CN203455762U - Dustproof heat dissipation device of computer memory module - Google Patents
Dustproof heat dissipation device of computer memory module Download PDFInfo
- Publication number
- CN203455762U CN203455762U CN201320509855.8U CN201320509855U CN203455762U CN 203455762 U CN203455762 U CN 203455762U CN 201320509855 U CN201320509855 U CN 201320509855U CN 203455762 U CN203455762 U CN 203455762U
- Authority
- CN
- China
- Prior art keywords
- memory module
- heat dissipation
- dustproof
- heat
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 6
- 239000000428 dust Substances 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000004519 grease Substances 0.000 claims abstract description 9
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000004883 computer application Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the field of computer application, in particular to a dustproof heat dissipation device of a computer memory module. The dustproof heat dissipation device comprises a dustproof cover, wherein the dustproof cover is shaped like a Chinese character 'tu', an opening at the top part of the dustproof cover is provided with a memory module slot, two sides of the memory module slot are provided with heat conduction silicone grease layers, the heat conduction silicone grease layers are provided with semiconductor chilling plates, and the outer sides of the semiconductor chilling plates are provided with heat dissipation fins; two ends of a base of the dustproof cover are respectively provided with a fan, the side wall of the base is provided with a current guiding groove, and the current guiding groove is in a wave shape. According to the dustproof heat dissipation device of the computer memory module, disclosed by the utility model, the dustproof cover is additionally arranged on the memory module, and thus the damage from dust to a computer can be effectively reduced; meanwhile, due to the additional arrangement of the semiconductor chilling plates and the fans, the heat dissipation problem of the memory module is efficiently solved, and the working stability of the memory module is greatly increased.
Description
Technical field
The utility model relates to computer application field, particularly a kind of computer memory bank dustproof heat radiator.
Background technology
Internal store insert slot for computer is positioned at mainboard one side, next-door neighbour CPU, and this design can make internal memory and CPU apart from nearer, reduces outside electromagnetic interference, increases stability.But, because CPU thermal value is huge, so heat radiator and radiator fan are all installed on CPU, the heat that radiator fan is transmitted to CPU heat radiator blows to surrounding along the groove on heat radiator, the memory bar slot of next-door neighbour CPU has to bear a large amount of hot blasts, because the very poor while of radiating effect of memory bar slot itself is born again a large amount of hot blasts, the product time is under thermal environment, affect the stability of internal memory and the connection of equipment, easily cause internal memory job insecurity and loose contact, cause computer corruption, blue screen even cannot start.Meanwhile, what adopt due to the installation of memory bar is open type design, and dust is very easy to fall into slot, causes short circuit or loose contact, affects computer and normally moves.
Utility model content
In order to overcome the defect of prior art, the utility model provides a kind of computer memory bank dustproof heat radiator that has dustproof and heat sinking function concurrently.
Technical solutions of the utility model are: a kind of computer memory bank dustproof heat radiator, it comprises a dust cover, dust cover is " protruding " font, its open top is provided with a memory bar slot, memory bar slot both sides are provided with heat-conducting silicone grease layer, on heat-conducting silicone grease layer, semiconductor chilling plate is installed, semiconductor chilling plate outside is provided with heat radiation fin; Dust cover base two ends are separately installed with a fan, and the sidewall of base is provided with diversion trench, and described diversion trench is waveform.
The utility model further improves and is: described dust cover is that aluminum is one-body molded.
The utility model computer memory bank dustproof heat radiator, for memory bar has installed a dust cover additional, effectively reduces the infringement of dust to machine; Meanwhile, by installing semiconductor chilling plate and fan additional, solve efficiently memory heat radiation problem, greatly increased the stability of internal memory work.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Number in the figure is: dust cover 1, memory bar slot 2, heat-conducting silicone grease layer 3, semiconductor chilling plate 4, heat radiation fin 5, fan 6, diversion trench 7.
Embodiment
As shown in Figure 1, the computer memory bank dustproof heat radiator that the utility model provides, it comprises a dust cover 1, dust cover 1 is that aluminum is one-body molded, and dust cover 1 is " protruding " font, and its open top is provided with a memory bar slot 2, memory bar slot 2 both sides are provided with heat-conducting silicone grease layer 3, semiconductor chilling plate 4 is installed on heat-conducting silicone grease layer 3, and semiconductor chilling plate 4 outsides are provided with heat radiation fin 5, and semiconductor chilling plate 4 refrigeration heat radiations are also discharged heat by the fin 5 that dispels the heat; Dust cover 1 base two ends are separately installed with a fan 6, and fan 6 is discharged the heat of dust cover 1 inside, and the sidewall of base is provided with diversion trench 7, and described diversion trench 7 is waveform, and diversion trench 7 can reduce ventilation speed, and heat is discharged more.
The above; it is only embodiment of the present utility model; but protection domain of the present utility model is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the utility model; the variation that can expect without creative work or replacement, within all should being encompassed in protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain that claims were limited.
Claims (2)
1. a computer memory bank dustproof heat radiator, it is characterized in that: it comprises a dust cover (1), dust cover (1) is " protruding " font, its open top is provided with a memory bar slot (2), memory bar slot (2) both sides are provided with heat-conducting silicone grease layer (3), semiconductor chilling plate (4) is installed on heat-conducting silicone grease layer (3), and semiconductor chilling plate (4) outside is provided with heat radiation fin (5); Dust cover (1) base two ends are separately installed with a fan (6), and the sidewall of base is provided with diversion trench (7), and described diversion trench (7) is waveform.
2. computer memory bank dustproof heat radiator according to claim 1, is characterized in that: described dust cover (1) is that aluminum is one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320509855.8U CN203455762U (en) | 2013-08-21 | 2013-08-21 | Dustproof heat dissipation device of computer memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320509855.8U CN203455762U (en) | 2013-08-21 | 2013-08-21 | Dustproof heat dissipation device of computer memory module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203455762U true CN203455762U (en) | 2014-02-26 |
Family
ID=50135624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320509855.8U Expired - Fee Related CN203455762U (en) | 2013-08-21 | 2013-08-21 | Dustproof heat dissipation device of computer memory module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203455762U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107193770A (en) * | 2017-05-19 | 2017-09-22 | 长沙开雅电子科技有限公司 | A kind of Dustproof heat conductive flame-retarding internal memory strip device |
| CN107193771A (en) * | 2017-05-19 | 2017-09-22 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding device of Novel internal memory bar |
| WO2018032393A1 (en) * | 2016-08-17 | 2018-02-22 | 陈玮彤 | Heat dissipation structure for memory bank |
| CN107861594A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of computer memory bank heat abstractor |
| CN108959151A (en) * | 2018-07-15 | 2018-12-07 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding new design realization device of memory bar |
-
2013
- 2013-08-21 CN CN201320509855.8U patent/CN203455762U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032393A1 (en) * | 2016-08-17 | 2018-02-22 | 陈玮彤 | Heat dissipation structure for memory bank |
| CN107193770A (en) * | 2017-05-19 | 2017-09-22 | 长沙开雅电子科技有限公司 | A kind of Dustproof heat conductive flame-retarding internal memory strip device |
| CN107193771A (en) * | 2017-05-19 | 2017-09-22 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding device of Novel internal memory bar |
| CN107861594A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of computer memory bank heat abstractor |
| CN108959151A (en) * | 2018-07-15 | 2018-12-07 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding new design realization device of memory bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU VOCATIONAL COLLEGE OF SCIENCE AND TECHNO Free format text: FORMER OWNER: ZHANG YANMEI Effective date: 20140331 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510800 GUANGZHOU, GUANGDONG PROVINCE TO: 510550 GUANGZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140331 Address after: Baiyun District of Guangzhou City, Guangdong province 510550 Zhongluotan Guangcong Road No. 1038 nine Patentee after: GUANGZHOU VOCATIONAL COLLEGE OF SCIENCE AND TECHNOLOGY Address before: 510800 Guangdong Province, Huadu District of Guangzhou City Garden Road No. 3 building 401 room full of Huayuan E1 Patentee before: Zhang Yanmei |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20190821 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |