US20200116437A1 - Vapor chamber based on flat plate loop heat pipe - Google Patents

Vapor chamber based on flat plate loop heat pipe Download PDF

Info

Publication number
US20200116437A1
US20200116437A1 US16/658,150 US201916658150A US2020116437A1 US 20200116437 A1 US20200116437 A1 US 20200116437A1 US 201916658150 A US201916658150 A US 201916658150A US 2020116437 A1 US2020116437 A1 US 2020116437A1
Authority
US
United States
Prior art keywords
heat
vapor chamber
flat plate
evaporator
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US16/658,150
Inventor
Hongxing Zhang
Guanglong MAN
Jinyin HUANG
Guoguang Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Institute of Spacecraft System Engineering
Original Assignee
Beijing Institute of Spacecraft System Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201710257571.7 priority Critical
Priority to CN201710257571.7A priority patent/CN107131784B/en
Priority to PCT/CN2017/000655 priority patent/WO2018191836A1/en
Application filed by Beijing Institute of Spacecraft System Engineering filed Critical Beijing Institute of Spacecraft System Engineering
Publication of US20200116437A1 publication Critical patent/US20200116437A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes

Abstract

The present disclosure discloses a vapor chamber based on a flat plate loop heat pipe. The flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line is pre-buried in an aluminum alloy plate, so as to form the vapor chamber based on the flat plate loop heat pipe. The evaporator of the flat plate loop heat pipe is arranged in a region, attached to a biggest heat source of a chip to be subjected to heat dissipation, on the vapor chamber, and the side, provided with a vapor channel, of the evaporator is attached to the biggest heat source.

Description

    CROSS REFERENCE TO RELATED APPLICATION
  • This application is a continuation of international application PCT/CN2017/000655, filed Oct. 31, 2017, which claims priority to Chinese Patent Application No. 201710257571.7 filed Apr. 19, 2017. The disclosures of these prior-filed applications are incorporated by reference in their entireties.
  • FIELD
  • The present disclosure relates to a vapor chamber, and more particularly, to a vapor chamber based on a flat plate loop heat pipe, and belongs to the technical field of electronic equipment heat dissipation.
  • BACKGROUND
  • A loop heat pipe is high-efficiency two-phase heat transfer equipment, and has the characteristics of high heat transfer performance, long-distance heat transfer, good temperature control, bending arbitrariness, convenience in installation, etc. Due to many advantages beyond comparison over other types of heat transfer equipment, the loop heat pipe has a very broad application prospect in many fields such as aviation, aerospace and ground electronic equipment heat dissipation.
  • As shown in FIG. 1, the loop heat pipe mainly includes an evaporator 1, a condenser 2, a reservoir 3, a vapor line 4 and a liquid line 5. The whole cycle is as follows: liquid is evaporated on the outer surface of a capillary wick 6 in the evaporator 1, and absorbs heat outside the evaporator 1, and then generates vapor flows from the vapor line 4 to the condenser 2, and releases the heat in the condenser 2 to a heat sink, so as to condense the vapor into liquid, and finally the liquid flows into the reservoir 3 through the liquid line 5. A liquid working fluid in the reservoir 3 is maintained being supplied to the capillary wick in the evaporator 1.
  • Because of the small space required for installation of a flat plate loop heat pipe, and the convenience of installing a flat plate evaporator and a heat source plane, it has been a research hotspot and a key application direction in recent years. Based on structures, flat plate loop heat pipes mainly fall into two forms. The first form is a disc-shaped flat plate loop heat pipe, where the evaporator is in a disc shape, and the evaporator and the reservoir are separated by a capillary wick. The second form is a rectangular flat plate loop heat pipe, where the reservoir is arranged on one side of the evaporator.
  • A Vapor Chamber (VC) usually adopts a flat plate structure provided with a capillary wick. After the VC is filled with a working fluid, temperature equalization is realized through a gas-liquid phase change of the working fluid. When the VC is used, heat sources (a chip or equipment) is attached to the VC, and heat conductive filler is used in the installation interface. There are mainly two application forms:
  • 1) a heat conductive VC: heat of one or more heat sources is conducted to one side or two sides (heat sink attached region as shown in FIG. 2) of a heat spreading plate, and then the heat is carried away in other heat dissipation modes (water cooling, heat conduction and the like), as shown in FIG. 2; and
  • (2) a heat spreading VC: heat of one or more heat sources is uniformly spread into other non-heat source regions of the whole VC to play a temperature equalization role and enlarge the heat dissipation area, and then the heat is carried away in other heat dissipation modes such as air cooling or heat conduction, as shown in FIG. 3.
  • However, the application of the VC has the following issues: there is a conflict between improvement of the product properties and the requirement for the capillary wick. On the one hand, in order to improve certain properties, it is desired that the capillary diameter is as small as possible, because reducing of the capillary diameter of the capillary wick can improve the maximum heat transfer capability, increase the maximum heat flux, improve the anti-overload and anti-gravity working capability and increase the size of the VC. On the other hand, in order to improve part of the properties, it is required that the capillary wick obtains a relatively high permeability by using a relatively large diameter and then increases the size of the VC, that is, increases the length of the flow, so the flowing resistance needs to be reduced, or decreases the thickness of the VC, that is, decreases the flowing sectional area, so the flowing resistance needs to be reduced.
  • SUMMARY
  • In view of the above, the present disclosure provides a vapor chamber based on a flat plate loop heat pipe, so as to improve the heat transfer capability, the maximum heat flux and the anti-overload and anti-gravity working capability of the vapor chamber, increase the size of a heat spreading plate and decrease the thickness of the vapor chamber, and solve a conflicting requirement between the improvement of the properties of the vapor chamber and the diameter of the capillary wick.
  • In the vapor chamber based on the flat plate loop heat pipe, the vapor chamber is attached to heat sources, and includes: a heat spreading plate and a flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line. The flat plate loop heat pipe is pre-buried in the heat spreading plate. The evaporator is arranged on the heat spreading plate at the position of attachment to the biggest heat source in the heat sources. The reservoir is used to supply liquid to the evaporator. Positions on the heat spreading plate that are attached to other heat sources except the biggest heat source in the heat sources are used as “heat source attached regions”, and positions on the heat spreading plate that are not attached to the heat sources, are used as “heat sink attached regions”. The gas/liquid line leading out from an outlet of the evaporator is disposed in a meandering fashion between the “heat source attached regions” and the “heat sink attached regions” on the heat spreading plate, so that a liquid working fluid enters the “heat sink attached regions” after absorbing heat of the “heat source attached regions” and being evaporated into vapor, and a gas working fluid releases heat in the “heat sink attached regions” and is condensed into liquid; and circulation is performed hereby, and the working fluid finally flows back into the reservoir after being condensed by the “heat sink attached regions” into liquid, thereby forming a loop.
  • As a preferable implementation of the present invention, cold sources are arranged in the “heat sink attached regions” on one side or two sides of the heat spreading plate. The gas/liquid line led out from the outlet of the evaporator is disposed in a meandering fashion between the “heat sink attached regions” and the “heat source attached regions” on the heat spreading plate.
  • As a preferable implementation of the present invention, the reservoir is suspended, and is not connected with the heat spreading plate in a heat conduction manner.
  • As a preferable implementation of the present invention, the evaporator is exposed and directly attached to the biggest heat source in the heat sources.
  • As a preferable implementation of the present invention, the gas/liquid line is firstly formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and then pre-buried in the heat spreading plate in a gluing or welding manner.
  • Beneficial effects.
  • (1) The flat plate loop heat pipe may use a small-diameter capillary wick to provide higher capillary force, and external loops are all bare pipes without capillary wicks, so that the flowing resistance is low; and finally the heat transfer capability, the maximum heat flux heat dissipation capability and the anti-overload and anti-gravity working capability of the vapor chamber may be improved, the size of the heat spreading plate may be increased, and the thickness of the vapor chamber may be decreased.
  • (2) Compared with a traditional vapor chamber structure, the vapor chamber of the present disclosure has the advantages that the thickness of the vapor chamber is decreased by downsizing the evaporator and the line of the flat plate loop heat pipe, so as to satisfy an application occasion with a smaller installation space.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a structural schematic diagram of a loop heat pipe;
  • FIG. 2 is a heat conduction schematic diagram of a heat conductive vapor chamber;
  • FIG. 3 is a heat conduction schematic diagram of a heat spreading vapor chamber;
  • FIGS. 4 and 5 are heat conduction schematic diagrams of a heat conductive vapor chamber based on a flat plate loop heat pipe; and
  • FIGS. 6 and 7 are heat conduction schematic diagrams of a heat spreading vapor chamber based on a flat plate loop heat pipe.
  • In the drawings, 1: evaporator; 2: condenser; 3: reservoir; 4: vapor line; 5: liquid line; 6: capillary wick; and 7: gas/liquid line
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • The present disclosure is described in detail below in combination with accompanying drawings and embodiments.
  • The present embodiment provides a vapor chamber based on a flat plate loop heat pipe, which may solve a conflicting requirement of the improvement of the properties of the vapor chamber for the diameter of a capillary wick.
  • Embodiment 1: Heat Conductive Vapor Chamber
  • As shown in FIGS. 4 and 5, a flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line is pre-buried in an aluminum alloy heat spreading plate in a gluing or welding manner to form a vapor chamber based on the flat plate loop heat pipe. The vapor chamber is attached to a circuit board to be subjected to heat dissipation, so that the evaporator of the flat plate loop heat pipe is arranged in a region, attached to a biggest heat source (namely a position with the greatest heat generation amount of the circuit board) of the circuit board, on the vapor chamber. The side, provided with a vapor channel, of the evaporator is attached to the biggest heat source. The evaporator may be pre-buried into the aluminum alloy heat spreading plate, or is only fixed in the aluminum alloy heat spreading plate. The evaporator is exposed and directly attached to the biggest heat source. The liquid reservoir of the flat plate loop heat pipe is suspended, and is not connected with the aluminum alloy heat spreading plate in a heat conduction manner, so as to prevent heat leakage to the reservoir. “Heat sink attached regions” and “heat source attached regions” are arranged on the vapor chamber. The “heat source attached regions” are regions attached to heat sources (except the biggest heat source) on the circuit board, and the “heat sink attached regions” are regions adopting a cooling mode (cold sources) on the back surface of the vapor chamber, as shown in FIG. 5. The gas/liquid line led out from an outlet of the evaporator is disposed in a meandering manner between the “heat sink attached regions” and the “heat source attached regions” on the vapor chamber. The gas/liquid line finally passes through the “heat sink attached regions” and then returns to the reservoir of the flat plate loop heat pipe, as shown in FIG. 4. The gas/liquid line may be first formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and then pre-buried in the aluminum alloy heat spreading plate in a gluing or welding manner.
  • Working principle: since the evaporator of the flat plate loop heat pipe is attached to the biggest heat source, liquid is evaporated into vapor in the evaporator, and the vapor flows to the “heat sink attached regions” and releases heat, and then is condensed into liquid. Since the gas/liquid line is disposed in a meandering fashion between the “heat source attached regions” and the “heat sink attached regions”, a liquid working fluid absorbs heat in the “heat source attached regions” and then is evaporated into vapor, and the vapor releases heat in the “heat sink attached regions” and then is condensed into liquid. This cycle is performed for multiple times, and finally the working fluid flows back into the reservoir after being condensed by the “heat sink attached regions” into the liquid. In such cycle operation, a function of conducting the heat of one or more heat sources to the “heat sink attached regions” is realized.
  • Embodiment 2: Heat Spreading Vapor Chamber
  • A main difference of the heat spreading vapor chamber from the heat conductive vapor chamber is that: except “heat source attached regions” on the vapor chamber, other regions in no contact with heat sources are all used as “heat sink attached regions”. Therefore, a gas/liquid line is disposed in a meandering fashion between the “heat source attached regions” and other regions. The working principle of the heat spreading vapor chamber is the same as that of the heat conductive vapor chamber.
  • The above contents are merely preferred embodiments of the present invention, but not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. that are made without departing from the spirit and principle of the present disclosure shall all fall within the protection scope of the present disclosure.

Claims (10)

1. A vapor chamber based on a flat plate loop heat pipe, wherein the vapor chamber is attached to heat sources, comprising:
a heat spreading plate; and
a flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line;
wherein the flat plate loop heat pipe is pre-buried in the heat spreading plate; wherein the evaporator is arranged on the heat spreading plate at the position of attachment to the biggest heat source in the heat sources; wherein the reservoir is used to supply liquid to the evaporator; positions on the heat spreading plate that are attached to other heat sources except the biggest heat source in the heat sources are used as “heat source attached regions”, and positions on the heat spreading plate that are not attached to the heat sources are used as “heat sink attached regions”; wherein the gas/liquid line leading out from an outlet of the evaporator is disposed in a meandering fashion between the “heat source attached regions” and the “heat sink attached regions” on the heat spreading plate, so that a liquid working fluid enters the “heat sink attached regions” after absorbing heat of the “heat source attached regions” and being evaporated into vapor, and a gas working fluid releases heat in the “heat sink attached regions” and is condensed into liquid; and circulation is performed hereby, and the working fluid finally flows back into the reservoir after being condensed by the “heat sink attached regions” into liquid, thus forming a loop.
2. The vapor chamber based on the flat plate loop heat pipe according to claim 1, wherein cold sources are arranged in the “heat sink attached regions” on one side or two sides of the heat spreading plate; and the gas/liquid line leading out from the outlet of the evaporator is disposed in a meandering fashion between the “heat sink attached regions” and the “heat source attached regions” on the heat spreading plate.
3. The vapor chamber based on the flat plate loop heat pipe according to claim 1, wherein the liquid reservoir is suspended, and is not connected with the heat spreading plate in a heat conduction manner.
4. The vapor chamber based on the flat plate loop heat pipe according to claim 1, wherein the evaporator is exposed and directly attached to the biggest heat source in the heat sources.
5. The vapor chamber based on the flat plate loop heat pipe according to claim 1, wherein the gas/liquid line is formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and pre-buried in the heat spreading plate in a gluing or welding manner.
6. The vapor chamber based on the flat plate loop heat pipe according to claim 1, wherein the heat spreading plate is an aluminum alloy plate.
7. The vapor chamber based on the flat plate loop heat pipe according to claim 2, wherein the liquid reservoir is suspended, and is not connected with the heat spreading plate in a heat conduction manner.
8. The vapor chamber based on the flat plate loop heat pipe according to claim 2, wherein the evaporator is exposed and directly attached to the biggest heat source in the heat sources.
9. The vapor chamber based on the flat plate loop heat pipe according to claim 2, wherein the gas/liquid line is formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and pre-buried in the heat spreading plate in a gluing or welding manner.
10. The vapor chamber based on the flat plate loop heat pipe according to claim 2, wherein the heat spreading plate is an aluminum alloy plate.
US16/658,150 2017-04-19 2019-10-20 Vapor chamber based on flat plate loop heat pipe Pending US20200116437A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201710257571.7 2017-04-19
CN201710257571.7A CN107131784B (en) 2017-04-19 2017-04-19 Soaking plate based on plate loop circuit heat pipe
PCT/CN2017/000655 WO2018191836A1 (en) 2017-04-19 2017-10-31 Flat loop heat pipe-based vapor chamber

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/000655 Continuation WO2018191836A1 (en) 2017-04-19 2017-10-31 Flat loop heat pipe-based vapor chamber

Publications (1)

Publication Number Publication Date
US20200116437A1 true US20200116437A1 (en) 2020-04-16

Family

ID=59715699

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/658,150 Pending US20200116437A1 (en) 2017-04-19 2019-10-20 Vapor chamber based on flat plate loop heat pipe

Country Status (4)

Country Link
US (1) US20200116437A1 (en)
EP (1) EP3614089A4 (en)
CN (1) CN107131784B (en)
WO (1) WO2018191836A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10831249B2 (en) * 2017-03-02 2020-11-10 Huawei Technologies Co., Ltd. Heat conduction component and mobile terminal

