CN204347737U - A kind of computer radiator - Google Patents

Abstract

The utility model relates to a computer radiator, which belongs to the field of computer hardware. The computer radiator mainly includes a main body of a computer case, a top plate of a main engine, heat dissipation fins, a strip type heat dissipation fin, a wingless fan, a side inlet fan, a heat dissipation copper pipe and a heat dissipation radiator. The copper plate, the top plate of the main engine is arranged on the top of the main body of the chassis, and the heat dissipation fins are protrudingly arranged on the outer surface of the top plate of the main engine. There are through holes, and the built-in heat sink is composed of a wingless fan, a side inlet fan, a heat dissipation copper tube and a heat dissipation copper plate. A wingless fan and a side inlet fan are arranged around the heat dissipation copper plate. The tube extends outside the enclosure. The utility model can quickly dissipate the heat in the case and ensure the normal operation of the components in the case, and has the characteristics of less heat dissipation noise than a fan, novel structure, simple structure, convenient use, low manufacturing cost and high heat dissipation efficiency.

Description

A computer radiator

technical field

The utility model relates to the field of computer hardware, in particular to a computer radiator.

Background technique

The use of computers is gradually becoming popular, and computers are widely used in all walks of life. When computers work for a long time, the components inside the computers will generate heat, which will shorten the life of the computers. At present, the heat dissipation of the computer is generally generated by the top blowing fan to blow the air to the heat sink. The wind is difficult to be blown to the bottom. The outer wall of the computer case is made of ordinary metal hard sheet, and the heat dissipation effect is not good. It is easy to make a lot of noise.

Therefore, it is necessary to propose a computer heat sink to improve heat dissipation efficiency and reduce noise.

Contents of the invention

In order to overcome the problems existing in the background technology, the utility model provides a computer heat sink, which is simple in structure, easy to use, high in heat dissipation efficiency, low in noise, novel in structure, and can enhance heat dissipation effect under low noise conditions.

In order to achieve the above object, the utility model is achieved through the following technical solutions: a computer heat sink, the heat sink mainly includes a mainframe top plate, a built-in heat sink, a strip heat sink, a chassis main body, a network card chip heat conduction sheet, a bridge Chip heat conduction sheet, heat dissipation fin, MOS tube heat conduction sheet, through hole, side plate, vent hole, wingless fan, side inlet fan, heat dissipation copper plate, heat dissipation copper pipe; On the surface, the top plate of the host computer is arranged on the top surface of the main body of the chassis, and the heat conduction sheet of the bridge chip, the heat conduction sheet of the MOS tube and the heat conduction sheet of the network card chip are in contact with the inner surface of the top plate of the main engine. Ventilation holes are provided between the heat sinks, and through holes are provided on the back of the main body of the chassis. There are wingless fans and side inlet fans. The surface of the heat dissipation copper plate is provided with heat dissipation copper pipes. The heat dissipation copper pipes extend to the outside of the chassis, and the copper pipes are filled with circulating cooling agents.

The number of cooling fins on the top plate of the host is 4 to 8 pieces.

There are 8 to 12 ventilation holes arranged inside between the two heat sinks.

The back of the chassis body is provided with 4 to 8 through holes.

Advantages and effects of the utility model: the utility model has the characteristics of simple structure, convenient use, high heat dissipation efficiency, low noise and novel structure. The heat inside is conducted, the inner wall between the bar-shaped cooling fins is provided with air holes, and the back of the main body of the chassis is provided with through holes, which can further dissipate heat inside the main body of the chassis, and the heat generated by the heating element is transferred to the cooling fins through the heat conducting fins. The heat dissipation fins transfer heat to the outside of the main body of the chassis, thus significantly enhancing the cooling effect of the computer.

Description of drawings

Fig. 1 is the structural representation of the utility model computer radiator;

Fig. 2 is a structural schematic diagram of the top plate of the computer radiator case of the present invention;

Fig. 3 is a schematic diagram of a front side view of a computer radiator of the present invention;

Fig. 4 is a schematic diagram of the back side view of the computer radiator of the present invention;

Fig. 5 is a structural schematic diagram of the side plate of the computer radiator of the present invention;

Fig. 6 is a structural schematic diagram of the built-in cooling fins of the computer radiator of the present invention.

In the figure, 1—host top plate, 2—built-in heat sink, 3—strip heat sink, 4—chassis main body, 5—heat conduction plate of network card chip, 6—heat conduction plate of bridge chip, 7—heat dissipation fin, 8—MOS tube Heat conducting sheet, 9—through hole, 10—side plate, 11—air vent, 12—wingless fan, 13—side inlet fan, 14—radiating copper plate, 15—radiating copper pipe.

Detailed ways

In order to make the purpose, technical solutions and beneficial effects of the present utility model clearer, the preferred embodiments of the present utility model will be described in detail below in conjunction with the accompanying drawings, so as to facilitate the understanding of technical personnel.

As shown in Figures 1-6, a computer radiator mainly includes a chassis main body 4, a mainframe top plate 1, heat dissipation fins 7, built-in heat sinks 2, bridge chip heat conduction fins 6, and MOS tube heat conduction fins 8. Network card chip heat conduction sheet 5, strip heat sink 3, vent hole 11, through hole 9, side plate 10, wingless fan 12, side inlet fan 13, heat dissipation copper plate 14, heat dissipation copper pipe 15, the MOS tube The heat conduction sheet 8, the bridge chip heat conduction sheet 6 and the network card chip heat conduction sheet 5 abut against the inner surface of the mainframe top plate 1, the mainframe top plate 1 is arranged on the top surface of the chassis main body 4, and the cooling fins 7 are arranged on the outer surface of the mainframe top plate 1. The bridge chip heat conduction sheet 6, the MOS tube heat conduction sheet 8, and the network card chip heat conduction sheet 5 can transfer the heat in the chassis body 4 to the heat dissipation fins 7, which are arranged on the outer surface of the top plate 1 of the host computer, and can quickly dissipate heat. Improved cooling efficiency.

The strip heat sink 3 is arranged on the side plate 10, and the air vent 11 is arranged between the strip heat sink 3, the side plate 10 is arranged on the side of the chassis main body 4, and the back of the chassis main body 4 is provided with a through hole 9, and the strip heat dissipation The sheet 3, the vent hole 11 and the through hole 9 increase the contact area between the chassis main body 4 and the outside world, which is beneficial to heat dissipation.

The built-in heat sink 2 is composed of a wingless fan 12, a side inlet fan 13, a heat dissipation copper pipe 15 and a heat dissipation copper plate 14. The built-in heat sink 2 is placed inside the chassis main body 4, and the heat dissipation copper plate 14 is surrounded by a wingless fan 12 and The side inlet fan 13 is provided with a heat dissipation copper pipe 15 on the surface of the heat dissipation copper plate 14, and the heat dissipation copper pipe 15 extends to the outside of the chassis main body 4, and a circulating cooling agent is housed in the heat dissipation copper pipe 15, and the heat dissipation copper plate 14 is located in the chassis main body 4. The heat dissipation copper plate 14 is arranged in the chassis main body 4 to facilitate the absorption of heat, the heat dissipation copper pipe 15 is arranged on the surface of the heat dissipation copper plate 14 to facilitate the transfer of heat, and the heat dissipation copper pipe 15 extends to the outside of the chassis to facilitate the distribution of heat.

The working process of the utility model: the utility model is installed on the computer, and the MOS tube heat conduction sheet 8, the bridge chip heat conduction sheet 6, and the network card chip heat conduction sheet 5 transfer the heat generated by the heating element to the heat dissipation fins 7 on the outer surface of the main engine top plate 1 The heat is dissipated through the heat dissipation fins 7, the wingless fan 12, the side inlet fan 13 and the heat dissipation copper plate 14 inside the chassis transfer the heat to the heat dissipation copper tube 15, and the heat is dissipated through the circulating cooling agent in the heat dissipation copper tube 15, and the side plate The strip cooling fins 3 on the 10, the air vent 11 between the strip cooling fins 3 and the through hole 9 on the back of the chassis main body 4 increase the basic area between the chassis main body 4 and the outside world, which is conducive to the distribution of heat.

The utility model has the characteristics of simple structure, convenient use, high heat dissipation efficiency, low noise and novel structure. Ventilation holes are provided between the heat sinks, and through holes are provided on the back of the chassis body, which can further dissipate heat inside the chassis body. The heat generated by the heating element is transferred to the cooling fins through the heat conducting sheet, and the cooling fins transfer the heat to the chassis. Outside the main body, thereby significantly enhancing the cooling effect of the computer.

Finally, it is noted that the above preferred embodiments are only used to illustrate the technical solutions of the present utility model without limitation. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that it can be described in the form Various changes can be made in the above and in the details without departing from the scope defined by the claims of the present invention.

Claims (4)

1. a computer radiator, is characterized in that: described heating radiator mainly comprises main frame top board, internal set heat radiation fin, bar shaped heat radiator, chassis body, network card chip conducting strip, bridge chip conducting strip, radiating fin, metal-oxide-semiconductor conducting strip, through hole, side plate, air hole, without wing fan, side air intake fan, dispel the heat copper coin, heat dissipation copper pipe, described radiating fin is convexly equipped in the outside surface of main frame top board, the end face of chassis body is located at by main frame top board, bridge chip conducting strip, metal-oxide-semiconductor conducting strip and network card chip conducting strip abut with the inside surface of main frame top board, the side plate of chassis body is provided with stripe shape heat radiator, air hole is provided with between bar shaped heat radiator, chassis body back is provided with through hole, internal set heat radiation fin is by without wing fan, side air intake fan, heat dissipation copper pipe and heat radiation copper coin composition, internal set heat radiation fin is arranged on the inside of chassis body, radiating copper panel area is provided with without wing fan and side air intake fan, heat radiation copper coin surface is provided with heat dissipation copper pipe, heat dissipation copper pipe extends to cabinet outside, copper pipe is built with circulation cooling agent.

2. a kind of computer radiator according to claim 1, is characterized in that: the radiating fin number on main frame top board is 4 to 8.

3. a kind of computer radiator according to claim 1, is characterized in that: between two heat radiator, inner side is provided with 8 to 12 air holes.

4. a kind of computer radiator according to claim 1, is characterized in that: chassis body back is provided with 4 to 8 through holes.