CN207424773U - Mainboard structure and host - Google Patents

Mainboard structure and host Download PDF

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Publication number
CN207424773U
CN207424773U CN201721362854.XU CN201721362854U CN207424773U CN 207424773 U CN207424773 U CN 207424773U CN 201721362854 U CN201721362854 U CN 201721362854U CN 207424773 U CN207424773 U CN 207424773U
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China
Prior art keywords
mainboard
cooling fin
fan
plate body
mainboard structure
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CN201721362854.XU
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Chinese (zh)
Inventor
王智勇
何东洋
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Hefei Huike Jinyang Technology Co Ltd
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Hefei Huike Jinyang Technology Co Ltd
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Abstract

The utility model is related to technical field of electronic device, a kind of mainboard structure and host are provided, the fan being electrically connected including mainboard body and with mainboard body, mainboard structure further includes heat sink, heat sink includes plate body, and plate body is fixed on mainboard body, and plate body protrudes outward to form multiple spaced cooling fins away from the one side of mainboard body, fan is arranged on plate body, and each cooling fin is enclosed and flowed arranged on the outside of fan with air between each cooling fin.Mainboard structure provided by the utility model arranges in pairs or groups to radiate to mainboard using fan with heat sink, and multiple cooling fins are equipped on plate body, to accelerate mainboard radiating rate, improves mainboard radiating efficiency, makes the work of mainboard efficient stable.

