WO2018032393A1 - Heat dissipation structure for memory bank - Google Patents
Heat dissipation structure for memory bank Download PDFInfo
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- WO2018032393A1 WO2018032393A1 PCT/CN2016/095638 CN2016095638W WO2018032393A1 WO 2018032393 A1 WO2018032393 A1 WO 2018032393A1 CN 2016095638 W CN2016095638 W CN 2016095638W WO 2018032393 A1 WO2018032393 A1 WO 2018032393A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat dissipation
- heat sink
- metal heat
- metal
- memory
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to the field of computer technology, and more particularly to a memory module heat dissipation structure.
- the memory module is an indispensable part of the computer. Most of the computers currently used do not have a structure for dissipating heat from the memory module. The memory is prone to instability after running in a hot chassis, which affects the use of the computer. Peer affects the life of the memory stick.
- the technical problem to be solved by the present invention is to provide a memory strip heat dissipation structure in view of the above-mentioned drawbacks of the prior art.
- a memory strip heat dissipation structure is configured, including a main board and a memory slot disposed on the main board; wherein, the two sides of the memory slot are respectively rotatably connected with a first metal heat sink and a second metal heat sink;
- the first metal heat sink is fixedly disposed with a first silicone heat sink, and the upper end is rotatably connected with a fixing rod, and the fixing rod end is connected with an L-shaped fixing buckle;
- the second metal heat sink is fixedly disposed at the side
- the second silicone heat sink has an upper end provided with a bayonet that cooperates with the fixed buckle.
- the memory strip heat dissipation structure of the present invention wherein the two sidewalls of the memory slot are respectively provided with a first cavity engaged with the first metal heat sink and a second metal heat sink The second cavity.
- the heat dissipation structure of the memory module of the present invention wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation holes.
- the heat dissipation structure of the memory module of the present invention wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation strips.
- the beneficial effects of the present invention are: the heat dissipation of the memory module is required, the first metal heat sink and the second metal heat sink are rotated, so that the first silicone heat sink and the second silicone heat sink are attached to the memory strip, and then Rotating the fixing rod, the fixing buckle and the bayonet are fastened to achieve the heat dissipation effect on the memory strip; the overall structure is simple and the cost is low.
- FIG. 1 is a schematic structural view of a heat dissipation structure of a memory module according to a preferred embodiment of the present invention.
- the heat dissipation structure of the memory module of the preferred embodiment of the present invention includes a main board 1 and a memory slot 10 disposed on the main board 1.
- the first side of the memory slot 10 is rotatably connected to the first metal heat sink. 100 and the second metal heat sink 101;
- the first metal heat sink 100 is fixedly disposed on the side of the first silicone heat sink 102, the upper end is rotatably connected with a fixing rod 103, and the end of the fixing rod 103 is connected with an L-shaped fixing buckle 104;
- the second metal heat sink 101 is fixedly disposed with a second silicone heat sink 105, and the upper end is provided with a bayonet 106 matched with the fixed buckle 104.
- the heat dissipation of the memory strip 2 is required to rotate the first metal heat sink 100 and the second metal.
- the heat sink 101 is configured such that the first silicone heat sink 102 and the second silicone heat sink 105 are attached to the memory stick 2, and then the fixing rod 103 is rotated, and the fixing buckle 104 and the bayonet 106 are fastened to achieve a heat dissipation effect on the memory strip 2;
- the overall structure is simple and the cost is low.
- the two sidewalls of the memory slot 10 are respectively provided with a first recess that cooperates with the first metal heat sink 100.
- the cavity 107 and the second cavity 108 mated with the second metal fin 101 occupy less space.
- a plurality of heat dissipation holes are disposed on the surfaces of the first metal heat sink 100 and the second metal heat sink 101, and the heat dissipation effect is good.
- a plurality of heat dissipation strips 109 are disposed on the surface of the first metal heat sink and the second metal heat sink, and the heat dissipation effect is good.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation structure for a memory bank, comprising a mainboard (1) and a memory slot (10) provided on the mainboard (1). Two side surfaces of the memory slot (10) are rotatably connected with a first metal heat dissipation piece (100) and a second metal heat dissipation piece (101), respectively; a side surface of the first metal heat dissipation piece (100) is fixedly provided with a first silicone heat dissipation piece (102), the upper end thereof is rotatably connected with a fixing rod (103), and the end portion of the fixing rod (103) is connected with an L-shaped fixing snap joint (104); a side surface of the second metal heat dissipation piece (101) is fixedly provided with a second silicone heat dissipation piece (105), and the upper end thereof is provided with a bayonet (106) matching the fixing snap joint (104); when a memory bank (2) requires heat dissipation, the first metal heat dissipation piece (100) and the second metal heat dissipation piece (101) are rotated so that the first silicone heat dissipation piece (102) and the second silicone heat dissipation piece (105) are attached to the memory bank (2), and then the fixing rod (103) is rotated so that the fixing snap joint (104) snap-fits the bayonet (106), so as to achieve a heat dissipation effect of the memory bank (2). The heat dissipation structure for a memory bank is simple in overall structure and low in costs.
Description
发明名称：一种内存条散热结构 Invention name: a memory strip heat dissipation structure
技术领域 Technical field
[0001] 本发明涉及计算机技术领域， 更具体地说， 涉及一种内存条散热结构。 [0001] The present invention relates to the field of computer technology, and more particularly to a memory module heat dissipation structure.
背景技术 Background technique
[0002] 内存条是电脑必不可少的组成部分， 目前使用的计算机内大都未安装对内存条 散热的结构， 内存长吋间在较热的机箱内运行后容易产生不稳定因素， 影响计 算机使用同吋影响内存条寿命。 [0002] The memory module is an indispensable part of the computer. Most of the computers currently used do not have a structure for dissipating heat from the memory module. The memory is prone to instability after running in a hot chassis, which affects the use of the computer. Peer affects the life of the memory stick.
技术问题 technical problem
[0003] 本发明要解决的技术问题在于， 针对现有技术的上述缺陷， 提供一种内存条散 热结构。 The technical problem to be solved by the present invention is to provide a memory strip heat dissipation structure in view of the above-mentioned drawbacks of the prior art.
问题的解决方案 Problem solution
技术解决方案 Technical solution
[0004] 本发明解决其技术问题所采用的技术方案是： [0004] The technical solution adopted by the present invention to solve the technical problem thereof is:
[0005] 构造一种内存条散热结构， 包括主板和设置在所述主板上的内存插槽； 其中， 所述内存插槽两侧面分别转动连接有第一金属散热片和第二金属散热片； 所述 第一金属散热片侧面固定设置有第一硅胶散热片， 上端转动连接有固定杆， 所 述固定杆端部连接设置有 L型固定卡扣； 所述第二金属散热片侧面固定设置有第 二硅胶散热片， 上端设置有与所述固定卡扣配合的卡口。 [0005] A memory strip heat dissipation structure is configured, including a main board and a memory slot disposed on the main board; wherein, the two sides of the memory slot are respectively rotatably connected with a first metal heat sink and a second metal heat sink; The first metal heat sink is fixedly disposed with a first silicone heat sink, and the upper end is rotatably connected with a fixing rod, and the fixing rod end is connected with an L-shaped fixing buckle; the second metal heat sink is fixedly disposed at the side The second silicone heat sink has an upper end provided with a bayonet that cooperates with the fixed buckle.
[0006] 本发明所述的内存条散热结构， 其中， 所述内存插槽两侧壁分别设置有与所述 第一金属散热片配合的第一凹腔和与所述第二金属散热片配合的第二凹腔。 [0006] The memory strip heat dissipation structure of the present invention, wherein the two sidewalls of the memory slot are respectively provided with a first cavity engaged with the first metal heat sink and a second metal heat sink The second cavity.
[0007] 本发明所述的内存条散热结构， 其中， 所述第一金属散热片与所述第二金属散 热片表面均设置有多个散热孔。 The heat dissipation structure of the memory module of the present invention, wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation holes.
[0008] 本发明所述的内存条散热结构， 其中， 所述第一金属散热片与所述第二金属散 热片表面均设置有多个散热条。 The heat dissipation structure of the memory module of the present invention, wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation strips.
发明的有益效果 Advantageous effects of the invention
有益效果
[0009] 本发明的有益效果在于： 需要对内存条进行散热吋， 转动第一金属散热片和第 二金属散热片， 使得第一硅胶散热片和第二硅胶散热片与内存条贴合， 而后转 动固定杆， 固定卡扣与卡口扣紧， 达到对内存条散热效果； 整体结构简单， 成 本低。 Beneficial effect [0009] The beneficial effects of the present invention are: the heat dissipation of the memory module is required, the first metal heat sink and the second metal heat sink are rotated, so that the first silicone heat sink and the second silicone heat sink are attached to the memory strip, and then Rotating the fixing rod, the fixing buckle and the bayonet are fastened to achieve the heat dissipation effect on the memory strip; the overall structure is simple and the cost is low.
对附图的简要说明 Brief description of the drawing
附图说明 DRAWINGS
[0010] 为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将结合附图及 实施例对本发明作进一步说明， 下面描述中的附图仅仅是本发明的部分实施例 ， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据 这些附图获得其他附图： The present invention will be further described with reference to the accompanying drawings and embodiments, in which FIG. For those skilled in the art, other drawings can be obtained according to these drawings without any creative work:
[0011] 图 1是本发明较佳实施例的内存条散热结构结构示意图。 1 is a schematic structural view of a heat dissipation structure of a memory module according to a preferred embodiment of the present invention.
本发明的实施方式 Embodiments of the invention
[0012] 为了使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发明实 施例中的技术方案进行清楚、 完整的描述， 显然， 所描述的实施例是本发明的 部分实施例， 而不是全部实施例。 基于本发明的实施例， 本领域普通技术人员 在没有付出创造性劳动的前提下所获得的所有其他实施例， 都属于本发明的保 护范围。 [0012] In order to make the objects, the technical solutions and the advantages of the embodiments of the present invention more clearly, the following description of the embodiments of the present invention will be clearly and completely described. For example, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
[0013] 本发明较佳实施例的内存条散热结构如图 1所示， 包括主板 1和设置在主板 1上 的内存插槽 10， 内存插槽 10两侧面分别转动连接有第一金属散热片 100和第二金 属散热片 101 ; 第一金属散热片 100侧面固定设置有第一硅胶散热片 102， 上端转 动连接有固定杆 103， 固定杆 103端部连接设置有 L型固定卡扣 104; 第二金属散 热片 101侧面固定设置有第二硅胶散热片 105， 上端设置有与固定卡扣 104配合的 卡口 106; 需要对内存条 2进行散热吋， 转动第一金属散热片 100和第二金属散热 片 101， 使得第一硅胶散热片 102和第二硅胶散热片 105与内存条 2贴合， 而后转 动固定杆 103， 固定卡扣 104与卡口 106扣紧， 达到对内存条 2散热效果； 整体结 构简单， 成本低。 [0013] The heat dissipation structure of the memory module of the preferred embodiment of the present invention, as shown in FIG. 1 , includes a main board 1 and a memory slot 10 disposed on the main board 1. The first side of the memory slot 10 is rotatably connected to the first metal heat sink. 100 and the second metal heat sink 101; the first metal heat sink 100 is fixedly disposed on the side of the first silicone heat sink 102, the upper end is rotatably connected with a fixing rod 103, and the end of the fixing rod 103 is connected with an L-shaped fixing buckle 104; The second metal heat sink 101 is fixedly disposed with a second silicone heat sink 105, and the upper end is provided with a bayonet 106 matched with the fixed buckle 104. The heat dissipation of the memory strip 2 is required to rotate the first metal heat sink 100 and the second metal. The heat sink 101 is configured such that the first silicone heat sink 102 and the second silicone heat sink 105 are attached to the memory stick 2, and then the fixing rod 103 is rotated, and the fixing buckle 104 and the bayonet 106 are fastened to achieve a heat dissipation effect on the memory strip 2; The overall structure is simple and the cost is low.
[0014] 如图 1所示， 内存插槽 10两侧壁分别设置有与第一金属散热片 100配合的第一凹
腔 107和与第二金属散热片 101配合的第二凹腔 108， 占用空间少。 [0014] As shown in FIG. 1, the two sidewalls of the memory slot 10 are respectively provided with a first recess that cooperates with the first metal heat sink 100. The cavity 107 and the second cavity 108 mated with the second metal fin 101 occupy less space.
[0015] 如图 1所示， 第一金属散热片 100与第二金属散热片 101表面均设置有多个散热 孔 （图中未显示） ， 散热效果好。 As shown in FIG. 1, a plurality of heat dissipation holes (not shown) are disposed on the surfaces of the first metal heat sink 100 and the second metal heat sink 101, and the heat dissipation effect is good.
[0016] 如图 1所示， 第一金属散热片与第二金属散热片表面均设置有多个散热条 109， 散热效果好。 [0016] As shown in FIG. 1, a plurality of heat dissipation strips 109 are disposed on the surface of the first metal heat sink and the second metal heat sink, and the heat dissipation effect is good.
[0017] 应当理解的是， 对本领域普通技术人员来说， 可以根据上述说明加以改进或变 换， 而所有这些改进和变换都应属于本发明所附权利要求的保护范围。
[0017] It is to be understood that those skilled in the art can devise modifications or variations in accordance with the above description, and all such modifications and changes are intended to be included within the scope of the appended claims.
Claims
[权利要求 1] 一种内存条散热结构， 包括主板和设置在所述主板上的内存插槽； 其 特征在于， 所述内存插槽两侧面分别转动连接有第一金属散热片和第 二金属散热片； 所述第一金属散热片侧面固定设置有第一硅胶散热片 [Claim 1] A memory strip heat dissipation structure, comprising a main board and a memory slot disposed on the main board; wherein: the first metal heat sink and the second metal are respectively rotatably connected to the two sides of the memory slot a heat sink; the first metal heat sink is fixedly disposed with a first silicone heat sink
， 上端转动连接有固定杆， 所述固定杆端部连接设置有 L型固定卡扣The upper end is rotatably connected with a fixing rod, and the fixing rod end is connected with an L-shaped fixing buckle
； 所述第二金属散热片侧面固定设置有第二硅胶散热片， 上端设置有 与所述固定卡扣配合的卡口。 The second metal heat sink is fixedly disposed with a second silicone heat sink on the side, and the upper end is provided with a bayonet matched with the fixed buckle.
[权利要求 2] 根据权利要求 1所述的内存条散热结构， 其特征在于， 所述内存插槽 两侧壁分别设置有与所述第一金属散热片配合的第一凹腔和与所述第 二金属散热片配合的第二凹腔。 [Claim 2] The memory module heat dissipation structure according to claim 1, wherein the two sidewalls of the memory slot are respectively provided with a first cavity engaged with the first metal heat sink and The second metal heat sink cooperates with the second cavity.
[权利要求 3] 根据权利要求 1所述的内存条散热结构， 其特征在于， 所述第一金属 散热片与所述第二金属散热片表面均设置有多个散热孔。 The memory strip heat dissipation structure according to claim 1, wherein the first metal heat sink and the second metal heat sink surface are each provided with a plurality of heat dissipation holes.
[权利要求 4] 根据权利要求 1所述的内存条散热结构， 其特征在于， 所述第一金属 散热片与所述第二金属散热片表面均设置有多个散热条。
[Claim 4] The memory module heat dissipation structure according to claim 1, wherein the first metal heat sink and the second metal heat sink surface are provided with a plurality of heat dissipation strips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/095638 WO2018032393A1 (en) | 2016-08-17 | 2016-08-17 | Heat dissipation structure for memory bank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/095638 WO2018032393A1 (en) | 2016-08-17 | 2016-08-17 | Heat dissipation structure for memory bank |
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| WO2018032393A1 true WO2018032393A1 (en) | 2018-02-22 |
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| PCT/CN2016/095638 WO2018032393A1 (en) | 2016-08-17 | 2016-08-17 | Heat dissipation structure for memory bank |
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| CN101414206A (en) * | 2007-10-18 | 2009-04-22 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device of memory |
| US20090277616A1 (en) * | 2008-05-06 | 2009-11-12 | International Business Machines Corporation | Method and apparatus of water cooling several parallel circuit cards each containing several chip packages |
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| CN203455762U (en) * | 2013-08-21 | 2014-02-26 | 张艳梅 | Dustproof heat dissipation device of computer memory module |
| CN205176783U (en) * | 2015-12-07 | 2016-04-20 | 南阳医学高等专科学校 | Calculator memory strip heat abstractor |
| CN106292961A (en) * | 2016-08-17 | 2017-01-04 | 陈玮彤 | A kind of memory bar radiator structure |
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2016
- 2016-08-17 WO PCT/CN2016/095638 patent/WO2018032393A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101414206A (en) * | 2007-10-18 | 2009-04-22 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device of memory |
| US20090277616A1 (en) * | 2008-05-06 | 2009-11-12 | International Business Machines Corporation | Method and apparatus of water cooling several parallel circuit cards each containing several chip packages |
| CN101997194A (en) * | 2009-08-11 | 2011-03-30 | 冯林 | Memory protection device and computer |
| CN203455762U (en) * | 2013-08-21 | 2014-02-26 | 张艳梅 | Dustproof heat dissipation device of computer memory module |
| CN205176783U (en) * | 2015-12-07 | 2016-04-20 | 南阳医学高等专科学校 | Calculator memory strip heat abstractor |
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