CN101464712A - Internal memory module group and its heat radiating device - Google Patents
Internal memory module group and its heat radiating device Download PDFInfo
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- CN101464712A CN101464712A CNA2007101252870A CN200710125287A CN101464712A CN 101464712 A CN101464712 A CN 101464712A CN A2007101252870 A CNA2007101252870 A CN A2007101252870A CN 200710125287 A CN200710125287 A CN 200710125287A CN 101464712 A CN101464712 A CN 101464712A
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- cover plate
- support portion
- heat
- contacts
- memory bar
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Abstract
A memory module comprises a memory strip and a heat dissipating device arranged on the memory strip. The memory strip is provided with a left side surface and a right side surface; the heat dissipating device comprises a radiator and at least one heat pipe; the radiator comprises a base and a cover plate which is installed on the base and in contact with the right side surface of the memory strip; the base comprises a body part which is in contact with the left side surface of the memory strip, a support part which extend from the body and is in contact with the top side of the memory strip; the heat pipe comprises an evaporation section which is in contact with one of the body part and the cover plate, and a condensation section which is in contact with the support part.
Description
Technical field
The present invention relates to a kind of internal memory module and heat abstractor thereof, be meant a kind of internal memory module and heat abstractor thereof that can be applicable in the small space especially.
Background technology
Along with computer industry constantly develops, the lifting of computing power makes that wafer capacity increases day by day on the memory bar, and volume is but more and more littler, and operating rate is piece more and more, and the heat that produces in this process constantly increases.For the wafer heat on these memory bars is fast and effeciently distributed, industry is installed auxiliary its heat radiation of heating radiator usually on memory bar.
Memory bar generally is installed on the mainboard, and owing to the narrow space that element on the mainboard gathers, the space is little and be used to install memory bar, the heating radiator that is installed on the memory bar very easily produces interference with adjacent elements, is not easy to assembling.Therefore, at present the employed heating radiator of memory bar is generally two foils, and these two sheet metals are sticked relative both sides at memory bar in order to distribute the heat that memory bar produces.Yet the heat exchange area of this sheet metal is less, is difficult to satisfy the radiating requirements of the more and more higher memory bar of thermal value.
Summary of the invention
In view of this, be necessary to provide a kind of internal memory module and heat abstractor that can be used in the small space and have excellent heat dispersion performance.
A kind of internal memory module comprises that a memory bar and is arranged on the heat abstractor on this memory bar, and this memory bar has a left-hand face and a right lateral surface.This heat abstractor comprises a heating radiator and at least one heat pipe, and this heating radiator comprises a pedestal and a cover plate.This cover plate is installed on this pedestal and with the right lateral surface of this memory bar and contacts.This pedestal comprise a body that contacts with the left-hand face of this memory bar with one from a support portion that this body extends and contacts with this memory bar top side.This heat pipe comprise one with one of them evaporator section that contacts of this body and cover plate and a condensation segment that contacts with this support portion.
A kind of internal memory module comprises that a memory bar and is arranged on the heat abstractor on this memory bar, and this memory bar has a left-hand face and a right lateral surface.This heat abstractor comprises a heating radiator, and this heating radiator comprises a pedestal and a cover plate.This cover plate is installed on this pedestal and with the right lateral surface of this memory bar and contacts.This pedestal comprises that a body that contacts with the left-hand face of this memory bar and extends and be positioned at a support portion of the top side of this memory bar from this body.This support portion is extended with some heat radiator straight up.
A kind of heat abstractor comprises a heating radiator and at least one heat pipe.This heating radiator comprises a pedestal and a cover plate, and this pedestal comprises that a body and extends and a support portion thicker than this body from this body.The mounting groove that this cover plate is fixed on this pedestal and formation one can be used for installing memory bar between this cover plate and this body.This heat pipe comprise one with one of them evaporator section that contacts of this body and cover plate and a condensation segment that contacts with this support portion.
Compared with prior art, internal memory module of the present invention and heat abstractor are installed on the body and with this memory bar by the evaporator section with heat pipe and close on, and the order and the condensation segment of this heat pipe is installed on the support portion, so design, the heat that memory bar produces can conduct on the support portion apace by heat pipe, and then is dispersed in the external environment condition and goes.Further, some heat radiator that vertically extend can be set on the support portion, so, guarantee that heating radiator has under the prerequisite of less thickness in the horizontal direction, can make heating radiator have bigger heat exchange area, make heat abstractor have good performance of heat dissipation.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the stereographic map of internal memory module in one embodiment of the invention.
Fig. 2 is the exploded view of internal memory module among Fig. 1.
Fig. 3 is the assembly drawing of another angle of internal memory module among Fig. 1.
Fig. 4 is the synoptic diagram when the internal memory module adopts two heat pipes among Fig. 1.
Embodiment
Fig. 1 is to the internal memory module and the heat abstractor thereof that Figure 3 shows that in one embodiment of the invention.The appearance profile of this internal memory module 100 is a rectangular parallelepiped, and it comprises a memory bar 200 and is installed in a heat abstractor 300 on this memory bar 200.
This memory bar 200 comprises a left-hand face 220, a right lateral surface 240, and is arranged on the left-hand face 220 of this memory bar 200 and the plurality of chips 260 of right lateral surface 240.This memory bar 200 electrically connects by a terminal (not shown) and a mainboard (not shown) that is arranged on its bottom usually.
This heat abstractor 300 comprises that one roughly is the heating radiator 400 of rectangular parallelepiped.This heating radiator 400 comprises that a pedestal 420 and is installed in the cover plate 440 on this pedestal 420.When being installed in this cover plate 440 on this pedestal 420, form a mounting groove 460 between this pedestal 420 and this cover plate 440, and this memory bar 200 is arranged in this mounting groove 460.The heat that memory bar 200 is produced when using is absorbed and is dispersed into this cover plate 440 by this pedestal 420 and goes in the external environment condition, thereby guarantees that this memory bar 200 is moving in normal temperature range.Concrete structure at each parts of this heating radiator 400 is described further below.
This pedestal 420 can be one-body molded by methods such as aluminium extrudeds, makes that the processing cost of this pedestal 420 is lower, strengthens the competitive power in market.This pedestal 420 comprises that a sheet of body 422 and is from support portion 424 that the top of this body 422 one is extended.
This support portion 424 extends to form from the top of this body 422 vertical-right, its in the horizontal direction the thickness of (as the 400 residing positions of heating radiator among Fig. 1) greater than this body 422 thickness in the horizontal direction.Corner in the lower right side of this support portion 424 is provided with a breach structure (among the figure mark), thus between this support portion 424 and this body 422 formation one stage portion 426.In other words, this stage portion 426 is formed on the junction of this body 422 and this support portion 424, and the thickness of its horizontal direction is between this support portion 424 and body 422 thickness in the horizontal direction.This stage portion 426 comprises a lower surface 4262 and one and these lower surface 4262 right lateral surface 4264 connected vertically.The lower surface 4262 of this stage portion 426 is vertical with the left-hand face 220 of this memory bar 200; And the right lateral surface 4264 of this stage portion 426 and left-hand face 220 almost parallels of this memory bar 200.
The lower surface 4262 of this stage portion 426 can play this pedestal 420 and this memory bar 200 effect of location mutually: this memory bar 200 is placed on this body 422, make the top of this memory bar 200 replace lower surface 4262, can realize the mutual location of this pedestal 420 and these memory bar 200 in the vertical directions in this stage portion 426.
The right lateral surface 4264 of this stage portion 426 is mainly used in this cover plate 440 is installed on this support portion 424.Two screws 4266 are spaced apart and arranged on the right lateral surface 4264 of this stage portion 426, this support portion 424 can be fixed on the cover plate 440 by screw 480 retaining elements such as grade.
This cover plate 440 is a sheet metal, can form by punching press, is formed with a protuberance 442 that protrudes laterally on it, and forms a depressed part (not marking among the figure) in these protuberance 442 relative sides.By this depressed part is set, this cover plate 440 can with memory bar 200 on have a differing heights chip 260 directly contact.Two through holes 444 are arranged on this cover plate 440 and are positioned at the both sides of this protuberance 442.Two screws, 4266 corresponding settings on this two through hole 444 and the stage portion 426 make two screws 480 pass in the screw 4266 that directly is combined on after the through hole 444 on this cover plate 440 on this stage portion 426.So, this cover plate 440 can be fixed on this pedestal 420, and this memory bar 200 is located in this cover plate 440 and these body 422 formed mounting grooves 460 tightly.When this memory bar 200 used, the heat that memory bar 200 produces can pass to this cover plate 440 and this body 422 simultaneously along opposite direction.Afterwards, the heat of these body 422 absorptions can conduct on this support portion 424 and then be dispersed in the external environment condition and go.
For distributing of further accelerated heat, can on this support portion 424, some heat radiator be set.In the present embodiment, the heat radiator 428 of some needle-likes extends vertically upward from the top side of this support portion 424, and these heat radiator 428 are parallel to each other, and along axially extending upward separately.In other words, these heat radiator 428 extend towards the direction away from this memory bar 200, and the bearing of trend of these heat radiator 428 is vertical with the lower surface 4262 of this stage portion 426.So be provided with, both can have guaranteed that this heating radiator 400 thickness in the horizontal direction is less can make heating radiator 400 have bigger heat exchange area again, thereby greatly promote the heat dispersion of heating radiator 400 to adapt to narrow mounting distance.
For the heat conduction velocity that further promotes heat abstractor 300 with the distributing of accelerated heat, this heat abstractor 300 can further comprise a heat pipe 500.This heat pipe 500 has the appearance profile that roughly is the U type, and it comprises an evaporator section 520, a condensation segment 540, and the linkage section 560 so that this evaporator section 520 is connected with this condensation segment 540.The middle part of this support portion 424 is provided with a mounting hole 427, and this mounting hole 427 is along the longitudinal extension of this pedestal 420, and this condensation segment 540 is accommodated and is fixed in the mounting hole 427.Be formed with a mounting hole 429 on the left-hand face of this body 422, this mounting hole 429 is along the longitudinal extension of this pedestal 420, and this evaporator section 520 is fixed in the mounting hole 429 on this body 422.In addition, in the present embodiment, the evaporator section 520 of this heat pipe 500 and condensation segment 540 are arranged on differing heights place on this heating radiator 300, and especially, these condensation segment 540 residing positions are higher than this evaporator section 520 residing positions.
By heat pipe 500 is set, the heat that body 422 absorbs can be passed on the support portion 424 apace and be dispersed in the external environment condition and go by the phase change of actuating medium in the heat pipe 500, thereby the temperature that can reduce body 422 strengthens the heat exchange effect between the chip 260 on body 422 and the memory bar 200, promotes the performance of heat abstractor 300.
As mentioned above, this body 422 and this cover plate 440 all are schistose textures, and these heat radiator 428 extension in the zone that right lateral surface defined of the left-hand face of this body 422 and this cover plate 440, so design, guaranteeing that heating radiator 400 has under the prerequisite of less thickness in the horizontal direction, can make heating radiator 400 have bigger heat exchange area.
In addition, the evaporator section 520 of heat pipe 500 is installed on the body 422 and with this memory bar 200 and closes on, and the condensation segment 540 of this heat pipe 500 is installed on the support portion 424 and with this heat radiator 428 and closes on.So design, the heat that memory bar 200 produces can conduct on the support portion 424 apace by heat pipe 500, and then is dispersed in the external environment condition by heat radiator 428 bigger surface areas and goes, and makes this heat abstractor 300 have good performance of heat dissipation.
In addition, for reduction is in contact with one another thermal resistance between the element to strengthen heat exchange effect, can between the right lateral surface 240 of this cover plate 440 and this memory bar 200, heat-conducting glue be set, also can between the left-hand face 220 of this body 422 and this memory bar 200, heat-conducting glue be set.
In the above-described embodiments, the quantity of heat pipe 500 is one; In other embodiments, can adopt two or many heat pipes.For example, Figure 4 shows that above-mentioned internal memory module 100 adopts 500,600 o'clock synoptic diagram of two heat pipes.Wherein, heat pipe 500 contacts with this support portion 424 with this body 422 simultaneously, and the evaporator section 620 of heat pipe 600 contacts with this support portion 424 with this cover plate 440 respectively with condensation segment 640.So design, the heat that this body 422 and this cover plate 440 are absorbed can pass to this support portion 424 apace by these two heat pipes 500,600, and then is dispersed in the external environment condition and goes.
Claims (15)
1. an internal memory module comprises that a memory bar and is arranged on the heat abstractor on this memory bar, and this memory bar has a left-hand face and a right lateral surface, it is characterized in that: this heat abstractor comprises a heating radiator and at least one heat pipe; This heating radiator comprises a pedestal and a cover plate, this cover plate is installed on this pedestal and with the right lateral surface of this memory bar and contacts, this pedestal comprise a body that contacts with the left-hand face of this memory bar with one from a support portion that this body extends and contacts with this memory bar top side; This heat pipe comprise one with one of them evaporator section that contacts of this body and cover plate and a condensation segment that contacts with this support portion.
2. internal memory module as claimed in claim 1 is characterized in that: this body and this cover plate are schistose texture.
3. internal memory module as claimed in claim 1 is characterized in that: form a mounting groove between this cover plate and this body, this memory bar is installed in this mounting groove.
4. internal memory module as claimed in claim 3, it is characterized in that: this pedestal also comprises a stage portion that is arranged on this body and this junction, support portion, this cover plate is removably mounted on this stage portion, and this stepped portions is between this cover plate and this body and form this mounting groove.
5. internal memory module as claimed in claim 1 is characterized in that: this support portion is extended with some heat radiator straight up.
6. internal memory module as claimed in claim 5 is characterized in that: these heat radiator are needle-like.
7. internal memory module as claimed in claim 1 is characterized in that: the quantity of heat pipe is two, and wherein a heat pipe contacts with the support portion with this body simultaneously, and another root heat pipe contacts with the support portion with this cover plate simultaneously.
8. internal memory module, comprise that a memory bar and is arranged on the heat abstractor on this memory bar, this memory bar has a left-hand face and a right lateral surface, it is characterized in that: this heat abstractor comprises a heating radiator, this heating radiator comprises a pedestal and a cover plate, this cover plate is installed on this pedestal and with the right lateral surface of this memory bar and contacts, and this pedestal comprises that a body that contacts with the left-hand face of this memory bar and extends and be positioned at a support portion of the top side of this memory bar from this body; This support portion is extended with some heat radiator straight up.
9. internal memory module as claimed in claim 8, it is characterized in that: this pedestal also comprises a stage portion that is arranged between this body and this support portion, this stage portion comprises a lower surface that contacts with the top side of this memory bar and one and the side surface that intersects of this lower surface, and this cover plate is installed on the side surface of this cover plate.
10. internal memory module as claimed in claim 9 is characterized in that: the thickness of this stage portion is between the thickness of this body and this support portion.
11. internal memory module as claimed in claim 8 is characterized in that: this heat abstractor also comprises at least one heat pipe, this heat pipe comprise one with one of them evaporator section that contacts of this body and this cover plate and a condensation segment that contacts with this support portion.
12. a heat abstractor is characterized in that: this heat abstractor comprises a heating radiator and at least one heat pipe; This heating radiator comprises a pedestal and a cover plate, this pedestal comprises that a body and extends and a support portion thicker than this body from this body, the mounting groove that this cover plate is fixed on this pedestal and formation one can be used for installing memory bar between this cover plate and this body; This heat pipe comprise one with one of them evaporator section that contacts of this body and cover plate and a condensation segment that contacts with this support portion.
13. heat abstractor as claimed in claim 12 is characterized in that: this heating radiator also comprises the some heat radiator that are arranged on this support portion.
14. heat abstractor as claimed in claim 12, it is characterized in that: this pedestal also comprises a stage portion that is arranged between this body and this support portion, this cover plate is removably mounted on this stage portion, and this stepped portions is between this cover plate and this body and form this mounting groove.
15. heat abstractor as claimed in claim 12 is characterized in that: the quantity of heat pipe is two, and wherein a heat pipe contacts with this support portion with this body simultaneously, and another root heat pipe contacts with this support portion with this cover plate simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101252870A CN101464712A (en) | 2007-12-21 | 2007-12-21 | Internal memory module group and its heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101252870A CN101464712A (en) | 2007-12-21 | 2007-12-21 | Internal memory module group and its heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101464712A true CN101464712A (en) | 2009-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101252870A Pending CN101464712A (en) | 2007-12-21 | 2007-12-21 | Internal memory module group and its heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101464712A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101893921A (en) * | 2010-04-08 | 2010-11-24 | 山东高效能服务器和存储研究院 | Noise-free energy-saving server |
| CN110488951A (en) * | 2019-08-23 | 2019-11-22 | 重庆电子工程职业学院 | Computer memory bank heat dissipation fixation assembly |
-
2007
- 2007-12-21 CN CNA2007101252870A patent/CN101464712A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101893921A (en) * | 2010-04-08 | 2010-11-24 | 山东高效能服务器和存储研究院 | Noise-free energy-saving server |
| CN110488951A (en) * | 2019-08-23 | 2019-11-22 | 重庆电子工程职业学院 | Computer memory bank heat dissipation fixation assembly |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090624 |