Description

Mainboard structure and host
Technical field
The utility model is related to technical field of electronic device, especially provide a kind of mainboard structure and host.
Background technology
Mainboard used in all-in-one machine and big data information processing causes mainboard fever hot since operational data is huge, If solve not in time, it may appear that host operation interim card, digital independent slowly, crash the problems such as in addition mainboard can due to overheat and It burns, the situation for causing loss of data, work delays etc. more serious, mainboard heat dissipation at present uses wind mostly using wind-cooling heat dissipating Fan accelerates the cross-ventilation on mainboard surface, and mainboard heat is distributed, and achievees the effect that the reduction of mainboard temperature, but due to master When temperature in chassis is higher, this mode cools down, and efficiency is low, speed is slow, it is impossible to reach preferable cooling-down effect.
Utility model content
The purpose of this utility model is to provide a kind of mainboard structures, it is intended to solve that mainboard radiating efficiency is low, radiating rate The technical issues of slow.
To achieve the above object, the technical solution adopted in the utility model is:A kind of mainboard structure is provided, including mainboard sheet Body and the fan being electrically connected with the mainboard body, the mainboard structure further include heat sink, and the heat sink includes plate Body, the plate body are fixed on the mainboard body, the plate body away from the mainboard body one side protrude outward to be formed it is more A spaced cooling fin, the fan are arranged on the plate body, also, each cooling fin is enclosed arranged on the outer of the fan It is flowed with air between each cooling fin side.
Further, the plate body is rectangular panel body, and the one side of the rectangular panel body horizontally outward protrudes out to form two fixations Portion, the rectangular panel body are arranged in each fixed part to be installed on the mainboard body by screw.
Further, each cooling fin is equidistantly arranged at intervals along the long side or short side direction of the plate body.
Further, each cooling fin is circumferentially distributed in the fan centered on the rotating middle shaft line of the fan Outside.
Further, the cooling fin is arc-shaped cooling fin, the bending direction of the arc-shaped cooling fin and the wind It is consistent to fan the negative direction rotated.
Further, the cooling fin is zigzag cooling fin.
Further, the mainboard body is equipped at least three for fixing the positioning column of the plate body, each described fixed Position column is worn into the plate body.
Further, the mainboard structure further includes the protection board for being covered on the heat sink, and the protection board, which is equipped with, to be used In the storage tank for accommodating the fan and each cooling fin.
Further, the protection board is equipped with multiple heat emission holes for heat dissipation.
The advantageous effect of mainboard structure provided by the utility model is:The utility model mainboard structure is using fan and dissipates Hot plate combination radiates to mainboard body, and fan accelerates the heat exchange speed between air and heat sink, radiating efficiency Increase, while multiple cooling fins are set on heat sink, heat dissipation area is considerably increased, improves radiating rate, makes mainboard sheet The heat that body generates can distribute faster, ensure mainboard body efficient operation, avoid the occurrence of the situations such as crash, delay, Also extend the usage time of mainboard body simultaneously.
The utility model also provides a kind of host, including mainboard structure described above.
Host provided by the utility model, as a result of above-mentioned mainboard structure, therefore mainboard radiating rate and heat dissipation Efficiency is all improved, and reduces host and situations such as interim card, crash occurs, while also extends the service life of host.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing is briefly described needed in description, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the schematic diagram for the mainboard structure that the utility model embodiment provides;
Fig. 2 is the structure diagram for the arc-shaped cooling fin that the utility model embodiment provides;
Fig. 3 is the structure diagram for the protection board that the utility model embodiment provides.
Wherein, each reference numeral in figure:
100- mainboard structures;1- mainboard bodies;2- heat sinks;21- plate bodys;211- fixed parts;22- cooling fins;3- fans; 4- protection boards;41- heat emission holes;42- storage tanks.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning Same or similar element is represented to same or similar label eventually or there is same or like element.Below by ginseng The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and it is not intended that the utility model Limitation.
In the description of the utility model, it is to be understood that term " length ", " width ", " on ", " under ", " preceding ", The orientation or position relationship of the instructions such as " rear ", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " are based on attached Orientation or position relationship shown in figure are for only for ease of description the utility model and simplify description rather than instruction or imply Signified device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that this The limitation of utility model.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the utility model, " multiple " are meant that two or two More than, unless otherwise specifically defined.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. terms should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integral;Can be Mechanical connection or electrical connection;It can be directly connected, can also be indirectly connected by intermediary, can be two The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis Concrete condition understands concrete meaning of the above-mentioned term in the utility model.
It please refers to Fig.1, the mainboard structure 100 now provided the utility model embodiment illustrates.Mainboard structure 100, The fan 3 being electrically connected including mainboard body 1 and with mainboard body 1, mainboard structure 100 further include heat sink 2, heat sink 2 Including plate body 21, plate body 21 is fixed on mainboard body 1, plate body 21 away from mainboard body 1 one side protrude outward to be formed it is multiple Spaced cooling fin 22, fan 3 is arranged on plate body 21, also, each cooling fin 22 is enclosed and existed arranged on the outside of fan 3 with air It is flowed between each cooling fin 22.
The mainboard structure 100 that the utility model embodiment provides, is placed on heat sink 2 using fan 3 and is set on heat sink 2 There is the realization heat dissipation of cooling fin 22 enclosed arranged on fan 3, when mainboard body 1 works, substantial amounts of thermal energy can be generated and be transferred to heat sink 2, radiated by heat sink 2 and cooling fin 22, while fan 3 generate wind increases air and heat sink 2 and cooling fin 22 it Between heat exchange, heat sink 2 and cooling fin 22 is allow as soon as possible to discharge the heat of mainboard body 1, accelerates heat dissipation speed Degree and radiating efficiency ensure that the temperature of mainboard body 1 is suitble to and meets the requirement of work, prevent due to 1 temperature mistake of mainboard body It is high and interim card occur either crash situation causes work delay or work data to be lost.
Further, please refer to Fig.1 and Fig. 2, in the present embodiment, plate body 21 is rectangular panel body, the one side of rectangular panel body It horizontally outward protrudes out to form two fixed parts 211, rectangular panel body is arranged in two fixed parts 211 to be installed on mainboard body by screw On 1, plate body 21 is set for rectangular panel body plate body 21 to be facilitated to be installed with mainboard body 1, the shape of rectangular panel body and mainboard body 1 Shape and the homogeneous cause of area, can make mainboard body 1 that generated thermal energy are transferred to plate body 21 to greatest extent, make mainboard body 1 Radiating rate increase, the horizontal one side of rectangular panel body set two fixed parts 211, be threaded respectively in two fixed parts 211 Plate body 21 is fixedly connected by hole using screw with mainboard body 1, and two fixed parts 211 may be configured as semicircle or polygon, make The exquisite appearance of plate body 21.
Further, please refer to Fig.1 and Fig. 2, in the present embodiment, long side or short side side of each cooling fin 22 along plate body 21 It is arranged at intervals to equidistant, is equidistantly arranged at intervals each cooling fin 22, each cooling fin 22 is made to realize Homogeneouslly-radiating, accelerates each heat dissipation The radiating efficiency of piece 22 improves the radiating rate of each cooling fin 22, effectively reduces the temperature of mainboard structure 100, makes mainboard body 1 Efficient operation.
Alternatively, part unlike the embodiments above is, referring to Fig. 2, each cooling fin 22 is with the rotating middle shaft line of fan 3 Centered on it is circumferentially distributed in the outside of fan 3, fan 3 is the central shaft high-speed rotation with fan 3, so with air occur convection current Wind-force is generated, therefore centered on fan 3, each cooling fin 22 is enclosed arranged on the outside of fan 3, is efficiently generated using fan 3 Wind energy, make 100 temperature of mainboard structure reduce while, can also be energy saving.
Preferably, referring to Fig. 2, in the present embodiment, each cooling fin 22 is arc-shaped cooling fin, arc-shaped cooling fin Bending direction is consistent with the negative direction that fan 3 rotates, and the wind blows air that fan 3 generates radiates along curved each arc-shaped Interval between piece increases the area that each arc-shaped cooling fin is contacted with air, air is made maximumlly to be dissipated with each arc-shaped Convection current occurs for the air of heat sink surface, accelerates the radiating rate of each cooling fin 22.
Further, in the present embodiment, cooling fin 22 is zigzag cooling fin, and cooling fin 22 is set to zigzag, is increased The big heat dissipation area of cooling fin 22, accelerates to reduce the temperature in mainboard structure 100.
Further, please refer to Fig.1 and Fig. 2, in the present embodiment, mainboard body 1 is equipped at least three for fixing The positioning column (not shown) of plate body 21, each positioning column are worn into plate body 21, and at least three positioning columns are set on mainboard body 1 Plate body 21 is fixedly connected, after positioning column is arranged in plate body 21, certain heat dissipation is left between mainboard body 1 and plate body 21 Gap, and in heat dissipation one layer of thermal grease of gap setting, the thermal energy of increasing mainboard body 1 makes master to the transmission speed of plate body 21 The temperature of plate body 1 quickly reduces.
Further, also referring to Fig. 1 to Fig. 3, in the present embodiment, mainboard structure 100, which further includes, is covered on heat dissipation The protection board 4 of plate 2, protection board 4 are equipped with to accommodate the storage tank 42 of fan 3 and each cooling fin 22, the temperature in heat dissipation of heat sink 2 Degree is higher, and setting protection board 4 that can avoid, generation personnel scald or circuit contacts with heat sink 2 and breaking phenomena occurs, and dissipate Fan 3 is also rotating when hot, and circuit easily enters in fan 3 and circuit is caused to be damaged, and fire can be even generated when serious, therefore is set Protection board 4 is put to prevent accident.
Further, referring to Fig. 2, in the present embodiment, protection board 4 is equipped with multiple heat emission holes 41 for heat dissipation, if Although putting the generation that protection board 4 effectively prevents the accidents such as heat sink 2 is scalded or circuit is damaged, affect plate body 21 and dissipate The external heat dissipation of backing 22 sets the heat emission hole 41 of rectangular arrangement or circular arrangement on protection board 4, makes thermal energy from heat emission hole It is discharged in 41, reduces the temperature in mainboard structure 100.
Do not show in figure, the utility model embodiment also provides a kind of host, and host includes above-mentioned mainboard structure 100.
The host that the utility model embodiment provides, employs above-mentioned mainboard structure 100, therefore the radiating rate of host Soon, good heat dissipation effect extends the service life of host.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims (10)

1. a kind of mainboard structure, the fan being electrically connected including mainboard body and with the mainboard body, it is characterised in that:Institute It states mainboard structure and further includes heat sink, the heat sink includes plate body, and the plate body is fixed on the mainboard body, the plate Body protrudes outward to form multiple spaced cooling fins away from the one side of the mainboard body, and the fan is arranged on the plate body On, also, each cooling fin is enclosed and flowed arranged on the outside of the fan with air between each cooling fin.
2. mainboard structure according to claim 1, it is characterised in that:The plate body be rectangular panel body, the rectangular panel body One side horizontally outward protrude out to form two fixed parts, the rectangular panel body is arranged in each fixed part to be installed on by screw On the mainboard body.
3. mainboard structure according to claim 1, it is characterised in that:Long side or short of each cooling fin along the plate body Edge direction is equidistantly arranged at intervals.
4. mainboard structure according to claim 1, it is characterised in that:Each cooling fin is with the rotating middle shaft of the fan It is circumferentially distributed in the outside of the fan centered on line.
5. mainboard structure according to claim 4, it is characterised in that:The cooling fin be arc-shaped cooling fin, the circle The bending direction of arcuation cooling fin is consistent with the negative direction that the fan rotates.
6. mainboard structure according to claim 4, it is characterised in that:The cooling fin is zigzag cooling fin.
7. mainboard structure according to claim 1, it is characterised in that:The mainboard body is equipped at least three for solid The positioning column of the fixed plate body, each positioning column are worn into the plate body.
8. mainboard structure according to any one of claims 1 to 7, it is characterised in that:The mainboard structure further includes lid and sets In the protection board of the heat sink, the protection board is equipped with to accommodate the storage tank of the fan and each cooling fin.
9. mainboard structure according to claim 8, it is characterised in that:The protection board is equipped with multiple heat dissipations for heat dissipation Hole.
10. a kind of host, it is characterised in that:Including mainboard structure as described in any one of claim 1 to 9.
CN201721362854.XU 2017-10-20 2017-10-20 Mainboard structure and host Active CN207424773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721362854.XU CN207424773U (en) 2017-10-20 2017-10-20 Mainboard structure and host

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721362854.XU CN207424773U (en) 2017-10-20 2017-10-20 Mainboard structure and host

Publications (1)

Publication Number Publication Date
CN207424773U true CN207424773U (en) 2018-05-29

Family

ID=62312228

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721362854.XU Active CN207424773U (en) 2017-10-20 2017-10-20 Mainboard structure and host

Country Status (1)

Country Link
CN (1) CN207424773U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112965583A (en) * 2019-12-12 2021-06-15 荣耀终端有限公司 Electronic device
RU2796575C1 (en) * 2019-12-12 2023-05-25 Хонор Девайс Ко., Лтд. Electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112965583A (en) * 2019-12-12 2021-06-15 荣耀终端有限公司 Electronic device
RU2796575C1 (en) * 2019-12-12 2023-05-25 Хонор Девайс Ко., Лтд. Electronic device

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