CN203535564U - Computer - Google Patents
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- CN203535564U CN203535564U CN201320705401.8U CN201320705401U CN203535564U CN 203535564 U CN203535564 U CN 203535564U CN 201320705401 U CN201320705401 U CN 201320705401U CN 203535564 U CN203535564 U CN 203535564U
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- conducting strip
- base plate
- heat
- conducting
- coated
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Abstract
A computer comprises a case, a plurality of heat conducting sheets, a main board and a plurality of heating elements. A case cover is arranged on the case and comprises a base plate and a plurality of radiation fins which are arranged on a surface of the base board in a protruding mode, and the heat conducting sheets are arranged on the other surface of the base board. The main board is arranged in the case and comprises a first surface and a second surface which are opposite. The heating elements are arranged on the first surface, the heating surfaces of part of the heating elements abut against the base board, and the heating surfaces of the other heating elements abut against the heat conducting sheets. According to the computer, the heating elements on the main board abut against the inner wall of a case housing directly or abut against the inner wall of the case housing through the heat conducting sheets, the radiation fins are arranged on the outer wall of the case housing, and heat generated by the heating elements can be transmitted to the base board rapidly and then transmitted to the outside of the case through the base board and the radiation fins, so that temperatures of the elements in the case are not too high, the computer normal operation is guaranteed, and the noise cannot be produced by radiation through the radiation fins.
Description
Technical field
The utility model relates to a kind of computing machine.
Background technology
Computer cabinet inside is provided with a plurality of elements, for example mainboard, central processing unit (Central Processing Unit, CPU), floppy disk and network card chip etc.In the inner member of computing machine, CPU, bridge chip and network card chip etc. are heater element.Computing machine is when operation, because the heater element of cabinet inside constantly gives out heat, if heat can not be dispersed into outside cabinet in time, easily cause temperature in chassis to raise, thereby affect the operation of element, even make the performance of element change or lose efficacy, the serviceable life that causes the hydraulic performance decline of computing machine and reduce computing machine.
General, radiator fan is installed in computer cabinet, for the heat that computing machine is produced, by Air Flow, be discharged into outside cabinet.Yet adopt radiator fan to reduce the method for computer cabinet temperature, when fan moves, easily produce larger noise.
Utility model content
Based on this, be necessary the computing machine that provides a kind of noise less.
A computing machine, comprises cabinet, a plurality of conducting strip, mainboard and a plurality of heater element;
Described cabinet is provided with case lid, and described case lid comprises base plate and some radiating fins, and described radiating fin is convexly set in a surface of described base plate;
Described conducting strip is located at another surface of described base plate;
Described mainboard is installed in described cabinet, and described mainboard comprises opposing first surface and second surface;
Described heater element is located at described first surface, the radiating surface of the described heater element of part and described base plate butt, the radiating surface of heater element and described conducting strip butt described in other.
In an embodiment, described a plurality of heater elements are respectively bridge chip, metal-oxide-semiconductor, network card chip, CPU and inductance therein.
In an embodiment, described a plurality of conducting strips are respectively bridge chip conducting strip, metal-oxide-semiconductor conducting strip and network card chip conducting strip therein;
The radiating surface of described bridge chip and described bridge chip conducting strip butt, the radiating surface of described metal-oxide-semiconductor and described metal-oxide-semiconductor conducting strip butt, the radiating surface of described network card chip and described network card chip conducting strip butt, the radiating surface of described CPU and described base plate butt, the radiating surface of described inductance and described base plate butt.
In an embodiment, between described bridge chip conducting strip and described base plate, be coated with heat-conducting silicone grease therein;
Between metal-oxide-semiconductor conducting strip and described base plate, be coated with heat-conducting silicone grease;
Between network card chip conducting strip and described base plate, be coated with heat-conducting silicone grease.
In an embodiment, between described bridge chip and described bridge chip conducting strip, be coated with heat-conducting silicone grease therein;
Between described metal-oxide-semiconductor and described metal-oxide-semiconductor conducting strip, be coated with heat-conducting silicone grease;
Between described network card chip and described network card chip conducting strip, be coated with heat-conducting silicone grease;
Between described CPU and described base plate, be coated with heat-conducting silicone grease;
Between described inductance and described base plate, be coated with heat-conducting silicone grease.
Therein in an embodiment, the radiating surface of the described heater element of a plurality of equal heights and a described conducting strip butt.
In an embodiment, described first surface is also provided with patch capacitor and Chip-R therein.
In an embodiment, described second surface is provided with solid capacitor, wire-wound inductor, connector, hard disk drawing box, MINPCIE seat, SATA seat, memory slot, PS2 seat and USB seat therein.
Above-mentioned computing machine, by the direct and cabinet inner walls butt by heater element on mainboard, or by conducting strip and cabinet inner walls butt, and on the outer wall of cabinet housing, radiating fin is set, the heat that heater element can be produced is delivered to base plate fast, by base plate and radiating fin, heat is delivered to outside cabinet again, it is too high that thereby the temperature of the element in assurance cabinet is unlikely to, guarantee the normal work of computing machine, and tradition is by the heat radiation form of built-in fans relatively, and radiating fin heat radiation can not produce noise.
Accompanying drawing explanation
Fig. 1 is the decomposition texture schematic diagram of the computing machine of an embodiment;
Fig. 2 is another surperficial structural representation of the mainboard shown in Fig. 1.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized with multiple different form, is not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.
Unless otherwise defined, all technology of using are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in instructions of the present utility model herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.
Please refer to Fig. 1, it is the decomposition texture schematic diagram of the computing machine 10 of an embodiment, comprises cabinet 110, a plurality of conducting strip 120, mainboard 130 and a plurality of heater element 140.
A plurality of conducting strips 120 are located at another surface of base plate 1122.
As shown in Figure 2, it is the structural representation of the first surface 132 of mainboard 130 as shown in Figure 1.A plurality of heater elements 140 are respectively bridge chip 141, metal-oxide-semiconductor 143, network card chip 145, CPU147 and inductance 149.Heater element 140 is located at first surface 132.
In embodiment as shown in Figure 1, a plurality of conducting strips 120 are respectively bridge chip conducting strip 122, MOS(Metal-Oxide-Semiconductor, Metal-oxide-semicondutor) pipe conducting strip 124 and network card chip conducting strip 126.
The radiating surface of part heater element 140 and base plate 1122 butts, the radiating surface of other heater elements 140 and conducting strip 120 butts.Because the height of heater element 140 is not identical, highly shorter heater element 140 need to could contact with base plate 1122 by conducting strip 120, and heat heater element 140 being produced by conducting strip 120 is delivered to base plate 1122 and dispels the heat.Highly higher heater element 140 can be directly and base plate 1122 butts, directly heat dispelled the heat by base plate 1122.
Specifically in the present embodiment, the radiating surface of bridge chip 141 and bridge chip conducting strip 122 butts, the radiating surface of metal-oxide-semiconductor 143 and metal-oxide-semiconductor conducting strip 124 butts, the radiating surface of network card chip 145 and network card chip conducting strip 126 butts, the radiating surface of CPU147 and base plate 1122 butts, the radiating surface of inductance 149 and base plate 1122 butts.Because the height of CPU147 and inductance 149 is higher, therefore, CPU147 and inductance 149 do not need just can direct and base plate 1122 butts by conducting strip 120.Directly and base plate 1122 butts, the heat of heater element 140 generations is more easily delivered to base plate 1122, more easily heat is delivered to outside cabinet 110 for heater element 140.
