CN204679943U - A kind of outer cooling mechanism for computer CPU - Google Patents

Abstract

An external heat dissipation mechanism for a computer CPU, which relates to the technical field of computer accessories, is arranged on a main box, and includes a bottom plate, the bottom plate is designed to be close to the inner wall of the main box, and an integrated circuit board is arranged on the bottom plate. A CPU is arranged on the integrated circuit board, and a bump is arranged behind the bottom plate, and the bump passes through the main box, and dense heat sinks are arranged on the bump, and the bottom plate, the bump And heat sinks are made of aluminum substrate. The beneficial effects of the utility model are: the utility model has a simple and reasonable structural design. By using the original built-in exhaust fan and adding external heat dissipation, the timely discharge of the heat in the CPU is ensured, and the safety of the CPU is ensured. At the same time, the cost is low. It is safe and effective, guarantees the quality of the product, is convenient and quick to use, and is convenient for popularization and use.

Description

An external cooling mechanism for computer CPU

Technical field:

The utility model relates to the technical field of computer accessories, in particular to an external cooling mechanism for a computer CPU.

Background technique:

A computer, commonly known as a computer, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers. The application of computers is becoming more and more common in China. After the reform and opening up, the number of computer users in China has continued to rise, and the application level has continued to improve. In particular, applications in the fields of Internet, communication, and multimedia have achieved good results. From 1996 to 2009, the number of computer users increased from 6.3 million to 67.1 million, and the number of networked computers increased from 29,000 to 59.4 million. Internet users have reached 316 million, wireless Internet has 670 million mobile users, of which 117 million are mobile Internet users, ranking first in the world. The computer mainly consists of a main box and a display screen. The main box contains a variety of components, of which the CPU is The brain of the entire information storage and calculation, so there will be a lot of waste heat during normal work. If the waste heat is not processed in time, it may cause damage to the computer. At present, only an exhaust fan is designed on the CPU to solve these problems, but this way of cooling The effect is not obvious.

Utility model content:

The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide an external heat dissipation mechanism for computer CPUs with reasonable structural design and strong heat dissipation.

The technical problems to be solved by the utility model are realized by the following technical solutions.

An external heat dissipation mechanism for computer CPU, which is arranged on the main box, and is characterized in that it includes a bottom plate, the bottom plate is designed to be close to the inner wall of the main box, and an integrated circuit board is arranged on the bottom plate. A CPU is arranged on the integrated circuit board, and a bump is arranged behind the bottom plate, and the bump passes through the main box, and dense heat sinks are arranged on the bump, and the bottom plate, bump and heat dissipation The chips are made of aluminum substrate.

A box body is arranged outside the heat sink, and the box body covers the heat sink. The box body is provided with ventilation slots to avoid scratches on the human body caused by protrusions, which is safer.

The box body is provided with an exhaust fan to timely discharge the heat emitted by the cooling fins.

Both ends of the bottom plate are provided with partitions, which ensures the large-area heat absorption of the integrated circuit board and is more effective.

The beneficial effects of the utility model are: the utility model has a simple and reasonable structural design. By using it in conjunction with the original built-in exhaust fan and adding external heat dissipation, it ensures the timely discharge of the heat in the CPU and the safety of the CPU. At the same time, the cost is low. It is safe and effective, guarantees the quality of the product, is convenient and quick to use, and is convenient for popularization and use.

Description of drawings:

Fig. 1 is the structural representation of the utility model;

Detailed ways:

In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific illustrations.

As shown in Figure 1, a kind of external heat dissipation mechanism for computer CPU is arranged on the main chassis 1, comprises a base plate 2, and the base plate 2 is designed close to the inner wall of the main chassis 1, and an integrated circuit board 3 is arranged on the base plate 2, integrated A CPU 4 is arranged on the circuit board 3, and a bump 5 is arranged behind the bottom plate 2. The bump 5 passes through the main box 1, and dense heat sinks 6 are arranged on the bump 5. The bottom plate 2, the bump 5 and the heat sink 6 are all made of Made of aluminum base plate, after setting in this way, the waste heat on the internal integrated circuit board 3 is absorbed directly through the internal aluminum base plate 1, and then the heat on the inner wall is directly discharged through the bump 5 and the heat sink 6, the effect is obvious, and the heat sink 6 A box body 7 is arranged on the outside, and the box body 7 covers the heat sink 6. The box body 7 is provided with a ventilation groove 8, so as to avoid protruding and causing scratches on the human body, which is safer. The box body 7 is provided with an exhaust fan 9 for timely The heat dissipated by the heat sink 7 is discharged, and the two ends of the bottom plate 2 are provided with partitions 10, which ensures the large-area absorption of the heat of the integrated circuit board 3 and is more effective.

The basic principles and main features of the present utility model and the advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.

Claims (4)

1. A kind of external cooling mechanism for computer CPU, is arranged on the main chassis, it is characterized in that: comprise a bottom plate, described bottom plate is close to the design of main chassis inner wall, and described bottom plate is provided with an integrated circuit board, so A CPU is arranged on the integrated circuit board, a bump is arranged behind the bottom plate, the bump passes through the main box, dense heat sinks are arranged on the bump, the bottom plate, the bump And heat sinks are made of aluminum substrate. 2. The external heat dissipation mechanism for computer CPU according to claim 1, characterized in that: a box is arranged outside the heat sink, the box covers the heat sink, and the box The body is provided with ventilation slots. 3. An external cooling mechanism for computer CPU according to claim 2, characterized in that: said box is provided with an exhaust fan. 4. An external heat dissipation mechanism for a computer CPU according to claim 1, characterized in that: partitions are arranged at both ends of the bottom plate.