CN209417646U - A kind of heat sinking mainboard - Google Patents
A kind of heat sinking mainboard Download PDFInfo
- Publication number
- CN209417646U CN209417646U CN201822039272.9U CN201822039272U CN209417646U CN 209417646 U CN209417646 U CN 209417646U CN 201822039272 U CN201822039272 U CN 201822039272U CN 209417646 U CN209417646 U CN 209417646U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- heat
- heat sink
- support column
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of heat sinking mainboards, belong to technical field of electronic accessory, technical points include mainboard and the component set on mainboard surface, heat sink is equipped on the upside of the mainboard, support column is equipped between the mainboard and heat sink, the mainboard is connect with heat sink by support column, the support column is hollow structure, the heat dissipation plate surface is surrounded by multiple slots, the slot is opposite with component locations each on mainboard, the mainboard is equipped with through-hole, and the support column is inserted in through-hole；The utility model provides a kind of computer main board of good heat dissipation effect, and heat sink is arranged on mainboard, heat sink material is arranged in support column, enables the comprehensive heat dissipation of mainboard, protects the component inside mainboard not to be damaged, long service life.
Description
Technical field
The utility model relates to a kind of computer main boards, more specifically more particularly to a kind of heat sinking mainboard.
Background technique
Mainboard is also most important part as the most basic of computer, is mainly used for integrated circuit and main circuit system
System is equipped with multiple expansion slot thereon and is inserted with various external plug-in units.At work, each component can produce computer thereon
Raw a large amount of heat, though radiator fan or other heat dissipation equipments can be arranged on general mainboard, waste heat is also difficult to distribute,
It if the heat of generation cannot scatter in time, easily causes the entire body temperature of computer excessively high, damages mainboard, increase use cost
It is high；The utility model has invented a kind of heat dissipation mainboard for disadvantages described above.
Utility model content
The purpose of this utility model is that in view of the above shortcomings of the prior art, provide it is a kind of it is dust-proof, memory can be protected
Item, using effect is good, will not influence the Novel computer memory chip shield that computer uses.
In order to solve the above-mentioned technical problem, the utility model is achieved through the following technical solutions: a kind of heat sinking
Mainboard, including memory bar and the shield for covering at memory bar surface, wherein heat sink is equipped on the upside of the mainboard, it is described
Support column is equipped between mainboard and heat sink, the mainboard is connect with heat sink by support column, and the support column is hollow knot
Structure, the heat dissipation plate surface are surrounded by multiple slots, the slot master opposite, described with component locations each on mainboard
Plate is equipped with through-hole, and the support column is inserted in through-hole.
Further, the component includes CPU, hard disk, video card, radiator fan and memory bar slot, further includes that I/O connects
Mouthful.
Further, heat conductive silica gel or graphite are equipped in the through-hole.
Further, the heat sink is fine copper heat sink.
Further, the heat sink is integral structure.
Further, the heat sink is detachably installed with mainboard.
Further, the through-hole and support column are equipped at least 4-8, it is preferable that through-hole and support column are arranged 6.
The shield of the utility model has the advantages that
1, one block of heat sink is set up on mainboard, increases the heat sinking function of body, guarantees that computer internal heat will not assemble,
Rapid heat dissipation；
2, there are gaps between mainboard and heat sink, make heat that can quickly circulate in gap, further take away heat, guarantee
Heat dissipation effect is more preferable, protects mainboard；
3, support rod is set as hollow structure, internal to install heat sink material, and multiple heat dissipation mode is combined, is further ensured that
The heat dissipation effect of mainboard.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model mainboard；
Fig. 2 is the structural schematic diagram of the utility model mainboard and heat sink.
Specific embodiment
Utility model is described in further detail With reference to embodiment.
As shown in Figs. 1-2, a kind of heat sinking mainboard, the component including mainboard 10 and set on 10 surface of mainboard, first device
Part includes CPU60, hard disk 70, video card 80, radiator fan 90 and memory bar slot 100, further includes I/O interface 110, each component
Position is as shown in Figure 1, rationally distributed.
It is equipped with heat sink 20 on the upside of mainboard 10, support column 30, mainboard 10 and heat sink are equipped between mainboard 10 and heat sink 20
20 are connected by support column 30, and support column 30 is hollow structure, and 20 surface of heat sink is equipped with multiple slots 40, slot 40 and mainboard
Each component locations are opposite on 10, and mainboard 10 is equipped with through-hole 50, and support column 30 is inserted in through-hole 50.
Heat conductive silica gel or graphite are equipped in through-hole 50, heat conductive silica gel and graphite are the Heat Conduction Material of good heat conduction effect, can be helped
Mainboard is helped to radiate.
Heat sink 20 is integral the fine copper heat sink of structure, guarantees that the heat dissipation effect of mainboard is more preferable；Heat sink 20 and master
Plate 10 is detachably installed, in use, support column can take out or install out of through-hole inside it, it is easy to use.
Through-hole 50 and support column 30 are equipped at least 4-8, it is preferable that as illustrated in fig. 1 and 2, through-hole and support column are provided with 6
It is a.
When the mainboard of the utility model is specifically used, one block of heat sink 20 is set up on mainboard, increases the heat dissipation function of body
Can, guarantee that computer internal heat will not assemble, rapid heat dissipation；There are gaps between mainboard 10 and heat sink 20, make heat in gap
Energy Rapid Circulation circulation, further takes away heat, guarantees that heat dissipation effect is more preferable, protects mainboard；Support rod is set as hollow structure,
Its internal installation heat sink material, multiple heat dissipation mode combine, and are further ensured that the heat dissipation effect of mainboard.
Embodiment only expresses the several embodiments of the utility model in summary, and the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (7)
1. a kind of heat sinking mainboard, the component including mainboard and set on mainboard surface, it is characterised in that: on the mainboard
Side is equipped with heat sink, and support column is equipped between the mainboard and heat sink, and the mainboard is connect with heat sink by support column, institute
Stating support column is hollow structure, and the heat dissipation plate surface is surrounded by multiple slots, each component on the slot and mainboard
Position is opposite, and the mainboard is equipped with through-hole, and the support column is inserted in through-hole.
2. a kind of heat sinking mainboard according to claim 1, it is characterised in that: the component include CPU, hard disk,
Video card, radiator fan and memory bar slot further include I/O interface.
3. a kind of heat sinking mainboard according to claim 1, it is characterised in that: be equipped in the through-hole heat conductive silica gel or
Graphite.
4. a kind of heat sinking mainboard according to claim 1, it is characterised in that: the heat sink is fine copper heat sink.
5. a kind of heat sinking mainboard according to claim 1, it is characterised in that: the heat sink is integral structure.
6. a kind of heat sinking mainboard according to claim 1 or 5, it is characterised in that: the heat sink and mainboard are removable
Unload installation.
7. a kind of heat sinking mainboard according to claim 1, it is characterised in that: the through-hole and support column are equipped with 4
Or 6 or 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822039272.9U CN209417646U (en) | 2018-12-06 | 2018-12-06 | A kind of heat sinking mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822039272.9U CN209417646U (en) | 2018-12-06 | 2018-12-06 | A kind of heat sinking mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209417646U true CN209417646U (en) | 2019-09-20 |
Family
ID=67936888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822039272.9U Expired - Fee Related CN209417646U (en) | 2018-12-06 | 2018-12-06 | A kind of heat sinking mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209417646U (en) |
-
2018
- 2018-12-06 CN CN201822039272.9U patent/CN209417646U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190920 Termination date: 20201206 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |