CN109976486A - A kind of heat radiator of computer CPU - Google Patents
A kind of heat radiator of computer CPU Download PDFInfo
- Publication number
- CN109976486A CN109976486A CN201910348586.3A CN201910348586A CN109976486A CN 109976486 A CN109976486 A CN 109976486A CN 201910348586 A CN201910348586 A CN 201910348586A CN 109976486 A CN109976486 A CN 109976486A
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- base plate
- conductive base
- cpu
- shell
- heat dissipation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat radiator of computer CPU, belongs to computer CPU and cool technical field.Apparatus of the present invention drip irrigation device an are as follows: sealing shell is installed above conductive base plate, and several spiral heat dissipation heads are set in conductive base plate upper surface, too large space will not be occupied while increasing heat radiation area again, so that the heat of CPU is distributed on the wider array of spiral heat dissipation head of contact surface by conductive base plate, coolant liquid is atomized by four atomizers that the water tank lower end of upper shell is installed and is sprayed on the spiral heat dissipation head and conductive base plate of lower section, the turbofan in drum type cavity being arranged again by shell left end takes away spiral heat dissipation head and conductive base plate surface with the drop of heat, cooled down by liquid flowing to CPU merely compared to more traditional cooling device, apparatus of the present invention cooperate turbofan to make its vaporization by atomized spray, it is greatly improved cooling effect.
Description
Technical field
It cools technical field the invention belongs to computer CPU, and in particular to a kind of heat radiator of computer CPU.
Background technique
The mainstream of existing conventional desktop computer mainframe box is tower mainframe box, and overall figure is cuboid.Desktop computer
Mainframe box be divided into it is horizontal and vertical, generally with vertical most commonly seen.All physics components are commonly referred to as in mainframe box
Computer hardware, including mainboard, hard disk, CPU, memory bar, independent display card, CD-ROM drive and power supply and each radiator.Existing tower
Formula mainframe box is non-ultra-thin case, and figure is big, weight weight.Wherein 1) the structure and its installation of cpu heat: traditional CPU dissipates
Hot device is to pass through the CPU mounting hole on mainboard, rigidity or material, frame mode close to rigidity with 4 screws/expansion bayonet lock
Cpu heat is fixed on mainboard.Usually there are following five kinds of problems: first, due to the tension that screw/expansion bayonet lock is twisted,
Stress between radiator and mainboard is excessive, causes the bending that mainboard is different degrees of.Second, sometimes due to this 4 screws are tight
Gu when respectively stress degree it is unbalanced, cause locally to tilt between cpu chip surface and the heat-conducting base of radiator, generate subtle sky
Gap considerably increases the thermal coefficient between cpu chip and radiator heat-conducting base, hinders cpu chip between radiator
Heat transmitting.Third, traditional cpu heat and matched fastener, part are various, install it is cumbersome, need mostly rather
Clock is to more than ten minutes etc..4th, it is immovable or can only unidirectionally move when parts of traditional cpu heat is mounted on mainboard
It is dynamic.The drawbacks of causing to occur cpu heat sometimes mutually to conflict with component position on certain mainboards, and being unable to normal mounting.The
Five, the cpu heat of most of traditional high-sides in order to reach better heat dissipation effect, can only simply increase radiator size
Figure, so that large-scale cpu heat substantially reduces the compatibility of mainframe box and mainboard, and the cost of user's purchase is also obvious
Increase.In addition, the CPU overwhelming majority TDP power consumption that ordinary user uses is all within 100W, but consider top CPU and overclocking
The challenging needs of user, the power consumption that cpu heat can carry will reach 180W or more.Therefore the performance of radiator also proposed
Higher requirement.2) installation and heat dissipation of independent display card: the independent display card in conventional desktop mainframe box, it is aobvious if it is low and middle-end
Card, is usually radiated using the radiator of video card first wife.If it is high-power high-end video card or using high, cumbersome
Water-cooling project or reinstall better air-cooled radiator.But on the market most of independent display card air-cooled radiator or
The more, complex installation process with certain compatible range or supporting part.And do not have the user of certain professional knowledge
Which type of radiator does not know select most suitable.Traditional host desktop case, independent display card are deposited in terms of heat dissipation
In following problem:
First, if independent display card, using air-cooled, due to the limitation of mounting means and dimensions, heat sink size can hardly
More than the size range of video card itself.And its matched fan will also occupy a part of volume of radiator, so radiator
Practical heat dissipation area is limited.Second, if its high expense of light is not said using water cooling.Water tank matched with water cooling, water pump,
Radiator, fan, water pipe etc. require the volume and weight for additionally increasing cabinet.And it is erroneous for installation, when user installation water cooling also
Need to have certain professional manipulative ability.Third, independent display card and cabinet side board air inlet are perpendicular.If using wind
It is cold, common unordered interference of the cold air flowed by air inlet by CPU radiator fan and VGA COOLER on mainboard, machine
Cold air outside case cannot completely, flowing through for one-dimensional order high efficiency and heat radiation is carried out in independent display card radiator because in cabinet not
Scientific, strict air duct makes to flow into the cold air of independent display card, cpu heat entrainment of reflux hot-air, affects heat dissipation
The heat exchange effect of device.4th, independent display card radiator is placed in horizontal parallel, and it is naturally upward to be highly detrimental to air hot-fluid
Lift.
Temperature is higher when powerful computer CPU is run, and will cause computer if cannot cooling down well to it
Operation is broken down or even CPU is burnt, and nowadays has air-cooled and water cooling two ways processing unit, wherein water-cooling type radiator
Using liquid, forced circulation takes away the heat of radiator under the drive of pump, and there is quiet, cooling to stablize compared with air-cooled, to ring
Border relies on the advantages that small, and compare air cooling equipment better effect, but does not all have change in recent years, and heat dissipation effect does not obtain more preferably
Promotion.
Summary of the invention
The technical problems to be solved by the invention: it is still needed to for current computer CPU cooling device cooling effect is bad
Continue the problem of improving, a kind of heat radiator of computer CPU is provided.
In order to solve the above technical problems, the present invention uses technical solution as described below:
A kind of heat radiator of computer CPU, including CPU, conductive base plate, water supply hose, delivery hose and spiral cooling tube；It is described
Conductive base plate is that several spiral heat dissipation heads have been fixedly mounted in rectangular-shaped and upper surface, is fixedly installed with outside the conductive base plate
The conductive base plate of lower end is pressed in the upper surface CPU of computer by shell, the Convenient table that the shell is fixedly mounted by four angles,
The upper shell is provided with a reservoir chamber, and the reservoir chamber lower end sets spiral there are four atomizer and downward and dissipates
Hot head, the cover top portion middle position of the reservoir chamber upper end is provided with a water inlet, and runs through among water inlet and be equipped with one
The male connection of internal thread interface, internal thread interface and water supply hose one end on the reservoir chamber is correspondingly connected with, it is described into
The water hose other end is fixedly installed with a male connection and is correspondingly connected with the internal thread interface in the spiral cooling tube lower end
In, shell lower-left end is provided with a water outlet at spiral heat dissipation head same horizontal line, and equally passes through among water outlet
It wears and is mounted with an internal thread interface, the internal thread interface left end is equipped with drum type cavity, and the internal thread interface and the drum
The male connection connection that cavity right end is fixedly mounted communicates, and drum type cavity middle is fixedly installed with turbofan,
Drum type cavity left end is equipped with a delivery hose, and the delivery hose other end passes through the male connection being fixedly mounted and spiral shell
The internal thread interface of rotation cooling tube upper end is correspondingly connected with.
Preferably, the conductive base plate and spiral heat dissipation head are copper material production.
Preferably, the conductive base plate is the square shape similar to CPU, and the conductive base plate is bigger than normal in CPU.
Preferably, the spiral cooling tube is fixed on the computer inner wall at heat sink body shell lower end position.
Preferably, the drum type cavity is broad in the middle, and both sides interface is relatively small.
Preferably, rubber seal is cased in each male connection.
Preferably, the Convenient table is corresponding with the fixing end of CPU surrounding on computer motherboard.
Preferably, circulating liquid is coolant liquid in described device.
Preferably, one layer of thermal conductive silicon is smeared in the upper surface CPU.
