CN102209452A - Atomization heat radiation cooling system - Google Patents
Atomization heat radiation cooling system Download PDFInfo
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- CN102209452A CN102209452A CN2010101579761A CN201010157976A CN102209452A CN 102209452 A CN102209452 A CN 102209452A CN 2010101579761 A CN2010101579761 A CN 2010101579761A CN 201010157976 A CN201010157976 A CN 201010157976A CN 102209452 A CN102209452 A CN 102209452A
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Abstract
The invention discloses an atomization heat radiation cooling system which is used for cooling a heat element. The system comprises: a liquid cooling apparatus; a liquid storage unit which is used for storing a fluid; an atomization heat radiation assembly, which is used for spraying the atomized fluid so as to absorb heat energy of the heat element; a conveying device, consisting of a first pump and a second pump; a transmission pipe, which is used for connecting the liquid storage unit, the atomization heat radiation assembly, the first pump, the second pump and the liquid cooling apparatus in series so as to form a fluid circuit.
Description
Technical field
The invention relates to a kind of atomizing heat radiation cooling system that radiating subassembly was suitable for that atomizes.
Background technology
Along with developing rapidly of computer industry, it is more and more serious that CPU pursues the heat dissipation problem that high-speedization, multifunction and miniaturization derive, and this is more outstanding in the narrow and small electronic installation in inner spaces such as mobile computer.If the heat real-time and effective that electronic component produced such as CPU in the mobile computer can't be distributed, will influence the service behaviour of electronic component, also can reduce the useful life of electronic component simultaneously, so the dealer adopts usually a cooling device to come electronic element radiating.
In numerous cooling technologies, liquid cools is a kind of very effectively type of cooling.Traditional liquid-cooling system mainly by absorber, radiator, mechanical pump, and transfer tube constitute a loop, fill cooling fluid in this loop, cooling fluid absorbs the heat that electronic component produced at this absorber place, emits heat after transfer tube reaches radiator.Under the driving action of this mechanical pump, this cooling fluid is constantly circulation in the loop, and then the heat of taking away this electronic component continuously and being produced.
Though existing liquid-cooling system can reach the effect that heat that heat-generating electronic elements is produced removes, and only utilizes cooling fluid, for example: water, it is limited constantly to repeat the radiating effect that circulates.
Therefore, how to develop a kind of atomizing heat radiation cooling system that improves above-mentioned prior art disappearance, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of atomizing heat radiation cooling system, only utilizes cooling fluid constantly to repeat circulation to solve existing liquid-cooling system, makes shortcomings such as radiating effect is limited.
For reaching above-mentioned purpose, of the present invention one implements aspect for a kind of atomizing heat radiation cooling system is provided than broad sense, in order to a heater element is dispelled the heat, comprises: a Control device of liquid cooling; One liquid storage unit stores a fluid; One atomizing radiating subassembly is in order to spray this fluid atomizing to absorb the heat of this heater element; One conveying device has first pump and one second pump; One transfer conduit is in order to form a fluid circuit with this liquid storage unit, this atomizing radiating subassembly, this first pump, this second pump and this Control device of liquid cooling serial connection.
Useful technique effect of the present invention is: atomizing of the present invention heat radiation cooling system with fluid atomizing and be injected into heat absorbing units, can make the heat of the absorption of fluids heat absorbing units of atomizing by atomizing component, can make cooling system reach better radiating effect.
Description of drawings
Fig. 1 is the structural representation of the cooling system of preferred embodiment of the present invention.
Fig. 2 A is the decomposition texture schematic diagram of atomizing radiating subassembly shown in Figure 1.
Fig. 2 B is the structure schematic diagram of the cavity body structure shown in Fig. 2 A.
Fig. 2 C is the structural representation of ccontaining porous absorption material in the reservoir of the cavity body structure of Fig. 2 B.
Fig. 3 A is the combining structure conception figure of Fig. 2 A.
