second main pipelines, the second main pipelines extend along the width direction of the heat superconducting heat dissipation plate, and one ends, far away from devices, of the second main pipelines incline towards the direction departing from the first heat dissipation area; the first heat dissipation pipeline and the second heat dissipation pipeline are communicated with each other and are both heat superconducting heat dissipation pipelines, heat transfer working media are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media in the first heat dissipation pipeline comprise liquid.
2. The thermal superconducting heat sink of claim 1, wherein: the heat superconducting radiating plate further comprises a third radiating area positioned at the upper part of the second radiating area, third radiating pipelines are distributed in the third radiating area and comprise a plurality of third main pipelines and third branches connected among the third main pipelines, the third main pipelines extend along the width direction of the heat superconducting radiating plate, one end, far away from the device, of each third main pipeline inclines towards the direction far away from the second radiating area, and the third branches are positioned at one end, far away from the device, of each third radiating area; the third heat dissipation pipeline is communicated with the second heat dissipation pipeline and is a thermal superconducting heat dissipation pipeline.
3. Thermal superconducting cooling plate according to claim 2, characterized in that: the sum of the heights of the first heat dissipation area and the second heat dissipation area accounts for 50% -70% of the height of the heat superconducting heat dissipation plate, and heat transfer working media in the second heat dissipation pipeline and the third heat dissipation pipeline are gaseous substances.
4. Thermal superconducting cooling plate according to claim 2, characterized in that: the second main pipeline and the third main pipeline are arc-shaped pipelines, and arc-shaped bulges of the second main pipeline and the third main pipeline face downwards.
5. Thermal superconducting cooling plate according to claim 2, characterized in that: the second main pipeline and the third main pipeline are arc-shaped pipelines, and arc-shaped bulges of the second main pipeline and the third main pipeline are upward.
6. Thermal superconducting cooling plate according to claim 2, characterized in that: the first heat dissipation pipelines are distributed in a hexagonal honeycomb shape; the second branch and the third branch are vertical pipelines, and the distribution density of the second branch is greater than that of the third branch.
7. A thermal superconducting heat sink, comprising a heat sink substrate and a plurality of thermal superconducting heat sink plates according to any one of claims 1 to 6; the radiator substrate is provided with a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing devices from bottom to top; the plurality of heat superconducting radiating plates are arranged on the second surface of the radiator substrate in parallel at intervals in the transverse direction, and each heat superconducting radiating plate extends along the longitudinal direction.
8. The thermal superconducting heat sink of claim 7, wherein: the second surface of the radiator substrate is provided with a groove channel, one end of the heat superconducting radiating plate is provided with a bending part, and the bending part is inserted into the groove channel.
9. The thermal superconducting heat sink of claim 7, wherein: the number of the mounting areas is three, and the three mounting areas correspond to the first heat dissipation area, the second heat dissipation area and the third heat dissipation area one to one.
10. A5G base station device, the 5G base station device comprising means characterized by: the 5G base station apparatus further comprising a thermal superconducting heat sink according to any one of claims 7 to 9, the devices of the 5G base station apparatus being disposed at a mounting area of the heat sink substrate.
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| CN202010345046.2A CN111609743A (en) | 2020-04-27 | 2020-04-27 | Heat superconducting radiating plate, radiator and 5G base station equipment |
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| CN202010345046.2A CN111609743A (en) | 2020-04-27 | 2020-04-27 | Heat superconducting radiating plate, radiator and 5G base station equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024001179A1 (en) * | 2022-06-29 | 2024-01-04 | 中兴通讯股份有限公司 | Heat conduction plate, heat dissipation apparatus, and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024001179A1 (en) * | 2022-06-29 | 2024-01-04 | 中兴通讯股份有限公司 | Heat conduction plate, heat dissipation apparatus, and electronic device |
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