CN107193770A - A kind of Dustproof heat conductive flame-retarding internal memory strip device - Google Patents
A kind of Dustproof heat conductive flame-retarding internal memory strip device Download PDFInfo
- Publication number
- CN107193770A CN107193770A CN201710355221.4A CN201710355221A CN107193770A CN 107193770 A CN107193770 A CN 107193770A CN 201710355221 A CN201710355221 A CN 201710355221A CN 107193770 A CN107193770 A CN 107193770A
- Authority
- CN
- China
- Prior art keywords
- heat conductive
- memory
- silica gel
- internal memory
- proof heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Silicon Compounds (AREA)
Abstract
Patent of the present invention is related to a kind of Dustproof heat conductive flame-retarding internal memory strip device, described device memory bar is injected silica gel by U-shaped memory bank mould, so that silica gel is entirely around depending on memory bar, fixed dust-proof heat conductive silica gel is formed, the dust-proof heat conductive silica gel of the fixation, which belongs to, once produces permanent use device.Fixed dust-proof heat conductive silica gel is installed on golden finger and the centre of memory grain of the internal memory of memory bar, i.e. above golden finger, below memory grain, physical size is 133mm × 5mm × 5mm, when memory bar is installed in memory bank, and fixed dust-proof heat conductive silica gel just covers memory bank.The dust-proof heat conductive silica gel part of fixation of described device, using silica gel material the features such as absorption property height, good heat endurance and stable chemical property, there is the characteristic of excellent heat conductive flame-retarding.
Description
Technical field
Patent of the present invention is related to calculator memory field.
Background technology
Computer is commonly called as computer, is that one kind can be run according to program, automatic, the modernization intelligence of high speed processing mass data
Can electronic equipment.It is made up of hardware system and software systems, is fitted without the computer referred to as bare machine of any software.It can be divided into
Supercomputer, industrial control computer, network computer（Containing server, work station）, personal computer（Desktop computer）, it is embedded
The class of formula computer five, more advanced computer has biocomputer, photonic computer, quantum computer etc..
Memory bar is the essential part of computer, and CPU can be by data/address bus to memory address.Historical electricity
There is main memory on brain mainboard, memory bar is the extension of main memory.There is no main memory on later computer main board, CPU is completely dependent on
Memory bar.Content on all external memory must be acted on by internal memory competence exertion.Memory bar was used after a period of time, and surface has
Many dusts, the dust that golden finger can be also produced on oxide layer, memory bar can cause computer crash, and blue screen is restarted, serious meeting
The golden finger of internal memory is burnt out, causes internal memory to be scrapped, while mainboard memory bank may also be damaged.In view of this, it is necessary to carry
For a kind of Dustproof heat conductive flame-retarding internal memory strip device.
Patent of invention content
Patent of the present invention is related to a kind of Dustproof heat conductive flame-retarding internal memory strip device, and described device memory bar is inserted by U-shaped internal memory
Groove mould injects silica gel so that silica gel forms fixed dust-proof heat conductive silica gel, this is fixed entirely around depending on memory bar
Dust-proof heat conductive silica gel, which belongs to, once produces permanent use device.
Fixed dust-proof heat conductive silica gel is installed on the golden finger and the centre of memory grain, i.e. golden finger of the internal memory of memory bar
Below side, memory grain, physical size is 133mm × 5mm × 5mm, when memory bar is installed in memory bank, fixed
Dust-proof heat conductive silica gel just covers memory bank.
The dust-proof heat conductive silica gel part of fixation of described device, using absorption property is high, heat endurance is good and chemical property is steady
The silica gel material for the features such as determining, the characteristic for having excellent heat conductive flame-retarding.
Brief description of the drawings
Fig. 1 is a kind of Dustproof heat conductive flame-retarding memory bar apparatus structure schematic diagram of patent of the present invention.
Embodiment
In order that the object, technical solution and advantage of patent of the present invention are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, patent of the present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain
Patent of the present invention, is not intended to limit the present invention patent.
Referring to Fig. 1, Fig. 1 is a kind of Dustproof heat conductive flame-retarding memory bar apparatus structure schematic diagram of patent of the present invention.
A kind of Dustproof heat conductive flame-retarding internal memory strip device, it is characterised in that described device includes memory bar（10）, internal memory
Particle（11）, fixed dust-proof heat conductive silica gel（12）, golden finger（13）, memory bank（20）.
A kind of Dustproof heat conductive flame-retarding internal memory strip device, it is characterised in that described device memory bar（10）Internal memory
Grain（11）Lower section, golden finger（13）Top, fixed dust-proof heat conductive silica gel is installed（12）.
A kind of Dustproof heat conductive flame-retarding internal memory strip device, it is characterised in that described device fixes dust-proof heat conductive silica gel
（12）With memory bar（10）It is integrated equipment, non-dismountable and replacing.
A kind of Dustproof heat conductive flame-retarding internal memory strip device, it is characterised in that described device fixes dust-proof heat conductive silica gel
（12）Physical size be 133mm × 5mm × 5mm, work as memory bar（10）It is installed on memory bank（20）It is fixed anti-when interior
Dirt heat conductive silica gel（12）Just cover memory bank（20）.
The preferred embodiment of patent of the present invention is the foregoing is only, patent is not intended to limit the invention, it is all at this
Any modifications, equivalent substitutions and improvements made within the spirit and principle of patent of invention etc., should be included in patent of the present invention
Protection domain within.
Claims (4)
1. a kind of Dustproof heat conductive flame-retarding internal memory strip device, it is characterised in that described device includes memory bar（10）, internal memory
Grain（11）, fixed dust-proof heat conductive silica gel（12）, golden finger（13）, memory bank（20）.
2. a kind of Dustproof heat conductive flame-retarding internal memory strip device according to claim 1, it is characterised in that in described device
Deposit bar（10）Memory grain（11）Lower section, golden finger（13）Top, fixed dust-proof heat conductive silica gel is installed（12）.
3. a kind of Dustproof heat conductive flame-retarding internal memory strip device according to claim 1, it is characterised in that described device is solid
Fixed dust-proof heat conductive silica gel（12）With memory bar（10）It is integrated equipment, non-dismountable and replacing.
4. a kind of Dustproof heat conductive flame-retarding internal memory strip device according to claim 1, it is characterised in that described device is solid
Fixed dust-proof heat conductive silica gel（12）Physical size be 133mm × 5mm × 5mm, work as memory bar（10）It is installed on memory bank
（20）When interior, fixed dust-proof heat conductive silica gel（12）Just cover memory bank（20）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710355221.4A CN107193770A (en) | 2017-05-19 | 2017-05-19 | A kind of Dustproof heat conductive flame-retarding internal memory strip device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710355221.4A CN107193770A (en) | 2017-05-19 | 2017-05-19 | A kind of Dustproof heat conductive flame-retarding internal memory strip device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107193770A true CN107193770A (en) | 2017-09-22 |
Family
ID=59874289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710355221.4A Pending CN107193770A (en) | 2017-05-19 | 2017-05-19 | A kind of Dustproof heat conductive flame-retarding internal memory strip device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107193770A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108959151A (en) * | 2018-07-15 | 2018-12-07 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding new design realization device of memory bar |
| CN109062356A (en) * | 2018-10-12 | 2018-12-21 | 李祥东 | A kind of computer sealing memory bar structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997194A (en) * | 2009-08-11 | 2011-03-30 | 冯林 | Memory protection device and computer |
| CN203455762U (en) * | 2013-08-21 | 2014-02-26 | 张艳梅 | Dustproof heat dissipation device of computer memory module |
| CN204390113U (en) * | 2015-01-13 | 2015-06-10 | 俞晓妮 | A kind of computer memory bank dustproof heat radiator |
| CN204557301U (en) * | 2015-04-13 | 2015-08-12 | 吉首大学 | A kind of Dust-proof computer memory bar |
-
2017
- 2017-05-19 CN CN201710355221.4A patent/CN107193770A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997194A (en) * | 2009-08-11 | 2011-03-30 | 冯林 | Memory protection device and computer |
| CN203455762U (en) * | 2013-08-21 | 2014-02-26 | 张艳梅 | Dustproof heat dissipation device of computer memory module |
| CN204390113U (en) * | 2015-01-13 | 2015-06-10 | 俞晓妮 | A kind of computer memory bank dustproof heat radiator |
| CN204557301U (en) * | 2015-04-13 | 2015-08-12 | 吉首大学 | A kind of Dust-proof computer memory bar |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108959151A (en) * | 2018-07-15 | 2018-12-07 | 长沙开雅电子科技有限公司 | A kind of dust-proof heat conductive flame-retarding new design realization device of memory bar |
| CN109062356A (en) * | 2018-10-12 | 2018-12-21 | 李祥东 | A kind of computer sealing memory bar structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170922 |
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| WD01 | Invention patent application deemed withdrawn after publication |