The present invention is compared with other methods, and advantageous effects are:
One sealing shell is installed above conductive base plate, and several spiral heat dissipation heads are set in conductive base plate upper surface, is increased
Too large space will not be occupied while heat dissipation area again, so that the heat of CPU is distributed to the wider array of spiral shell of contact surface by conductive base plate
It revolves on heat dissipation head, be atomized coolant liquid by four atomizers that the water tank lower end of upper shell is installed and be sprayed at lower section
Spiral heat dissipation head and conductive base plate on, then turbofan in the drum type cavity that is arranged by shell left end is by spiral heat dissipation
Head and conductive base plate surface are taken away with the drop of heat, compared to more traditional cooling device merely by liquid flow to CPU into
Row cooling, apparatus of the present invention cooperate turbofan to make its vaporization, are greatly improved cooling effect by atomized spray.
Detailed description of the invention
Fig. 1 is the schematic view of the front view of apparatus of the present invention；
Fig. 2 is the side view of Fig. 1；
Fig. 3 is the structural schematic diagram of male connection in apparatus of the present invention in Fig. 1；
1, shell；101, internal thread interface；2, conductive base plate；3, spiral heat dissipation head；4, reservoir chamber；5, drum type cavity；6, turbine
Fan；7, water supply hose；8, delivery hose；9, atomizer；10, male connection；1001, rubber seal；11, spiral is cold
But it manages；12, Convenient table；13,CPU.
Specific embodiment
Below in conjunction with the attached drawing in the present invention, technical solution in the embodiment of the present invention carry out it is clear, completely retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, those skilled in the art's all other reality obtained without making creative work
Example is applied, protection scope of the present invention is belonged to.Hereinafter such as there are "upper", "lower", "left", "right" printed words, only expression and attached drawing
The upper and lower, left and right direction of itself is consistent, does not play restriction effect to structure.
A kind of heat radiator of computer CPU as shown in Fig. 1 ~ 3, including CPU13, conductive base plate 2, water supply hose 7, water outlet
Hose 8 and spiral cooling tube 11；The conductive base plate 2 is that several spiral heat dissipation heads 3 have been fixedly mounted in rectangular-shaped and upper surface,
The heat dissipation area that conductive base plate 2 can be increased in this way, cools down to it convenient for subsequent, is fixedly mounted outside the conductive base plate 2
There is shell 1, the conductive base plate 2 of lower end is pressed in computer by the Convenient table 12 that four angles are fixedly mounted by the shell 1
The upper surface CPU13,1 upper end of shell are provided with a reservoir chamber 4,4 lower end of reservoir chamber set there are four atomizer 9 and
Spiral heat dissipation head 3 downward can make coolant liquid be atomized into droplet in this way and be sprayed at conductive base plate 2 and spiral heat dissipation head 3
Surface cools down to it, and the cover top portion middle position of 4 upper end of reservoir chamber is provided with a water inlet, and in water inlet
Between through being equipped with an internal thread interface 101, the outer spiral shell of the internal thread interface 101 on the reservoir chamber 4 and 7 one end of water supply hose
Line connector 10 is correspondingly connected with, and 7 other end of water supply hose is fixedly installed with a male connection and is correspondingly connected in the spiral shell
In the internal thread interface for revolving 11 lower end of cooling tube, the 1 lower-left end of shell is provided with one at 3 same horizontal line of spiral heat dissipation head
Water outlet, and also extended through among water outlet and be mounted with an internal thread interface 101,101 left end of internal thread interface is equipped with
Drum type cavity 5, and the internal thread interface 101 connect phase with the male connection 10 that 5 right end of drum type cavity is fixedly mounted
Logical, 5 middle of drum type cavity is fixedly installed with turbofan 6, and 5 left end of drum type cavity is equipped with a delivery hose 8, institute
It states 8 other end of delivery hose and passes through the male connection 10 being fixedly mounted and the internal thread interface 101 of 11 upper end of spiral cooling tube
It is correspondingly connected with, quickly rotation flows 1 inner cavity air of shell toward drum type cavity 5 to such turbofan 6, forms shell inner cavity negative
On the one hand pressure can take away the drop of conductive base plate 2 and the attachment of 3 surface of spiral heat dissipation head, play cooling effect, on the other hand make
Coolant liquid in device can circulate counterclockwise, so that the coolant liquid with heat flows to spiral cooling tube through delivery hose 8
It is cooled in 11, and is re-introduced into reservoir chamber 4 from the water supply hose 7 of 11 lower end of spiral cooling tube and continues sprinkling cooling.
The conductive base plate 2 and spiral heat dissipation head 3 are copper material production, and heat-conducting effect is more preferable.
The conductive base plate 2 is the square shape similar to CPU13, and the conductive base plate 2 is bigger than normal in CPU13, this
Sample contacts fixation with 2 bottom margin of conductive base plate convenient for shell 1.
The spiral cooling tube 11 is fixed on the computer inner wall at 1 lower end position of heat sink body shell, is convenient for turbine
Fan 6 drives the flowing of coolant liquid left-hand circular.
The drum type cavity 5 is broad in the middle, and both sides interface is relatively small, intermediate in this way to place biggish turbofan 6, and
And the small coolant liquid of both ends bore or air velocity are faster.
It is cased with rubber seal 1001 in each male connection 10, prevents internal liquid from revealing.
The Convenient table 12 is corresponding with the fixing end of CPU13 surrounding on computer motherboard, so that apparatus main body can be consolidated
It is scheduled on mainboard and conductive base plate 2 is pressed together on the surface CPU13.
Circulating liquid is coolant liquid in described device.
One layer of thermal conductive silicon is smeared in the upper surface CPU13, fills up the gap between CPU13 and conductive base plate 2, reduces mutual
Between thermal resistance, both increase heating conduction.
The workflow of apparatus of the present invention are as follows:
When apparatus of the present invention are run, turbofan 6 is rotated so that air is turned left flowing from the right side so that 1 inner cavity of shell formed it is negative
It presses, cooling liquid such as Fig. 1 counterclockwise flow, liquid flows into reservoir chamber 4 in water supply hose 7, flowing and lower section due to liquid
Subnormal ambient, coolant liquid is sprayed through atomizer 9 is attached to 3 surface of lower end conductive base plate 2 and spiral heat dissipation head in droplet,
It is sucked out again through turbofan 6 to delivery hose 8, the CPU13 heat being transmitted in conductive base plate 2 and spiral heat dissipation head 3 is taken away,
Play cooling effect, the coolant liquid with heat flows into spiral cooling tube 11 after cooling through delivery hose 8, continue from
Lower end water outlet flow to water supply hose 7, circularly carries out cooling heat to CPU13.
The present invention is further described by specific embodiment above, it should be understood that, here specifically
Description, should not be construed as the restriction for the essence of the present invention with range, and one of ordinary skilled in the art is reading this explanation
The various modifications made after book to above-described embodiment belong to the range that the present invention is protected.
Claims (9)
1. a kind of heat radiator of computer CPU, including CPU(13), conductive base plate (2), water supply hose (7), delivery hose (8) and
Spiral cooling tube (11), which is characterized in that the conductive base plate (2) is that several spirals have been fixedly mounted in rectangular-shaped and upper surface
Heat dissipation head (3), the conductive base plate (2) is external to be fixedly installed with shell (1), and the shell (1) is fixedly mounted by four angles
Convenient table (12) conductive base plate (2) of lower end is pressed in the CPU(13 of computer) upper surface, shell (1) the upper end setting
Have a reservoir chamber (4), reservoir chamber (4) lower end sets spiral heat dissipation head there are four atomizer (9) and downward
(3), the cover top portion middle position of reservoir chamber (4) upper end is provided with a water inlet, and runs through among water inlet and be equipped with
The external screw thread of one internal thread interface (101), internal thread interface (101) and water supply hose (7) one end on the reservoir chamber (4) connects
Head (10) is correspondingly connected with, and water supply hose (7) other end is fixedly installed with a male connection and is correspondingly connected in the spiral shell
In the internal thread interface for revolving cooling tube (11) lower end, shell (1) the lower-left end is at spiral heat dissipation head (3) same horizontal line
It is provided with a water outlet, and is also extended through among water outlet and is mounted with an internal thread interface (101), the internal thread interface
(101) left end is equipped with drum type cavity (5), and the internal thread interface (101) and drum type cavity (5) right end fixed installation
Male connection (10) connection communicates, and drum type cavity (5) middle is fixedly installed with turbofan (6), the drum type chamber
Body (5) left end is equipped with a delivery hose (8), the male connection (10) that delivery hose (8) other end passes through fixed installation
It is correspondingly connected with the internal thread interface (101) of spiral cooling tube (11) upper end.
2. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the conductive base plate (2) and spiral shell
Heat dissipation head (3) are revolved for copper material production.
3. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the conductive base plate (2) is class
Be similar to CPU(13) square shape, and the conductive base plate (2) is bigger than normal in CPU(13).
4. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the spiral cooling tube (11)
It is fixed on the computer inner wall at heat sink body shell (1) lower end position.
5. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the drum type cavity (5) is intermediate
Greatly, both sides interface is relatively small.
6. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that each male connection
(10) rubber seal (1001) are all cased on.
7. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the Convenient table (12) and meter
Calculate mainboard on CPU(13) surrounding fixing end it is corresponding.
8. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that circulating liquid in described device
For coolant liquid.
9. a kind of heat radiator of computer CPU according to claim 1, which is characterized in that the CPU(13) upper surface painting
Smear one layer of thermal conductive silicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910348586.3A CN109976486A (en) | 2019-04-28 | 2019-04-28 | A kind of heat radiator of computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910348586.3A CN109976486A (en) | 2019-04-28 | 2019-04-28 | A kind of heat radiator of computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109976486A true CN109976486A (en) | 2019-07-05 |
Family
ID=67086707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910348586.3A Pending CN109976486A (en) | 2019-04-28 | 2019-04-28 | A kind of heat radiator of computer CPU |
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| Country | Link |
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| CN (1) | CN109976486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110865695A (en) * | 2019-10-16 | 2020-03-06 | 王天红 | Water-cooled CPU radiator |
| CN110989810A (en) * | 2020-02-07 | 2020-04-10 | 苏州溢博伦光电仪器有限公司 | Evaporation formula electronic chip forced air cooling heat abstractor |
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| CN102209452A (en) * | 2010-03-29 | 2011-10-05 | 研能科技股份有限公司 | Atomization heat radiation cooling system |
| CN207720621U (en) * | 2017-12-29 | 2018-08-10 | 东莞市达亿五金机械有限公司 | Stream the radiator of increasing heat radiation area |
| CN109062389A (en) * | 2018-10-25 | 2018-12-21 | 郑州莱兹电子科技有限公司 | A kind of CPU radiator |
| CN109099402A (en) * | 2018-09-26 | 2018-12-28 | 中山市领群光电科技有限公司 | A kind of fin connection structure of effective increasing heat radiation area and preparation method thereof |
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2019
- 2019-04-28 CN CN201910348586.3A patent/CN109976486A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060012958A1 (en) * | 2002-08-30 | 2006-01-19 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| CN102209452A (en) * | 2010-03-29 | 2011-10-05 | 研能科技股份有限公司 | Atomization heat radiation cooling system |
| CN207720621U (en) * | 2017-12-29 | 2018-08-10 | 东莞市达亿五金机械有限公司 | Stream the radiator of increasing heat radiation area |
| CN109099402A (en) * | 2018-09-26 | 2018-12-28 | 中山市领群光电科技有限公司 | A kind of fin connection structure of effective increasing heat radiation area and preparation method thereof |
| CN109062389A (en) * | 2018-10-25 | 2018-12-21 | 郑州莱兹电子科技有限公司 | A kind of CPU radiator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110865695A (en) * | 2019-10-16 | 2020-03-06 | 王天红 | Water-cooled CPU radiator |
| CN110865695B (en) * | 2019-10-16 | 2020-11-10 | 王天红 | Water-cooled CPU radiator |
| CN110989810A (en) * | 2020-02-07 | 2020-04-10 | 苏州溢博伦光电仪器有限公司 | Evaporation formula electronic chip forced air cooling heat abstractor |
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Application publication date: 20190705 |
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