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107131784B (en) * 2017-04-19 2019-07-12 北京空间飞行器总体设计部 Soaking plate based on plate loop circuit heat pipe
CN112113450A (en) * 2020-09-16 2020-12-22 武汉大学 Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2372785Y (en) * 1999-05-28 2000-04-05 郭清松 Radiator for electrical equipment
CN101043806A (en) * 2006-03-20 2007-09-26 建准电机工业股份有限公司 Combined heat radiating module
CN201044554Y (en) * 2007-02-07 2008-04-02 中国科学院工程热物理研究所 Water cooling type microflute group and thermoelectricity composite laser thermal control system
CN101487584A (en) * 2009-02-25 2009-07-22 华南理工大学 Heat radiating module for high-power LED lamp
US9546826B1 (en) * 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
WO2011130313A1 (en) * 2010-04-12 2011-10-20 The Curators Of The University Of Missouri Multiple thermal circuit heat spreader
WO2012059975A1 (en) * 2010-11-01 2012-05-10 富士通株式会社 Loop-shaped heat pipe and electronic device equipped with same
CN102819303A (en) * 2011-06-09 2012-12-12 鸿富锦精密工业(深圳)有限公司 Computer case
CN202630760U (en) * 2012-05-14 2012-12-26 南昌大学 LED (Light Emitting Diode) heating panel type pulse heat pipe
CN103824826B (en) * 2014-02-21 2017-01-04 电子科技大学 A kind of fluid channel heat dissipating method
TWI580921B (en) * 2014-05-09 2017-05-01 財團法人工業技術研究院 Pulsating multi-pipe heat pipe
CN107131784B (en) * 2017-04-19 2019-07-12 北京空间飞行器总体设计部 Soaking plate based on plate loop circuit heat pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10831249B2 (en) * 2017-03-02 2020-11-10 Huawei Technologies Co., Ltd. Heat conduction component and mobile terminal

Also Published As

Publication number Publication date
EP3614089A4 (en) 2021-01-06
WO2018191836A1 (en) 2018-10-25
EP3614089A1 (en) 2020-02-26
CN107131784B (en) 2019-07-12
CN107131784A (en) 2017-09-05

Similar Documents

Publication Publication Date Title
US20200116437A1 (en) Vapor chamber based on flat plate loop heat pipe
CA2687005C (en) A heat transfer device combining a flatten loop heat pipe and a vapor chamber
WO2017148197A1 (en) Heat-dissipation apparatus
JPWO2011122332A1 (en) Phase change cooler and electronic device equipped with the same
CN100370890C (en) Highly effective flat-type loop heat-pipe apparatus
TW200643362A (en) Loop-type heat exchange apparatus
TWM450187U (en) Circulation type thermosyphon heat dissipation device
CN104851857A (en) Chip cooling system
CN205783400U (en) The radiating subassembly of air-conditioner outdoor unit and air-conditioner outdoor unit
CN110848822A (en) Radiating component, radiator and air conditioner
US20130312938A1 (en) Heat pipe with vaporized working fluid flow accelerator
WO2018191834A1 (en) Flat loop heat pipe-based notebook computer cooling system
WO2019037392A1 (en) Radiator, outdoor unit, and air conditioner
US20070034358A1 (en) Heat dissipation device
CN101566748B (en) Radiating module and backlight module adopting same
US20190226769A1 (en) Vapor-liquid phase fluid heat transfer module
CN100580362C (en) Modified duct heater heat dispersion system
US20140055954A1 (en) Heat pipe structure, and thermal module and electronic device using same
CN108362148A (en) Combined type cold plate
CN205424865U (en) High -power LED phase change heat sink
TWM513991U (en) Refrigerant type heat dissipation device
CN204131905U (en) Electronic equipment
CN204333037U (en) For the heat exchange of heat pipe of semiconductor chip heat radiation
CN204165434U (en) Heat pipe
CN102646651A (en) Thin hot plate structure

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED