CN203288578U - Dissipation sheet module with microgroove flat heat tubes - Google Patents
Dissipation sheet module with microgroove flat heat tubes Download PDFInfo
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- CN203288578U CN203288578U CN2013202649614U CN201320264961U CN203288578U CN 203288578 U CN203288578 U CN 203288578U CN 2013202649614 U CN2013202649614 U CN 2013202649614U CN 201320264961 U CN201320264961 U CN 201320264961U CN 203288578 U CN203288578 U CN 203288578U
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- heat pipe
- microflute group
- plate heat
- group flat
- sheet module
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Abstract
The utility model provides a dissipation sheet module with microgroove flat heat tubes. The dissipation sheet module comprises an upper base plate, a lower base plate, and heat dissipation fins arranged between the upper base plate and the lower base plate, wherein the heat dissipation fins are the microgroove flat heat tubes. The dissipation sheet module provided by the utility model has the advantages of being high in heat exchange efficiency, good in heat dissipation performance, and capable of effectively reducing the junction temperatures of heating components such as IGBT (insulated gate bipolar translator).
Description
Technical field
The utility model relates to the loose sheet module of a kind of microflute group flat-plate heat pipe, is used for the heat radiation of IGBT.
Background technology
Along with the develop rapidly of the industries such as communication, power electronics, green energy resource, wherein the heating power of electronic element used is also improving constantly, and utilizes traditional radiating subassembly to be difficult to well solve relevant hot arraign topic.
Traditional heat radiation, mainly with the thermal source radiation fin, is dispelled the heat by the mode that heat exchange is discharged the system outside with heat; Current industry mainly adopts the radiating module form that is comprised of fin+fan, and its heat conduction path is as follows: thermal source (IGBT) → fin (HeatSink) → heat is taken away by fan (forced convertion).in the industries such as power electronics, the caloric value of IGBT heating module is increasing, often reach several kilowatts, even higher, have higher density of heat flow rate and larger hot transmission quantity, as shown in Figure 1, for traditional IGBT radiating module schematic diagram, described traditional IGBT fin comprises fin substrate 1 and the fin fin 2 that is attached thereto, the heat that the IGBT heater element produces is passed to fin substrate 1, conduct to afterwards fin fin 2 surfaces, and by cross-ventilation, heat is taken away, because the conductive coefficient of fin is relatively low, cause the heat exchanger effectiveness of fin relatively low, so the heat loss that is difficult to well IGBT7 be produced falls, thereby cause IGBT heater element junction temperature to raise.Has larger temperature gradient by fin substrate 1 to fin fin 2 heat transmission.Especially near fin fin 2 surface area, along with fin fin 2 highly constantly rises, fin fin 2 surface temperatures are more and more lower, thereby cause fin fin 2 and the heat exchanger effectiveness of air constantly to reduce, and cause the radiating efficiency of fin significantly to reduce.
Summary of the invention
The technical problems to be solved in the utility model is the IGBT radiating module that thermal resistance is little, thermal response is quick, heat output is large, lightweight, volume is little, simple in structure, structural strength is large.
In order to solve the problems of the technologies described above, the technical solution of the utility model has been to provide the loose sheet module of a kind of microflute group flat-plate heat pipe, it is characterized in that, comprise upper substrate, infrabasal plate and be located at upper substrate and infrabasal plate between radiating fin, wherein, described radiating fin is microflute group flat-plate heat pipe.
Preferably, the thickness of described upper substrate and infrabasal plate all is controlled at 10.0mm～25.0mm, and the thickness of microflute group flat-plate heat pipe is 1.0mm～8.0mm, and width is 10.0mm～120.0mm, and length all is controlled at 40.0mm～350.0mm.
Preferably, described upper substrate and infrabasal plate all are provided with groove, and the two ends up and down of microflute group flat-plate heat pipe all are located in groove.
