CN204631733U - A dust-proof and heat-dissipating device for a computer memory stick - Google Patents
A dust-proof and heat-dissipating device for a computer memory stick Download PDFInfo
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- CN204631733U CN204631733U CN201520225693.4U CN201520225693U CN204631733U CN 204631733 U CN204631733 U CN 204631733U CN 201520225693 U CN201520225693 U CN 201520225693U CN 204631733 U CN204631733 U CN 204631733U
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- slot
- water
- cooling
- computer memory
- tank
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域：Technical field:
本实用新型涉及散热装置技术领域，具体为一种计算机内存条防尘散热装置。 The utility model relates to the technical field of cooling devices, in particular to a dust-proof cooling device for computer memory sticks.
背景技术：Background technique:
计算机内存条插槽位于主板一侧，紧邻CPU，这种设计可以使内存与CPU 距离更近，减少外界电磁干扰，增加稳定性。但是，因为CPU 发热量巨大，所以在CPU 上均安装有散热片和散热风扇，散热风扇将CPU 传导到散热片的热量沿散热片上的沟槽吹到四周，紧邻CPU 的内存条插槽不得不承受大量热风，由于内存条插槽本身的散热效果很差同时又承受大量热风，长时间处在热环境下，影响内存的稳定性和设备的连接，容易造成内存工作不稳定和接触不良，造成计算机死机、蓝屏甚至无法启动。同时，由于内存条的安装采用的是敞开式设计，灰尘非常容易落入插槽中，引起短路或接触不良，影响电脑正常运行。 The memory slot of the computer is located on one side of the motherboard, next to the CPU. This design can make the distance between the memory and the CPU closer, reduce external electromagnetic interference, and increase stability. However, because the CPU generates a huge amount of heat, a heat sink and a cooling fan are installed on the CPU. The cooling fan transfers the heat from the CPU to the heat sink and blows it around along the groove on the heat sink. The memory slot next to the CPU has to be Bear a lot of hot air, because the cooling effect of the memory slot itself is very poor and it also bears a lot of hot air. If it is in a hot environment for a long time, it will affect the stability of the memory and the connection of the device, which will easily lead to unstable operation of the memory and poor contact, resulting in Computer freezes, blue screens, or even won't boot. At the same time, because the installation of the memory stick adopts an open design, dust is very easy to fall into the slot, causing a short circuit or poor contact, which affects the normal operation of the computer.
实用新型内容 Utility model content
本实用新型的目的在于提供一种计算机内存条防尘散热装置，以解决上述背景技术中提出的问题。 The purpose of this utility model is to provide a computer memory stick dust-proof and heat-dissipating device to solve the problems raised in the above-mentioned background technology.
为实现上述目的，本实用新型提供如下技术方案： In order to achieve the above object, the utility model provides the following technical solutions:
一种计算机内存条防尘散热装置，包括插槽，其特征在于：在插槽的内壁上设置有制冷片，在插槽的外壁两侧皆设置有导热片，防尘片设置在插槽的外表面，在防尘片上设有散热孔，散热孔的内部设置有防尘网，冷却箱紧贴导热片，冷却箱的进水口与微型水泵的出水口连接，微型水泵的进水口与水箱的出水口连接，冷却箱的出水口与水箱的进水口连接，温度感应装置与微型水泵电连接。 A computer memory stick dust-proof heat dissipation device, including a slot, is characterized in that: a cooling sheet is arranged on the inner wall of the slot, a heat conduction sheet is arranged on both sides of the outer wall of the slot, and the dust-proof sheet is arranged on the slot On the outer surface, there are cooling holes on the dust-proof sheet, and dust-proof nets are arranged inside the cooling holes. The cooling box is close to the heat-conducting sheet. The water inlet of the cooling box is connected to the water outlet of the micro-water pump. The water outlet is connected, the water outlet of the cooling box is connected with the water inlet of the water tank, and the temperature sensing device is electrically connected with the micro water pump.
进一步设置在于： Further settings are:
所述制冷片为半导体制冷片。 The refrigerating sheet is a semiconductor refrigerating sheet. the
所述导热片为厚度为0.5mm的纯铜翘片。 The heat conducting sheet is a pure copper sheet with a thickness of 0.5mm.
所述温度感应装置设置在水箱的左侧壁面上，所述温度感应装置为温度传感器。 The temperature sensing device is arranged on the left side wall of the water tank, and the temperature sensing device is a temperature sensor.
与现有技术相比，本实用新型的有益效果是： Compared with the prior art, the beneficial effects of the utility model are:
本实用新型计算机内存条防尘散热装置，为内存条加装了防尘片，有效减少灰尘对机器的损害；同时，通过加装半导体制冷片及导热翘片对产生的热量进行散失，设置的冷却箱能够进一步的带走内存条因长时间工作而产生的热量，使内存条运行环境温度的恒定，从而保证内存条的平稳运行，宁静高效地解决内存散热问题，大大增加了内存工作的稳定性。 The utility model of the computer memory bar dust-proof heat dissipation device is equipped with a dust-proof sheet for the memory bar, which effectively reduces the damage of dust to the machine; at the same time, the heat generated is dissipated by adding a semiconductor refrigeration sheet and a heat-conducting warp sheet, and the set The cooling box can further take away the heat generated by the memory stick due to long-term work, so that the operating environment temperature of the memory stick is constant, thereby ensuring the smooth operation of the memory stick, solving the heat dissipation problem of the memory stick quietly and efficiently, and greatly increasing the stability of the work of the memory stick sex.
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。 The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
附图说明：Description of drawings:
图1为本实用新型的结构示意图； Fig. 1 is the structural representation of the utility model;
图2为本实用新型插槽顶部的结构示意图。 Fig. 2 is a structural schematic diagram of the top of the slot of the utility model.
图中：1 微型水泵、2 水管、3 水箱、4 散热孔、5 防尘网、6 防尘片、7 导热片、8 冷却箱、9 温度感应装置、10 制冷片、11 插槽。 In the picture: 1 micro-water pump, 2 water pipe, 3 water tank, 4 cooling holes, 5 dust-proof net, 6 dust-proof sheet, 7 heat-conducting sheet, 8 cooling box, 9 temperature sensing device, 10 cooling sheet, 11 slot.
具体实施方式：Detailed ways:
请参阅图1-2，本实用新型的一种计算机内存条防尘散热装置，包括插槽11，在插槽11的内壁上设置有制冷片10，所述制冷片10是半导体制冷片，在插槽11的外壁两侧皆设置有导热片7，导热片7选择厚度为0.5mm的纯铜翘片，防尘片6设置在插槽11的外表面，本实施例中设置于插槽11的顶部及外周上，在防尘片6上设有散热孔4，散热孔4的内部设置有防尘网5，冷却箱8紧贴导热片7，冷却箱8的进水口通过水管2与微型水泵1的出水口连接，微型水泵1的进水口通过水管2与水箱3的出水口连接，冷却箱8的出水口通过水管2与水箱3的进水口连接，从而形成冷却循环系统，本实施例中，微型水泵1与水箱3均设置在插槽11的左侧，温度感应装置9设置在水箱3的左侧壁面上，温度感应装置9与微型水泵1通过导线电连接，温度感应装置9选择温度传感器。 Please refer to Fig. 1-2, a kind of dust-proof cooling device of computer memory stick of the present utility model, comprises slot 11, is provided with cooling chip 10 on the inner wall of slot 11, and described cooling chip 10 is semiconductor cooling chip, in Both sides of the outer wall of the slot 11 are provided with a heat conduction sheet 7, the heat conduction sheet 7 is a pure copper sheet with a thickness of 0.5mm, and the dustproof sheet 6 is arranged on the outer surface of the slot 11. In this embodiment, it is arranged on the slot 11. On the top and outer periphery of the dust-proof sheet 6, there is a cooling hole 4, and the inside of the cooling hole 4 is provided with a dust-proof net 5, the cooling box 8 is close to the heat-conducting sheet 7, and the water inlet of the cooling box 8 passes through the water pipe 2 and the micro The water outlet of the water pump 1 is connected, the water inlet of the micro water pump 1 is connected with the water outlet of the water tank 3 through the water pipe 2, and the water outlet of the cooling box 8 is connected with the water inlet of the water tank 3 through the water pipe 2, thereby forming a cooling cycle system. Among them, the micro water pump 1 and the water tank 3 are all arranged on the left side of the slot 11, the temperature sensing device 9 is arranged on the left side wall of the water tank 3, the temperature sensing device 9 and the micro water pump 1 are electrically connected by wires, and the temperature sensing device 9 selects Temperature Sensor.
本实用新型的工作原理如下： The working principle of the utility model is as follows:
当内存条温度过高时，温度感应装置9会以电信号的形式传递给微型水泵1，这时微型水泵1开启，把水箱3中的水抽入冷却箱8中，导热片7会把内存条的热量吸收，并且把热量传导给冷却箱8，经冷却循环系统，吸收热量的水会再次回到水箱3中，循环流动的水能够进一步的带走内存条因长时间工作而产生的热量，使内存条运行环境温度的恒定，宁静高效地解决内存散热问题，散热孔4内设置有防尘网5，防尘片6和防尘网5能够对微尘形成阻挡，从而保证内存条的平稳运行。 When the temperature of the memory stick is too high, the temperature sensing device 9 will transmit the electric signal to the micro water pump 1, and then the micro water pump 1 will turn on and pump the water in the water tank 3 into the cooling box 8, and the heat conduction sheet 7 will transfer the memory The heat of the memory stick is absorbed, and the heat is transferred to the cooling box 8. After the cooling circulation system, the water that absorbs the heat will return to the water tank 3 again, and the circulating water can further take away the heat generated by the memory stick due to long-term work. , so that the temperature of the operating environment of the memory stick is constant, and the problem of heat dissipation of the memory is solved quietly and efficiently. There is a dust-proof net 5 in the cooling hole 4, and the dust-proof sheet 6 and the dust-proof net 5 can form a barrier to dust, thereby ensuring the memory stick. run smoothly.
尽管已经示出和描述了本实用新型的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本实用新型的范围由所附权利要求及其等同物限定。 Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520225693.4U CN204631733U (en) | 2015-04-15 | 2015-04-15 | A dust-proof and heat-dissipating device for a computer memory stick |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520225693.4U CN204631733U (en) | 2015-04-15 | 2015-04-15 | A dust-proof and heat-dissipating device for a computer memory stick |
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| CN204631733U true CN204631733U (en) | 2015-09-09 |
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| CN201520225693.4U Expired - Fee Related CN204631733U (en) | 2015-04-15 | 2015-04-15 | A dust-proof and heat-dissipating device for a computer memory stick |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107608920A (en) * | 2017-10-27 | 2018-01-19 | 郑州云海信息技术有限公司 | A kind of server memory slot interface device |
| CN110488951A (en) * | 2019-08-23 | 2019-11-22 | 重庆电子工程职业学院 | Computer memory stick heat dissipation fixing assembly |
| CN111103933A (en) * | 2018-10-26 | 2020-05-05 | 成都西达瑞电子科技有限公司 | Storage card access mechanism with cooling mechanism |
-
2015
- 2015-04-15 CN CN201520225693.4U patent/CN204631733U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107608920A (en) * | 2017-10-27 | 2018-01-19 | 郑州云海信息技术有限公司 | A kind of server memory slot interface device |
| CN111103933A (en) * | 2018-10-26 | 2020-05-05 | 成都西达瑞电子科技有限公司 | Storage card access mechanism with cooling mechanism |
| CN110488951A (en) * | 2019-08-23 | 2019-11-22 | 重庆电子工程职业学院 | Computer memory stick heat dissipation fixing assembly |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20180415 |
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| CF01 | Termination of patent right due to non-payment of annual fee |