Fig. 3 B is the A-A generalized section of Fig. 3 A.
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and icon be when the usefulness that explain in itself, but not in order to restriction the present invention.
Atomizing heat radiation cooling system of the present invention applicable to an electronic installation (for example: host shell inside mobile computer), mainly the heat-generating electronic elements to host shell dispels the heat, see also Fig. 1, it is the structural representation of the cooling system of preferred embodiment of the present invention, as shown in the figure, the cooling system 1 of present embodiment can comprise liquid storage unit 11, atomizing radiating subassembly 12, the conveying device that includes first pump 13 and second pump 14, Control device of liquid cooling 15 and transfer conduit 16, wherein liquid storage unit 11 stores a fluid, and this Control device of liquid cooling 15 comprises heat exchanger 151 and fan 152.
Atomizing radiating subassembly 12 of the present invention is 11 reception fluids from the liquid storage unit, and with the ejection of this fluid atomizing to absorb the heat of a heater element (not icon), as for, first pump 13 of the present invention and second pump 14 can be a piezoelectric pump and adopt the form of one-in-and-one-out, promptly have single inlet and single outlet, the inlet of first pump 13 and second pump 14 all is connected with atomizing radiating subassembly 12, and outlet then is connected with Control device of liquid cooling 15.
Wherein, first pump 13 is that the fluid of 11 inside, liquid storage unit is sucked in the atomizing radiating subassembly 12, and the fluid recovery that is not atomized in the radiating subassembly 12 that will atomize and being sent in the heat exchanger 151, as for, 14 of second pumps are that the fluid of will vaporize in the atomizing radiating subassembly 12 is sent to heat exchanger 151, except can guarantee that fluid can smooth and easyly flow in fluid circuit, also can increase the circulation rate of fluid by the suction of first pump 13 and second pump 14 in loop.
Heat exchanger 151 can be metal material, it receives first pump 13 and does not transmit the fluid that is drawn the generation atomizing by suction, and receive this fluid of having vaporized that second pump 14 is transmitted, can utilize the heat in the metal absorption fluids, making the fluid condenses of having vaporized is liquid, and the temperature of reduction fluid, 151 of heat exchangers that heat up as for the heat because of absorption fluids can cool off by fan 152 blowings, and the fluid after the cooling will be circulated back in the liquid storage unit 11.
See also Fig. 2 A, it is the decomposition texture schematic diagram of atomizing radiating subassembly shown in Figure 1, as shown in the figure, atomizing radiating subassembly 12 of the present invention can comprise cavity body structure 121, atomizing component 122, heat absorbing units 123, potted component 124 and 125 and porous absorption material 126, atomizing radiating subassembly 12 is mainly by piling up setting with cavity body structure 121, porous absorption material 126, potted component 124, atomizing component 122, potted component 125 and heat absorbing units 123 are corresponding in regular turn, to finish assembling (as shown in Figure 3A).
See also Fig. 2 B and cooperate Fig. 2 A, wherein Fig. 2 B is the structure schematic diagram of the cavity body structure shown in Fig. 2 A, as shown in the figure, cavity body structure 121 of the present invention can comprise a reservoir 1211, an access road 1212 and one first exit passageway 1213, to make fluid that liquid storage lifts first 11 inside by in the access road 1212 input reservoirs 1211 by the suction of first pump 13, by suction do not draw produce atomizing fluid then by 1213 outputs of first exit passageway.As for, reservoir 1211 inside then ccontaining absorb material 126 (shown in Fig. 2 C), and for example foaming is cotton, is mainly used to fluid-absorbent.
And, shown in Fig. 2 B, on cavity body structure 121, also has groove 1214 around reservoir 1211 peripheries, use for a circular potted component 124 (shown in Fig. 2 A and Fig. 3 B) and be provided with thereon, so that can combine closely between cavity body structure 121 and the atomizing component 122, can prevent that fluid from leaking.
Please consult Fig. 2 A again, the bottom of heat absorbing units 123 of the present invention directly contacts with heater element (not icon) or fits with thermal paste, in order to absorb the heat that this heater element produces, and have a storage tank 1231 and one second output channel 1232, then have a plurality of bulge-structures of arranging in staggered mode 1233 in these storage tank 1231 inside, on heat absorbing units 123, also has groove 1234 in addition around storage tank 1231 peripheries, use for a circular potted component 125 (shown in Fig. 2 A and Fig. 3 B) and be provided with thereon, so that can combine closely between heat absorbing units 123 and the atomizing component 122, can prevent that fluid from leaking.
Please consult Fig. 2 A again, atomizing component 122 of the present invention can be by atomization unit 1221, actuating unit 1222 and circuit unit 1223 are formed, actuating unit 1222 is arranged between atomization unit 1221 and the circuit unit 1223, wherein, atomization unit 1221 can be an atomizing piece, and it has a plurality of spray orifices 12211, these a plurality of spray orifices 12211 are with the reservoir 1211 of cavity body structure 121 and absorb material 126 corresponding settings, and actuating unit 1222 can be a for example ring piezoelectric sheet, and it can be an annular hollow structure and has an opening 12221, as for, circuit unit 1223 can be a for example flexible circuit sheet, and also be an annular hollow structure and have opening 12221 corresponding openings 12231 with actuating unit 1222, opening 12221 and 12231 is and a plurality of spray orifice 12211 corresponding settings, actuating unit 1222 is to be subjected to voltage triggered that circuit unit 1223 transmits and start, to cause the vibration of atomization unit 1221, and then the fluids that will be adsorbed in the absorption material 126 are discharged the drop 127 that forms atomizing by spray orifice 12211, and make drop 127 in regular turn the opening 12231 of the opening 12221 by actuating unit 1222 and circuit unit 1223 be injected in the storage tank 1231 of heat absorbing units 123 (shown in Fig. 3 B), the drop 127 that the heat transferred that makes a plurality of bulge-structures 1233 that heat absorbing units 123 spontaneous heating elements are absorbed is atomized, so that be converted to steam state after drop 127 heat absorptions, be that drop 127 becomes steam, be sent in the heat exchanger 151 cooling by second output channel 1232 by second pump 14 then and be condensed into liquid state, can make cooling system 1 reach better radiating effect by mode with fluid atomizing.
Fluid of the present invention can use pure water, pure water and ethylene glycol mixture, perfluorocarbon compound or PFPE, wherein the mixed liquor of pure water and ethylene glycol half and half can be operated fluid in about-20 ℃ to 65 ℃ intervals, and perfluorocarbon compound (PFCs (perfluorocarbons)), can use for example FC-3284, FC-72, FC-84, the FC-770 of 3MTM fluorinertTM, as for PFPE (PFPEs (perfluoropolyethers)), can use Solvay Solexis's for example
Perfluorocarbon compound and PFPE are that heat passes special-purpose fluid, have high dielectric strength and good insulation characterisitic, even if being leaked, it also can not cause short circuit, and these fluid boiling points are roughly at 50 ℃～90 ℃, different according to kind, when temperature of heating elements is higher than the boiling point of fluid, the heat that the fluid of atomizing and heat absorption act unit are 123 passes mechanism will carry out in the boiling mode, and hot transfer efficiency is higher.
In sum, atomizing of the present invention heat radiation cooling system with fluid atomizing and be injected into heat absorbing units, can make the heat of the absorption of fluids heat absorbing units of atomizing by atomizing component, can make cooling system reach better radiating effect.
The present invention must make all changes that is equal to or replacement by the personage who knows this technology spirit according to the present invention, however this all change that is equal to or replace neither disengaging such as the scope of additional copy application claim institute desire protection.
Claims (10)
1. atomizing heat radiation cooling system in order to a heater element is dispelled the heat, comprises:
One Control device of liquid cooling;
One liquid storage unit stores a fluid;
One atomizing radiating subassembly is in order to spray this fluid atomizing to absorb the heat of this heater element;
One conveying device has first pump and one second pump;
One transfer conduit is in order to form a fluid circuit with this liquid storage unit, this atomizing radiating subassembly, this first pump, this second pump and this Control device of liquid cooling serial connection.
2. atomizing heat radiation cooling system according to claim 1, it is characterized in that, this atomizing radiating subassembly comprises a cavity body structure, a heat absorbing units and an atomizing component, this cavity body structure is in order to store this fluid, this heat absorbing units contacts with this heater element, and in order to absorb the heat that this heater element produces, this atomizing component is arranged between this cavity body structure and this heat absorbing units, in order to this fluid ejection is atomized in this heat absorbing units, to absorb the heat of this heat absorbing units.
3. atomizing heat radiation cooling system according to claim 2, it is characterized in that, this cavity body structure has a reservoir, an access road and one first exit passageway, and this first pump is imported this reservoir with this fluid of this inside, liquid storage unit by this access road, and this fluid that will not be atomized is sent to this Control device of liquid cooling by this first exit passageway.
4. atomizing heat radiation cooling system according to claim 3, it is characterized in that, this heat absorbing units has a storage tank and one second output channel, this storage tank inside has a plurality of bulge-structures of arranging in staggered mode, this fluid that these a plurality of bulge-structures are atomized the heat transferred that this heat absorbing units absorbed, with this fluid vaporization that will atomize, and make this second pump the fluid of vaporizing is sent to this Control device of liquid cooling by this second output channel.
5. atomizing heat radiation cooling system according to claim 4, it is characterized in that, this atomizing component comprises an atomization unit, an actuating unit and a circuit unit, this actuating unit is arranged between this atomization unit and this circuit unit, this atomization unit have a plurality of spray orifices and with the corresponding setting of this cavity body structure, this actuating unit is triggered by this circuit unit and start is injected into this fluid atomizing that will be stored in this cavity body structure in this storage tank of this heat absorbing units.
6. atomizing heat radiation cooling system according to claim 1 is characterized in that the store fluid of this liquid storage unit is pure water, pure water and ethylene glycol mixture, perfluorocarbon compound or PFPE.
7. atomizing heat radiation cooling system, in order to a heater element is dispelled the heat, this system includes an atomizing radiating subassembly, and this atomizing radiating subassembly comprises at least:
One cavity body structure is in order to store a fluid;
One heat absorbing units, it contacts with this heater element, in order to absorb the heat that this heater element produces; And
One atomizing component, comprise an atomization unit, an actuating unit and a circuit unit, it is arranged between this cavity body structure and this heat absorbing units, this atomization unit have a plurality of spray orifices and with the corresponding setting of this cavity body structure, this actuating unit is arranged between this atomization unit and this circuit unit, triggered and start by this circuit unit, be injected into this fluid atomizing that will be stored in this cavity body structure in the storage tank of this heat absorbing units and absorb heat.
8. atomizing heat radiation cooling system according to claim 7, it is characterized in that, this cavity body structure has a reservoir, an access road and one first exit passageway, and this fluid is to import this reservoir by this access road, and this fluid that is not atomized is by this first exit passageway output.
9. atomizing heat radiation cooling system according to claim 8 is characterized in that this atomizing radiating subassembly also has one and absorbs material, and it is placed in this reservoir of this cavity body structure, in order to adsorb this fluid.
10. atomizing heat radiation cooling system according to claim 8, it is characterized in that, this heat absorbing units also has one second output channel, this storage tank inside has a plurality of bulge-structures of arranging in staggered mode, these a plurality of bulge-structures are these fluids that heat transferred that this heat absorbing units is absorbed is atomized, and discharge with this fluid vaporization that will atomize and by this second output channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010157976 CN102209452B (en) | 2010-03-29 | 2010-03-29 | Atomization heat radiation cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010157976 CN102209452B (en) | 2010-03-29 | 2010-03-29 | Atomization heat radiation cooling system |
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| CN102209452A true CN102209452A (en) | 2011-10-05 |
| CN102209452B CN102209452B (en) | 2013-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010157976 Expired - Fee Related CN102209452B (en) | 2010-03-29 | 2010-03-29 | Atomization heat radiation cooling system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104111711A (en) * | 2013-04-19 | 2014-10-22 | 微曜科技股份有限公司 | phase change heat dissipation system |
| CN104501118A (en) * | 2014-12-20 | 2015-04-08 | 东莞市闻誉实业有限公司 | Heat sink with atomizing sheet |
| CN108093601A (en) * | 2016-11-22 | 2018-05-29 | 英业达科技有限公司 | Radiator and apply its thin client |
| CN108224604A (en) * | 2018-01-31 | 2018-06-29 | 珠海格力电器股份有限公司 | A kind of electrical appliance kit cooling system, method and air conditioner |
| CN109041523A (en) * | 2018-08-10 | 2018-12-18 | 中国人民解放军国防科技大学 | Synthetic double-jet spray cooling device based on ultrasonic atomization |
| CN109976486A (en) * | 2019-04-28 | 2019-07-05 | 杨晓林 | A kind of heat radiator of computer CPU |
| CN109974504A (en) * | 2019-03-27 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | The spraying cold plate of integrated atomization mechanism |
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| US20050183844A1 (en) * | 2004-02-24 | 2005-08-25 | Isothermal Systems Research | Hotspot spray cooling |
| TW200622177A (en) * | 2004-12-16 | 2006-07-01 | Ind Tech Res Inst | An ultrasonic atomizing cooling apparatus |
| CN1993030A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Compact spray cooling heat exchanger |
| US7654100B2 (en) * | 2001-04-26 | 2010-02-02 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| CN101668404A (en) * | 2008-09-01 | 2010-03-10 | 研能科技股份有限公司 | Microfluid conveying and atomizing device |
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2010
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Patent Citations (5)
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| US7654100B2 (en) * | 2001-04-26 | 2010-02-02 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US20050183844A1 (en) * | 2004-02-24 | 2005-08-25 | Isothermal Systems Research | Hotspot spray cooling |
| TW200622177A (en) * | 2004-12-16 | 2006-07-01 | Ind Tech Res Inst | An ultrasonic atomizing cooling apparatus |
| CN1993030A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Compact spray cooling heat exchanger |
| CN101668404A (en) * | 2008-09-01 | 2010-03-10 | 研能科技股份有限公司 | Microfluid conveying and atomizing device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104111711A (en) * | 2013-04-19 | 2014-10-22 | 微曜科技股份有限公司 | phase change heat dissipation system |
| CN104501118A (en) * | 2014-12-20 | 2015-04-08 | 东莞市闻誉实业有限公司 | Heat sink with atomizing sheet |
| CN104501118B (en) * | 2014-12-20 | 2017-06-16 | 东莞市闻誉实业有限公司 | Radiator with atomizing piece |
| CN108093601A (en) * | 2016-11-22 | 2018-05-29 | 英业达科技有限公司 | Radiator and apply its thin client |
| CN108224604A (en) * | 2018-01-31 | 2018-06-29 | 珠海格力电器股份有限公司 | A kind of electrical appliance kit cooling system, method and air conditioner |
| CN109041523A (en) * | 2018-08-10 | 2018-12-18 | 中国人民解放军国防科技大学 | Synthetic double-jet spray cooling device based on ultrasonic atomization |
| CN109974504A (en) * | 2019-03-27 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | The spraying cold plate of integrated atomization mechanism |
| CN109976486A (en) * | 2019-04-28 | 2019-07-05 | 杨晓林 | A kind of heat radiator of computer CPU |
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| Publication number | Publication date |
|---|---|
| CN102209452B (en) | 2013-06-26 |
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