The radiating surface of the heater element 140 of a plurality of equal heights can with conducting strip 120 butts.Specifically in the present embodiment, the radiating surface of the metal-oxide-semiconductor 143 of a plurality of equal heights and metal-oxide-semiconductor conducting strip 124 butts.The radiating surface of the network card chip 145 of a plurality of equal heights and network card chip conducting strip 126 butts.By by the heater element of a plurality of equal heights 140 and conducting strip 120 butts, the structure of computing machine 10 is more simple, and easier for installation on base plate 1122 of conducting strip 120, is conducive to reduce production process.
In the present embodiment, the logical screw of bridge chip conducting strip 122 is fixed on the surface of base plate 1122, between bridge chip conducting strip 122 and base plate 1122, is coated with heat-conducting silicone grease.The logical screw of metal-oxide-semiconductor conducting strip 124 is fixed on the surface of base plate 1122, between metal-oxide-semiconductor conducting strip 124 and base plate 1122, is coated with heat-conducting silicone grease.Between the radiating surface of bridge chip 141 and bridge chip conducting strip 122, be coated with heat-conducting silicone grease.Between metal-oxide-semiconductor 143 and metal-oxide-semiconductor conducting strip 124, be coated with heat-conducting silicone grease.Between network card chip 145 and network card chip conducting strip 126, be coated with heat-conducting silicone grease.Between CPU147 and base plate 1122, be coated with heat-conducting silicone grease.Between inductance 149 and base plate 1122, be coated with heat-conducting silicone grease.
Between heater element 140 and conducting strip 120, between heater element 140 and base plate 1122 and apply silica gel between conducting strip 120 and base plate 1122, can effectively fill the space between each element, thereby the contact area between increase element, the heat that can more rapidly heater element 140 be produced is transmitted to base plate 1122 and dispels the heat.
In the present embodiment, the first surface 132 of mainboard 130 is provided with patch capacitor and Chip-R.The height of patch capacitor and Chip-R is shorter with respect to the height of the CPU147 arranging on first surface 132 and inductance 149.Patch capacitor, Chip-R and heater element 140 are located to the same surface of mainboard 130, can make the distance between heater element 140 and base plate 1122 shorter, thereby make heat-transfer path shorter, the heat that heater element 140 is produced is transferred to base plate 1122 sooner, is dispersed into cabinet 110 outsides.Certainly, in other embodiments, patch capacitor and Chip-R also can be located at the second surface 134 of mainboard 130.
In the present embodiment, the second surface 134 of mainboard 130 is provided with solid capacitor 151, wire-wound inductor 152, connector 153, hard disk drawing box 154, MINPCIE seat 155, SATA seat 156, memory slot 157, PS2 seat 158 and USB seat 159 etc.The height of the elements such as solid capacitor 151, wire-wound inductor 152, connector 153, hard disk drawing box 154, MINPCIE seat 155, SATA seat 156, memory slot 157, PS2 seat 158 and USB seat 159 is higher with respect to the height of the CPU147 arranging on mainboard 130 and inductance 149.For convenience of description, solid capacitor 151, wire-wound inductor 152, connector 153, hard disk drawing box 154, MINPCIE seat 155, SATA seat 156, memory slot 157, PS2 seat 158 and USB seat 159 are referred to as to higher element.Higher element is all arranged on to the second surface 134 of mainboard 130, the distance between heater element 140 and mainboard 130 can be too not far away, and heat-transfer path is shorter, is beneficial to heat radiation.Memory slot 157 grades are installed on to the second surface 134 of mainboard 130, can make to install memory bar etc. more convenient to operate.
Above-mentioned computing machine 10, by the direct and cabinet 110 inner walls butts by heater element on mainboard 130 140, or by conducting strip 120 and cabinet 110 inner walls butts, and radiating fin 1124 is set on the outer wall of cabinet 110 housings, the heat that heater element 140 can be produced is delivered to base plate 1122 fast, by base plate 1122 and radiating fin 1124, heat is delivered to outside cabinet 110 again, thereby the temperature that guarantees the element in cabinet 110 is unlikely to too high, guarantee the normal work of computing machine 10, and tradition is by the heat radiation form of built-in fans relatively, radiating fin 1124 heat radiations can not produce noise.
In addition, case lid 112 itself is designed to a heating radiator, is conducive to save material, reduce cost.Meanwhile, case lid 122 comprises base plate 1122 and some radiating fins 1124, and radiating fin 1124 has larger surface area, thereby can increase the area of dissipation of case lid 112, can make heat be delivered to more fast cabinet 110 outsides.
Above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (8)
1. a computing machine, is characterized in that, comprises cabinet, a plurality of conducting strip, mainboard and a plurality of heater element;
Described cabinet is provided with case lid, and described case lid comprises base plate and some radiating fins, and described radiating fin is convexly set in a surface of described base plate;
Described conducting strip is located at another surface of described base plate;
Described mainboard is installed in described cabinet, and described mainboard comprises opposing first surface and second surface;
Described heater element is located at described first surface, the radiating surface of the described heater element of part and described base plate butt, the radiating surface of heater element and described conducting strip butt described in other.
2. computing machine according to claim 1, is characterized in that, described a plurality of heater elements are respectively bridge chip, metal-oxide-semiconductor, network card chip, CPU and inductance.
3. computing machine according to claim 2, is characterized in that, described a plurality of conducting strips are respectively bridge chip conducting strip, metal-oxide-semiconductor conducting strip and network card chip conducting strip;
The radiating surface of described bridge chip and described bridge chip conducting strip butt, the radiating surface of described metal-oxide-semiconductor and described metal-oxide-semiconductor conducting strip butt, the radiating surface of described network card chip and described network card chip conducting strip butt, the radiating surface of described CPU and described base plate butt, the radiating surface of described inductance and described base plate butt.
4. computing machine according to claim 3, is characterized in that, between described bridge chip conducting strip and described base plate, is coated with heat-conducting silicone grease;
Between metal-oxide-semiconductor conducting strip and described base plate, be coated with heat-conducting silicone grease;
Between network card chip conducting strip and described base plate, be coated with heat-conducting silicone grease.
5. computing machine according to claim 3, is characterized in that, between described bridge chip and described bridge chip conducting strip, is coated with heat-conducting silicone grease;
Between described metal-oxide-semiconductor and described metal-oxide-semiconductor conducting strip, be coated with heat-conducting silicone grease;
Between described network card chip and described network card chip conducting strip, be coated with heat-conducting silicone grease;
Between described CPU and described base plate, be coated with heat-conducting silicone grease;
Between described inductance and described base plate, be coated with heat-conducting silicone grease.
6. computing machine according to claim 1, is characterized in that, the radiating surface of the described heater element of a plurality of equal heights and a described conducting strip butt.
7. computing machine according to claim 1, is characterized in that, described first surface is also provided with patch capacitor and Chip-R.
8. computing machine according to claim 7, is characterized in that, described second surface is provided with solid capacitor, wire-wound inductor, connector, hard disk drawing box, MINPCIE seat, SATA seat, memory slot, PS2 seat and USB seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320705401.8U CN203535564U (en) | 2013-11-08 | 2013-11-08 | Computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320705401.8U CN203535564U (en) | 2013-11-08 | 2013-11-08 | Computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203535564U true CN203535564U (en) | 2014-04-09 |
Family
ID=50421755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320705401.8U Expired - Lifetime CN203535564U (en) | 2013-11-08 | 2013-11-08 | Computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203535564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108398994A (en) * | 2018-05-02 | 2018-08-14 | 昆山莹帆精密五金有限公司 | A kind of cpu box formula evaporator |
-
2013
- 2013-11-08 CN CN201320705401.8U patent/CN203535564U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108398994A (en) * | 2018-05-02 | 2018-08-14 | 昆山莹帆精密五金有限公司 | A kind of cpu box formula evaporator |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |