CN110488951A - Computer memory bank heat dissipation fixation assembly - Google Patents
Computer memory bank heat dissipation fixation assembly Download PDFInfo
- Publication number
- CN110488951A CN110488951A CN201910785481.4A CN201910785481A CN110488951A CN 110488951 A CN110488951 A CN 110488951A CN 201910785481 A CN201910785481 A CN 201910785481A CN 110488951 A CN110488951 A CN 110488951A
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- CN
- China
- Prior art keywords
- memory bar
- water cooling
- water
- fixedly connected
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention discloses a kind of computer memory bank heat dissipation fixation assemblies, by the way that the memory bar is inserted into the link slot, it is connect with metallic laminas, the side of the circular memory bar of the side water cooling component one week, and radiating and cooling is carried out by surface of the coolant liquid of internal flow to the memory bar, the top water cooling component is located at the top of the memory bar, radiating and cooling is carried out to the top of the memory bar, the air-cooled component is fixed on the outside of the side water cooling component, air-supply cooling is carried out to the side water cooling component, by carrying out external cooling to the memory bar, guarantee that the internal element of the memory bar operates normally, and then guarantee the normal operation of computer.
Description
Technical field
The present invention relates to computer components field more particularly to a kind of computer memory bank heat dissipation fixation assemblies.
Background technique
Computer universal at present requires to use memory bar, and memory bar makes the channel for connecting CPU and other equipment, plays
The effect of buffering and data exchange, importance is self-evident, but the device of memory bar heat dissipation is not dedicated in existing computer,
As the capacity and working frequency of memory bar constantly increase, the failure rate of memory bar is also constantly increased, only the normal work of memory bar
Make, can just computer be made to work normally.
Summary of the invention
The purpose of the present invention is to provide a kind of computer memory bank heat dissipation fixation assemblies, it is intended to solve in the prior art
The capacity and working frequency of memory bar constantly increase, and the failure rate of memory bar also constantly increases, and only memory bar works normally,
Computer can be made to work normally.
To achieve the above object, a kind of computer memory bank heat dissipation fixation assembly that the present invention uses, including pedestal, memory
Item and radiator, the pedestal have connection bump and link slot, and the connection bump is located at the center of the pedestal, and court
Surface is stretched out to the direction far from the pedestal, the link slot is located at the center of the connection bump, and towards the pedestal
Direction extend；The memory bar is detachably connected with the base, and the bottom of the memory bar is protruded into the link slot, and
The direction that top is directed away from the pedestal extends；The radiator is fixedly connected with the memory bar, and is located in described
The surface of item is deposited, and close to the top of the memory bar；The radiator include side water cooling component, top water cooling component and
Air-cooled component, the side water cooling component are fixedly connected with the memory bar, and around the side of the memory bar, the top
Water cooling component is fixedly connected with the memory bar, and is located at the top of the memory bar, far from the pedestal, the air-cooled component
It is fixedly connected with the side water cooling component, and is located at the separate memory bar side of the side water cooling component.
Wherein, the side water cooling component includes water-cooled block, water cooling box and water circulating pump, the water-cooled block and the memory
Item is fixedly connected, and around the side of the memory bar；The water cooling box is fixedly connected with the water-cooled block, and is located at the water
Cold piece of the separate memory bar side；The water circulating pump connects the water cooling box and water-cooled block by conduit, and is located at institute
It states between water cooling box and the water-cooled block.
Wherein, the top water cooling component includes U-shaped water cooling tube, disengaging water pump and liquid reserve tank, the U-shaped water cooling tube and institute
It states memory bar to be fixedly connected, and is located at the top of the memory bar, far from the pedestal；The disengaging water pump and the U-shaped water
Cold pipe is fixedly connected, and is located at the opening portion of the U-shaped water cooling tube；The liquid reserve tank is fixedly connected with the disengaging water pump, and
Positioned at the disengaging water pump far from U-shaped water cooling tube side.
Wherein, the air-cooled component includes thermal conductive network and fan, and the thermal conductive network is fixedly connected with the water-cooled block, and position
In the surface of the water-cooled block, far from the memory bar；The fan is fixedly connected with the thermal conductive network, and is located at described thermally conductive
The surface of net, far from the water-cooled block side.
Wherein, the radiator further includes heat exchanger, and the quantity of the heat exchanger is multiple, and respectively with the water cooling
Case is fixedly connected, and is fixedly connected with the liquid reserve tank, and the heat exchanger is located at the surface of the water cooling box, and is located at the storage
The surface of liquid case.
Wherein, the radiator further includes heat-conducting glue layer, and the heat-conducting glue layer is fixedly connected with the memory bar, and with
The water-cooled block is fixedly connected, and is fixedly connected with the U-shaped water cooling tube, and the heat-conducting glue layer is located at the memory bar and described
Between water-cooled block, and between the memory bar and the U-shaped water cooling tube.
Wherein, computer memory bank heat dissipation fixation assembly further includes attachment device, the attachment device with it is described interior
It deposits item to be fixedly connected, and is detachably connected with the base, and be located at the bottom of the memory bar.
Wherein, the attachment device includes link block and fixture, and the link block is fixedly connected with the memory bar, and with
The connection bump is detachably connected, and around one week of the memory bar, is also located at the bottom of the memory bar, the fixture
It is slidably connected with the link block, and is detachably connected with the connection bump.
Wherein, the attachment device further includes adjustable spring, one end of the adjustable spring and the fixed company of the link block
It connects, the other end is fixedly connected with the fixture, and between the fixture and the link block, and is located at the interior of institute's link block
Portion.
A kind of computer memory bank heat dissipation fixation assembly of the invention, by the way that the memory bar is inserted into the link slot
It is interior, it is connect with metallic laminas, the side of the circular memory bar of the side water cooling component one week, and pass through the cold of internal flow
But liquid carries out radiating and cooling to the surface of the memory bar, and the top water cooling component is located at the top of the memory bar, to institute
The top for stating memory bar carries out radiating and cooling, and the air-cooled component is fixed on the outside of the side water cooling component, to the side
Face water cooling component carries out air-supply cooling, by cooling outside the inside and outside progress to the memory bar, guarantees the interior of the memory bar
Portion's element operates normally, and then guarantees the normal operation of computer.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is overall structure diagram of the invention.
Fig. 2 is the sectional view of attachment device part of the invention.
In figure: 1- pedestal, 2- memory bar, 3- attachment device, 4- radiator, 11- connection bump, 12- link slot, 31-
Link block, 32- fixture, 33- adjustable spring, the side 41- water cooling component, the top 42- water cooling component, the air-cooled component of 43-, 44- are changed
Hot device, 45- heat-conducting glue layer, 100- computer memory bank heat dissipation fixation assembly, 411- water-cooled block, 412- water cooling box, 413- circulation
Water pump, 421-U shape water cooling tube, 422- pass in and out water pump, 423- liquid reserve tank, 431- thermal conductive network, 432- fan.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.In addition, in the description of the present invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
Please refer to Fig. 1 and Fig. 2, the present invention provides a kind of computer memory bank radiate fixation assembly 100, including pedestal 1,
Memory bar 2 and radiator 4, the pedestal 1 have connection bump 11 and link slot 12, and the connection bump 11 is located at the bottom
The center of seat 1, and surface is stretched out in the direction for being directed away from the pedestal 1, the link slot 12 is located at the connection bump 11
Center, and extend towards the direction of the pedestal 1；The memory bar 2 is detachably connected with the pedestal 1, the memory bar 2
Bottom is protruded into the link slot 12, and top is directed away from the direction extension of the pedestal 1；The radiator 4 with it is described
Memory bar 2 is fixedly connected, and is located at the surface of the memory bar 2, and close to the top of the memory bar 2；The radiator 4
Including side water cooling component 41, top water cooling component 42 and air-cooled component 43, the side water cooling component 41 and the memory bar 2
It is fixedly connected, and around the side of the memory bar 2, the top water cooling component 42 is fixedly connected with the memory bar 2, and position
In the top of the memory bar 2, far from the pedestal 1, the air-cooled component 43 is fixedly connected with the side water cooling component 41,
And it is located at separate 2 side of memory bar of the side water cooling component 41.
In the present embodiment, the pedestal 1 is annular base 1, and has the connection bump 11 and the link slot
12, the connection bump 11 is ring seal protrusion, and the direction for being directed away from the pedestal 1 extends, the connection bump 11
Middle section is the link slot 12, and the link slot 12 is protruded into the pedestal 1 inside the connection bump 11, by the bottom
Hardware on seat 1 exposes, and the memory bar 2 is the cuboid of width very little, and bottom is inserted into the link slot 12, with institute
State the hardware connection of pedestal 1；The side water cooling component 41 surround one week of the memory bar 2, and inner filling water is cold
Liquid makes water cooling liquid and 2 mediate contact of memory bar, and flows water cooling liquid always, cold and hot water cooling liquid is replaced, the top
Water cooling component 42 is fixedly connected with the side water cooling component 41, and is contacted with the top of the memory bar 2, in the top water
It is full of water cooling liquid in cold component 42, and keeps water cooling liquid stream dynamic, replaces cold and hot liquids, the air-cooled component 43 is fixed on the side
The outer surface of face water cooling component 41, and quantity is two, is located at the front and rear sides of the memory bar 2, and far from described interior
Item 2 is deposited, the air-cooled component 43 connects power supply, makes the air-cooled component 43 by blowing to the side water cooling component 41
Cooling, in this way, being connect by the way that the memory bar 2 to be inserted into the link slot 12 with metallic laminas, the side water cooling component
The side of the 41 circular memory bars 2 one week, and radiated by surface of the coolant liquid of internal flow to the memory bar 2
Cooling, the top water cooling component 42 are located at the top of the memory bar 2, carry out radiating and cooling to the top of the memory bar 2,
The air-cooled component 43 is fixed on the outside of the side water cooling component 41, carries out air-supply drop to the side water cooling component 41
Temperature by carrying out external cooling to the memory bar 2, and then guarantees that the inside of the memory bar 2 operates normally.
Further, the side water cooling component includes water-cooled block 411, water cooling box 412 and water circulating pump 413, the water
It is fixedly connected with the memory bar 2 for cold piece 411, and around the side of the memory bar 2；The water cooling box 412 and the water cooling
Block 411 is fixedly connected, and is located at separate 2 side of memory bar of the water-cooled block 411；The water circulating pump 413 is by leading
Pipe connects the water cooling box 412 and water-cooled block 411, and between the water cooling box 412 and the water-cooled block 411.
In the present embodiment, the inner hollow of the water-cooled block 411, coolant liquid is placed in the water-cooled block 411, described
Water-cooled block 411 is integrally formed around the side of the memory bar 2, the water cooling box 412 with the water-cooled block 411, the circulation
Water pump 413 connects the water-cooled block 411 and the water cooling box 412 by conduit, makes coolant liquid and institute in the water cooling box 412
The coolant liquid displacement in water-cooled block 411 is stated, so that the coolant liquid in the water-cooled block 411 is remained lower temperature, and then make institute
Stating memory bar 2 can be cooled down in raising frequency work, it is ensured that the memory bar 2 works normally.
Further, the top water cooling component 42 includes U-shaped water cooling tube 421, disengaging water pump 422 and liquid reserve tank 423, institute
It states U-shaped water cooling tube 421 to be fixedly connected with the memory bar 2, and is located at the top of the memory bar 2, far from the pedestal 1；Institute
It states disengaging water pump 422 to be fixedly connected with the U-shaped water cooling tube 421, and is located at the opening portion of the U-shaped water cooling tube 421；The storage
Liquid case 423 is fixedly connected with the disengaging water pump 422, and is located at the separate U-shaped water cooling tube 421 of the disengaging water pump 422
Side.
In the present embodiment, U-shaped water cooling tube 421 is located at the top of the memory bar 2, and around the memory bar 2
One week, positioned at the two sides of the memory bar 2, the U-shaped water cooling tube 421 had inlet and outlet, was located at the U-shaped water cooling tube
421 it is ipsilateral, the disengaging water pump 422 connects the inlet and outlet of the U-shaped water cooling tube 421, and connects the liquid reserve tank
423, there is coolant liquid in the liquid reserve tank 423, in this way, the disengaging water pump 422 by the coolant liquid in the liquid reserve tank 423 from
The import is pumped in the U-shaped water cooling tube 421 by the heat of the memory bar 2, and the disengaging water pump 422 will be added
The coolant pump of heat, which is sent back in the liquid reserve tank 423, to be cooled down, and can so make to carry out rapid cooling at the top of the memory bar 2,
Ensure that the memory bar 2 works normally.
Further, the air-cooled component 43 includes thermal conductive network 431 and fan 432, the thermal conductive network 431 and the water cooling
Block 411 is fixedly connected, and is located at the surface of the water-cooled block 411, far from the memory bar 2；The fan 432 with it is described thermally conductive
Net 431 is fixedly connected, and is located at the surface of the thermal conductive network 431, far from 411 side of water-cooled block.
In the present embodiment, the thermal conductive network 431 is heat conductivity graphite material, and 431 diamond shape of thermal conductive network is distributed in institute
The surface of water-cooled block 411 is stated, and is connected with each other, intermediate there are heat-dissipating space, the fan 432 and 431 screw threads of thermal conductive network
Connection, and it is located at drying far from the cooling block side, and to the thermal conductive network 431 for the thermal conductive network 431, it will be described thermally conductive
Net 431 cools down, and by accelerating the radiating rate of the water-cooled block 411, so that the coolant liquid in the water-cooled block 411 is cooled down fast
Degree is fast, and then guarantees that the inside of the memory bar 2 operates normally.
Further, the radiator 4 further includes heat exchanger 44, and the quantity of the heat exchanger 44 is multiple, and respectively
It is fixedly connected with the water cooling box 412, and is fixedly connected with the liquid reserve tank 423, the heat exchanger 44 is located at the water cooling box
412 surface, and it is located at the surface of the liquid reserve tank 423.
In the present embodiment, the heat exchanger 44 is board-like heat-conductive heat-exchanger 44, and quantity is two, and is located at
The surface of the water cooling box 412 and the liquid reserve tank 423, by the Heat Conduction Material in the heat exchanger 44 by the water cooling box
412 and the liquid reserve tank 423 in heat derives, and exchanged heat by the liquid inside the heat exchanger 44, can be quickly
Cool down to the water cooling box 412 and the liquid reserve tank 423, and then guarantees that the inside of the memory bar 2 operates normally.
Further, the radiator 4 further includes heat-conducting glue layer 45, and the heat-conducting glue layer 45 and the memory bar 2 are solid
Fixed connection, and be fixedly connected with the water-cooled block 411, and be fixedly connected with the U-shaped water cooling tube 421, the heat-conducting glue layer 45
Between the memory bar 2 and the water-cooled block 411, and between the memory bar 2 and the U-shaped water cooling tube 421.
In the present embodiment, the heat-conducting glue layer 45 is silica gel material, and is coated in the water-cooled block 411 and described interior
It deposits between item 2, the water-cooled block 411 is fixedly connected with the memory bar 2, it, will by the thermal conductivity of the heat-conducting glue layer 45
In heat transfer to the water-cooled block 411, thermally conductive cooling is carried out to the memory bar 2；The heat-conducting glue layer 45 is also coated in institute
It states between memory bar 2 and the U-shaped water cooling tube 421, and the top of the U-shaped water cooling tube 421 and the memory bar 2 is fixed and is connected
Connect, by the thermal conductivity of the heat-conducting glue layer 45, transfer heat on the U-shaped water cooling tube 421, to the memory bar 2 into
The thermally conductive cooling of row, and then guarantee that the inside of the memory bar 2 operates normally.
Further, the computer memory bank heat dissipation fixation assembly 100 further includes attachment device 3, the attachment device 3
It is fixedly connected with the memory bar 2, and is detachably connected with the pedestal 1, and be located at the bottom of the memory bar 2.
In the present embodiment, the attachment device 3 is integrally formed with the memory bar 2, and logical with the water-cooled block 411
It crosses the heat-conducting glue layer 45 to be bonded, and engages with the pedestal 1, can also be dismantled with the pedestal 1, by the memory bar 2
It is fixed with the pedestal 1, so that the memory bar 2 is preferably connect with the metallic laminas on the pedestal 1, and position will not occur
It moves, and then keeps the connectivity of the memory bar 2 and the pedestal 1 more preferable, guarantee that computer can operate normally.
Further, the attachment device 3 includes link block 31 and fixture 32, the link block 31 and the memory bar 2
It is fixedly connected, and is detachably connected with the connection bump 11, and around one week of the memory bar 2, be also located at the memory
The bottom of item 2, the fixture 32 are slidably connected with the link block 31, and are detachably connected with the connection bump 11.
In the present embodiment, the link block 31 is fastened around one week of the memory bar 2, and is located at the memory
The one end that connect with the connection bump 11 of the close bottom position of item 2, the link block 31 is U-shaped, is open towards the company
Protrusion 11 is connect, and is cooperated with the connection bump 11, the fixture 32 is fixed at the U-shaped opening of the link block 31, and is hung down
It is directly slided in the link block 31 and the section of the connection bump 11, the link block 31 is bonded with the connection bump 11
Afterwards, the fixture 32 is fixed by the link block 31 and the connection bump 11, and then keeps memory bar and the pedestal 1 fixed.
Further, the attachment device 3 further includes adjustable spring 33, one end of the adjustable spring 33 and the connection
Block 31 is fixedly connected, and the other end is fixedly connected with the fixture 32, and between the fixture 32 and the link block 31, and
Positioned at the inside of institute's link block 31.
In the present embodiment, the adjustable spring 33 connects the link block 31 and the fixture 32, makes the fixture
32 are constrained by the adjustable spring 33, and when the link block 31 is contacted with the connection bump 11, the fixture 32 is by institute
The pressure of connection bump 11 is stated, and then compresses the adjustable spring 33, continues the link block 31 and the connection bump 11
Fitting, after being bonded completely, the fixture 32 is popped up by the adjustable spring 33, and the link block 31 and the connection is convex
It plays 11 to fix, keeps the connection of the memory bar 2 more preferable, and then work normally the memory bar 2.
Above disclosed is only a preferred embodiment of the present invention, cannot limit the power of the present invention with this certainly
Sharp range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and weighs according to the present invention
Benefit requires made equivalent variations, still belongs to the scope covered by the invention.
Claims (9)
- The fixation assembly 1. a kind of computer memory bank radiates, which is characterized in that including pedestal, memory bar and radiator,The pedestal has connection bump and link slot, and the connection bump is located at the center of the pedestal, and is directed away from institute Surface is stretched out in the direction for stating pedestal, and the link slot is located at the center of the connection bump, and prolongs towards the direction of the pedestal It stretches；The memory bar is detachably connected with the base, and the bottom of the memory bar is protruded into the link slot, and top direction Direction far from the pedestal extends；The radiator is fixedly connected with the memory bar, and is located at the table of the memory bar Face, and close to the top of the memory bar；The radiator includes side water cooling component, top water cooling component and air-cooled component, the side water cooling component and institute It states memory bar to be fixedly connected, and around the side of the memory bar, the top water cooling component is fixedly connected with the memory bar, And it is located at the top of the memory bar, far from the pedestal, the air-cooled component is fixedly connected with the side water cooling component, and Positioned at the side water cooling component far from the memory bar side.
- The fixation assembly 2. computer memory bank as described in claim 1 radiates, which is characterized in thatThe side water cooling component includes water-cooled block, water cooling box and water circulating pump, and the water-cooled block and the memory bar, which are fixed, to be connected It connects, and around the side of the memory bar；The water cooling box is fixedly connected with the water-cooled block, and is located at the remote of the water-cooled block From the memory bar side；The water circulating pump connects the water cooling box and water-cooled block by conduit, and is located at the water cooling box Between the water-cooled block.
- The fixation assembly 3. computer memory bank as claimed in claim 2 radiates, which is characterized in thatThe top water cooling component includes U-shaped water cooling tube, disengaging water pump and liquid reserve tank, the U-shaped water cooling tube and the memory bar It is fixedly connected, and is located at the top of the memory bar, far from the pedestal；The disengaging water pump is fixed with the U-shaped water cooling tube Connection, and it is located at the opening portion of the U-shaped water cooling tube；The liquid reserve tank is fixedly connected with the disengaging water pump, and is located at described Pass in and out the separate U-shaped water cooling tube side of water pump.
- The fixation assembly 4. computer memory bank as claimed in claim 2 radiates, which is characterized in thatThe air-cooled component includes thermal conductive network and fan, and the thermal conductive network is fixedly connected with the water-cooled block, and is located at the water Cold piece of surface, far from the memory bar；The fan is fixedly connected with the thermal conductive network, and is located at the table of the thermal conductive network Face, far from the water-cooled block side.
- The fixation assembly 5. computer memory bank as claimed in claim 3 radiates, which is characterized in thatThe radiator further includes heat exchanger, and the quantity of the heat exchanger is multiple, and fixes connect with the water cooling box respectively It connects, and is fixedly connected with the liquid reserve tank, the heat exchanger is located at the surface of the water cooling box, and is located at the table of the liquid reserve tank Face.
- The fixation assembly 6. computer memory bank as claimed in claim 3 radiates, which is characterized in thatThe radiator further includes heat-conducting glue layer, and the heat-conducting glue layer is fixedly connected with the memory bar, and with the water cooling Block is fixedly connected, and is fixedly connected with the U-shaped water cooling tube, the heat-conducting glue layer be located at the memory bar and the water-cooled block it Between, and between the memory bar and the U-shaped water cooling tube.
- The fixation assembly 7. computer memory bank as described in claim 1 radiates, which is characterized in thatThe computer memory bank heat dissipation fixation assembly further includes attachment device, the attachment device and the fixed company of the memory bar It connects, and is detachably connected with the base, and be located at the bottom of the memory bar.
- The fixation assembly 8. computer memory bank as claimed in claim 7 radiates, which is characterized in thatThe attachment device includes link block and fixture, and the link block is fixedly connected with the memory bar, and with the connection Protrusion is detachably connected, and around one week of the memory bar, is also located at the bottom of the memory bar, the fixture and the company It connects block to be slidably connected, and is detachably connected with the connection bump.
- The fixation assembly 9. computer memory bank as claimed in claim 8 radiates, which is characterized in thatThe attachment device further includes adjustable spring, and one end of the adjustable spring is fixedly connected with the link block, the other end It is fixedly connected with the fixture, and between the fixture and the link block, and is located at the inside of institute's link block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910785481.4A CN110488951A (en) | 2019-08-23 | 2019-08-23 | Computer memory bank heat dissipation fixation assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910785481.4A CN110488951A (en) | 2019-08-23 | 2019-08-23 | Computer memory bank heat dissipation fixation assembly |
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| CN110488951A true CN110488951A (en) | 2019-11-22 |
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| CN201910785481.4A Pending CN110488951A (en) | 2019-08-23 | 2019-08-23 | Computer memory bank heat dissipation fixation assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253816A (en) * | 2021-07-15 | 2021-08-13 | 深圳市嘉合劲威电子科技有限公司 | Memory bank for internet server |
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| CN107344407A (en) * | 2017-08-23 | 2017-11-14 | 柳州市瑞安机械制造有限责任公司 | A kind of cold wind blower |
| CN208158543U (en) * | 2018-04-25 | 2018-11-27 | 李世运 | A kind of novel fire resistant solar power generation panel assembly |
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| CN113253816A (en) * | 2021-07-15 | 2021-08-13 | 深圳市嘉合劲威电子科技有限公司 | Memory bank for internet server |
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Application publication date: 20191122 |