More preferably, the severity control of described groove is at 3.0mm～15.0mm.
the production method of the loose sheet module of above-mentioned microflute group flat-plate heat pipe, it is characterized in that, concrete steps are: at the lower surface of upper substrate and the upper surface of infrabasal plate, offer groove, the width of groove meets: after microflute group flat-plate heat pipe inserts groove, the clearance control of the inwall of microflute group flat-plate heat pipe and groove is between 0.05mm～0.25mm, upper substrate and infrabasal plate are cleaned, decontamination, after deoiling, insert soft soldering flux in groove, and utilize location and welding fixture that microflute group flat-plate heat pipe is inserted in groove, toast afterwards welding, baking temperature is controlled at 80 ℃～160 ℃, stoving time is controlled at 0.5hr～1.0hr, cooling, obtain the loose sheet module of microflute group flat-plate heat pipe.
The utility model has the advantages that heat exchanger effectiveness is high, perfect heat-dissipating, can effectively reduce the junction temperature of the heater elements such as IGBT.
Description of drawings
Fig. 1 is traditional IGBT radiating module schematic diagram;
Fig. 2 is microflute group flat-plate heat pipe fundamental diagram;
Fig. 3 is microflute group flat-plate heat pipe front view;
Fig. 4 is microflute group flat-plate heat pipe end view;
Fig. 5 is the loose sheet modular structure schematic diagram of microflute group flat-plate heat pipe.
Embodiment
, for the utility model is become apparent, hereby with preferred embodiment, and coordinate accompanying drawing to be described in detail below.
Embodiment 1
As shown in Figure 5, for the loose sheet modular structure schematic diagram of microflute group flat-plate heat pipe, the loose sheet module of described microflute group flat-plate heat pipe comprise upper substrate 3, infrabasal plate 4 and be located at upper substrate 3 and infrabasal plate 4 between radiating fin, wherein, described radiating fin is microflute group flat-plate heat pipe 5.The thickness of described upper substrate 3 and infrabasal plate 4 all is controlled at 10.0mm, and the thickness of microflute group flat-plate heat pipe 5 is 1.0mm, and width is 10.0mm, and length all is controlled at 40.0mm.The upper surface of the lower surface of described upper substrate 3 and infrabasal plate 4 all is provided with groove 6, and the two ends up and down of microflute group flat-plate heat pipe 5 all are located in groove 6.The severity control of described groove 6 is at 3.0mm.
As shown in Figure 3, be microflute group flat-plate heat pipe front view, Fig. 4 is its end view, and microflute group flat-plate heat pipe 5 is a kind of heat conducting elements with heat superconducting performance.The apparent heat conductivity of microflute group flat-plate heat pipe 5 is 10,000 times of left and right of same metal material pyroconductivity, 5～20 times of exchange capability of heat with conventional heat pipe of same surface area, bearing capacity is more than 10～20 times of the latter, and cost only has below 1/5 of conventional heat pipe.As shown in Figure 2, be microflute group flat-plate heat pipe fundamental diagram, microflute group flat-plate heat pipe 5 comprises housing 51, is provided with fluid passage 52 and steam channel 53 in housing 51, during use, will be pumped into 1.0 * 10 in housing 51
-2Fill with appropriate hydraulic fluid sealing after the negative pressure of Pa.One end of housing 51 is evaporation section (bringing-up section) 54, and middle part is adiabatic section 55, and the other end is condensation segment (cooling section) 56.Hydraulic fluid carburation by evaporation when one end of housing 51 is heated, steam flows to the other end and emits heat and condense into liquid under small pressure reduction, liquid flows back to evaporation section along gravity direction, and so endlessly, heat Q reaches the other end by an end of microflute group flat-plate heat pipe 5 in circulation.Microflute group flat-plate heat pipe has the characteristics such as thermal resistance is little, thermal response is quick, heat output is large, lightweight, volume is little, simple in structure, structural strength is large.
the production method of the loose sheet module of above-mentioned microflute group flat-plate heat pipe is: at the lower surface of upper substrate 3 and the upper surface of infrabasal plate 4, offer groove 6, the width of groove 6 meets: after microflute group flat-plate heat pipe 5 inserts groove 6, the clearance control of the inwall of microflute group flat-plate heat pipe 5 and groove 6 is at 0.05mm, upper substrate 3 and infrabasal plate 4 are cleaned, decontamination, after deoiling, insert soft soldering flux in groove 6, and utilize location and welding fixture that microflute group flat-plate heat pipe 5 is inserted in groove 6, toast afterwards welding, baking temperature is controlled at 80 ℃, stoving time is controlled at 1.0hr, cooling, obtain the loose sheet module of microflute group flat-plate heat pipe.
Thermal resistance is little, thermal response is quick, heat output is large, have the characteristics such as higher conductive coefficient (for 10,000 times of left and right of same metal material pyroconductivity) along the heat transfer direction because microflute group flat-plate heat pipe 5 has; The loose sheet Modular surface of microflute group flat-plate heat pipe has very little temperature gradient.The loose upper and lower surf zone fin surface of the sheet module temperature difference of microflute group flat-plate heat pipe is very little, thereby the fine heat exchanger effectiveness that improves the loose sheet module of microflute group flat-plate heat pipe, significantly improve the loose sheet module heat dissipating performance of microflute group flat-plate heat pipe, effectively reduced the junction temperature of the heater elements such as IGBT.
Embodiment 2
As shown in Figure 5, for the loose sheet modular structure schematic diagram of microflute group flat-plate heat pipe, the loose sheet module of described microflute group flat-plate heat pipe comprise upper substrate 3, infrabasal plate 4 and be located at upper substrate 3 and infrabasal plate 4 between radiating fin, wherein, described radiating fin is microflute group flat-plate heat pipe 5.The thickness of described upper substrate 3 and infrabasal plate 4 all is controlled at 25mm, and the thickness of microflute group flat-plate heat pipe 5 is 8.0mm, and width is 120.0mm, and length all is controlled at 350.0mm.The upper surface of the lower surface of described upper substrate 3 and infrabasal plate 4 all is provided with groove 6, and the two ends up and down of microflute group flat-plate heat pipe 5 all are located in groove 6.The severity control of described groove 6 is at 15.0mm.
As shown in Figure 3, be microflute group flat-plate heat pipe front view, Fig. 4 is its end view, and microflute group flat-plate heat pipe 5 is a kind of heat conducting elements with heat superconducting performance.The apparent heat conductivity of microflute group flat-plate heat pipe 5 is 10,000 times of left and right of same metal material pyroconductivity, 5～20 times of exchange capability of heat with conventional heat pipe of same surface area, bearing capacity is more than 10～20 times of the latter, and cost only has below 1/5 of conventional heat pipe.As shown in Figure 2, be microflute group flat-plate heat pipe fundamental diagram, microflute group flat-plate heat pipe 5 comprises housing 51, is provided with fluid passage 52 and steam channel 53 in housing 51, during use, will be pumped into 1.0 * 10 in housing 51
-3Fill with appropriate hydraulic fluid sealing after the negative pressure of Pa.One end of housing 51 is evaporation section (bringing-up section) 54, and middle part is adiabatic section 55, and the other end is condensation segment (cooling section) 56.Hydraulic fluid carburation by evaporation when one end of housing 51 is heated, steam flows to the other end and emits heat and condense into liquid under small pressure reduction, liquid flows back to evaporation section along gravity direction, and so endlessly, heat Q reaches the other end by an end of microflute group flat-plate heat pipe 5 in circulation.Microflute group flat-plate heat pipe has the characteristics such as thermal resistance is little, thermal response is quick, heat output is large, lightweight, volume is little, simple in structure, structural strength is large.
the production method of the loose sheet module of above-mentioned microflute group flat-plate heat pipe is: at the lower surface of upper substrate 3 and the upper surface of infrabasal plate 4, offer groove 6, the width of groove 6 meets: after microflute group flat-plate heat pipe 5 inserts groove 6, the clearance control of the inwall of microflute group flat-plate heat pipe 5 and groove 6 is between 0.25mm, upper substrate 3 and infrabasal plate 4 are cleaned, decontamination, after deoiling, insert soft soldering flux in groove 6, and utilize location and welding fixture that microflute group flat-plate heat pipe 5 is inserted in groove 6, toast afterwards welding, baking temperature is controlled at 160 ℃, stoving time is controlled at 0.5hr, cooling, obtain the loose sheet module of microflute group flat-plate heat pipe.
Thermal resistance is little, thermal response is quick, heat output is large, have the characteristics such as higher conductive coefficient (for 10,000 times of left and right of same metal material pyroconductivity) along the heat transfer direction because microflute group flat-plate heat pipe 5 has; The loose sheet Modular surface of microflute group flat-plate heat pipe has very little temperature gradient.The loose upper and lower surf zone fin surface of the sheet module temperature difference of microflute group flat-plate heat pipe is very little, thereby the fine heat exchanger effectiveness that improves the loose sheet module of microflute group flat-plate heat pipe, significantly improve the loose sheet module heat dissipating performance of microflute group flat-plate heat pipe, effectively reduced the junction temperature of the heater elements such as IGBT.
Claims (4)
1. the loose sheet module of a microflute group flat-plate heat pipe, it is characterized in that, comprise upper substrate (3), infrabasal plate (4) and be located at upper substrate (3) and infrabasal plate (4) between radiating fin, wherein, described radiating fin is microflute group flat-plate heat pipe (5).
2. the loose sheet module of microflute group flat-plate heat pipe as claimed in claim 1, it is characterized in that, the thickness of described upper substrate (3) and infrabasal plate (4) all is controlled at 10.0mm～25.0mm, the thickness of microflute group flat-plate heat pipe is 1.0mm～8.0mm, width is 10.0mm～120.0mm, and length all is controlled at 40.0mm～350.0mm.
3. the loose sheet module of microflute group flat-plate heat pipe as claimed in claim 1, it is characterized in that, described upper substrate (3) and infrabasal plate (4) all are provided with groove (6), and the two ends up and down of microflute group flat-plate heat pipe (5) all are located in groove (6).
4. the loose sheet module of microflute group flat-plate heat pipe as claimed in claim 3, is characterized in that, the severity control of described groove (6) is at 3.0mm～15.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202649614U CN203288578U (en) | 2013-05-15 | 2013-05-15 | Dissipation sheet module with microgroove flat heat tubes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202649614U CN203288578U (en) | 2013-05-15 | 2013-05-15 | Dissipation sheet module with microgroove flat heat tubes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203288578U true CN203288578U (en) | 2013-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202649614U Expired - Lifetime CN203288578U (en) | 2013-05-15 | 2013-05-15 | Dissipation sheet module with microgroove flat heat tubes |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247584A (en) * | 2013-05-15 | 2013-08-14 | 上海鹰峰电子科技有限公司 | Microgroove group flat plate heat pipe heat radiation fin module and production method of module |
-
2013
- 2013-05-15 CN CN2013202649614U patent/CN203288578U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247584A (en) * | 2013-05-15 | 2013-08-14 | 上海鹰峰电子科技有限公司 | Microgroove group flat plate heat pipe heat radiation fin module and production method of module |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201604 Shanghai Songjiang District Shihudang Industrial Park Tang Road, No. 158 Patentee after: SHANGHAI EAGTOP ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 201604 Shanghai Songjiang District Shihudang Industrial Park Tang Road, No. 158 Patentee before: SHANGHAI EAGTOP ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200402 Address after: 201617 Building 2, no.218, TANGMING Road, Shihudang Town, Songjiang District, Shanghai Patentee after: Shanghai hoto Electronic Technology Co.,Ltd. Address before: 201604 Shanghai Songjiang District Shihudang Industrial Park Tang Road, No. 158 Patentee before: SHANGHAI EAGTOP ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131113 |
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| CX01 | Expiry of patent term |